3D IC 市場按最終用途領域、基板類型、製造流程、產品類型和地區分類 - 市場規模、佔有率、展望、機會分析，2020-2027 年

3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

出版日期: 2025年02月18日 | 出版商:

Coherent Market Insights | 英文 140 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

預計2025年全球3D IC市場規模為198.4億美元，2032年將達到736.6億美元，2025年至2032年的年複合成長率(CAGR)為20.6%。

報告範圍		報告詳細資訊
基準年	2024	2025 年市場規模	198.4億美元
效能資料	從 2020 年到 2024 年	預測期	2025 至 2032 年
預測期：2025-2032年複合年成長率：	20.60%	2032 年價值預測	736.6億美元

圖：2025 年各地區 3D IC市場佔有率（%）

隨著對更緊湊、更高性能電子設備的需求不斷增加，全球 3D IC 市場正在經歷強勁成長。 3D IC，又稱3D體電路，是指將兩個或多個IC晶片垂直組裝堆疊在一起，並透過矽通孔（TSV）垂直連接，以減少佈線長度，提高訊號傳播速度。透過將許多組件整合到小體積中，設備可以變得更小。 3D IC 技術透過將矽晶圓堆疊並整合到單一包裝中來最大限度地提高晶片晶粒，有助於降低晶片成本。記憶體、圖形、處理器和無線電電子設備等各種組件可以放置在單一模組中。 3D IC 的高頻寬和低功耗特性正在推動各種應用的需求，包括家用電子電器、醫療設備和汽車產業。

市場動態：

全球 3D IC 市場受到高性能可攜式消費性電子產品日益成長的需求所推動。對於外形規格小巧、功能增強的設備的需求推動了 3D IC 的需求。然而，生產 3D IC 的高製造成本對其廣泛應用構成了挑戰。設計和製造過程的複雜性增加了製造成本。商業機會在於自動駕駛汽車、擴增實境和虛擬實境設備中 3D IC 的新興應用。使用 3D IC 技術整合邏輯晶片、記憶體和感測器組件有助於實現汽車中的高級駕駛輔助、導航和資訊娛樂服務。 3D IC 支援更高的頻寬和更低的功耗，因此它們將更多地被用在對圖形和處理要求較高的電池供電設備中。透過新材料和設計技術來降低製造成本的努力將進一步有助於解決這些障礙。

本研究的主要特點

本報告對全球 3D IC 市場進行了詳細分析，並以 2024 年為基準年，給出了預測期（2025-2032 年）的市場規模和年複合成長率（CAGR%）。
它還強調了各個領域的潛在商機並說明了該市場的有吸引力的投資提案矩陣。
它還提供了對市場促進因素、限制因素、機會、新產品發布和核准、市場趨勢、區域前景以及主要企業採用的競爭策略的重要見解。
全球 3D IC 市場的主要企業是根據公司亮點、產品系列、關鍵亮點、財務表現和策略等參數進行的分析。
本報告的見解將使負責人和企業經營團隊能夠就未來產品發布、新興趨勢、市場擴張和行銷策略做出明智的決策。
本研究報告針對該產業的各個相關人員，包括投資者、供應商、產品製造商、經銷商、新進業者和財務分析師。
相關人員可以透過用於分析全球 3D IC 市場的各種策略矩陣更輕鬆地做出決策。

Report Coverage	Report Details
Base Year:	2024	Market Size in 2025:	USD 19.84 Bn
Historical Data for:	2020 To 2024	Forecast Period:	2025 To 2032
Forecast Period 2025 to 2032 CAGR:	20.60%	2032 Value Projection:	USD 73.66 Bn

The global 3D ICs market is witnessing robust growth with the rising demand for more compact and high-performance electronic devices. 3D ICs, also known as three-dimensional integrated circuits, refers to the vertical assembly of two or more IC chips stacked and connected vertically via through-silicon vias (TSVs) to reduce wire length and improve the signal propagation speeds. It enables device miniaturization by integrating more components in a small footprint. 3D ICs technology helps maximize chip density by stacking silicon dies and integrating them into one package which helps reduce the chip cost. It allows the placement of different components such as memory, graphics, processors, and radio electronics in one module. The higher bandwidth and low power consumption features associated with 3D ICs are fueling their demand for various applications across consumer electronics, medical devices, and automotive industries.

Market Dynamics:

The global 3D ICs market is driven by the increasing demand for high performance portable consumer electronics. The demand for devices with improved functionality in a compact form factor is propelling the need for 3D ICs. However, the high manufacturing cost associated with 3D ICs fabrication poses a challenge for widespread adoption. The complexity in the design and manufacturing process increases production costs. Opportunities lies in the emerging applications of 3D ICs in autonomous vehicles, augmented and virtual reality devices. The integration of logic chips, memory, and sensor components using 3D ICs technology can help enable advanced driver assistance, navigation, and infotainment services in vehicles. 3D ICs supports higher bandwidth and low-power consumption which will drive their adoption in battery-operated devices with graphics and processing-intensive requirements. efforts to lower manufacturing costs through new materials and design techniques will further help address barriers.

Key Features of the Study:

This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2025-2032), considering 2024 as the base year
It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
It profiles key players in the global 3D ICs market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
Key companies covered as a part of this study include Amkor Technology, ASE Group, BeSang Inc., IBM Corporation, Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology Inc., MonolithIC 3D ICs Inc., Samsung Electronics Co. Ltd., STATS ChipPAC Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company, Tezzaron Semiconductor, Toshiba Corporation, United Microelectronics Corporation, and Xilinx Inc.
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global 3D ICs market

Detailed Segmentation:

By Product Type
- LED
- Memories
- MEMS
- Sensor
- Logic
- Others
By Substrate Type
- Silicon on Insulator (SOI)
- Bulk Silicon
By Application
- Information and Communication Technology
- Military
- Consumer Electronics
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East
- Africa
Key Players Insights
- Amkor Technology
- ASE Group
- BeSang Inc.
- IBM Corporation
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Micron Technology Inc.
- MonolithIC 3D ICs Inc.
- Samsung Electronics Co. Ltd.
- STATS ChipPAC Ltd.
- STMicroelectronics N.V.
- Taiwan Semiconductor Manufacturing Company
- Tezzaron Semiconductor
- Toshiba Corporation
- United Microelectronics Corporation
- Xilinx Inc.

1. Research Objectives and Assumptions

Research Objectives
Assumptions
Abbreviations

2. Market Purview

Report Description
- Market Definition and Scope
Executive Summary
- Market Snippet, By End-Use Sectors
- Market Snippet, By Substrate Type
- Market Snippet, By Fabrication Process
- Market Snippet, By Process
- Market Snippet, By Region
Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

Market Dynamics
- Drivers
- Restraints
- Market Opportunities
Regulatory Scenario
Industry Trend
Merger and Acquisitions
New System Launch/Approval

4. Impact of COVID-19 Pandemic on 3D ICs Market

Short Term and Long Term Impact, By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East and Africa

5. Global 3D ICs Market, By End- Use Sectors, 2018-2028 (US$ Billion)

Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
Consumer electronics
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Information and communication technology
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Transport (automotive and aerospace)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Military
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Others (Biomedical applications and R&D)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)

6. Global 3D ICs Market, By Substrate Type, 2018-2028 (US$ Billion)

Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
Silicon on insulator (SOI)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Bulk silicon
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)

7. Global 3D ICs Market, By Fabrication Process, 2018-2028 (US$ Billion)

Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
Beam re-crystallization
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Wafer bonding
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Silicon epitaxial growth
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Solid phase crystallization
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)

8. Global 3D ICs Market, By Process, 2018-2028 (US$ Billion)

Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
MEMS and Sensor
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
RF SiP
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Optoelectronics and imaging
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Memories (3D Stacks)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
Logic (3D Sip/Soc)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
HB LED
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)

9. Global 3D ICs Market, By Region, 2018-2028 (US$ Billion)

Introduction
- Market Share Analysis, By Region, 2020 and 2028 (%)
North America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
  - U.S.
  - Canada
Europe
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
  - U.K.
  - Germany
  - Italy
  - France
  - Russia
  - Rest of Europe
Asia Pacific
- Regional Trends
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
  - India
  - Japan
  - ASEAN
  - Australia
  - South Korea
  - Rest of Asia Pacific
Latin America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
  - Brazil
  - Argentina
  - Mexico
  - Rest of Latin America
Middle East and Africa
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
  - GCC Countries
  - South Africa
  - Rest of the Middle East and Africa

10. Competitive Landscape

Company Profiles
- Taiwan Semiconductor Manufacturing Company, Ltd
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- MonolithIC 3D Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- XILINX, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Elpida Memory, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- (Micron Technology, Inc.)
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- The 3M Company,
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Ziptronix, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- STATS ChipPAC Ltd.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- United Microelectronics Corporation
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Tezzaron Semiconductor Corporation
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates