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市場調查報告書
商品編碼
1775578

3D積體電路市場 - 2025年至2030年預測

Three-Dimensional Integrated Circuit Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 142 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

3D積體電路市場預計將從 2025 年的 128.99 億美元成長到 2030 年的 206.81 億美元，複合年成長率為 9.90%。

3D積體電路市場趨勢：

3D 積體電路 (IC) 是透過垂直堆疊晶粒或晶圓並透過矽通孔 (TSV) 或銅互連 (Cu-Cu) 連接它們而構成的金屬氧化物半導體 (MOS) 電子裝置，與 2D 方法相比，它能夠在更小的佔用空間內以更低的功耗還獲得更高的性能，同時能夠實現更高的靈活性，從而獲得更高的靈活性，從而獲得更高的靈活性，同時實現更高的靈活性，從而獲得更高的靈活性，從而實現更高的靈活性，從而實現更高的靈活性，從而實現更高的頻寬，從而獲得更高的靈活性，從而實現更高的異質整合。

加大研發投入已成為多家公司的策略發展方向，從而推動了產業規模的顯著擴張。此外，技術的顯著進步預計將推動3D IC市場的發展。人工智慧 (AI)、物聯網 (IoT)、穿戴式電子產品、擴增實境/虛擬實境 (AR/VR) 和高效能電腦的蓬勃發展，正加速3D IC的需求成長。

3D積體電路市場細分分析：

感測器是用於測量壓力、位置、溫度和加速度等特性並提供回饋的設備。感測器，也稱為換能器，是現代數據採集系統的基本組成部分之一。其應用範圍廣泛，包括洪水和水位監測系統、環境監測、交通監控、人工照明節能、遠端系統監控和設備故障診斷、精密農業和動物追蹤。

目前，醫療保健、汽車和製造業等各種垂直應用正在推動市場發展。這些應用增強了感測器的功能。因此，預計感測器市場將呈指數級成長，從而推動對 3D IC 的需求。感測器中的 3D IC 使其比常規 IC 更具技術優勢。此外，物聯網的興起以及對更先進的篩檢和感測技術的強勁需求預計將以可觀的速度擴大市場需求。

推動3D積體電路市場成長的因素：

3D IC 領域研究和創新的不斷增加正在推動市場成長。 AR/VR、人工智慧、物聯網和高性能電腦等創新技術的日益普及正在推動 3D IC 的使用，預計 3D IC 將隨著第四次工業革命而成長。加強研發和創新是許多公司保持競爭優勢的首要任務。許多公司正在進行策略性併購，以保持領先地位。 2021 年 2 月，ASM Pacific Technology 與 EV Group 簽署了共同開發契約(JDA)，共同開發用於 3D IC/異構整合應用的晶粒到晶圓混合鍵合解決方案。晶粒到晶圓混合鍵合是使用小晶片技術將系統晶片(SoC) 裝置重新設計為 3D 堆疊晶片的關鍵製程。該技術將來自不同製程節點的晶片組合在一起，為 5G、高效能運算 (HPC) 和人工智慧 (AI) 等新興應用提供支援。

此外，技術的進步也導致了全球專利和版權數量的增加。 2022年8月，GBT Technologies Inc. 收到美國專利商標局 (USPTO) 的頒發通知，繼續申請一項關於3D、多平面積體電路設計和製造技術的專利申請。這是該公司第二次申請3D、MP晶片結構的專利。這項原創創新為積體電路設計和製造提供了一種新穎的方法，使尖端的類比、數位和混合型積體電路能夠整合在矽晶片上。

該專利旨在提供能夠降低成本和能耗的設計，同時生產高性能的精密微晶片。這些技術旨在實現在更小尺寸的矽晶圓上進行設計和製造。預計此類創新和研究將在預測期內推動市場顯著成長。

3D積體電路企業：

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation

目錄

第1章執行摘要

第2章市場概述

  • 市場概覽
  • 市場定義
  • 調查範圍
  • 市場區隔

第3章 經營狀況

  • 市場促進因素
  • 市場限制
  • 市場機會
  • 波特五力分析
  • 產業價值鏈分析
  • 政策法規
  • 策略建議

第4章 技術展望

5. 3D積體電路市場（按技術）

  • 介紹
  • 單片
  • 晶圓上晶圓
  • 晶粒上晶片
  • 晶粒

6. 3D積體電路市場（依應用）

  • 介紹
  • MEMS
  • 儲存裝置
  • 感應器
  • 其他

7. 3D積體電路市場（按地區）

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼
    • 泰國
    • 其他

第8章競爭格局及分析

  • 主要企業和策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章：公司簡介

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation
  • Aveni Inc.
  • JCET Group
  • STMicroelectronics
  • Advanced Semiconductor Engineering Inc.（ASE）
  • IBM

第10章 附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益
  • 調查方法
  • 簡稱
簡介目錄
Product Code: KSI061610416

The Three-Dimensional Integrated Circuit Market is expected to grow from US$12.899 billion in 2025 to US$20.681 billion in 2030, at a CAGR of 9.90%.

Three-Dimensional Integrated Circuit Market Trends:

3D integrated circuits (ICs) are metal oxide semiconductor (MOS) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Further, it has a high bandwidth and heterogeneous integration providing greater flexibility.

Growing investment in R&D has been a strategic development for several companies. It has broadened the scope to the industry. Further, with the significant advancement of technology, 3D IC will propel the 3DIC market. The increasing advent of artificial intelligence (AI), Internet of Things (IoT), wearable electronics, AR/VR, and high-performing computers will be snowballing the demand for 3D IC.

Three-Dimensional Integrated Circuit Market Segment Analysis:

A sensor is a device used to measure a property, such as pressure, position, temperature, or acceleration, and respond with feedback. Also known as transducers, sensors are one of the fundamental building blocks of modern data acquisition systems. They have a wide range of applications from flood & water level monitoring systems, environmental monitoring, traffic monitoring & controlling, energy saving in artificial lighting, remote system monitoring & equipment fault diagnostics, and precision agriculture & animal tracking.

These diverse applications across several industry verticals like healthcare, automotive, and manufacturing industries, among others, are driving the market ahead in the current period. It makes the functioning of the sensor superior and better. Hence, the sensors market is projected to grow at an exponential rate, driving demand for 3-D IC. A 3-D IC in sensors gives the sensor a technological edge over a normal IC. Furthermore, the rise in IoT and superior demand for better screening and sensing technology is anticipated to expand the market demand at a significant pace.

Three-Dimensional Integrated Circuit Market Growth Drivers:

Growing research and innovation in 3D IC is driving the market growth. Increasing adoption of innovative technologies like AR/VR, Artificial Intelligence, IoT, and high-performing computers is propelling the use of 3D ICs. This is anticipated to grow with the fourth industrial revolution. Increasing R&D and innovation is a top priority for several companies to stay in the game. Companies are entering into strategic mergers and acquisitions to stay at the top of the game. In February 2021, ASM Pacific Technology and EV Group entered into a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a crucial process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. This technology combines chips with various process nodes to power new applications like 5G, high-performance computing (HPC), and artificial intelligence (AI).

Further, increasing technology is also increasing the patents and copyrights worldwide. In August 2022, GBT Technologies Inc. received an issue notification from the United States Patent and Trademark Office (USPTO) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. This is the second patent application for its 3D, MP microchip architecture. The original innovation offered a novel approach to integrated circuit design and production that allows for the integration of cutting-edge analog, digital, and mixed-type ICs on a silicon wafer.

The current patent aims to provide a design to reduce the cost and energy and produce sophisticated microchips with higher performance. These techniques aim to make it possible to design and manufacture them on silicon with a smaller footprint. Such innovation and research are anticipated to significantly boost the market in the forecast period.

Three-Dimensional Integrated Circuit Companies:

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation

Three-Dimensional Integrated Circuit Market Segmentation:

By Technology

  • Monolithic
  • Wafer on Water
  • Die on Wafer
  • Die on Die

By Application

  • MEMS
  • Storage Device
  • Sensors
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indoensia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY TECHNOLOGY

  • 5.1. Introduction
  • 5.2. Monolithic
  • 5.3. Wafer on Water
  • 5.4. Die on Wafer
  • 5.5. Die on Die

6. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. MEMS
  • 6.3. Storage Device
  • 6.4. Sensors
  • 6.5. Others

7. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Taiwan Semiconductor Manufacturing Company
  • 9.2. Invensas Corporation
  • 9.3. Amkor Technology Inc.
  • 9.4. Xilinx, Inc.
  • 9.5. Tezzaron Semiconductor Corporation
  • 9.6. Aveni Inc.
  • 9.7. JCET Group
  • 9.8. STMicroelectronics
  • 9.9. Advanced Semiconductor Engineering Inc. (ASE)
  • 9.10. IBM

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key Benefits for the Stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations