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市場調查報告書
商品編碼
2149590

面板級封裝市場預測（2034 年）—按封裝形式、面板基板、面板尺寸、封裝配置、最終用戶和地區分類的全球分析

Panel-Level Packaging Market Forecasts to 2034 - Global Analysis By Packaging Format, Panel Substrate, Panel Size, Package Configuration, End User and Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

全球面板級包裝市場預計到 2026 年將達到 5 億美元，並在預測期內以 24.0% 的複合年成長率成長，到 2034 年將達到 28 億美元。

面板級封裝是一種先進的半導體封裝技術，組裝並互連在大型矩形或正方形面板上，而不是在單個圓形晶圓上。更大的加工面積有望提高某些應用中的封裝吞吐量和材料利用率。該技術支援扇出型封裝和其他需要高密度互連和異質整合的先進封裝架構。面板級製程包括線路重布形成、成型、晶片放置、微影術、金屬化和定序。應用領域包括高效能運算、行動裝置、汽車電子和其他緊湊型電子系統。對先進封裝日益成長的需求以及提高封裝經濟性的壓力正在推動人們對基於面板的封裝方法的興趣。開發重點在於面板翹曲控制、對準精度、製程均勻性、良率、設備相容性和可擴展製造。

市場動態

對經濟高效的先進包裝的需求日益成長

對具成本效益先進封裝解決方案日益成長的需求正在推動面板級封裝技術的應用。與晶圓級封裝相比，面板級封裝具有更高的產能和更低的單位成本。面板尺寸的增大意味著每個面板可以容納更多元件，從而提高製造效率並降低成本。行動和消費性電子應用對扇出型封裝的需求不斷成長，也促進了市場擴張。隨著先進封裝技術的日益複雜，需要更大的基板來容納多晶片配置。面板級封裝能夠以經濟高效的方式生產用於人工智慧和高效能運算應用的大型封裝。

製程複雜性和產量挑戰

面板級封裝製程複雜度高，包括需要易於操作和均勻處理大型面板，這構成了推廣應用的一大障礙。面板翹曲、模具錯位和缺陷管理等良率挑戰會影響生產成本。認證設備和工藝專業知識的匱乏也限制了其應用。面板級封裝設備所需的大量資本投入限制了市場進入。製程最佳化的漫長開發週期也延緩了產品上市時間。

採用玻璃基板和大型面板

面板級封裝中玻璃基板的日益普及為市場擴張帶來了巨大的機會。大尺寸面板的開發使得人工智慧和資料中心應用所需的大型封裝能夠以更低的成本實現生產。面板級封裝技術向新應用領域的拓展也創造了市場機會。設備和製程技術的進步正在提高產能和良率。不斷擴展的面板級封裝標準生態系統正在為市場成長提供支撐。

與晶圓級封裝的競爭

與晶圓級封裝技術的競爭可能會限制面板級封裝在某些應用中的普及。經濟壓力可能會延遲對面板級封裝產能的投資。技術複雜性可能會延緩技術普及進程。地緣政治緊張局勢可能會擾亂面板級封裝設備和材料的供應鏈。科技的快速發展會為早期採用者帶來技術過時的風險。

新型冠狀病毒（COVID-19）的影響：

新冠感染疾病加速了對5G、人工智慧和高效能運算（HPC）應用領域先進封裝解決方案的需求，刺激了對面板級封裝技術的投資。供應鏈中斷凸顯了具成本效益封裝解決方案對於維持競爭力的重要性。疫情後，面板級封裝產能投資增加，支撐了市場成長。政府對半導體製造業的持續支持也推動了面板級封裝技術的應用。面板級封裝正日益被認為是實現具成本效益先進封裝的關鍵。

在預測期內，扇出型面板級封裝細分市場預計將佔據最大的市場佔有率。

預計在預測期內，扇出型面板級封裝將佔據最大的市場佔有率。這是因為扇出型封裝具有高I/O密度和設計柔軟性，適用於各種應用。行動裝置、消費性電子和汽車應用領域的廣泛採用正在推動市場成長。扇出型面板級封裝技術的進步正在提高良率和性能。成熟的工藝技術和基礎設施鞏固了該領域的領先地位。扇出型面板級封裝是面板級封裝普及的主要驅動力。

預計在預測期內，玻璃基板細分市場將呈現最高的複合年成長率。

在預測期內，玻璃基板市場預計將呈現最高的成長率，這主要得益於高密度面板級封裝技術的日益普及。與有機基板相比，玻璃基板具有更優異的尺寸穩定性，並且能夠形成更精細的結構。人工智慧應用對大尺寸面板的需求不斷成長，也推動了該細分市場的成長。玻璃處理和加工技術的進步提高了良率和產能。玻璃基板在先進的面板級封裝技術中正日益受到青睞。

市佔率最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這主要得益於台灣、韓國和日本等地區強大的半導體封裝產業基礎。該地區擁有一些世界領先的OSAT（外包半導體封裝測試公司）和IDM（整合元件製造商），並在面板級封裝領域取得了長足發展。主要半導體製造商正在推動對面板級封裝服務的巨大需求。政府對半導體製造業的支持進一步鞏固了該地區的市場領導地位。先進封裝產能的持續擴張正在推動市場成長。

複合年成長率最高的地區：

在預測期內，亞太地區預計將呈現最高的複合年成長率，這主要得益於先進封裝產能的持續擴張和技術的廣泛應用。台灣和韓國正在擴大其面向先進應用的面板級封裝產能。中國也在增加對國內面板級封裝產能的投資。人工智慧和高效能運算領域投資的增加正在加速對面板級封裝的需求。該地區供應鏈的發展也為市場成長提供了支撐。

免費客製化服務：

所有購買此報告的客戶均可享受以下免費自訂選項之一：

  • 企業概況
    • 對其他市場參與者（最多 3 家公司）進行全面分析
    • 對主要公司進行SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶要求，我們可以提供主要國家的市場估算和預測，以及複合年成長率（註：需經可行性確認）。
  • 競爭性標竿分析
    • 根據產品系列、企業發展和策略聯盟對重點公司進行基準分析。

目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 促進因素、挑戰與機遇
  • 競爭格局概述
  • 戰略洞察與建議

第2章：研究框架

  • 研究目標和範圍
  • 相關人員分析
  • 研究假設和限制
  • 調查方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 技術與創新展望
  • 新興市場/高成長市場
  • 監管和政策環境
  • 新冠疫情的影響及復甦前景

第4章：競爭環境與策略評估

  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 替代品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要公司市佔率分析
  • 產品基準評效和效能比較

第5章 全球面板級包裝市場：依包裝類型分類

  • 扇出型面板級封裝
  • 扇入式面板級封裝
  • 面板級、晶片級封裝
  • 面板級系統級封裝
  • 面板級嵌入式晶片封裝
  • 其他包裝形式

第6章 全球面板級封裝市場：依面板基板

  • 有機基板
  • 玻璃基板
  • 重新配置的模塑面板
  • 陶瓷基板
  • 金屬板
  • 其他配電基板

第7章 全球面板級封裝市場：依面板尺寸分類

  • 300毫米級面板
  • 500毫米級面板
  • 600毫米級面板
  • 700毫米級面板
  • 大尺寸面板

第8章 全球面板級封裝市場：依封裝配置分類

  • 單晶片封裝
  • 多晶片封裝
  • 晶片封裝
  • 記憶體邏輯封裝
  • 異構包
  • 其他軟體包配置

第9章 全球面板級封裝市場：依最終用戶分類

  • 鑄造廠
  • 半導體組裝和測試的外部承包商
  • 垂直整合的設備製造商
  • 無晶圓廠半導體公司
  • 電子製造服務供應商
  • 其他最終用戶

第10章 全球面板級封裝市場：依地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 其他南美國家
  • 世界其他地區（RoW）
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第11章 策略市場資訊

  • 工業價值網路和供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第12章 產業趨勢與策略舉措

  • 併購
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第13章：公司簡介

  • TSMC
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • ASE Technology Holding Co., Ltd.
  • Amkor Technology, Inc.
  • Powertech Technology Inc.
  • ChipMOS TECHNOLOGIES INC.
  • Deca Technologies
  • JCET Group Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Unimicron Technology Corporation
  • AT&S Austria Technologie & Systemtechnik AG
  • LPKF Laser & Electronics SE
  • ASMPT Limited
  • Besi NV
Product Code: SMRC40077

According to Stratistics MRC, the Global Panel-Level Packaging Market is accounted for $0.5 billion in 2026 and is expected to reach $2.8 billion by 2034 growing at a CAGR of 24.0% during the forecast period. Panel-Level Packaging is an advanced semiconductor packaging approach in which semiconductor dies are assembled and interconnected on large rectangular or square panels rather than individual circular wafers. Larger processing areas can potentially increase packaging throughput and improve material utilization for certain applications. The technology supports fan-out packaging and other advanced package architectures requiring high-density interconnections and heterogeneous integration. Panel-level processes may include redistribution layer formation, molding, die placement, lithography, metallization, and singulation. Applications include high-performance computing, mobile devices, automotive electronics, and other compact electronic systems. Growing demand for advanced packaging and increasing pressure to improve packaging economics are supporting interest in panel-based approaches. Development focuses on panel warpage control, alignment accuracy, process uniformity, yield, equipment compatibility, and scalable manufacturing.

Market Dynamics

Driver:

Growing demand for cost-effective advanced packaging

Increasing demand for cost-effective advanced packaging solutions is driving adoption of panel-level packaging that offers higher throughput and lower cost per unit compared to wafer-level approaches. Growing panel sizes enable more units per panel, improving manufacturing efficiency and reducing costs. Rising demand for fan-out packaging for mobile and consumer applications supports market expansion. Growing complexity of advanced packaging requires larger substrates to accommodate multi-die configurations. Panel-level packaging enables cost-effective production of large packages for AI and high-performance computing.

Restraint:

Process complexity and yield challenges

High process complexity of panel-level packaging, including handling of large panels and achieving uniform processing, presents significant adoption barriers. Yield challenges associated with panel warpage, die shift, and defect control affect production economics. Limited availability of qualified equipment and process expertise constrains adoption. High capital investment requirements for panel-level equipment limit market entry. Extended development cycles for process optimization delay time-to-market.

Opportunity:

Glass substrate adoption and large-format panels

Growing adoption of glass substrates for panel-level packaging presents significant opportunities for market expansion. Development of large-format panels enables cost-effective production of large packages for AI and data center applications. Expansion of panel-level packaging to new applications creates market opportunities. Advances in equipment and process technology improve throughput and yield. Growing ecosystem of panel-level packaging standards supports market development.

Threat:

Competition from wafer-level packaging

Competition from wafer-level packaging approaches may limit panel-level packaging adoption in certain applications. Economic pressures may delay investment in panel-level capacity. Technology complexity may slow adoption timelines. Geopolitical tensions may disrupt supply chains for panel-level equipment and materials. Rapid technology evolution creates obsolescence risk for early adopters.

Covid-19 Impact:

The COVID-19 pandemic accelerated demand for advanced packaging solutions for 5G, AI, and high-performance computing applications, driving investment in panel-level packaging technology. Supply chain disruptions highlighted the importance of cost-effective packaging solutions for maintaining competitiveness. The post-pandemic period has witnessed increased investment in panel-level packaging capacity, supporting market growth. Growing government support for semiconductor manufacturing continues driving adoption. Panel-level packaging is increasingly recognized as critical for cost-effective advanced packaging.

The fan-out panel-level packaging segment is expected to be the largest during the forecast period

The fan-out panel-level packaging segment is expected to account for the largest market share during the forecast period as fan-out packaging offers high I/O density and design flexibility for diverse applications. Growing adoption for mobile, consumer, and automotive applications drives market expansion. Advances in fan-out panel-level packaging technology improve yield and performance. Established process knowledge and infrastructure support segment leadership. Fan-out panel-level packaging is the primary driver of panel-level packaging adoption.

The glass substrates segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the glass substrates segment is predicted to witness the highest growth rate driven by increasing adoption for high-density panel-level packaging. Glass substrates offer superior dimensional stability and finer feature capability compared to organic substrates. Growing demand for large-format panels for AI applications supports segment growth. Advances in glass handling and processing technology improve yield and throughput. Glass substrates are increasingly preferred for advanced panel-level packaging.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share owing to dominant semiconductor packaging base in Taiwan, South Korea, and Japan. The region hosts the world's leading OSAT and IDM companies with extensive panel-level packaging development. Major semiconductor manufacturers drive substantial demand for panel-level packaging services. Government support for semiconductor manufacturing reinforces regional market leadership. Continued advanced packaging capacity expansion drives market growth.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR driven by continued advanced packaging capacity expansion and technology adoption. Taiwan and South Korea are expanding panel-level packaging capacity for advanced applications. China is investing in domestic panel-level packaging capabilities. Growing investment in AI and high-performance computing accelerates demand for panel-level packaging. Regional supply chain development supports market growth.

Key players in the market

Some of the key players in the Panel-Level Packaging Market include TSMC, Samsung Electronics Co., Ltd., Intel Corporation, ASE Technology Holding Co., Ltd., Amkor Technology, Inc., Powertech Technology Inc., ChipMOS TECHNOLOGIES INC., Deca Technologies, JCET Group Co., Ltd., Shinko Electric Industries Co., Ltd., Unimicron Technology Corporation, AT&S Austria Technologie & Systemtechnik AG, LPKF Laser & Electronics SE, ASMPT Limited, and Besi N.V.

Key Developments:

In August 2026, ASE Technology Holding Co., Ltd. announced the qualification of its fan-out panel-level packaging process for AI accelerator applications, enabling cost-effective production of large multi-die packages.

In April 2026, Amkor Technology, Inc. expanded its panel-level packaging capacity in Asia to meet growing demand for advanced packaging services.

In December 2025, Deca Technologies introduced a new adaptive patterning technology for panel-level packaging, improving yield and reducing die shift.

In July 2025, Powertech Technology Inc. announced the launch of panel-level chip-scale packaging services for mobile and consumer applications.

Packaging Formats Covered:

  • Fan-Out Panel-Level Packaging
  • Fan-In Panel-Level Packaging
  • Panel-Level Chip-Scale Packaging
  • Panel-Level System-in-Package
  • Panel-Level Embedded Die Packaging
  • Other Packaging Formats

Panel Substrates Covered:

  • Organic Substrates
  • Glass Substrates
  • Reconstituted Molded Panels
  • Ceramic Substrates
  • Metal-Based Panels
  • Other Panel Substrates

Panel Sizes Covered:

  • 300 mm-Class Panels
  • 500 mm-Class Panels
  • 600 mm-Class Panels
  • 700 mm-Class Panels
  • Large-Format Panels

Package Configurations Covered:

  • Single-Die Packages
  • Multi-Die Packages
  • Chiplet Packages
  • Memory-Logic Packages
  • Heterogeneous Packages
  • Other Package Configurations

End Users Covered:

  • Foundries
  • Outsourced Semiconductor Assembly and Test Providers
  • Integrated Device Manufacturers
  • Fabless Semiconductor Companies
  • Electronics Manufacturing Service Providers
  • Other End Users

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Panel-Level Packaging Market, By Packaging Format

  • 5.1 Fan-Out Panel-Level Packaging
  • 5.2 Fan-In Panel-Level Packaging
  • 5.3 Panel-Level Chip-Scale Packaging
  • 5.4 Panel-Level System-in-Package
  • 5.5 Panel-Level Embedded Die Packaging
  • 5.6 Other Packaging Formats

6 Global Panel-Level Packaging Market, By Panel Substrate

  • 6.1 Organic Substrates
  • 6.2 Glass Substrates
  • 6.3 Reconstituted Molded Panels
  • 6.4 Ceramic Substrates
  • 6.5 Metal-Based Panels
  • 6.6 Other Panel Substrates

7 Global Panel-Level Packaging Market, By Panel Size

  • 7.1 300 mm-Class Panels
  • 7.2 500 mm-Class Panels
  • 7.3 600 mm-Class Panels
  • 7.4 700 mm-Class Panels
  • 7.5 Large-Format Panels

8 Global Panel-Level Packaging Market, By Package Configuration

  • 8.1 Single-Die Packages
  • 8.2 Multi-Die Packages
  • 8.3 Chiplet Packages
  • 8.4 Memory-Logic Packages
  • 8.5 Heterogeneous Packages
  • 8.6 Other Package Configurations

9 Global Panel-Level Packaging Market, By End User

  • 9.1 Foundries
  • 9.2 Outsourced Semiconductor Assembly and Test Providers
  • 9.3 Integrated Device Manufacturers
  • 9.4 Fabless Semiconductor Companies
  • 9.5 Electronics Manufacturing Service Providers
  • 9.6 Other End Users

10 Global Panel-Level Packaging Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 TSMC
  • 13.2 Samsung Electronics Co., Ltd.
  • 13.3 Intel Corporation
  • 13.4 ASE Technology Holding Co., Ltd.
  • 13.5 Amkor Technology, Inc.
  • 13.6 Powertech Technology Inc.
  • 13.7 ChipMOS TECHNOLOGIES INC.
  • 13.8 Deca Technologies
  • 13.9 JCET Group Co., Ltd.
  • 13.10 Shinko Electric Industries Co., Ltd.
  • 13.11 Unimicron Technology Corporation
  • 13.12 AT&S Austria Technologie & Systemtechnik AG
  • 13.13 LPKF Laser & Electronics SE
  • 13.14 ASMPT Limited
  • 13.15 Besi N.V.

List of Tables

  • Table 1 Global Panel-Level Packaging Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Panel-Level Packaging Market, By Packaging Format (2023-2034) ($MN)
  • Table 3 Global Panel-Level Packaging Market, By Fan-Out Panel-Level Packaging (2023-2034) ($MN)
  • Table 4 Global Panel-Level Packaging Market, By Fan-In Panel-Level Packaging (2023-2034) ($MN)
  • Table 5 Global Panel-Level Packaging Market, By Panel-Level Chip-Scale Packaging (2023-2034) ($MN)
  • Table 6 Global Panel-Level Packaging Market, By Panel-Level System-in-Package (2023-2034) ($MN)
  • Table 7 Global Panel-Level Packaging Market, By Panel-Level Embedded Die Packaging (2023-2034) ($MN)
  • Table 8 Global Panel-Level Packaging Market, By Other Packaging Formats (2023-2034) ($MN)
  • Table 9 Global Panel-Level Packaging Market, By Panel Substrate (2023-2034) ($MN)
  • Table 10 Global Panel-Level Packaging Market, By Organic Substrates (2023-2034) ($MN)
  • Table 11 Global Panel-Level Packaging Market, By Glass Substrates (2023-2034) ($MN)
  • Table 12 Global Panel-Level Packaging Market, By Reconstituted Molded Panels (2023-2034) ($MN)
  • Table 13 Global Panel-Level Packaging Market, By Ceramic Substrates (2023-2034) ($MN)
  • Table 14 Global Panel-Level Packaging Market, By Metal-Based Panels (2023-2034) ($MN)
  • Table 15 Global Panel-Level Packaging Market, By Other Panel Substrates (2023-2034) ($MN)
  • Table 16 Global Panel-Level Packaging Market, By Panel Size (2023-2034) ($MN)
  • Table 17 Global Panel-Level Packaging Market, By 300 mm-Class Panels (2023-2034) ($MN)
  • Table 18 Global Panel-Level Packaging Market, By 500 mm-Class Panels (2023-2034) ($MN)
  • Table 19 Global Panel-Level Packaging Market, By 600 mm-Class Panels (2023-2034) ($MN)
  • Table 20 Global Panel-Level Packaging Market, By 700 mm-Class Panels (2023-2034) ($MN)
  • Table 21 Global Panel-Level Packaging Market, By Large-Format Panels (2023-2034) ($MN)
  • Table 22 Global Panel-Level Packaging Market, By Package Configuration (2023-2034) ($MN)
  • Table 23 Global Panel-Level Packaging Market, By Single-Die Packages (2023-2034) ($MN)
  • Table 24 Global Panel-Level Packaging Market, By Multi-Die Packages (2023-2034) ($MN)
  • Table 25 Global Panel-Level Packaging Market, By Chiplet Packages (2023-2034) ($MN)
  • Table 26 Global Panel-Level Packaging Market, By Memory-Logic Packages (2023-2034) ($MN)
  • Table 27 Global Panel-Level Packaging Market, By Heterogeneous Packages (2023-2034) ($MN)
  • Table 28 Global Panel-Level Packaging Market, By Other Package Configurations (2023-2034) ($MN)
  • Table 29 Global Panel-Level Packaging Market, By End User (2023-2034) ($MN)
  • Table 30 Global Panel-Level Packaging Market, By Foundries (2023-2034) ($MN)
  • Table 31 Global Panel-Level Packaging Market, By Outsourced Semiconductor Assembly and Test Providers (2023-2034) ($MN)
  • Table 32 Global Panel-Level Packaging Market, By Integrated Device Manufacturers (2023-2034) ($MN)
  • Table 33 Global Panel-Level Packaging Market, By Fabless Semiconductor Companies (2023-2034) ($MN)
  • Table 34 Global Panel-Level Packaging Market, By Electronics Manufacturing Service Providers (2023-2034) ($MN)
  • Table 35 Global Panel-Level Packaging Market, By Other End Users (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) are also represented in the same manner as above.