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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1878278

面板級封裝市場－2025-2030 年預測

Panel Level Packaging Market - Forecasts from 2025 to 2030

出版日期: 2025年11月03日 | 出版商:

Knowledge Sourcing Intelligence | 英文 150 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

面板級封裝市場預計將從 2025 年的 405,083,000 美元成長到 2030 年的 1,968,233,000 美元，複合年成長率為 37.18%。

面板級包裝市場分析

面板級封裝是一種先進的組裝技術，它將電子元件整合到大型基板或面板上，然後將該面板分割成更小的單元或獨立封裝。這些面板採用多種材料製造，包括玻璃、陶瓷和有機基板，從而在設計和性能特性方面具有靈活性。多種組裝技術，例如覆晶合、焊線和表面黏著技術(SMT)，用於將電子元件固定到面板基板。電阻器和電容器等被動元件也可以嵌入基板結構中，從而實現更高的整合密度和更優異的電氣性能。

面板級封裝技術是全球半導體封裝產業最具發展前景的領域之一。推動面板級封裝市場發展的關鍵因素包括靈活的電路設計能力和滿足現代半導體應用經濟和技術要求的成本效益高的封裝解決方案。這項技術使製造商能夠在保持先進電子應用所需的高精度和高可靠性標準的同時，實現規模經濟。

主要市場促進因素

電子設備和5G技術

面板級封裝市場預計將在5G網路、人工智慧、進階駕駛輔助系統（ADAS）、智慧城市和物聯網相關產品等未來應用中發揮關鍵作用。面板級封裝具有高效能、節能、輕薄小巧外形規格，並有望在消費性電子產業中廣泛應用，用於製造智慧型手機、筆記型電腦和智慧型穿戴裝置等超薄便攜設備。

美國消費科技協會 (CTA) 預測，消費性電子產品零售額將成長 4.3%，達到 4,610 億美元，顯示市場正強勁擴張。消費性電子產品銷售額的年成長顯著提升了對面板級封裝解決方案的需求，以支持小型化趨勢。據 CTA 稱，記憶體、邏輯電路、類比電路和微處理器相關的半導體產品佔半導體行業總銷售額的 80% 以上，這促使市場領導更加專注於這些特定產品類型類別的面板級封裝製程。

主流5G智慧型手機天線模組採用面板級封裝技術，這使得5G部署與封裝需求之間形成了直接的需求連結。全球行動通訊系統協會（GSMA）預測，到2025年，全球三分之一的人口將覆蓋5G網路，這將顯著提升對5G智慧型手機的需求。美國消費科技協會（CTA）估計，2022年5G智慧型手機的營收將達到613.7億美元，比2021年的533.8億美元成長15%。這一成長趨勢表明，市場對面板級封裝解決方案的需求龐大，以支援下一代無線技術的部署。

汽車產業的成長

在汽車行業，採用能夠將電子元件小型化並整合到單一面板上的尖端半導體封裝技術，預計將顯著推動面板級封裝市場的成長。電氣及電子工程師學會（IEEE）指出，諸如車聯網（V2X）和高級駕駛輔助系統（ADAS）等技術通訊，持續維持汽車產業對半導體的需求。

根據國際汽車製造商協會（OICA）的數據，2021年印度乘用車銷量約佔全球總銷量的68.21%，而中國和美國是該領域最大的兩個市場。印度汽車製造商協會（SIAM）的報告顯示，印度汽車產業持續穩定成長，2021-2022會計年度（2021年4月至2022年2月）汽車銷售量成長了35.97%。這表明，全球市場對面板級封裝解決方案的需求巨大，以支持汽車電子產品的普及。

隨著汽車產業向電氣化、自動駕駛和聯網汽車汽車等方向發展，每輛車所需的半導體數量顯著增加。面板級封裝（PLP）技術能夠以經濟高效的方式整合複雜的電子系統，同時滿足汽車應用特有的嚴格可靠性和環境要求，從而滿足這些需求。

區域市場動態

預計亞太地區在整個預測期內將繼續保持顯著的市場佔有率。該地區是重要的半導體製造中心，並在面板級封裝技術發展方面處於領先地位。根據半導體產業協會（SIA）估計，亞太地區佔全球半導體銷售額的50%以上，鞏固了該地區在全球半導體生產領域的主導地位。

許多主要的面板級封裝市場參與企業都位於台灣，包括台積電、日月光科技和力拓科技。這些公司正大力投資面板級封裝技術，以提升其半導體產品的功能和提案。 2020年，台灣政府工業局推出了“半導體登月計劃”，旨在開發包括面板級封裝在內的先進封裝技術。該計劃在五年內共投入500億新台幣（約18億美元），反映了政府維持技術領先地位的決心。

這些因素共同推動亞太半導體市場的成長，產生協同效應，將在整個預測期內促進面板級封裝市場的發展，從而鞏固該地區作為全球先進半導體封裝技術開發和生產中心的地位。

本報告的主要優勢：

深入分析：提供對主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、行業垂直領域和其他細分市場。
競爭格局：了解全球主要參與者採取的策略舉措，並了解透過正確的策略進入市場的潛力。
市場促進因素與未來趨勢：分析市場促進因素和關鍵趨勢及其對未來市場發展的影響。
可操作的建議：利用這些見解，在動態環境中做出策略決策，並開拓新的商機和收入來源。
受眾廣泛：適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業，且經濟實惠。

公司如何使用我們的報告範例

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

2022年至2024年的歷史數據和2025年至2030年的預測數據
成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
競爭定位、策略和市場佔有率分析
按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
公司概況（策略、產品、財務資訊、關鍵發展等）

Panel level packaging represents an advanced assembly methodology involving the integration of electrical components onto large substrates or panels, which are subsequently divided into smaller units or individual packages. These panels are fabricated from diverse materials including glass, ceramic, or organic substrates, providing flexibility in design and performance characteristics. Multiple assembly techniques including flip-chip bonding, wire bonding, and surface mount technology are employed to secure electrical components to the panel substrate. Passive components such as resistors and capacitors may also be embedded within the substrate structure, enabling higher integration density and improved electrical performance.

Panel-level package technology represents the most promising advancement area within the global semiconductor packaging industry. Key influencing elements driving panel-level packaging market development include flexible circuit design capabilities and cost-effective packaging solutions that address the economic and technical requirements of modern semiconductor applications. This technology enables manufacturers to achieve economies of scale while maintaining high precision and reliability standards essential for advanced electronic applications.

Primary Market Drivers

Electronic Devices and 5G Technology

The panel level packaging market is anticipated to play crucial roles in future applications involving 5G networks, artificial intelligence, advanced driver-assistance systems (ADAS), smart cities, and Internet of Things-related products. Panel-level packaging delivers high-performing, energy-efficient, thin, and small form factor packages finding extensive applications in the consumer electronics industry for creating ultra-thin portable devices including smart mobile phones, laptops, and smart wearables.

The Consumer Technology Association (CTA) predicted retail purchases of consumer electronics would increase by 4.3% to $461 billion, demonstrating robust market expansion. Annual growth in consumer electronics sales has substantially increased demand for panel-level packaging solutions supporting miniaturization trends. According to CTA, memory, logic, analog, and microprocessor-related semiconductor products account for more than 80% of total semiconductor industry sales, providing market leaders with stronger motivation to concentrate on panel-level packaging processes for these specific product categories.

Mainstream chips in antenna modules of 5G smartphones utilize panel-level packaging technology, creating direct demand linkage between 5G deployment and packaging requirements. The Groupe Speciale Mobile Association (GSMA) predicted that by 2025, one-third of the world's population would be serviced by 5G networks, substantially increasing demand for 5G-enabled smartphones. The Consumer Technology Association (CTA) estimated 5G smartphone sales would generate $61.37 billion in revenue in 2022, representing a 15% increase from $53.38 billion in 2021. This growth trajectory demonstrates substantial demand for panel-level packaging market solutions supporting next-generation wireless technology deployment.

Automotive Sector Growth

The automotive sector is expected to boost panel level packaging market growth significantly through adoption of cutting-edge semiconductor packaging technologies enabling miniaturization and integration of electronic components onto single panels. The Institute of Electrical and Electronics Engineers (IEEE) noted that automotive industry demand for semiconductors has remained consistent due to advancements in technologies including vehicle-to-everything communication and advanced driver-assistance systems (ADAS).

According to the International Organization of Motor Vehicle Manufacturers (OICA), approximately 68.21% of passenger cars were sold globally in 2021, with China and the United States representing the two largest markets in this sector. The Society of Indian Automobile Manufacturers (SIAM) reported that the Indian automobile industry has been expanding steadily, with automobile sales increasing by 35.97% in fiscal year 2021-22 (April 2021 through February 2022). This demonstrates substantial demand for panel level packaging solutions supporting automotive electronics proliferation across global markets.

The automotive industry's transition toward electrification, autonomous driving capabilities, and connected vehicle features requires significantly increased semiconductor content per vehicle. Panel-level packaging technology addresses these requirements by enabling cost-effective integration of complex electronic systems while meeting the stringent reliability and environmental requirements characteristic of automotive applications.

Regional Market Dynamics

During the forecast period, the Asia Pacific region is expected to maintain significant market share dominance. The Asia Pacific region functions as a major hub for semiconductor manufacturing and has positioned itself at the forefront of panel-level packaging technology development. The Semiconductor Industry Association (SIA) estimated that Asia-Pacific accounts for more than 50% of worldwide semiconductor revenue, underscoring the region's dominant position in global semiconductor production.

Numerous significant panel-level packaging market participants including TSMC, ASE Technology Holding, and Powertech Technology are based in Taiwan. These companies are making substantial investments in panel-level packaging technology to enhance functionality and value propositions of their semiconductor products. The Taiwanese government's Industrial Development Bureau (IDB) launched the "Semiconductor Moonshot Project" in 2020, aimed at developing advanced packaging technologies including panel-level packaging. The project was allocated total funding of TWD 50 billion (approximately $1.8 billion) over five years, demonstrating governmental commitment to maintaining technological leadership.

These factors collectively contribute to semiconductor market growth in Asia Pacific regions, creating reinforcing momentum that boosts the panel level packaging market throughout the forecast period and solidifies the region's position as the global epicenter for advanced semiconductor packaging innovation and production.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

PANEL LEVEL PACKAGING MARKET BY WAFER SIZE
Up to 400mm
More than 400mm
PANEL LEVEL PACKAGING MARKET BY END-USER
Automotive
Electronics
Communications
Others
PANEL LEVEL PACKAGING MARKET BY GEOGRAPHY
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Others
Asia Pacific
China
India
Japan
South Korea
Indonesia
Thailand
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. PANEL LEVEL PACKAGING MARKET BY WAFER SIZE

5.1. Introduction
5.2. Up to 400mm
5.3. More than 400mm

6. PANEL LEVEL PACKAGINGMARKET BY END-USER

6.1. Introduction
6.2. Automotive
6.3. Electronics
6.4. Communications
6.5. Others

7. PANEL LEVEL PACKAGING MARKET BY GEOGRAPHY

7.1. Introduction
7.2. North America
- 7.2.1. USA
- 7.2.2. Canada
- 7.2.3. Mexico
7.3. South America
- 7.3.1. Brazil
- 7.3.2. Argentina
- 7.3.3. Others
7.4. Europe
- 7.4.1. Germany
- 7.4.2. France
- 7.4.3. United Kingdom
- 7.4.4. Spain
- 7.4.5. Others
7.5. Middle East and Africa
- 7.5.1. Saudi Arabia
- 7.5.2. UAE
- 7.5.3. Others
7.6. Asia Pacific
- 7.6.1. China
- 7.6.2. India
- 7.6.3. Japan
- 7.6.4. South Korea
- 7.6.5. Indonesia
- 7.6.6. Thailand
- 7.6.7. Others