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市場調查報告書

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2074895

電子封裝材料市場預測至2034年－全球材料類型、封裝類型、性能、應用、產品形式與區域分析

Electronic Packaging Materials Market Forecasts to 2034 - Global Analysis By Material Type, Packaging Type, Property, Application, Product Form and Geography

出版日期: 2026年06月11日 | 出版商:

Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，預計到 2026 年，全球電子封裝材料市場規模將達到 320 億美元，並在預測期內以 8.5% 的複合年成長率成長，到 2034 年將達到 615 億美元。

電子封裝材料是用於保護、連接、絕緣和支撐電子系統中電子元件和半導體裝置的材料。這些材料包括基板、封裝材料、黏合劑、導熱介面材料、陶瓷、聚合物和導電化合物，旨在確保可靠性、溫度控管和電氣性能。電子封裝材料在提高家用電子電器、通訊、汽車電子和工業系統中裝置的耐用性、小型化和功能性方面發揮著至關重要的作用。半導體技術的進步和電子裝置日益成長的複雜性正在推動全球電子封裝材料的持續創新。

半導體製造需求不斷成長

封裝材料對於保護晶片、確保電氣性能和實現小型化至關重要。半導體裝置可靠性和效率的提升正使各公司受益匪淺。世界各國政府都在資助半導體供應鏈項目，以加強國內生產。供應商也在投資研發先進的封裝材料，例如高性能聚合物、陶瓷和複合材料。對半導體日益成長的需求正在推動全球電子封裝材料的應用。

複雜溫度控管的挑戰

最先進的晶片會產生巨大的熱負荷，因此需要高導熱性和高穩定性的封裝材料。企業面臨著如何在性能和成本效益之間取得平衡的挑戰。中小企業難以承擔實施專用溫度控管技術的成本。供應商必須設計出既能實現電絕緣又能有效散熱的材料。儘管各國政府鼓勵創新，但全球發展仍有差距。這些溫度控管方面的挑戰正在阻礙先進封裝材料的廣泛商業化。

先進的晶片封裝創新

先進的封裝技術，例如3D堆疊、系統級封裝（SiP）和扇出型晶圓級封裝，蘊藏著巨大的發展機會。這些技術需要具有卓越電學、熱學和機械性能的新型材料。對於企業而言，這些技術帶來的益處包括提升裝置效能、縮小面積和提高可靠性。供應商正在投資研發針對下一代晶片最佳化的封裝材料。世界各國政府都在資助旨在加強半導體生態系統的各項舉措，而半導體公司與材料供應商之間的夥伴關係正在不斷擴大其影響力。

半導體市場需求波動

家用電子電器、汽車和電腦市場的周期性變化導致包裝材料需求波動。企業面臨供應過剩或供不應求的風險，這取決於市場週期。供應商難以維持穩定的生產和定價。中小企業尤其容易受到需求波動的影響。儘管各國政府都在努力提高供應鏈的韌性，但全球供需失衡的局面依然存在。這些波動阻礙了市場的穩定擴張。

新型冠狀病毒（COVID-19）的影響：

新冠感染疾病對電子封裝材料市場的影響喜憂參半。初期，由於封鎖期間半導體產量下降，市場需求放緩。然而，疫情加速了數位設備的普及，提振了半導體的長期需求。企業開始考慮採用先進的封裝材料來增強供應鏈的韌性。各國政府也將半導體創新納入經濟復甦計畫。供應鏈中斷減緩了產能擴張的步伐。整體而言，疫情起到了催化劑的作用，加速了人們對電子封裝材料的長期需求。

在預測期內，電氣絕緣領域預計將佔據最大的市場佔有率。

由於絕緣材料對於保護半導體裝置免受漏電影響、確保可靠性和維持性能穩定性至關重要，預計在預測期內，電氣絕緣材料將佔據最大的市場佔有率。家用電子電器和汽車產業正在積極應用絕緣材料。供應商正在投資研發先進的絕緣聚合物和複合材料。各國政府透過半導體現代化計畫支持相關研究。宣傳宣傳活動也在強調絕緣材料在實現下一代晶片中的重要性。

預計在預測期內，導熱係數細分市場將呈現最高的複合年成長率。

在預測期內，由於高性能晶片和微型元件對高效散熱封裝材料的需求不斷成長，導熱領域預計將呈現最高的成長率。企業正從延長裝置壽命和降低故障率中獲益。世界各國政府都在資助相關項目，以加強溫度控管創新。供應商與半導體公司之間的合作正在擴大市場覆蓋範圍。宣傳宣傳活動強調了導熱技術在日益小型化的電子產品開發中的重要作用。新創企業也正攜創新的導熱封裝解決方案進入市場。

市佔率最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這主要得益於該地區在封裝材料領域的大量投資，以及消費性電子和汽車電子產業的早期應用。中國、日本、韓國和台灣等國家和地區在半導體封裝生產方面處於領先地位。相關政策框架正在推動整個產業領域的現代化。企業正日益採用先進的封裝解決方案。創新材料的廣泛應用在全部區域蓬勃發展。學術機構也積極進行半導體封裝應用的研究。

複合年成長率最高的地區：

在預測期內，亞太地區預計將呈現最高的複合年成長率，這主要得益於對先進晶片需求的成長以及政府對半導體創新提供的補貼。印度和東南亞國家正在崛起為封裝材料應用的新興中心。經濟實惠的解決方案在中型製造商中越來越受歡迎。半導體和電子相關項目正在擴大先進封裝技術的普及範圍。電子商務平台正在促進材料向各類企業的分銷。年輕一代越來越青睞高性能、小型化產品。

免費客製化服務：

所有購買此報告的客戶均可享受以下免費自訂選項之一：

企業概況
- 對其他市場參與者（最多 3 家公司）進行全面分析
- 對主要公司進行SWOT分析（最多3家公司）
區域分類
- 根據客戶要求，我們可以提供主要國家的市場估算和預測，以及複合年成長率（註：需經可行性確認）。
競爭性標竿分析
- 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 荷蘭
- 比利時
- 瑞典
- 瑞士
- 波蘭
- 其他歐洲國家
亞太地區
- 中國
- 日本
- 印度
- 韓國
- 澳洲
- 印尼
- 泰國
- 馬來西亞
- 新加坡
- 越南
- 其他亞太國家
南美洲
- 巴西
- 阿根廷
- 哥倫比亞
- 智利
- 秘魯
- 其他南美國家
世界其他地區（RoW）
- 中東
  - 沙烏地阿拉伯
  - 阿拉伯聯合大公國
  - 卡達
  - 以色列
  - 其他中東國家
- 非洲
  - 南非
  - 埃及
  - 摩洛哥
  - 其他非洲國家

第11章策略市場資訊

工業價值網路和供應鏈評估
空白區域和機會地圖
產品演進與市場生命週期分析
通路、經銷商和打入市場策略的評估

第12章產業趨勢與策略舉措

併購
夥伴關係、聯盟和合資企業
新產品發布和認證
擴大生產能力和投資
其他策略舉措

第13章：公司簡介

DuPont de Nemours, Inc.
Henkel AG & Co. KGaA
Hitachi Chemical Co., Ltd.
Shin-Etsu Chemical Co., Ltd.
Sumitomo Bakelite Co., Ltd.
BASF SE
Toray Industries, Inc.
Mitsubishi Chemical Group Corporation
AGC Inc.
Nitto Denko Corporation
Huntsman Corporation
SABIC
Dow Inc.
Kuraray Co., Ltd.
Merck KGaA

簡介目錄圖表

Product Code: SMRC37430

According to Stratistics MRC, the Global Electronic Packaging Materials Market is accounted for $32.0 billion in 2026 and is expected to reach $61.5 billion by 2034 growing at a CAGR of 8.5% during the forecast period. Electronic packaging materials are materials used to protect, connect, insulate, and support electronic components and semiconductor devices within electronic systems. These materials include substrates, encapsulants, adhesives, thermal interface materials, ceramics, polymers, and conductive compounds designed to ensure reliability, heat management, and electrical performance. Electronic packaging materials play a vital role in enhancing device durability, miniaturization, and functionality across consumer electronics, telecommunications, automotive electronics, and industrial systems. Advancements in semiconductor technologies and increasing electronic device complexity are driving continuous innovation in electronic packaging materials globally.

Market Dynamics:

Driver:

Rising semiconductor manufacturing demand

Packaging materials are critical for protecting chips, ensuring electrical performance, and enabling miniaturization. Enterprises benefit from improved reliability and efficiency in semiconductor devices. Governments are funding semiconductor supply chain initiatives to strengthen domestic production. Vendors are investing in advanced packaging materials such as high-performance polymers, ceramics, and composites. This rising demand for semiconductors is propelling adoption of electronic packaging materials worldwide.

Restraint:

Complex thermal management challenges

Advanced chips generate significant thermal loads, requiring packaging materials with high conductivity and stability. Enterprises face challenges in balancing performance with cost-effective solutions. Smaller firms struggle to afford specialized thermal management technologies. Vendors must design materials that combine electrical insulation with effective heat dissipation. Governments are encouraging innovation, but global disparities remain. These thermal challenges are slowing widespread commercialization of advanced packaging materials.

Opportunity:

Advanced chip packaging innovations

An important opportunity lies in advanced chip packaging innovations such as 3D stacking, system-in-package (SiP), and fan-out wafer-level packaging. These approaches demand new materials with superior electrical, thermal, and mechanical properties. Enterprises benefit from improved device performance, reduced footprint, and enhanced reliability. Vendors are investing in packaging materials tailored for next-generation chips. Governments are funding initiatives to strengthen semiconductor ecosystems. Partnerships between semiconductor firms and material providers are expanding reach.

Threat:

Semiconductor market demand fluctuations

Cyclical shifts in consumer electronics, automotive, and computing markets create volatility in packaging material demand. Enterprises risk overcapacity or shortages depending on market cycles. Vendors face challenges in maintaining stable production and pricing. Smaller firms are particularly vulnerable to demand swings. Governments are promoting supply chain resilience, but global inconsistencies persist. These fluctuations are posing hurdles to consistent market expansion.

Covid-19 Impact:

Covid-19 had a mixed impact on the electronic packaging materials market. Demand slowed initially as semiconductor production declined during lockdowns. However, the pandemic accelerated adoption of digital devices, boosting long-term semiconductor demand. Enterprises began exploring advanced packaging materials to strengthen supply chain resilience. Governments included semiconductor innovation in recovery packages. Supply chain disruptions delayed production scale-up. Overall, the pandemic acted as a catalyst, accelerating long-term interest in electronic packaging materials.

The electrical insulation segment is expected to be the largest during the forecast period

The electrical insulation segment is expected to account for the largest market share during the forecast period as insulation materials are essential for protecting semiconductor devices from electrical leakage, ensuring reliability, and maintaining performance stability. Adoption is strong among consumer electronics and automotive industries. Vendors are investing in advanced insulation polymers and composites. Governments are supporting research through semiconductor modernization programs. Awareness campaigns highlight the importance of insulation in enabling next-generation chips.

The thermal conductivity segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the thermal conductivity segment is predicted to witness the highest growth rate due to rising demand for packaging materials that efficiently dissipate heat in high-performance chips and compact devices. Enterprises benefit from improved device longevity and reduced failure rates. Governments are funding initiatives to strengthen thermal management innovation. Partnerships between vendors and semiconductor firms are expanding reach. Awareness campaigns emphasize the role of thermal conductivity in advancing miniaturized electronics. Startups are entering the market with innovative thermal packaging solutions.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share owing to significant investment in packaging materials, and early adoption across consumer and automotive electronics industries. Countries such as China, Japan, South Korea, and Taiwan are leading in semiconductor packaging production. Policy frameworks encourage modernization across industrial sectors. Enterprises are increasingly deploying advanced packaging solutions. Penetration of innovative materials is widespread across the region. Academic institutions are actively researching semiconductor packaging applications.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR driven by rising demand for advanced chips, and supportive government subsidies for semiconductor innovation. India and Southeast Asian countries are emerging as new hubs for packaging material adoption. Affordable solutions are gaining traction among mid-sized manufacturers. Semiconductor and electronics programs are expanding access to advanced packaging technologies. E-commerce platforms are helping distribute materials to diverse enterprises. Younger demographics are increasingly drawn to high-performance and miniaturized products.

Key players in the market

Some of the key players in Electronic Packaging Materials Market include DuPont de Nemours, Inc., Henkel AG & Co. KGaA, Hitachi Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd., Sumitomo Bakelite Co., Ltd., BASF SE, Toray Industries, Inc., Mitsubishi Chemical Group Corporation, AGC Inc., Nitto Denko Corporation, Huntsman Corporation, SABIC, Dow Inc., Kuraray Co., Ltd. and Merck KGaA.

Key Developments:

In March 2026, Nitto Denko Corporation updated its long-term packaging engineering roadmap to prioritize the deployment of bio-based, ultra-thin backgrinding and dicing tapes. The strategic pivot focuses on supplying high-adhesion processing tapes that leave zero chemical residue on fragile wafer surfaces during ultra-thin substrate processing, matching tightening environmental circular mandates without sacrificing cleanroom purity.

In October 2025, Sumitomo Bakelite officially introduced an optimized suite of photosensitive insulation materials specifically engineered for Redistribution Layers (RDL) in high-density power semiconductors and edge AI chipsets. Alongside these RDL polymers, the company rolled out high-purity granule encapsulation materials and Molded Underfill (MUF) compounds designed to eliminate voids in ultra-fine pitch micro-bump arrays during compression molding.

Material Types Covered:

Substrate Materials
Encapsulation Materials
Thermal Interface Materials
Conductive Materials
Other Material Types

Packaging Types Covered:

IC Packaging
Advanced Packaging
Power Packaging
Optoelectronic Packaging
Other Packaging Types

Properties Covered:

Thermal Conductivity
Electrical Insulation
Moisture Resistance
Mechanical Strength
Other Properties

Applications Covered:

Semiconductors
Consumer Electronics
Automotive Electronics
Telecommunications
Other Applications

End Users Covered:

Films
Laminates
Pastes
Resins
Other Product Forms

Regions Covered:

North America
- United States
- Canada
- Mexico
Europe
- United Kingdom
- Germany
- France
- Italy
- Spain
- Netherlands
- Belgium
- Sweden
- Switzerland
- Poland
- Rest of Europe
Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Thailand
- Malaysia
- Singapore
- Vietnam
- Rest of Asia Pacific
South America
- Brazil
- Argentina
- Colombia
- Chile
- Peru
- Rest of South America
Rest of the World (RoW)
- Middle East
Saudi Arabia
United Arab Emirates
Qatar
Israel
Rest of Middle East
- Africa
South Africa
Egypt
Morocco
Rest of Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

1.1 Market Snapshot and Key Highlights
1.2 Growth Drivers, Challenges, and Opportunities
1.3 Competitive Landscape Overview
1.4 Strategic Insights and Recommendations

2 Research Framework

2.1 Study Objectives and Scope
2.2 Stakeholder Analysis
2.3 Research Assumptions and Limitations
2.4 Research Methodology
- 2.4.1 Data Collection (Primary and Secondary)
- 2.4.2 Data Modeling and Estimation Techniques
- 2.4.3 Data Validation and Triangulation
- 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

3.1 Market Definition and Structure
3.2 Key Market Drivers
3.3 Market Restraints and Challenges
3.4 Growth Opportunities and Investment Hotspots
3.5 Industry Threats and Risk Assessment
3.6 Technology and Innovation Landscape
3.7 Emerging and High-Growth Markets
3.8 Regulatory and Policy Environment
3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

4.1 Porter's Five Forces Analysis
- 4.1.1 Supplier Bargaining Power
- 4.1.2 Buyer Bargaining Power
- 4.1.3 Threat of Substitutes
- 4.1.4 Threat of New Entrants
- 4.1.5 Competitive Rivalry
4.2 Market Share Analysis of Key Players
4.3 Product Benchmarking and Performance Comparison

5 Global Electronic Packaging Materials Market, By Material Type

5.1 Substrate Materials
5.2 Encapsulation Materials
5.3 Thermal Interface Materials
5.4 Conductive Materials
5.5 Other Material Types

6 Global Electronic Packaging Materials Market, By Packaging Type

6.1 IC Packaging
6.2 Advanced Packaging
6.3 Power Packaging
6.4 Optoelectronic Packaging
6.5 Other Packaging Types

7 Global Electronic Packaging Materials Market, By Property

7.1 Thermal Conductivity
7.2 Electrical Insulation
7.3 Moisture Resistance
7.4 Mechanical Strength
7.5 Other Properties

8 Global Electronic Packaging Materials Market, By Application

8.1 Semiconductors
8.2 Consumer Electronics
8.3 Automotive Electronics
8.4 Telecommunications
8.5 Other Applications

9 Global Electronic Packaging Materials Market, By Product Form

9.1 Films
9.2 Laminates
9.3 Pastes
9.4 Resins
9.5 Other Product Forms

10 Global Electronic Packaging Materials Market, By Geography

10.1 North America
- 10.1.1 United States
- 10.1.2 Canada
- 10.1.3 Mexico
10.2 Europe
- 10.2.1 United Kingdom
- 10.2.2 Germany
- 10.2.3 France
- 10.2.4 Italy
- 10.2.5 Spain
- 10.2.6 Netherlands
- 10.2.7 Belgium
- 10.2.8 Sweden
- 10.2.9 Switzerland
- 10.2.10 Poland
- 10.2.11 Rest of Europe
10.3 Asia Pacific
- 10.3.1 China
- 10.3.2 Japan
- 10.3.3 India
- 10.3.4 South Korea
- 10.3.5 Australia
- 10.3.6 Indonesia
- 10.3.7 Thailand
- 10.3.8 Malaysia
- 10.3.9 Singapore
- 10.3.10 Vietnam
- 10.3.11 Rest of Asia Pacific
10.4 South America
- 10.4.1 Brazil
- 10.4.2 Argentina
- 10.4.3 Colombia
- 10.4.4 Chile
- 10.4.5 Peru
- 10.4.6 Rest of South America
10.5 Rest of the World (RoW)
- 10.5.1 Middle East
  - 10.5.1.1 Saudi Arabia
  - 10.5.1.2 United Arab Emirates
  - 10.5.1.3 Qatar
  - 10.5.1.4 Israel
  - 10.5.1.5 Rest of Middle East
- 10.5.2 Africa
  - 10.5.2.1 South Africa
  - 10.5.2.2 Egypt
  - 10.5.2.3 Morocco
  - 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

11.1 Industry Value Network and Supply Chain Assessment
11.2 White-Space and Opportunity Mapping
11.3 Product Evolution and Market Life Cycle Analysis
11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

12.1 Mergers and Acquisitions
12.2 Partnerships, Alliances, and Joint Ventures
12.3 New Product Launches and Certifications
12.4 Capacity Expansion and Investments
12.5 Other Strategic Initiatives

13 Company Profiles

13.1 DuPont de Nemours, Inc.
13.2 Henkel AG & Co. KGaA
13.3 Hitachi Chemical Co., Ltd.
13.4 Shin-Etsu Chemical Co., Ltd.
13.5 Sumitomo Bakelite Co., Ltd.
13.6 BASF SE
13.7 Toray Industries, Inc.
13.8 Mitsubishi Chemical Group Corporation
13.9 AGC Inc.
13.10 Nitto Denko Corporation
13.11 Huntsman Corporation
13.12 SABIC
13.13 Dow Inc.
13.14 Kuraray Co., Ltd.
13.15 Merck KGaA

簡介目錄圖表

List of Tables

Table 1 Global Electronic Packaging Materials Market Outlook, By Region (2023-2034) ($MN)
Table 2 Global Electronic Packaging Materials Market, By Material Type (2023-2034) ($MN)
Table 3 Global Electronic Packaging Materials Market, By Substrate Materials (2023-2034) ($MN)
Table 4 Global Electronic Packaging Materials Market, By Encapsulation Materials (2023-2034) ($MN)
Table 5 Global Electronic Packaging Materials Market, By Thermal Interface Materials (2023-2034) ($MN)
Table 6 Global Electronic Packaging Materials Market, By Conductive Materials (2023-2034) ($MN)
Table 7 Global Electronic Packaging Materials Market, By Other Material Types (2023-2034) ($MN)
Table 8 Global Electronic Packaging Materials Market, By Packaging Type (2023-2034) ($MN)
Table 9 Global Electronic Packaging Materials Market, By IC Packaging (2023-2034) ($MN)
Table 10 Global Electronic Packaging Materials Market, By Advanced Packaging (2023-2034) ($MN)
Table 11 Global Electronic Packaging Materials Market, By Power Packaging (2023-2034) ($MN)
Table 12 Global Electronic Packaging Materials Market, By Optoelectronic Packaging (2023-2034) ($MN)
Table 13 Global Electronic Packaging Materials Market, By Other Packaging Types (2023-2034) ($MN)
Table 14 Global Electronic Packaging Materials Market, By Property (2023-2034) ($MN)
Table 15 Global Electronic Packaging Materials Market, By Thermal Conductivity (2023-2034) ($MN)
Table 16 Global Electronic Packaging Materials Market, By Electrical Insulation (2023-2034) ($MN)
Table 17 Global Electronic Packaging Materials Market, By Moisture Resistance (2023-2034) ($MN)
Table 18 Global Electronic Packaging Materials Market, By Mechanical Strength (2023-2034) ($MN)
Table 19 Global Electronic Packaging Materials Market, By Other Properties (2023-2034) ($MN)
Table 20 Global Electronic Packaging Materials Market, By Application (2023-2034) ($MN)
Table 21 Global Electronic Packaging Materials Market, By Semiconductors (2023-2034) ($MN)
Table 22 Global Electronic Packaging Materials Market, By Consumer Electronics (2023-2034) ($MN)
Table 23 Global Electronic Packaging Materials Market, By Automotive Electronics (2023-2034) ($MN)
Table 24 Global Electronic Packaging Materials Market, By Telecommunications (2023-2034) ($MN)
Table 25 Global Electronic Packaging Materials Market, By Other Applications (2023-2034) ($MN)
Table 26 Global Electronic Packaging Materials Market, By Product Form (2023-2034) ($MN)
Table 27 Global Electronic Packaging Materials Market, By Films (2023-2034) ($MN)
Table 28 Global Electronic Packaging Materials Market, By Laminates (2023-2034) ($MN)
Table 29 Global Electronic Packaging Materials Market, By Pastes (2023-2034) ($MN)
Table 30 Global Electronic Packaging Materials Market, By Resins (2023-2034) ($MN)
Table 31 Global Electronic Packaging Materials Market, By Other Product Forms (2023-2034) ($MN)