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市場調查報告書
商品編碼
1957149

電子封裝市場－全球產業規模、佔有率、趨勢、機會、預測：依材料、封裝技術、最終用戶、地區和競爭格局分類，2021-2031年

Electronic Packaging Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Material, By Packaging Technology, By End User, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 185 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球電子封裝市場預計將從 2025 年的 17.1 億美元大幅成長至 2031 年的 47.9 億美元，複合年成長率為 18.73%。

電子封裝是指保護半導體元件的外殼和結構，對於確保物理完整性和溫度控管至關重要。這項市場擴張的主要驅動力是先進半導體在消費性電子和汽車領域的應用日益廣泛，這些領域對耐用性和效率有嚴格的要求。為了滿足不斷成長的晶片需求，SEMI報告稱，為反映整個供應鏈的活性化，到2024年，全球半導體晶圓廠的產能將增加6%。

市場概覽
預測期 2027-2031
市場規模：2025年 17.1億美元
市場規模：2031年 47.9億美元
複合年成長率：2026-2031年 18.73%
成長最快的細分市場 家用電子電器
最大的市場 亞太地區

然而，緊湊型裝置結構中溫度控管的技術複雜性為市場帶來了巨大的挑戰。在不影響可靠性的前提下，在高密度環境中散熱會產生高昂的成本，這些成本構成了限制快速發展的財務和技術障礙。這些挑戰凸顯了小型化追求與當前熱控制技術物理限制之間的矛盾。

市場促進因素

汽車產業的快速數位化和電氣化是推動對高可靠性電子封裝解決方案需求的主要動力。隨著汽車產業向自動駕駛和電動出行轉型，對能夠承受嚴苛工作環境的感測器模組和電力電子產品的需求日益成長。這些封裝系統對於維持現代汽車中高壓電池管理系統和碳化矽逆變器的熱效率和機械可靠性至關重要。國際能源總署（IEA）於2024年4月發布的《2024年全球電動車展望》報告也印證了這一趨勢，該報告預測，到2024年，電動車銷量將達到約1700萬輛，而銷量的成長將需要擴大汽車級半導體封裝能力。

此外，先進封裝技術的快速普及，尤其是在高效能運算領域，也推動了市場成長。製造商正擴大採用異質整合和3D堆疊技術來提升頻寬和處理速度，這就需要能夠支援卓越散熱和高密度互連的封裝結構。這種技術革新正在推動對專用設施的大規模資本投資。例如，SK海力士在2024年4月的新聞稿中宣布，將投資38.7億美元在印第安納州建造先進封裝廠，以支援人工智慧供應鏈。這一成長與整個行業的復甦相吻合。根據半導體產業協會的報告，2024年8月全球半導體銷售額達531億美元，顯示市場需求強勁。

市場挑戰

全球電子封裝市場的一大障礙在於，如何在緊湊的裝置結構中有效控制散熱，這是一項極具挑戰性的技術難題。儘管半導體元件的密度不斷提高以提升性能，但它們必須在日益縮小的封裝空間內有效地散發大量熱量，以確保可靠性。這種物理限制迫使製造商採用高成本的專用材料和複雜的設計，從根本上增加了封裝流程的複雜性。因此，必須進行嚴格的測試以防止過熱失效，這延長了產品開發週期，延遲了新產品的上市時間，並減緩了整個行業的創新步伐。

此外，採用這些先進散熱解決方案所帶來的財務負擔也對市場成長構成了重大障礙。處理高密度環境所需的精密機械設備需要巨額資本投入，這擠壓了現有企業的利潤空間，並限制了中小企業的進入。這種必要支出的增加反映在近期的產業趨勢中。根據SEMI於2025年4月發布的報告，2024年全球組裝和封裝設備的銷售額成長了25%。設備成本的激增表明，應對散熱挑戰所帶來的財務負擔正在直接阻礙電子封裝產業的擴充性和快速成長。

市場趨勢

系統級封裝 (SiP) 解決方案的日益普及正在從根本上改變全球電子封裝市場，其驅動力在於市場對整合邏輯、記憶體和感測器等多種半導體元件的緊湊型模組的需求。這種方法解決了汽車系統和消費性電子產品在提高功能密度和小型化方面面臨的關鍵挑戰，使製造商能夠在縮小裝置面積的同時簡化供應鏈物流。為了適應這些模組化架構，領先的合約組裝和測試服務供應商正在積極擴展其生產基礎設施。例如，根據《投資者》雜誌2025年2月報道，安姆科科技越南公司正在尋求監管部門核准，計劃將其年產能從12億個提升至36億個，以滿足全球不斷成長的需求。

同時，隨著晶圓從傳統圓形轉向大型矩形面板的轉變，面板級封裝（PLP）正成為一項革命性的量產技術。這項變革顯著提高了面積利用率和生產效率，而面板內玻璃基板的使用則增強了下一代處理器的熱穩定性和佈線密度。行業領導者正在加速研發以檢驗這些尖端材料。根據《韓國先驅報》2025年5月報道，三星電子機械公司已啟動一條試點生產線，並計劃在2025年第二季生產首批玻璃基板原型。

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：全球電子封裝市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依材質（塑膠、金屬、玻璃、其他）
    • 依封裝技術分類（通孔安裝、表面黏著技術[SMD]、晶片級封裝[CSP]）
    • 按最終用戶分類（家用電子電器、航太與國防、汽車、通訊、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美電子封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國別分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲電子封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國別分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區電子封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國別分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲電子封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東與非洲：國別分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美電子封裝市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國別分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進因素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 近期趨勢

第13章：全球電子封裝市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的議價能力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Amkor Technology, Inc.
  • ASE Technology Holding Co. Ltd
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Ltd
  • KYOCERA Corporation
  • Powertech Technology Inc.
  • Shinko Electric Industries Co., Ltd.
  • Amtech Systems, Inc.
  • JCET Group Inc.

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 22143

The Global Electronic Packaging Market is projected to experience substantial growth, rising from USD 1.71 Billion in 2025 to USD 4.79 Billion by 2031 at a CAGR of 18.73%. Electronic packaging defines the protective enclosures and structures surrounding semiconductor components, which are critical for ensuring physical integrity and managing thermal regulation. This market expansion is primarily fueled by the increasing integration of advanced semiconductors within the consumer and automotive sectors, both of which demand rigorous standards for durability and efficiency. Mirroring this increased activity across the supply chain, SEMI reported that global semiconductor fab capacity was expected to grow by 6 percent in 2024 to accommodate the escalating demand for chips.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 1.71 Billion
Market Size 2031USD 4.79 Billion
CAGR 2026-203118.73%
Fastest Growing SegmentConsumer Electronics
Largest MarketAsia Pacific

However, the market faces a significant hurdle regarding the technical complexities of thermal management within compact device architectures. The substantial costs associated with dissipating heat in densely packed environments, without sacrificing reliability, establish a financial and engineering barrier that constrains rapid development. These challenges highlight the tension between the push for miniaturization and the physical limitations of current thermal regulation technologies.

Market Driver

The rapid digitization and electrification of the automotive industry serve as a primary engine for the demand for robust electronic packaging solutions. As the sector shifts toward autonomous driving and electric mobility, there is an intensified need for sensor modules and power electronics capable of enduring harsh operating conditions. These packaging systems are vital for maintaining the thermal efficiency and mechanical reliability of high-voltage battery management systems and silicon carbide inverters in modern vehicles. Highlighting this trend, the International Energy Agency's 'Global EV Outlook 2024' report from April 2024 projected that electric car sales would reach approximately 17 million units in 2024, a volume increase that necessitates expanded automotive-grade semiconductor packaging capabilities.

Furthermore, the market is being propelled by the accelerated adoption of advanced semiconductor packaging technologies, particularly within the high-performance computing landscape. Manufacturers are increasingly employing heterogeneous integration and 3D stacking techniques to boost bandwidth and processing speeds, requiring packaging architectures that support superior heat dissipation and dense interconnects. This technical evolution is driving massive capital investment into specialized facilities; for instance, SK Hynix announced in an April 2024 press release a commitment of 3.87 billion USD to construct an advanced packaging plant in Indiana to support AI supply chains. This growth aligns with broader industry recovery, as the Semiconductor Industry Association reported global semiconductor sales of 53.1 billion USD in August 2024, signaling robust demand.

Market Challenge

A major impediment to the Global Electronic Packaging Market is the profound technical difficulty of managing thermal output in compact device architectures. As semiconductor components become increasingly densified to enhance performance, they generate substantial heat that must be effectively dissipated within shrinking enclosures to ensure reliability. This physical constraint forces manufacturers to employ specialized high-cost materials and intricate engineering designs, fundamentally complicating the packaging process. Consequently, the development cycle is prolonged because companies must conduct rigorous testing to prevent overheating failures, thereby delaying time-to-market for new products and slowing the overall pace of industry innovation.

Moreover, the financial burden associated with implementing these advanced thermal solutions creates a formidable barrier to market growth. The requirement for precision machinery to handle densely packed environments necessitates massive capital investment, which strains the profit margins of established players and restricts the entry of smaller entities. This escalation in necessary expenditure is reflected in recent industry trends; according to SEMI, global sales of assembly and packaging equipment rose by 25 percent in 2024 as reported in April 2025. This surge in equipment costs illustrates how the financial demands of addressing thermal challenges directly hamper the scalability and rapid expansion of the electronic packaging sector.

Market Trends

The increasing utilization of System-in-Package (SiP) solutions marks a fundamental shift in the Global Electronic Packaging Market, driven by the need to integrate diverse semiconductor components-such as logic, memory, and sensors-into unified, compact modules. This approach addresses the critical demand for functional density and miniaturization in automotive systems and consumer electronics, allowing manufacturers to streamline supply chain logistics while reducing device footprints. To accommodate these modular architectures, leading outsourced assembly and test providers are aggressively expanding their production infrastructure; for example, The Investor reported in February 2025 that Amkor Technology Vietnam is seeking regulatory approval to triple its facility's annual capacity from 1.2 billion to 3.6 billion units to meet surging global demand.

Simultaneously, Panel-Level Packaging (PLP) is emerging as a transformative force for high-volume scaling by transitioning manufacturing from traditional circular wafers to larger rectangular panels. This evolution significantly improves area utilization and production efficiency, while the adoption of glass substrates within these panels enhances thermal stability and interconnect density for next-generation processors. Industry leaders are accelerating development to validate these advanced materials; as noted by The Korea Herald in May 2025, Samsung Electro-Mechanics has commenced operations at a pilot line with the objective of producing its first glass substrate prototype by the second quarter of 2025.

Key Market Players

  • Amkor Technology, Inc.
  • ASE Technology Holding Co. Ltd
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Ltd
  • KYOCERA Corporation
  • Powertech Technology Inc.
  • Shinko Electric Industries Co., Ltd.
  • Amtech Systems, Inc.
  • JCET Group Inc.

Report Scope

In this report, the Global Electronic Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Electronic Packaging Market, By Material

  • Plastic
  • Metal
  • Glass
  • others

Electronic Packaging Market, By Packaging Technology

  • Through-Hole Mounting
  • Surface-Mount Technology [SMD]
  • Chip-Scale Packages [CSP]

Electronic Packaging Market, By End User

  • Consumer Electronics
  • Aerospace & Defense
  • Automotive
  • Telecommunication
  • others

Electronic Packaging Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Electronic Packaging Market.

Available Customizations:

Global Electronic Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Electronic Packaging Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Material (Plastic, Metal, Glass, others)
    • 5.2.2. By Packaging Technology (Through-Hole Mounting, Surface-Mount Technology [SMD], Chip-Scale Packages [CSP])
    • 5.2.3. By End User (Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, others)
    • 5.2.4. By Region
    • 5.2.5. By Company (2025)
  • 5.3. Market Map

6. North America Electronic Packaging Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Material
    • 6.2.2. By Packaging Technology
    • 6.2.3. By End User
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Electronic Packaging Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Material
        • 6.3.1.2.2. By Packaging Technology
        • 6.3.1.2.3. By End User
    • 6.3.2. Canada Electronic Packaging Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Material
        • 6.3.2.2.2. By Packaging Technology
        • 6.3.2.2.3. By End User
    • 6.3.3. Mexico Electronic Packaging Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Material
        • 6.3.3.2.2. By Packaging Technology
        • 6.3.3.2.3. By End User

7. Europe Electronic Packaging Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Material
    • 7.2.2. By Packaging Technology
    • 7.2.3. By End User
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Electronic Packaging Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Material
        • 7.3.1.2.2. By Packaging Technology
        • 7.3.1.2.3. By End User
    • 7.3.2. France Electronic Packaging Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Material
        • 7.3.2.2.2. By Packaging Technology
        • 7.3.2.2.3. By End User
    • 7.3.3. United Kingdom Electronic Packaging Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Material
        • 7.3.3.2.2. By Packaging Technology
        • 7.3.3.2.3. By End User
    • 7.3.4. Italy Electronic Packaging Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Material
        • 7.3.4.2.2. By Packaging Technology
        • 7.3.4.2.3. By End User
    • 7.3.5. Spain Electronic Packaging Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Material
        • 7.3.5.2.2. By Packaging Technology
        • 7.3.5.2.3. By End User

8. Asia Pacific Electronic Packaging Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Material
    • 8.2.2. By Packaging Technology
    • 8.2.3. By End User
    • 8.2.4. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Electronic Packaging Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Material
        • 8.3.1.2.2. By Packaging Technology
        • 8.3.1.2.3. By End User
    • 8.3.2. India Electronic Packaging Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Material
        • 8.3.2.2.2. By Packaging Technology
        • 8.3.2.2.3. By End User
    • 8.3.3. Japan Electronic Packaging Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Material
        • 8.3.3.2.2. By Packaging Technology
        • 8.3.3.2.3. By End User
    • 8.3.4. South Korea Electronic Packaging Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Material
        • 8.3.4.2.2. By Packaging Technology
        • 8.3.4.2.3. By End User
    • 8.3.5. Australia Electronic Packaging Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Material
        • 8.3.5.2.2. By Packaging Technology
        • 8.3.5.2.3. By End User

9. Middle East & Africa Electronic Packaging Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Material
    • 9.2.2. By Packaging Technology
    • 9.2.3. By End User
    • 9.2.4. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Electronic Packaging Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Material
        • 9.3.1.2.2. By Packaging Technology
        • 9.3.1.2.3. By End User
    • 9.3.2. UAE Electronic Packaging Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Material
        • 9.3.2.2.2. By Packaging Technology
        • 9.3.2.2.3. By End User
    • 9.3.3. South Africa Electronic Packaging Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Material
        • 9.3.3.2.2. By Packaging Technology
        • 9.3.3.2.3. By End User

10. South America Electronic Packaging Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Material
    • 10.2.2. By Packaging Technology
    • 10.2.3. By End User
    • 10.2.4. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Electronic Packaging Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Material
        • 10.3.1.2.2. By Packaging Technology
        • 10.3.1.2.3. By End User
    • 10.3.2. Colombia Electronic Packaging Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Material
        • 10.3.2.2.2. By Packaging Technology
        • 10.3.2.2.3. By End User
    • 10.3.3. Argentina Electronic Packaging Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Material
        • 10.3.3.2.2. By Packaging Technology
        • 10.3.3.2.3. By End User

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Electronic Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Amkor Technology, Inc.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. ASE Technology Holding Co. Ltd
  • 15.3. Intel Corporation
  • 15.4. Samsung Electronics Co., Ltd.
  • 15.5. Taiwan Semiconductor Manufacturing Company Ltd
  • 15.6. KYOCERA Corporation
  • 15.7. Powertech Technology Inc.
  • 15.8. Shinko Electric Industries Co., Ltd.
  • 15.9. Amtech Systems, Inc.
  • 15.10. JCET Group Inc.

16. Strategic Recommendations

17. About Us & Disclaimer