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1637739

電子封裝：市場佔有率分析、產業趨勢與統計、成長預測（2025-2030）

Electronic Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計2025年電子封裝市場規模為255.5億美元，2030年將達722.8億美元，預測期間（2025-2030年）複合年成長率為23.12%。

電子封裝-市場-IMG1

主要亮點

  • 隨著電視、參與企業、MP3、數位相機等需求的快速成長，電子封裝越來越成為大規模生產的首選。物聯網和人工智慧的興起，加上複雜電子產品的激增，正在推動消費性電子和汽車產業的高階應用領域。因此，電子封裝領域的先進技術正迅速被採用，以滿足這一新興的需求。
  • 銷售電子產品的公司認知到它們在塑造消費者選擇方面發揮的重要作用，正在穩步將永續性納入其包裝設計中。例如，科技巨頭三星已承諾在 2025 年之前在其整個產品線中採用環保材料。這項雄心勃勃的舉措涉及從傳統的塑膠包裝轉向生物分解性或可回收的替代品。這些舉措不僅引起了具有環保意識的消費者的共鳴，而且使該品牌成為環保意識日益增強的市場中負責任的領跑者。
  • 數位時代正在重塑包裝設計。現代家用電子電器產品包裝包括2D碼、擴增實境(AR) 介面和近距離場通訊(NFC) 標籤等功能。這些創新正在徹底改變消費者與包裝互動的方式。
  • 透過將實體包裝與數位體驗相結合，這些技術增強了用戶參與度。例如，透過掃描包裝上的2D碼，消費者可以被引導至提供詳細產品規格、使用者評論或身臨其境型虛擬實境演示的網站。這些功能支撐著這些技術在家用電子電器封裝市場中日益成長的重要性。
  • 汽車產業在市場格局中發揮著主導作用，特別是隨著向電動和混合動力汽車的快速過渡。由於這些車輛中廣泛使用儲存設備、處理器、類比電路和感測器，對電子封裝的需求預計將顯著增加。
  • 根據 IBEF 預測，到 2025 年，印度電動車 (EV) 市場規模可能達到 5,000 億印度盧比（70.9 億美元）。此外，根據CEEW能源金融中心的一項研究，到2030年，印度電動車市場規模將達到2,060億美元。這種樂觀的預測預計將進一步提振電子封裝市場。
  • 儘管COVID-19大流行給許多行業蒙上了陰影，但電子產品包裝解決方案和消費性電子產品包裝卻表現出了韌性。行動電話和電腦產業主要推動家用電子電器包裝的需求。儘管面臨停產、原料短缺和供應鏈中斷等挑戰，這些產業的產出仍然相對完好。

電子封裝市場趨勢

航太和國防領域預計將增加電子封裝的採用

  • 無論是美國、法國、英國等已開發國家，或是俄羅斯、印度、中國等開發中國家，國防預算都在增加。其中許多國家也熱衷於出口武器。因此，航太和國防市場的研發投資持續成長。
  • 在當今動態的地緣政治氣候下，集體防禦的重要性怎麼強調都不為過。從武器和導引系統到武裝車輛及其動力來源，軍隊和國防部隊在保護國家免受外部威脅方面發揮著至關重要的作用。為了維持強大的軍事體系，監控部隊和軍隊都必須最大限度地提高效率和效力。
  • 印度國防生產部報告顯示，2022-23會計年度國防生產實現歷史性里程碑，達1兆印度盧比（約120.5億美元）。此外，印度的國防電池需求預計將加倍，從2022年的4吉瓦增加到2030年的10吉瓦。國防生產的持續成長以及國防電池採用的增加是未來幾年推動市場成長的前景。
  • 海軍軍艦、艦載衛星通訊通道、武器控制系統和海岸防衛隊都依賴先進的電子產品。這些組件需要軍用級封裝，特別是考慮到濕度和惡劣環境的挑戰。這種需求不僅強調了對高品質產品的需求，也刺激了研發投資。

亞太地區市場將實現顯著成長

  • 在汽車基礎設施擴張和電動車銷量激增的推動下，預計亞太地區將在預測期內主導市場。由於中產階級收入的增加和年輕人口的顯著增加，汽車行業的需求預計將成長。印度汽車工業商協會（SIAM）的報告顯示，2023年印度乘用車產量將達到454萬輛，較2022年的365萬輛大幅成長，顯示該市場未來將穩定成長。
  • 中國作為全球公認的電子中心，在電氣元件和電子產品的大規模生產方面表現出色，堅持一流的品質、性能和交付基準。這一優勢支撐了電子封裝市場的強勁成長潛力。
  • 中國的工業成長是由不斷成長的內需、技術創新和對生產優質產品的承諾所推動的。中國紙和紙板的大規模生產為電子產品包裝的銷售創造了良好的環境。
  • 印度國家投資促進和便利化局（NIPFA）的報告顯示，在強力的政策支持、大量投資和不斷成長的電子產品需求的推動下，到2025年，印度電子製造業將成長2200億美元。

電子封裝產業概況

電子封裝市場較為分散。微系統幾乎應用於每個產業領域，主要領域包括消費性電子、醫療設備、航太和國防以及通訊。主要市場參與企業包括 UFP Technologies、Schott AG、Sealed Air Corporation、DuPont de Nemours Inc. 和 Sonoco Products Company。

  • 2023 年 9 月，Sealed Air 與 3D 自動化包裝解決方案領先供應商 Spark Technologies 合作。 Sealed Air 將在澳洲、韓國、日本和韓國獨家經銷 Sparkk Technologies 的 3D CVP 自動化包裝解決方案。作為合作夥伴關係的一部分，希悅爾客戶將受益於業界領先的自動化包裝解決方案，使他們能夠簡化流程並創造更安全的工作環境。
  • 2023 年 11 月，Mondi 宣布將推廣紙板包裝作為完全可回收和可堆肥的選擇，從而引領永續替代方案的發展。該公司採用再生纖維製成的紙板在紙包裝實現82.5%的回收率方面發揮著極其重要的作用，這一點在歐洲備受關注。 Mondi 的材料和設計專家致力於白色家電和家用電子電器，正在建立先進的瓦楞紙解決方案來取代 EPS 材料。
  • 2023 年 9 月，Schott AG 為航太業推出了新型微電子封裝。與由可伐鐵鎳合金製成的傳統電子產品包裝相比，該包裝旨在延長航空電子設備保護的使用壽命，同時減輕高達 75% 的重量。據說該產品還可以保護敏感電子設備，例如射頻設計、直流/直流轉換器（DC/DC）、電力儲存設備和感測器組件。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場動態

  • 市場概況
  • 產業吸引力－波特五力分析
    • 供應商的議價能力
    • 消費者議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度
  • 產業價值鏈分析
  • 市場促進因素
    • 加速全球電動車銷售
    • 透過技術進步提升產品品質
  • 市場限制因素
    • 電子封裝的高成本和缺乏熟練的專業人員是市場成長的挑戰
  • 技術簡介

第5章市場區隔

  • 按材質
    • 塑膠
    • 金屬
    • 玻璃
  • 按最終用戶產業
    • 消費性電子產品
    • 航太/國防
    • 車
    • 醫療保健
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 英國
      • 德國
      • 法國
      • 義大利
      • 歐洲其他地區
    • 亞太地區
      • 中國
      • 印度
      • 日本
      • 其他亞太地區
    • 拉丁美洲
      • 巴西
      • 阿根廷
      • 其他拉丁美洲
    • 中東/非洲
      • 阿拉伯聯合大公國
      • 沙烏地阿拉伯
      • 南非
      • 其他中東/非洲

第6章 競爭狀況

  • 公司簡介
    • SCHOTT AG
    • DuPont de Nemours Inc.
    • Sealed Air Corporation
    • GY Packaging
    • UFP Technologies Inc.
    • Sonoco Products Company
    • Smurfit Kappa Group PLC
    • Dunapack Packaging Group
    • WestRock Company
    • Mondi Group
    • Dordan Manufacturing Company

第7章 投資分析

第8章市場的未來

簡介目錄
Product Code: 46566

The Electronic Packaging Market size is estimated at USD 25.55 billion in 2025, and is expected to reach USD 72.28 billion by 2030, at a CAGR of 23.12% during the forecast period (2025-2030).

Electronic Packaging - Market - IMG1

Key Highlights

  • As demand surges for TVs, set-top boxes, MP3 players, and digital cameras, electronics packaging is increasingly favored for mass production. The rise of IoT and AI, coupled with the proliferation of intricate electronics, propels the high-end application segment within the consumer electronics and automotive industries. Consequently, to meet this burgeoning demand, advanced technologies for electronics packaging have been swiftly adopted.
  • Companies selling electronics are steadily weaving sustainability into their packaging designs, recognizing its pivotal role in shaping consumer choices. For example, tech giant Samsung has committed to integrating eco-friendly materials across its entire product line by 2025. This ambitious move encompasses a shift from conventional plastic packaging to biodegradable or recycled alternatives. Such initiatives not only resonate with eco-conscious consumers but also position the brand as a responsible frontrunner in a market increasingly attuned to environmental issues.
  • The digital age is reshaping packaging design. Modern consumer electronics packaging now boasts features like QR codes, augmented reality (AR) interfaces, and NFC (near-field communication) tags. These innovations are revolutionizing consumer interactions with packaging.
  • By blending physical packaging with digital experiences, these technologies amplify user engagement. For example, scanning a QR code on a package might lead consumers to a website showcasing detailed product specs, user reviews, or even immersive virtual reality demonstrations. Such capabilities underscore the growing importance of these technologies in the consumer electronics packaging market.
  • The automotive industry, particularly with its swift pivot toward electric and hybrid vehicles, plays a dominant role in the market landscape. Given the extensive use of memory devices, processors, analog circuits, and sensors in these vehicles, the demand for electronics packaging is poised for a significant uptick.
  • Forecasts from IBEF suggest that the Indian electric vehicles (EV) market could touch INR 50,000 crores (USD 7.09 billion) by 2025. Additionally, insights from a CEEW Centre for Energy Finance study indicate a whopping USD 206 billion opportunity for EVs in India by 2030. Such bullish projections are set to further fuel the electronics packaging market.
  • While the COVID-19 pandemic cast a shadow on many industries, electronics packaging solutions and consumer electronics packaging showed resilience. The mobile phone and computer industries primarily drive the demand for consumer electronics packaging. Despite challenges like production halts, raw material shortages, and supply chain disruptions, these industries' output remained relatively unscathed.

Electronic Packaging Market Trends

Aerospace and Defense Segment Expected to Increasingly Adopt Electronics Packaging

  • Defense budgets are on the rise in both developed nations, including the United States, France, and the United Kingdom, and in developing nations like Russia, India, and China. Many of these countries are also keen on weapon exports. Consequently, there has been a sustained push for R&D investments in the aerospace and defense market.
  • In today's dynamic geopolitical climate, the significance of collective defense cannot be overstated. Military and defense forces, encompassing everything from weapons and guidance systems to armed vehicles and their power sources, play a pivotal role in safeguarding a nation from external threats. To uphold a robust military system, both surveillance and armed forces must function with utmost efficiency and effectiveness.
  • As reported by the Department of Defence Production (India), defense production in the Financial Year (FY) 2022-23 achieved a historic milestone, surpassing INR 1 lakh crore (~USD 12.05 billion) for the first time, up from INR 95,000 crore (~USD 11.45 billion) in FY 2021-22. Additionally, India's demand for defense batteries is projected to double, rising from 4 gigawatt hours in 2022 to 10 gigawatt hours by 2030. This consistent uptick in defense production, alongside the growing adoption of defense batteries, is poised to drive market growth over the coming years.
  • Naval warships, onboard satellite communication channels, weapon control systems, and coastguards all rely on advanced electronic products. These components necessitate military-grade packaging, especially given the challenges posed by humidity and harsh environments. Such demands not only underscore the need for high-quality products but also fuel investments in R&D.

Asia-Pacific to Experience Significant Market Growth

  • During the forecast period, Asia-Pacific is poised to dominate the market, driven by expanding automotive infrastructure and a surge in electric vehicle sales. With rising incomes among the middle-income group and a substantial youth demographic, demand in the automotive industry is set to escalate. The Society of Indian Automobile Manufacturers (SIAM) reported that in 2023, India produced 4.54 million passenger vehicles, a notable rise from 3.65 million units in 2022, signaling robust future market growth.
  • China, recognized globally as the electronics hub, excels in mass-producing electrical components and electronic products, adhering to top-notch quality, performance, and delivery benchmarks. This prowess underscores the vast growth potential of the electronics packaging market.
  • China's industry growth is fueled by surging domestic demand, technological innovations, and a commitment to producing premium products. Such extensive production of paper and paperboard in China fosters a thriving environment for electronics packaging sales.
  • The Indian electronic manufacturing industry, buoyed by strong policy backing, substantial investments, and a rising demand for electronic products, is projected to hit USD 220 billion by 2025, as reported by the National Investment Promotion & Facilitation Agency (NIPFA).

Electronic Packaging Industry Overview

The electronics packaging market is fragmented. Microsystems are used in almost every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, and communications. The major market players include UFP Technologies, Schott AG, Sealed Air Corporation, DuPont de Nemours Inc., and Sonoco Products Company.

  • September 2023: Sealed Air collaborated with Sparck Technologies, a key 3D automated packaging solutions provider. Sealed Air is expected to exclusively distribute Sparck Technologies' 3D CVP automated packaging solutions in Australia, South Korea, Japan, and South Korea. As part of the alliance, Sealed Air's customers will benefit from access to the industry's most advanced automated packaging solutions, allowing them to streamline processes and create a more secure work environment.
  • November 2023: Mondi announced that it was leading the charge for sustainable alternatives by promoting corrugated packaging as a fully recyclable and compostable option. The company's corrugated boxes, made from recycled fibers, play a pivotal role in achieving Europe's notable 82.5% recycling rate for paper-based packaging. Committed to circular packaging for white goods and electronics, Mondi's experts in materials and designs are crafting advanced corrugated solutions as substitutes for EPS materials.
  • September 2023: Schott AG unveiled new microelectronic packages for the aerospace industry. The packages aim to extend the life of avionics protection while reducing the weight by up to 75% compared to conventional electronics packaging made from Kovar iron-nickel alloy. The products are also said to protect sensitive electronics, such as radio frequency designs, direct current/direct current converters (DC/DC), electrical storage devices, and sensor components.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Market Drivers
    • 4.4.1 Accelerated Sales of Electrical Automotive Worldwide
    • 4.4.2 Technological Advancements Driving Product Quality
  • 4.5 Market Restraints
    • 4.5.1 High Costs of Electronic Packaging and Lack of Skilled Professionals to Challenge Market Growth
  • 4.6 Technology Snapshot

5 MARKET SEGMENTATION

  • 5.1 By Material
    • 5.1.1 Plastic
    • 5.1.2 Metal
    • 5.1.3 Glass
  • 5.2 By End-user Industry
    • 5.2.1 Consumer Electronics
    • 5.2.2 Aerospace and Defense
    • 5.2.3 Automotive
    • 5.2.4 Healthcare
  • 5.3 By Geography
    • 5.3.1 North America
      • 5.3.1.1 United States
      • 5.3.1.2 Canada
    • 5.3.2 Europe
      • 5.3.2.1 United Kingdom
      • 5.3.2.2 Germany
      • 5.3.2.3 France
      • 5.3.2.4 Italy
      • 5.3.2.5 Rest of Europe
    • 5.3.3 Asia-Pacific
      • 5.3.3.1 China
      • 5.3.3.2 India
      • 5.3.3.3 Japan
      • 5.3.3.4 Rest of Asia-Pacific
    • 5.3.4 Latin America
      • 5.3.4.1 Brazil
      • 5.3.4.2 Argentina
      • 5.3.4.3 Rest of Latin America
    • 5.3.5 Middle East and Africa
      • 5.3.5.1 United Arab Emirates
      • 5.3.5.2 Saudi Arabia
      • 5.3.5.3 South Africa
      • 5.3.5.4 Rest of Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 SCHOTT AG
    • 6.1.2 DuPont de Nemours Inc.
    • 6.1.3 Sealed Air Corporation
    • 6.1.4 GY Packaging
    • 6.1.5 UFP Technologies Inc.
    • 6.1.6 Sonoco Products Company
    • 6.1.7 Smurfit Kappa Group PLC
    • 6.1.8 Dunapack Packaging Group
    • 6.1.9 WestRock Company
    • 6.1.10 Mondi Group
    • 6.1.11 Dordan Manufacturing Company

7 INVESTMENT ANALYSIS

8 FUTURE OF THE MARKET