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半導體生產設備

市場調查報告書

商品編碼

2068700

光子積體電路市場預測至2034年－按組件、整合類型、應用、最終用戶和地區分類的全球分析

Photonic IC Market Forecasts to 2034 - Global Analysis By Component, Integration Type, Application, End User, and By Geography

出版日期: 2026年06月11日 | 出版商:

Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，預計到 2026 年，全球光子積體電路市場規模將達到 174 億美元，並在預測期內以 11.6% 的複合年成長率成長，到 2034 年將達到 419 億美元。

光子積體電路 (PIC) 將多種光子功能整合到單一晶片上，從而能夠操控光訊號，實現高速資料傳輸、感測和訊號處理。這些元件已成為通訊、資料中心互連、LiDAR、生物醫學診斷和量子計算等應用領域的重要基礎技術。市場涵蓋了各種組件，例如雷射、調製器、檢測器、波導管和光放大器，整合架構也從單片式到混合式和模組化設計不等。隨著頻寬需求的爆炸性成長和電子電路物理極限的逼近，光子積體電路有望成為實現更快、更節能系統的有效途徑。

高頻寬資料傳輸需求激增

通訊業者和資料中心營運商正面臨前所未有的壓力，需要應對由串流媒體、雲端運算和人工智慧 (AI) 工作負載驅動的指數級成長的網路流量。光子積體電路 (IC) 能夠透過光纖實現Terabit太比特 (TB) 的資料傳輸速度，同時與傳統電子解決方案相比顯著降低功耗。隨著 5G 網路、邊緣運算和超大規模資料中心的普及，短距離銅纜連接正被光連接模組所取代，這種需求進一步成長。領先的雲端服務供應商正在積極部署矽光電到伺服器機架中，以消除頻寬瓶頸。對更快、更有效率資料傳輸的持續需求，正推動著光子積體電路在通訊基礎設施中的廣泛應用。

製造成本高，包裝複雜

光子積體電路的製造需要專門的製造流程、精確的光學元件對準以及昂貴的化合物半導體基板，例如磷化銦和砷化鎵。封裝階段尤其具有挑戰性，因為光纖必須以亞微米級的精度與晶片上的波導管對準，而這個過程難以大規模自動化。這些技術挑戰導致其單位成本高於成熟的CMOS晶片，限制了其在價格敏感型應用中的普及。對於中小企業而言，用於無塵室設施和光子裝置表徵測試設備的巨額資本投入構成了一個主要的進入門檻。

LiDAR與生物醫學感測領域的新應用領域

自動駕駛汽車和高級駕駛輔助系統 (ADAS) 的普及，正推動著對緊湊型固態雷射雷達解決方案的爆炸式需求。在這一領域，光子積體電路可以取代笨重的機械掃描系統。晶片上的整合光學相控陣無需移動部件即可實現光束控制，從而降低成本並提高可靠性。在醫療領域，光子積體電路正助力實現用於即時診斷的晶片實驗室設備、用於眼科的光學同調斷層掃描(OCT) 以及用於連續健康監測的穿戴式生物感測器。隨著這些應用從研究原型走向商業化產品，傳統通訊以外的全新收入來源正在湧現，市場也因此更加多元化，並吸引了來自汽車和醫療設備業的更多投資。

與先進電子互連技術的激烈競爭

儘管光子積體電路在長距離通訊方面具有明顯的優勢，但電子訊號處理和銅纜技術的不斷進步正在縮小其在短距離應用中的性能差距。均衡、PAM-4調製和主動電纜設計等新興技術使銅纜能夠實現比以往更高的資料傳輸速率，這可能會減緩伺服器機架和基板級連接向光技術的過渡。此外，整合了電子和光電的共封裝光學元件的快速普及，正將價值獲取從獨立的光子元件供應商轉移到整合解決方案供應商，如果傳統的光子積體電路製造商不調整經營模式，則可能面臨被淘汰的風險。

新型冠狀病毒（COVID-19）的影響：

疫情對光子積體電路市場產生了雙重影響。一方面，封鎖和遠端辦公導致網路流量激增，加速了對資料中心升級和光纖到府（FTTH）部署的投資，而這些部署都高度依賴光子裝置。另一方面，供應鏈中斷和亞洲工廠停工暫時限制了化合物半導體晶圓和封裝材料的供應。由於實驗室關閉和運轉率降低，研發活動也受到影響。然而，疫情後雲端運算、遠端醫療和線上娛樂的蓬勃發展創造了持續的需求，許多網路營運商正在加快光電的部署計劃，以應對未來對更高頻寬的持續需求。

在預測期內，「雷射」細分市場預計將佔據最大的市場佔有率。

雷射器領域體現了光源在所有光電系統中的基礎性作用，預計在預測期內將佔據最大的市場佔有率。構成資料中心和通訊網路骨幹的光收發器依賴連續波或脈衝雷射來產生特定波長的訊號。分佈回饋雷射、可調式雷射和垂直腔面共振器雷射 (VCSEL) 的進步正在拓展其應用範圍，從短距離多模光纖鏈路擴展到長距離連貫系統。雷射二極體相對成熟的製造生態系統，以及其在所有基於光子積體電路 (PIC) 的產品中不可替代的功能，預計將在整個預測期內保持其在銷售和收入方面的主導地位。

預計在預測期內，混合型PIC細分市場將呈現最高的複合年成長率。

在整個預測期內，混合光子積體電路（PIC）市場預計將呈現最高的成長率。這是因為這種整合方法在性能、成本和製造柔軟性之間實現了最佳平衡。混合光子積體電路結合了磷化銦基主動式元件（雷射、放大器）的卓越光學性能和矽光子被動電路的擴充性，使其能夠實現大規模生產並與CMOS製程相容。這種異質整合使設計人員能夠針對每個功能選擇最佳材料，而無需受限於單片製造流程。領先的代工廠和研究聯盟正在推動混合整合製程的標準化，從而降低組裝複雜性並降低成本。這種方法充分利用了現有的電子製造基礎設施，加速了商業化進程，使混合光子積體電路成為下一代收發器、感測器和運算互連的理想選擇。

市佔率最大的地區：

在整個預測期內，北美預計將佔據最大的市場佔有率，這主要得益於其擁有眾多大型光子積體電路代工廠、領先的雲端服務供應商以及大量的國防研究經費。美國是領先的矽光電開發公司的所在地，包括英特爾、思科以及許多源自大學研究計畫的資金雄厚的新創公司。政府主導的各項舉措，例如整合光電製造實驗室（AIM Photonics），正在加速技術轉移和人才培養。亞馬遜、谷歌和微軟營運的超大規模資料中心的集中部署，正在創造對先進光連接模組的強勁需求。這項由研發、製造和終端用戶需求交織而成的生態系統，將在整個預測期內鞏固北美的市場領導地位。

複合年成長率最高的地區：

在預測期內，亞太地區預計將呈現最高的複合年成長率，這主要得益於大規模的電信基礎設施投資和不斷擴大的國內半導體產能。中國的「寬頻中國」戰略和雄心勃勃的5G部署正在推動光纖接取網路和回程傳輸基礎設施對光子裝置的巨大需求。日本和韓國憑藉主導地位，也做出了貢獻。印度不斷成長的資料中心市場和數位轉型措施進一步增強了這一成長勢頭。此外，亞太地區在先進製造業領域邁向自給自足的步伐，正鼓勵本地代工廠建立自身的光子積體電路開發能力，從而加速光子積體電路的普及應用，並降低對西方供應商的依賴。基礎設施投資和戰略性產業政策的共同作用，使亞太地區成為成長最快的區域市場。

免費客製化服務：

所有購買此報告的客戶均可享受以下免費自訂選項之一：

企業概況
- 對其他市場參與者（最多 3 家公司）進行全面分析
- 對主要公司進行SWOT分析（最多3家公司）
區域細分
- 根據客戶要求，我們可以提供主要國家的市場估算和預測，以及複合年成長率（註：需經可行性確認）。
競爭性標竿分析
- 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 荷蘭
- 比利時
- 瑞典
- 瑞士
- 波蘭
- 其他歐洲國家
亞太地區
- 中國
- 日本
- 印度
- 韓國
- 澳洲
- 印尼
- 泰國
- 馬來西亞
- 新加坡
- 越南
- 其他亞太國家
南美洲
- 巴西
- 阿根廷
- 哥倫比亞
- 智利
- 秘魯
- 其他南美國家
世界其他地區（RoW）
- 中東
  - 沙烏地阿拉伯
  - 阿拉伯聯合大公國
  - 卡達
  - 以色列
  - 其他中東國家
- 非洲
  - 南非
  - 埃及
  - 摩洛哥
  - 其他非洲國家

第10章戰略市場資訊

工業價值網路和供應鏈評估
空白區域和機會地圖
產品演進與市場生命週期分析
通路、經銷商和打入市場策略的評估

第11章產業趨勢與策略舉措

併購
夥伴關係、聯盟和合資企業
新產品發布和認證
擴大生產能力和投資
其他策略舉措

第12章：公司簡介

Intel Corporation
Cisco Systems, Inc.
Broadcom Inc.
Marvell Technology, Inc.
Nokia Corporation
Coherent Corp.
Lumentum Holdings Inc.
Fujitsu Limited
NEC Corporation
Huawei Technologies Co., Ltd.
Hamamatsu Photonics KK
STMicroelectronics NV
Tower Semiconductor Ltd.
GlobalFoundries Inc.
Synopsys, Inc.

簡介目錄圖表

Product Code: SMRC37133

According to Stratistics MRC, the Global Photonic IC Market is accounted for $17.4 billion in 2026 and is expected to reach $41.9 billion by 2034 growing at a CAGR of 11.6% during the forecast period. Photonic integrated circuits (PICs) integrate multiple photonic functions onto a single chip, enabling the manipulation of light signals for high-speed data transmission, sensing, and signal processing. These devices are critical enablers for telecommunications, data center interconnects, LiDAR, biomedical diagnostics, and quantum computing applications. The market encompasses a wide range of components including lasers, modulators, detectors, waveguides, and optical amplifiers, with integration architectures ranging from monolithic to hybrid and modular designs. As bandwidth demands explode and electronic circuits approach physical limits, photonic ICs offer a compelling pathway for faster, more energy-efficient systems.

Market Dynamics:

Driver:

Soaring demand for high-bandwidth data transmission

Telecommunications and data center operators face unprecedented pressure to handle exponentially growing internet traffic from streaming, cloud computing, and artificial intelligence workloads. Photonic ICs enable terabit-per-second data rates over fiber optics while consuming significantly less power than conventional electronic alternatives. The shift toward 5G networks, edge computing, and hyperscale data centers further amplifies this need, as optical interconnects replace copper connections at shorter distances. Major cloud providers are actively deploying silicon photonics within their server racks to overcome bandwidth bottlenecks. This relentless demand for faster, more efficient data movement continues to drive widespread adoption of photonic ICs across communication infrastructure.

Restraint:

High manufacturing costs and packaging complexity

Producing photonic ICs requires specialized fabrication processes, precision alignment of optical components, and costly compound semiconductor substrates such as indium phosphide and gallium arsenide. The packaging stage is particularly challenging because optical fibers must be aligned with on-chip waveguides with sub-micron accuracy, a process that remains difficult to automate at scale. These technical hurdles translate into higher per-unit costs compared to mature electronic CMOS chips, limiting adoption in price-sensitive applications. Small and medium-sized enterprises face significant barriers to entry due to the substantial capital expenditure required for cleanroom facilities and testing equipment designed for photonic device characterization.

Opportunity:

Emerging applications in LiDAR and biomedical sensing

Autonomous vehicles and advanced driver-assistance systems are creating massive demand for compact, solid-state LiDAR solutions, where photonic ICs can replace bulky mechanical scanning systems. Optical phased arrays integrated on chips enable beam steering without moving parts, reducing cost and improving reliability. In healthcare, photonic ICs are enabling lab-on-a-chip devices for point-of-care diagnostics, optical coherence tomography for ophthalmology, and wearable biosensors for continuous health monitoring. As these applications mature from research prototypes to commercial products, they open entirely new revenue streams beyond traditional telecommunications, diversifying the market and attracting fresh investment from automotive and medical device industries.

Threat:

Intense competition from advanced electronic interconnects

While photonic ICs offer clear advantages at longer distances, continuous improvements in electronic signal processing and copper interconnect technologies are narrowing the performance gap for short-reach applications. Emerging techniques like equalization, PAM-4 modulation, and active cable designs allow copper to achieve higher data rates than previously possible, potentially delaying the transition to optics within server racks and board-level connections. Additionally, the rapid adoption of co-packaged optics that integrate electronics and photonics could shift value capture away from standalone photonic component suppliers toward integrated solution providers, forcing traditional PIC manufacturers to adapt their business models or risk obsolescence.

Covid-19 Impact:

The pandemic created a dual effect on the photonic IC market. On one hand, lockdowns and remote work triggered explosive growth in internet traffic, accelerating investments in data center upgrades and fiber-to-the-home deployments that rely heavily on photonic components. On the other hand, supply chain disruptions and factory shutdowns in Asia temporarily constrained the availability of compound semiconductor wafers and packaging materials. Research and development activities faced delays as laboratories closed or operated at reduced capacity. Nevertheless, the post-pandemic surge in cloud computing, telehealth, and online entertainment has created sustained demand, with many network operators fast-forwarding their photonic adoption plans to accommodate permanently higher bandwidth usage patterns.

The Lasers segment is expected to be the largest during the forecast period

The Lasers segment is expected to account for the largest market share during the forecast period, reflecting the fundamental role of light sources in any photonic system. Optical transceivers, which form the backbone of data center and telecom networks, depend on continuous-wave or pulsed lasers to generate signals at specific wavelengths. Advances in distributed feedback lasers, tunable lasers, and vertical-cavity surface-emitting lasers (VCSELs) have expanded application possibilities across short-reach multimode fiber links and long-haul coherent systems. The relatively mature manufacturing ecosystem for laser diodes, combined with their irreplaceable function in every PIC-based product, ensures this component category maintains its volume and revenue dominance throughout the forecast timeline.

The Hybrid PICs segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the Hybrid PICs segment is predicted to witness the highest growth rate, as this integration approach offers the best compromise between performance, cost, and manufacturing flexibility. Hybrid PICs combine the superior optical performance of indium phosphide-based active components (lasers, amplifiers) with the high-volume scalability and CMOS compatibility of silicon photonic passive circuits. This heterogeneous integration allows designers to select the optimal material for each function without the constraints of monolithic processing. Major foundries and research consortia are standardizing hybrid integration processes, reducing assembly complexity and driving down costs. The approach's ability to leverage existing electronic fabrication infrastructure accelerates commercialization, making hybrid PICs the preferred choice for next-generation transceivers, sensors, and computing interconnects.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share, driven by the presence of leading photonic IC foundries, major cloud service providers, and extensive defense research funding. The United States hosts key players in silicon photonics development, including Intel, Cisco, and numerous well-funded startups originating from university research programs. Government initiatives such as the American Institute for Manufacturing Integrated Photonics (AIM Photonics) accelerate technology transfer and workforce development. The concentration of hyperscale data centers operated by Amazon, Google, and Microsoft creates captive demand for advanced optical interconnects. This ecosystem of research, manufacturing, and end-user demand solidifies North America's market leadership throughout the forecast period.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, fueled by massive telecommunications infrastructure investments and the expansion of domestic semiconductor capabilities. China's "Broadband China" strategy and ambitious 5G rollout drive substantial demand for photonic components in fiber access networks and backhaul infrastructure. Japan and South Korea contribute through leading positions in compound semiconductor materials and precision packaging technologies. India's growing data center market and digital transformation initiatives add further momentum. Additionally, the regional push for self-sufficiency in advanced manufacturing encourages local foundries to develop indigenous photonic IC capabilities, accelerating adoption and reducing reliance on Western suppliers. This combination of infrastructure spending and strategic industrial policy makes Asia Pacific the fastest-growing regional market.

Key players in the market

Some of the key players in Photonic IC Market include Intel Corporation, Cisco Systems, Inc., Broadcom Inc., Marvell Technology, Inc., Nokia Corporation, Coherent Corp., Lumentum Holdings Inc., Fujitsu Limited, NEC Corporation, Huawei Technologies Co., Ltd., Hamamatsu Photonics K.K., STMicroelectronics N.V., Tower Semiconductor Ltd., GlobalFoundries Inc. and Synopsys, Inc.

Key Developments:

In April 2026, Marvell acquired Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell's optical technology portfolio by integrating advanced plasmonics modulation to scale bandwidth and energy efficiency for next-generation 1.6T and 3.2T coherent data center interconnect (DCI) platforms.

In April 2026, Broadcom, in collaboration with over 30 industry partners, launched the Optical Compute Interconnect Multi-Source Agreement (OCI MSA) to define an open, plug-and-play optical standard for multi-vendor AI scale-up architecture.

In March 2026, Coherent announced founding membership in the XPO MSA to enable a 12.8 Tbps liquid-cooled optical module supporting high-density AI infrastructures. Concurrently, they demonstrated multi-technology co-packaged optics (CPO) architectures merging silicon photonics, VCSEL, and Indium Phosphide (InP)-on-silicon elements.

Components Covered:

Lasers
Modulators
Detectors
Multiplexers and Demultiplexers
Optical Amplifiers
Waveguides
Splitters and Couplers
Other Components

Integration Types Covered:

Monolithic PICs
Hybrid PICs
Modular PICs

Applications Covered:

Data Communication
Telecommunications
Sensing and Lidar
Medical and Life Sciences
Defense and Aerospace
Industrial Automation
Quantum and Research Applications

End Users Covered:

Datacenters
Telecom Operators
Automotive OEMs
Healthcare and Biotech
Defense Organizations
Industrial Users

Regions Covered:

North America
- United States
- Canada
- Mexico
Europe
- United Kingdom
- Germany
- France
- Italy
- Spain
- Netherlands
- Belgium
- Sweden
- Switzerland
- Poland
- Rest of Europe
Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Thailand
- Malaysia
- Singapore
- Vietnam
- Rest of Asia Pacific
South America
- Brazil
- Argentina
- Colombia
- Chile
- Peru
- Rest of South America
Rest of the World (RoW)
- Middle East
Saudi Arabia
United Arab Emirates
Qatar
Israel
Rest of Middle East
- Africa
South Africa
Egypt
Morocco
Rest of Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

1.1 Market Snapshot and Key Highlights
1.2 Growth Drivers, Challenges, and Opportunities
1.3 Competitive Landscape Overview
1.4 Strategic Insights and Recommendations

2 Research Framework

2.1 Study Objectives and Scope
2.2 Stakeholder Analysis
2.3 Research Assumptions and Limitations
2.4 Research Methodology
- 2.4.1 Data Collection (Primary and Secondary)
- 2.4.2 Data Modeling and Estimation Techniques
- 2.4.3 Data Validation and Triangulation
- 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

3.1 Market Definition and Structure
3.2 Key Market Drivers
3.3 Market Restraints and Challenges
3.4 Growth Opportunities and Investment Hotspots
3.5 Industry Threats and Risk Assessment
3.6 Technology and Innovation Landscape
3.7 Emerging and High-Growth Markets
3.8 Regulatory and Policy Environment
3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

4.1 Porter's Five Forces Analysis
- 4.1.1 Supplier Bargaining Power
- 4.1.2 Buyer Bargaining Power
- 4.1.3 Threat of Substitutes
- 4.1.4 Threat of New Entrants
- 4.1.5 Competitive Rivalry
4.2 Market Share Analysis of Key Players
4.3 Product Benchmarking and Performance Comparison

5 Global Photonic IC Market, By Component

5.1 Lasers
5.2 Modulators
5.3 Detectors
5.4 Multiplexers and Demultiplexers
5.5 Optical Amplifiers
5.6 Waveguides
5.7 Splitters and Couplers
5.8 Other Components

6 Global Photonic IC Market, By Integration Type

6.1 Monolithic PICs
6.2 Hybrid PICs
6.3 Modular PICs

7 Global Photonic IC Market, By Application

7.1 Data Communication
7.2 Telecommunications
7.3 Sensing and Lidar
7.4 Medical and Life Sciences
7.5 Defense and Aerospace
7.6 Industrial Automation
7.7 Quantum and Research Applications

8 Global Photonic IC Market, By End User

8.1 Datacenters
8.2 Telecom Operators
8.3 Automotive OEMs
8.4 Healthcare and Biotech
8.5 Defense Organizations
8.6 Industrial Users

9 Global Photonic IC Market, By Geography

9.1 North America
- 9.1.1 United States
- 9.1.2 Canada
- 9.1.3 Mexico
9.2 Europe
- 9.2.1 United Kingdom
- 9.2.2 Germany
- 9.2.3 France
- 9.2.4 Italy
- 9.2.5 Spain
- 9.2.6 Netherlands
- 9.2.7 Belgium
- 9.2.8 Sweden
- 9.2.9 Switzerland
- 9.2.10 Poland
- 9.2.11 Rest of Europe
9.3 Asia Pacific
- 9.3.1 China
- 9.3.2 Japan
- 9.3.3 India
- 9.3.4 South Korea
- 9.3.5 Australia
- 9.3.6 Indonesia
- 9.3.7 Thailand
- 9.3.8 Malaysia
- 9.3.9 Singapore
- 9.3.10 Vietnam
- 9.3.11 Rest of Asia Pacific
9.4 South America
- 9.4.1 Brazil
- 9.4.2 Argentina
- 9.4.3 Colombia
- 9.4.4 Chile
- 9.4.5 Peru
- 9.4.6 Rest of South America
9.5 Rest of the World (RoW)
- 9.5.1 Middle East
  - 9.5.1.1 Saudi Arabia
  - 9.5.1.2 United Arab Emirates
  - 9.5.1.3 Qatar
  - 9.5.1.4 Israel
  - 9.5.1.5 Rest of Middle East
- 9.5.2 Africa
  - 9.5.2.1 South Africa
  - 9.5.2.2 Egypt
  - 9.5.2.3 Morocco
  - 9.5.2.4 Rest of Africa

10 Strategic Market Intelligence

10.1 Industry Value Network and Supply Chain Assessment
10.2 White-Space and Opportunity Mapping
10.3 Product Evolution and Market Life Cycle Analysis
10.4 Channel, Distributor, and Go-to-Market Assessment

11 Industry Developments and Strategic Initiatives

11.1 Mergers and Acquisitions
11.2 Partnerships, Alliances, and Joint Ventures
11.3 New Product Launches and Certifications
11.4 Capacity Expansion and Investments
11.5 Other Strategic Initiatives

12 Company Profiles

12.1 Intel Corporation
12.2 Cisco Systems, Inc.
12.3 Broadcom Inc.
12.4 Marvell Technology, Inc.
12.5 Nokia Corporation
12.6 Coherent Corp.
12.7 Lumentum Holdings Inc.
12.8 Fujitsu Limited
12.9 NEC Corporation
12.10 Huawei Technologies Co., Ltd.
12.11 Hamamatsu Photonics K.K.
12.12 STMicroelectronics N.V.
12.13 Tower Semiconductor Ltd.
12.14 GlobalFoundries Inc.
12.15 Synopsys, Inc.

簡介目錄圖表

List of Tables

Table 1 Global Photonic IC Market Outlook, By Region (2023-2034) ($MN)
Table 2 Global Photonic IC Market Outlook, By Component (2023-2034) ($MN)
Table 3 Global Photonic IC Market Outlook, By Lasers (2023-2034) ($MN)
Table 4 Global Photonic IC Market Outlook, By Modulators (2023-2034) ($MN)
Table 5 Global Photonic IC Market Outlook, By Detectors (2023-2034) ($MN)
Table 6 Global Photonic IC Market Outlook, By Multiplexers and Demultiplexers (2023-2034) ($MN)
Table 7 Global Photonic IC Market Outlook, By Optical Amplifiers (2023-2034) ($MN)
Table 8 Global Photonic IC Market Outlook, By Waveguides (2023-2034) ($MN)
Table 9 Global Photonic IC Market Outlook, By Splitters and Couplers (2023-2034) ($MN)
Table 10 Global Photonic IC Market Outlook, By Other Components (2023-2034) ($MN)
Table 11 Global Photonic IC Market Outlook, By Integration Type (2023-2034) ($MN)
Table 12 Global Photonic IC Market Outlook, By Monolithic PICs (2023-2034) ($MN)
Table 13 Global Photonic IC Market Outlook, By Hybrid PICs (2023-2034) ($MN)
Table 14 Global Photonic IC Market Outlook, By Modular PICs (2023-2034) ($MN)
Table 15 Global Photonic IC Market Outlook, By Application (2023-2034) ($MN)
Table 16 Global Photonic IC Market Outlook, By Data Communication (2023-2034) ($MN)
Table 17 Global Photonic IC Market Outlook, By Telecommunications (2023-2034) ($MN)
Table 18 Global Photonic IC Market Outlook, By Sensing and Lidar (2023-2034) ($MN)
Table 19 Global Photonic IC Market Outlook, By Medical and Life Sciences (2023-2034) ($MN)
Table 20 Global Photonic IC Market Outlook, By Defense and Aerospace (2023-2034) ($MN)
Table 21 Global Photonic IC Market Outlook, By Industrial Automation (2023-2034) ($MN)
Table 22 Global Photonic IC Market Outlook, By Quantum and Research Applications (2023-2034) ($MN)
Table 23 Global Photonic IC Market Outlook, By End User (2023-2034) ($MN)
Table 24 Global Photonic IC Market Outlook, By Datacenters (2023-2034) ($MN)
Table 25 Global Photonic IC Market Outlook, By Telecom Operators (2023-2034) ($MN)
Table 26 Global Photonic IC Market Outlook, By Automotive OEMs (2023-2034) ($MN)
Table 27 Global Photonic IC Market Outlook, By Healthcare and Biotech (2023-2034) ($MN)
Table 28 Global Photonic IC Market Outlook, By Defense Organizations (2023-2034) ($MN)
Table 29 Global Photonic IC Market Outlook, By Industrial Users (2023-2034) ($MN)