 |
市場調查報告書
商品編碼
2041933
矽光電和光子積體電路互動式專利趨勢（2026 年）Si Photonics & Photonic IC Interactive Patent Landscape Dashboard 2026 |
||||||
全球智慧財產權競爭日趨激烈。主要參與企業有哪些？哪些技術正在塑造矽光電和光子積體電路的未來？
主要特點
- 互動式儀表板使用戶能夠自由、動態地探索專利趨勢，即時發現關鍵見解並客製化分析以滿足特定需求。
- 全球專利趨勢，包括專利出版品隨時間的變化、申請國家、專利系列以及申請數量。
- 智慧財產權領域的主要專利持有者和新參與企業，按地區和價值鏈中的位置進行分類。
- 各參與企業的智慧財產權狀況及其專利組合的相對優勢。
- 我們專注於大型企業的智慧財產權組合。
- 按技術領域分類的專利：PIC/SiPh 平台、主動元件、光耦合、光收發器、光 I/O 和互連、封裝和測試、光子計算、光子感測。
- 依材料類別分類的專利分類：Si 和 SOI、InP、SiN、TFLN 和 LNOI、絕緣體上的聚合物、BTO。
- 每個細分領域包括：智慧財產權趨勢、主要專利持有者排名、智慧財產權領域的新參與企業、主要智慧財產權參與企業以及主要專利。
- 一個包含所有已分析專利的 Excel資料庫（包括專利細分和指向最新線上資料庫的超連結）。
矽光電和光子積體電路技術的競爭格局正在不斷演變。
矽光電（SiPh）和光子積體電路（PIC）是下一代光纖通訊、資料中心互連、人工智慧基礎設施和先進感測系統的核心。透過將波導管、共振器、光電探測器、檢測器、諧振器、整合器、光源介面和光I/O結構等光學功能整合到晶片級平台上，PIC和SiPh技術實現了更高水準的頻寬密度、功率效率和系統整合。
這個互動式智慧財產權儀表板和資料庫涵蓋了超過36,400項專利公開信息，這些資訊被歸類到13,300多個專利系列中。從專利公開趨勢來看，自2010年代中期以來，專利公開數量呈現強勁且持續的成長勢頭，預計到2025年，專利系列將超過1,700個，單項專利數量將超過4,500項。雖然由於2026年4月才進行搜尋，2026年的數據尚不完整，但初步的公開數量表明，專利申請活動將在全年持續穩定成長，專利系列將超過2,000個。
這一加速趨勢反映了光I/O、共封裝光學元件、連貫互連、光晶片和3D光子整合技術的快速發展，以及矽光電在光收發器、同調光學和資料中心通訊等領域的工業應用。隨著人工智慧和高效能運算系統在頻寬、延遲和功耗方面面臨日益嚴峻的限制，這些技術正展現出越來越重要的戰略價值。
知識產權（IP）領域的競爭格局極為複雜。主要申請者包括英特爾、諾基亞、台積電、思科、華為、三星集團、NTT、格羅方德、惠普、Rockley Photonics、康寧、Marvell、日月光集團、IBM、imec、CEA、Meta、富士通、加州大學、OpenLight Photonics、住友電工、Alphabet、ETRI 和 Ciphaena。這證實了矽光電和光子積體電路不僅是光纖通訊公司，也是半導體製造商、晶圓代工廠、OSAT（外包半導體封裝測試）公司、先進材料供應商、研發機構、雲端基礎設施公司和專業純參與企業的策略競爭領域。
此儀表板將專利趨勢分為八個關鍵技術領域：PIC/SiPh平台、主動元件、光耦合、光收發器、光I/O和互連、封裝和測試、光子計算以及光子感測。它還追蹤關鍵材料和平台系列，例如Si和SOI、InP、SiN、TFLN和LNOI、絕緣體上聚合物以及BTO，這些材料和平台與整合光電和PIC應用密切相關。
該軟體專為動態研究和競爭性基準測試而設計，互動式儀表板和 Excel資料庫使用戶能夠分析專利趨勢、對關鍵申請人進行基準測試、識別新參與企業、探索技術和材料平台、存取專利級記錄，並在光電和半導體創新這一最具活力的領域之一中發現新的機會。
主要專利參與企業的競爭定位
矽光電和光子積體電路的專利格局由半導體公司、光纖網路領導企業、晶圓代工廠、OSAT（外包半導體封裝測試）公司、研發機構、雲端基礎設施公司、材料供應商以及純粹的專業公司共同塑造。這種多樣性反映了積體光電在光子積體電路平台、主動元件、光收發器、光I/O、CPO（複合光子元件）和先進封裝等領域的戰略地位。
英特爾、諾基亞、思科、華為、台積電、Marvell、三星集團、NTT 和 GlobalFoundries 等領先公司已建立了強大的智慧財產權 (IP) 地位，這反映了 SiPh 在光纖通訊領域的成熟度及其在資料中心、AI/HPC 和半導體藍圖中日益成長的重要性。
Rockley Photonics 和 OpenLight Photonics 等專業公司繼續成為創新的關鍵驅動力，尤其是在整合光電平台、光引擎、主動元件、感測和異質整合領域。
未來的智慧財產權領導地位不僅取決於產品組合的規模，還取決於透過先進封裝、光 I/O、光子晶片和 3D 整合來擴展光子整合的能力。
依技術領域分類
此儀表板將矽光電和光子積體電路的專利趨勢分為八個技術領域：PIC/SiPh 平台、主動元件、光耦合、光收發器、光 I/O 和互連、封裝和測試、光子計算和光子感測。
它還包括材料細分，涵蓋矽和SOI、磷化銦、氮化矽、TFLN和LNOI、絕緣體上聚合物以及BTO。這種雙重細分使用戶能夠快速識別創新集中的領域，比較各公司的市場定位，並追蹤新興技術和平台的發展趨勢。
我們全面的專利情報解決方案，結合了強大的資料庫和互動式儀表板，既提供了全面的數據訪問，又提供了強大的分析功能。
互動式儀表板
我們基於精心挑選的專利數據構建的交互式線上儀表板，使專利的整體情況更易於獲取、更具可操作性，並可根據決策者的需求進行客製化。
主要特點：
- 根據優先事項和競爭狀況，動態探索不斷變化的智慧財產權 (IP) 格局。
- 清晰且互動的視覺化功能可讓您即時獲得洞察。
- 您可以按參與企業、技術、國家/地區、日期和法律狀態篩選和分析資料。
- 本報告重點關注季度關鍵趨勢、主要參與企業和技術發展。
- 您可以立即從整體趨勢深入了解參與企業、技術和專利。
- 根據每個團隊（研發、智慧財產權、策略、業務發展）的需求客製化洞察。
- 請查看儀表板。
專利資料庫
此知識產權資訊平台由一個結構化的Excel資料庫提供支持，該資料庫包含本研究中選取的所有專利，其中包括：
- 關鍵專利資訊（專利號、日期、權利人、姓名、摘要等）
- 指向最新線上資料庫（原始文件、法律地位等）的超鏈接
- 技術和材料分類（PIC/SiPh 平台、主動元件、光耦合、光收發器、光 I/O 和互連、封裝和測試、光子計算、光子感測、Si 和 SOI、InP、SiN、TFLN 和 LNOI、絕緣體上聚合物和 BTO）。
- 矽光電和光子積體電路的範例資料庫。
本報告中提及的公司（部分名單）
英特爾、諾基亞、台積電、思科、華為、三星集團、NTT（日本電報電話公司）、格羅方德、惠普、洛克利光子學、康寧、Marvell、日月光集團、IBM、Meta、富士通、OpenLight Photonics、住友電工、Alphabet、Ciena、PsiQuantum、愛立信、Lightmatter、蘋果、甲骨文、RTX公司、輝達、上海希智科技、Lumentum、意法半導體、Ayar Labs、Coherent、海信、霍尼韋爾、群創光電、瑞薩電子、陶氏化學、NEC、博世、京瓷、Aurora、群創光電、三菱電機、卡爾蔡司、美國海軍、歐司朗、索尼、Skorpios Technologies、AMD、Orca Computing、Resonac、PicSM、藤倉、Photonics、Vexnanics； Photonics、大眾集團、HyperLight Oki Electric、Panasonic、Scantinel Photonics、Toshiba、Accelink Technologies、Lockheed Martin、SPIL、CETC - 中國電子科技集團公司、Hitachi、Xilian Optical Fiber、AT&T、ASMLML、Celestial AI、SEFFECT Photonics、Miss 等科技、杭佈、阿廣袈、Sam、USFFECT Photonics. Instruments、AEVA、Canon、Lightwave Logic、Micron、3M、Nano Photonics、Ranovus、Thales、聯華電子中心、味之素、GS Yuasa、NCAP、Scintill Photonics、Teramount、Unimicron、Applied Materials、BAE Systems、Furukawa Electric 等。
The global IP race is accelerating: who are the key players, and which technologies are shaping the future of silicon photonics and photonic integrated circuits?
Key Features
- Interactive dashboard enabling free and dynamic exploration of the patent landscape, allowing users to instantly drill down into key insights and tailor the analysis to their specific needs.
- Global patenting trends, including time evolution of patent publications, countries of patent filings, patent families and applications.
- Main patent assignees and IP newcomers grouped by geographical area and value chain position.
- Players’ IP position and the relative strength of their patent portfolio.
- Focus on players’ IP portfolios.
- Patents categorized by technology segments: PIC / SiPh Platforms, Active Devices, Optical Coupling, Optical Transceivers, Optical I/O & Interconnects, Packaging & Testing, Photonic Computing, and Photonic Sensing.
- Patents categorized by material segments: Si & SOI, InP, SiN, TFLN & LNOI, Polymer on Insulator, and BTO.
- For each segment: IP dynamics, ranking of main patent assignees, IP newcomers, key IP players and key patents.
- Excel database containing all patents analyzed, including patent segmentations and hyperlinks to an updated online database.
Evolving Competitive Landscape of Si Photonics & Photonics IC Technologies
Silicon photonics (SiPh) and photonic integrated circuits (PIC) sit at the heart of next-generation optical communication, datacenter interconnects, AI infrastructure and advanced sensing systems. By integrating optical functions such as waveguides, modulators, photodetectors, filters, resonators, couplers, light-source interfaces and optical I/O structures onto chip-scale platforms, PIC and SiPh technologies are enabling a new level of bandwidth density, power efficiency and system integration.
This interactive IP dashboard and database cover 36,400+ patent publications grouped into 13,300+ patent families. The patent publication trend shows a strong and sustained acceleration from the mid-2010s onward, with publications rising to more than 1,700 patent families and 4,500 individual patents in 2025. Although 2026 data is incomplete because the search was performed in April 2026, the early publication level suggests that patenting activity is expected to continue growing steadily throughout the year and should exceed 2,000 patent families.
This acceleration reflects the industrial adoption of silicon photonics in optical transceivers, coherent optics and datacenter communications, as well as the rapid emergence of optical I/O, co-packaged optics, photonic interconnects, optical chiplets and 3D photonic integration. These technologies are becoming increasingly strategic as AI and HPC systems face growing constraints in bandwidth, latency and power consumption.
The competitive IP landscape is highly diversified. Leading applicants include Intel, Nokia, TSMC, Cisco, Huawei, Samsung Group, NTT, GlobalFoundries, HP, Rockley Photonics, Corning, Marvell, ASE Group, IBM, imec, CEA, Meta, Fujitsu, University of California, OpenLight Photonics, Sumitomo Electric, Alphabet, ETRI and Ciena. This confirms that Si Photonics & Photonic IC is not only a field for optical communication companies, but also a strategic battleground for semiconductor players, foundries, OSATs, advanced materials suppliers, R&D organizations, cloud infrastructure companies and specialized pure players.
The dashboard structures the patent landscape across eight key technology segments: PIC / SiPh Platforms, Active Devices, Optical Coupling, Optical Transceivers, Optical I/O & Interconnects, Packaging & Testing, Photonic Computing, and Photonic Sensing. It also tracks major material and platform families, including Si & SOI, InP, SiN, TFLN & LNOI, Polymer on Insulator, and BTO, when explicitly linked to integrated photonics or PIC applications.
Designed for dynamic exploration and competitive benchmarking, the interactive dashboard and Excel database enable users to analyze patenting dynamics, benchmark key applicants, identify IP newcomers, explore technology segments and materials platforms, access patent-level records, and detect emerging opportunities in one of the most dynamic areas of photonics and semiconductor innovation.
Competitive Positioning of Key Patent Players
The Si Photonics & Photonic IC patent landscape is shaped by semiconductor companies, optical networking leaders, foundries, OSATs, R&D organizations, cloud infrastructure players, materials suppliers, and pure players. This diversity reflects the strategic role of integrated photonics across PIC platforms, active devices, optical transceivers, optical I/O, CPO and advanced packaging.
Major players such as Intel, Nokia, Cisco, Huawei, TSMC, Marvell, Samsung Group, NTT, and GlobalFoundries hold strong IP positions, showing both the maturity of SiPh in optical communications and its growing importance for datacenter, AI/HPC and semiconductor roadmaps.
Specialized pure players such as Rockley Photonics and OpenLight Photonics also remain important innovation drivers, particularly in integrated photonic platforms, optical engines, active devices, sensing and heterogeneous integration.
Future IP leadership will depend not only on portfolio size, but also on the ability to scale photonic integration through advanced packaging, optical I/O, photonic chiplets, and 3D integration..
Technology Segmentation
The dashboard segments the Si Photonics & Photonic IC patent landscape into eight technology areas: PIC / SiPh Platforms, Active Devices, Optical Coupling, Optical Transceivers, Optical I/O & Interconnects, Packaging & Testing, Photonic Computing, and Photonic Sensing.
It also includes material segmentation covering Si & SOI, InP, SiN, TFLN & LNOI, Polymer on Insulator, and BTO. This dual segmentation helps users quickly identify where innovation is concentrated, compare players’ positioning, and track emerging technology and platform trends.
A comprehensive patent intelligence solution combining a robust database and an interactive dashboard to deliver both exhaustive data access and powerful analytical capabilities
Interactive dashboard
Interactive online dashboard built from carefully selected patent data, making patent landscapes more accessible, actionable, and tailored to decision-makers’ needs.
Key features:
- Dynamically explore the evolving competitive IP landscape based on your priorities
- Access clear, interactive visualizations for immediate insights
- Filter and analyze data by players, technologies, countries, dates, and legal status
- Focus on key quarterly highlights on emerging trends, key players, and technological developments
- Drill down instantly from high-level trends to specific players, technologies, and patents
- Tailor insights to the needs of each team (R&D, IP, strategy, business development)
- Discover the dashboard
Patent database
This IP dashboard is supported by a structured Excel database containing all patents selected for this study, including:
- Key patent information (numbers, dates, assignees, titles, abstracts, etc.)
- Hyperlinks to an up-to-date online database (original documents, legal status, etc.)
- Technology and material segmentation (PIC/SiPh Platforms, Active Devices, Optical Coupling, Optical Transceivers, Optical I/O & Interconnects, Packaging & Testing, Photonic Computing, Photonic Sensing, Si & SOI, InP, SiN, TFLN & LNOI, Polymer on Insulator, and BTO).
- Si photonics and photonic IC sample database.
Companies mentioned in the report (non-exhaustive)
Intel, Nokia, TSMC, Cisco, Huawei, Samsung Group, NTT – Nippon Telegraph & Telephone, GlobalFoundries, HP – Hewlett Packard Development, Rockley Photonics, Corning, Marvell, ASE Group, IBM, Meta, Fujitsu, OpenLight Photonics, Sumitomo Electric, Alphabet, Ciena, PsiQuantum, Ericsson, Lightmatter, Apple, Oracle, RTX Corporation, NVIDIA, Shanghai Xizhi Technology, Lumentum, STMicroelectronics, Ayar Labs, Coherent, Hisense, Honeywell, Innolux, Renesas Electronics, Dow Chemical, NEC, Bosch, Kyocera, Aurora, Innolight Technology, Mitsubishi Electric, Carl Zeiss, US Navy, AMS-Osram, Sony, Skorpios Technologies, AMD, Orca Computing, Resonac, Broadcom, Fujikura, Nayuan Technology Singapore, Nexus Photonics, SMART Photonics, Analog Photonics, Volkswagen Group, HyperLight, Oki Electric, Panasonic, Scantinel Photonics, Toshiba, Accelink Technologies, Lockheed Martin, SPIL, CETC – China Electronics Technology Group Corporation, Hitachi, Xilian Optical Fiber, AT&T, ASML, Celestial AI, SEFFECT Photonics, Hangzhou Guangzhiyuan Technology, JBD, MACOM Technology Solutions, Shinko, Texas Instruments, AEVA, Canon, Lightwave Logic, Micron, 3M, Nano Photonics, Ranovus, Thales, United Microelectronics Centre, Ajinomoto, GS Yuasa, NCAP, Scintil Photonics, Teramount, Unimicron, Applied Materials, BAE Systems, Furukawa Electric, and more.
