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2032 年遠端資訊系統晶片市場預測：按處理器核心、節點大小、核心組件整合、車輛類型、應用和地區進行的全球分析

Telematics Systems-on-Chips Market Forecasts to 2032 - Global Analysis By Processing Core (ARM-based, x86-based, RISC-V based), Node Size (>20 nm, 20-10 nm, <10-7 nm, <7 nm), Core Component Integration, Vehicle Type, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球遠端資訊系統晶片市場預計在 2025 年達到 56 億美元，到 2032 年將達到 116 億美元，預測期內的複合年成長率為 10.9%。

遠端資訊系統晶片整合了先進的半導體平台，將運算、通訊和定位技術相結合，為連網汽車生態系統提供動力。這些系統單晶片 (SoC) 支援即時導航、資訊娛樂、車聯網 (V2X)通訊和車隊管理解決方案。隨著自動駕駛汽車、電動車和連網物流的興起，該市場正在迅速擴張。原始設備製造商 (OEM) 和服務供應商擴大採用 SoC 來提供高效、可擴展且安全的遠端資訊處理解決方案。隨著對智慧交通系統需求的不斷成長，該市場在塑造全球汽車互聯的未來方面正發揮關鍵作用。

對提高處理能力的需求

消費者和監管機構不斷推動更智慧、更互聯的汽車，這是推動遠端資訊處理系統晶片 (SoC) 處理能力提升的主要驅動力。現代遠端資訊處理單元不再僅僅用於導航，它們也是即時數據分析、ADAS（高級駕駛輔助系統）和 V2X通訊的樞紐。這需要 SoC 擁有強大的運算能力，能夠同時無延遲地處理來自多個感測器和攝影機的資料。因此，半導體公司正在優先開發高效能多核心處理器，以滿足這些嚴苛的要求，從而加速其市場擴張。

開發成本高

開發系統晶片需要複雜的架構、專有IP核的授權以及在尖端半導體節點上昂貴的製造流程。獲得汽車級可靠性和壽命認證又會增加成本。這些不斷上升的成本可能會阻礙小型企業的發展，甚至會對成熟企業的研發預算造成壓力，這可能會減緩市場創新和整合的步伐，最終只有資金雄厚的競爭對手才能跟上腳步。

自動駕駛和聯網汽車的成長

全球自動駕駛汽車和連網汽車平台的加速部署，為車聯網SoC製造商的顯著成長鋪平了道路。這些汽車依賴車聯網系統作為其通訊神經系統，需要能夠處理大量資料吞吐量的SoC，以實現即時地圖繪製、感測器融合和車聯網（V2X）互動。從基礎車聯網到關鍵自動駕駛功能的演進，催生了對更精密、更安全、更強大的晶片的需求。能夠提供符合自動駕駛嚴格安全標準的整合解決方案的公司，將有望在這個新興市場中獲得巨大收益。

智慧財產權（IP）安全風險

隨著遠端資訊處理SoC變得越來越複雜和互聯，網路安全漏洞和智慧財產權盜竊的威脅也愈發嚴峻。這些晶片包含寶貴的專有設計，並處理敏感的車輛和用戶數據，因此很容易成為惡意攻擊者的目標。成功的駭客攻擊可能導致車輛系統未授權存取、隱私被侵犯，甚至昂貴的研發投資被盜。此外，此類安全漏洞可能嚴重損害品牌聲譽，削弱消費者對聯網汽車技術的信任，從而導致採用率下降，並增加製造商的責任。

COVID-19的影響：

疫情最初擾亂了遠端資訊處理SoC市場，導致工廠關閉和嚴重的供應鏈瓶頸，導致生產停頓，汽車製造放緩。然而，這場危機加速了數位化和互聯互通的長期趨勢。為了確保業務永續營運連續性，企業更加重視非接觸式服務和車隊管理，這刺激了最初停工後對遠端資訊處理解決方案的需求。這導致市場呈現V型復甦，不僅復甦，而且進入了新的成長階段，因為各行各業都認知到可靠的連結在韌性營運模式中發揮的關鍵作用。

預測期內，基於 ARM 的架構部分預計將成為最大的市場

預計基於 ARM 架構的細分市場將在預測期內佔據最大市場佔有率，這得益於其在性能和能源效率之間的出色平衡，而這正是汽車遠端資訊處理單元始終在線連接的關鍵要求。此外，ARM 成熟的生態系統和授權模式為聯網汽車。

預計安全和安保整合部門在預測期內將實現最高複合年成長率

隨著汽車產業向更高自主性邁進，功能安全成為不可或缺的要素，預計安全與安防整合領域將在預測期內實現最高成長率。嚴格的法規和消費者安全意識的提升迫使汽車製造商將強大的基於硬體的安全功能直接整合到SoC晶片中，以抵禦網路攻擊。此外，要取得ISO 26262等功能安全認證，需要專用的安全子系統，而這些子系統如今已成為現代遠端資訊處理SoC的標準元件。監管壓力和技術需求的融合，使得安全與安防整合成為晶片設計中成長最快、最關鍵的功能。

佔比最大的地區：

在預測期內，北美預計將佔據最大的市場佔有率，這得益於主要汽車原始設備製造商 (OEM) 的佈局以及其強大的科技行業——該行業是先進遠端資訊處理和車聯網服務的早期採用者。該地區消費者的高可支配收入推動了對配備先進資訊娛樂和 ADAS 功能的高階汽車的需求，而這些功能都依賴先進的遠端資訊處理系統晶片 (SoC)。此外，政府推出的車輛安全法規以及完善的自動駕駛汽車測試基礎設施，正在為下一代遠端資訊處理系統的部署和創新創造有利環境，進一步鞏固該地區的主導地位。

複合年成長率最高的地區：

在預測期內，由於汽車產銷的爆炸性成長，尤其是在中國、日本和韓國，亞太地區預計將呈現最高的複合年成長率。該地區是全球半導體製造和電子產品的中心，確保了關鍵零件的穩健供應鏈。此外，都市化的加快、智慧城市基礎設施投資的增加以及政府對車輛追蹤和安全要求的不斷加強，正在催生對遠端資訊處理系統的巨大需求。蓬勃發展的中階對新車聯網功能的需求，為遠端資訊處理系統晶片 (SoC) 供應商提供了一個巨大的尚未開發的市場，從而推動了卓越的成長。

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目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球遠端資訊處理系統晶片市場（按處理器核心）

  • 基於ARM的架構
  • 基於 x86 的架構
  • 基於RISC-V的架構

6. 全球遠端資訊系統晶片市場（依節點大小）

  • 20 奈米以上（傳統節點）
  • 20奈米至10奈米（主流節點）
  • 10 奈米至 7 奈米（先進節點）
  • 高達 7 奈米（前沿節點）

7. 全球遠端資訊處理系統晶片市場（依核心組件整合）

  • 數據機整合
    • 4G/LTE
    • 5G（NSA 和 SA）
    • C-V2X（PC5和Uu介面）
  • GNSS整合
  • 連接整合
  • 綜合安全保障

8. 全球遠端資訊系統晶片市場（依車輛類型）

  • 乘用車（PV）
  • 輕型商用車（LCV）
  • 重型商用車（HCV）

9. 全球遠端資訊系統晶片市場（按應用）

  • 安全與保障
  • 資訊娛樂和導航
  • 車輛管理
  • 車隊管理和追蹤
  • 基於使用情況的保險（UBI）

第10章。按地區分類的全球遠端資訊系統晶片市場

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章 公司概況

  • Qualcomm
  • NXP Semiconductors
  • Renesas Electronics
  • Infineon Technologies
  • STMicroelectronics
  • MediaTek
  • Texas Instruments
  • NVIDIA
  • Broadcom
  • Mobileye
  • Robert Bosch
  • Continental
  • HARMAN
  • u-blox
  • Quectel
  • Sierra Wireless
Product Code: SMRC31439

According to Stratistics MRC, the Global Telematics Systems-on-Chips Market is accounted for $5.6 billion in 2025 and is expected to reach $11.6 billion by 2032 growing at a CAGR of 10.9% during the forecast period. Telematics Systems-on-Chips integrates advanced semiconductor platforms combining computing, communication, and positioning technologies to power connected vehicle ecosystems. These SoCs enable real-time navigation, infotainment, vehicle-to-everything (V2X) communication, and fleet management solutions. Driven by the rise of autonomous vehicles, electric mobility, and connected logistics, the market is expanding rapidly. OEMs and service providers are increasingly adopting SoCs to deliver efficient, scalable, and secure telematics solutions. With accelerating demand for intelligent transport systems, this market is becoming pivotal in shaping the future of automotive connectivity worldwide.

Market Dynamics:

Driver:

Demand for Enhanced Processing Power

The relentless consumer and regulatory push for smarter, more connected vehicles is the primary catalyst for the need for enhanced processing power in Telematics SoCs. Modern telematics units are no longer just for navigation; they are the hub for real-time data analytics, advanced driver-assistance systems (ADAS), and V2X communication. This requires SoCs with immense computational capabilities to process data from multiple sensors and cameras simultaneously without latency. Consequently, semiconductor companies are prioritizing the development of high-performance, multi-core processors to meet these rigorous demands, directly fueling market growth

Restraint:

High Development Costs

Developing a system-on-chip involves complex architecture, licensing of proprietary IP cores, and expensive fabrication processes at cutting-edge semiconductor nodes. Moreover, achieving automotive-grade certification for reliability and longevity adds another layer of cost. These soaring expenses can deter smaller players and strain the R&D budgets of even established companies, potentially slowing the pace of innovation and consolidation in the market as only the well-funded competitors can keep pace.

Opportunity:

Growth of Autonomous and Connected Vehicles

The accelerating global rollout of autonomous and connected vehicle platforms unlocks a substantial growth avenue for Telematics SoC manufacturers. These vehicles rely on telematics systems as their communication nervous system, requiring SoCs that can handle massive data throughput for real-time mapping, sensor fusion, and vehicle-to-everything (V2X) interactions. This evolution from basic telematics to critical autonomous driving functions creates a need for more sophisticated, secure, and powerful chips. Companies that can deliver integrated solutions meeting the stringent safety standards of autonomous driving are positioned to capture a significant and lucrative share of this emerging market.

Threat:

Intellectual Property (IP) Security Risks

As Telematics SoCs become more complex and interconnected, they face escalating threats from cybersecurity breaches and intellectual property theft. These chips contain valuable proprietary designs and process sensitive vehicle and user data, making them attractive targets for malicious actors. A successful hack could lead to unauthorized access to vehicle systems, privacy violations, or the theft of costly R&D investments. Moreover, such security failures can severely damage a brand's reputation and erode consumer trust in connected car technologies, potentially leading to slowed adoption rates and increased liability for manufacturers.

Covid-19 Impact:

The pandemic initially disrupted the Telematics SoC market through factory closures and severe supply chain bottlenecks, halting production and delaying vehicle manufacturing. However, the crisis also accelerated the long-term trend towards digitalization and connectivity. The heightened focus on contactless services and fleet management to ensure business continuity stimulated demand for telematics solutions post the initial lockdowns. This created a V-shaped recovery, where the market not only rebounded but entered a new phase of growth, as industries recognized the critical role of reliable connectivity in a resilient operational model.

The ARM-based architecture segment is expected to be the largest during the forecast period

The ARM-based architecture segment is expected to account for the largest market share during the forecast period attributed to its exceptional balance of performance and energy efficiency, a critical requirement for the always-on nature of telematics units in vehicles. Furthermore, ARM's established ecosystem and licensing model provide a scalable and cost-effective foundation for semiconductor companies to build upon, reducing time-to-market. Its widespread adoption across the mobile and embedded industries has created a vast repository of software and developer expertise, making it the de facto choice for automakers and Tier-1 suppliers seeking reliable and versatile processing solutions for their connected car portfolios.

The safety and security integration segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the safety and security integration segment is predicted to witness the highest growth rate driven by the automotive industry's transition towards higher levels of autonomy, where functional safety is non-negotiable. Stringent regulations and consumer awareness are forcing automakers to integrate robust hardware-based security features directly into the SoC silicon to protect against cyberattacks. Additionally, achieving certifications like ISO 26262 for functional safety requires dedicated security subsystems, which are now becoming a standard component in modern Telematics SoCs. This convergence of regulatory pressure and technological necessity makes safety and security integration the fastest-growing critical function within the chip design.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share anchored by the presence of major automotive OEMs and a strong technology sector that is an early adopter of advanced telematics and connected car services. High consumer disposable income in the region fuels demand for premium vehicles equipped with sophisticated infotainment and ADAS features, all of which rely on advanced Telematics SoCs. Moreover, supportive government regulations promoting vehicle safety and the well-established infrastructure for testing autonomous vehicles create a conducive environment for the deployment and innovation of next-generation telematics systems, solidifying the region's dominant position.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR propelled by the explosive expansion of its automotive production and sales, particularly in China, Japan, and South Korea. This region is a global hub for semiconductor manufacturing and electronics, ensuring a robust supply chain for key components. Furthermore, rising urbanization, increasing investments in smart city infrastructure, and growing governmental mandates for vehicle tracking and safety are creating massive demand for telematics systems. The burgeoning middle class's appetite for connected features in new vehicles provides a vast, untapped market for Telematics SoC vendors, driving exceptional growth.

Key players in the market

Some of the key players in Telematics Systems-on-Chips Market include Qualcomm, NXP Semiconductors, Renesas Electronics, Infineon Technologies, STMicroelectronics, MediaTek, Texas Instruments, NVIDIA, Broadcom, Mobileye, Robert Bosch, Continental, HARMAN, u-blox, Quectel, and Sierra Wireless.

Key Developments:

In September 2025, Qualcomm partnered with BMW to unveil the Snapdragon Ride Pilot, an advanced AI-enabled automated driving system in the BMW iX3, supporting hands-free driving on highways and smart parking, validated in over 60 countries.

In April 2025, Texas Instruments (TI) introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. The industry's first automotive BAW-based clocks, the CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators, improve advanced driver assistance system (ADAS) reliability. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities.

In June 2025, Broadcom is now shipping its Tomahawk 6 switch chip, offering 102.4 terabits per second of bandwidth on a single chip. That's double the capacity of any current Ethernet switch and is aimed squarely at powering larger, more complex AI networks. Built to handle both scale-up and scale-out network designs, Tomahawk 6 supports 100G and 200G SerDes and co-packaged optics, giving cloud providers and hyperscalers flexible options when connecting clusters of over a million processing units. It also introduces new routing features that help networks respond to congestion and failure in real time critical for AI training and inference tasks.

Node Sizes Covered:

  • >20 nm (Legacy Nodes)
  • 20 nm - 10 nm (Mainstream Nodes)
  • <10 nm - 7 nm (Advanced Nodes)
  • <7 nm (Leading-Edge Nodes)

Core Component Integrations Covered:

  • Modem Integration
  • GNSS Integration
  • Connectivity Integration
  • Safety and Security Integration

Vehicle Types Covered:

  • Passenger Cars (PV)
  • Light Commercial Vehicles (LCV)
  • Heavy Commercial Vehicles (HCV)

Applications Covered:

  • Safety and Security
  • Infotainment and Navigation
  • Vehicle Management
  • Fleet Management and Tracking
  • Usage-Based Insurance (UBI)

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Telematics Systems-on-Chips Market, By Processing Core

  • 5.1 Introduction
  • 5.2 ARM-based Architecture
  • 5.3 x86-based Architecture
  • 5.4 RISC-V based Architecture

6 Global Telematics Systems-on-Chips Market, By Node Size

  • 6.1 Introduction
  • 6.2 >20 nm (Legacy Nodes)
  • 6.3 20 nm - 10 nm (Mainstream Nodes)
  • 6.4 <10 nm - 7 nm (Advanced Nodes)
  • 6.5 <7 nm (Leading-Edge Nodes)

7 Global Telematics Systems-on-Chips Market, By Core Component Integration

  • 7.1 Introduction
  • 7.2 Modem Integration
    • 7.2.1 4G/LTE
    • 7.2.2 5G (NSA and SA)
    • 7.2.3 C-V2X (PC5 and Uu Interfaces)
  • 7.3 GNSS Integration
  • 7.4 Connectivity Integration
  • 7.5 Safety and Security Integration

8 Global Telematics Systems-on-Chips Market, By Vehicle Type

  • 8.1 Introduction
  • 8.2 Passenger Cars (PV)
  • 8.3 Light Commercial Vehicles (LCV)
  • 8.4 Heavy Commercial Vehicles (HCV)

9 Global Telematics Systems-on-Chips Market, By Application

  • 9.1 Introduction
  • 9.2 Safety and Security
  • 9.3 Infotainment and Navigation
  • 9.4 Vehicle Management
  • 9.5 Fleet Management and Tracking
  • 9.6 Usage-Based Insurance (UBI)

10 Global Telematics Systems-on-Chips Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Qualcomm
  • 12.2 NXP Semiconductors
  • 12.3 Renesas Electronics
  • 12.4 Infineon Technologies
  • 12.5 STMicroelectronics
  • 12.6 MediaTek
  • 12.7 Texas Instruments
  • 12.8 NVIDIA
  • 12.9 Broadcom
  • 12.10 Mobileye
  • 12.11 Robert Bosch
  • 12.12 Continental
  • 12.13 HARMAN
  • 12.14 u-blox
  • 12.15 Quectel
  • 12.16 Sierra Wireless

List of Tables

  • Table 1 Global Telematics Systems-on-Chips Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Telematics Systems-on-Chips Market Outlook, By Processing Core (2024-2032) ($MN)
  • Table 3 Global Telematics Systems-on-Chips Market Outlook, By ARM-based Architecture (2024-2032) ($MN)
  • Table 4 Global Telematics Systems-on-Chips Market Outlook, By x86-based Architecture (2024-2032) ($MN)
  • Table 5 Global Telematics Systems-on-Chips Market Outlook, By RISC-V based Architecture (2024-2032) ($MN)
  • Table 6 Global Telematics Systems-on-Chips Market Outlook, By Node Size (2024-2032) ($MN)
  • Table 7 Global Telematics Systems-on-Chips Market Outlook, By >20 nm (Legacy Nodes) (2024-2032) ($MN)
  • Table 8 Global Telematics Systems-on-Chips Market Outlook, By 20 nm - 10 nm (Mainstream Nodes) (2024-2032) ($MN)
  • Table 9 Global Telematics Systems-on-Chips Market Outlook, By <10 nm - 7 nm (Advanced Nodes) (2024-2032) ($MN)
  • Table 10 Global Telematics Systems-on-Chips Market Outlook, By <7 nm (Leading-Edge Nodes) (2024-2032) ($MN)
  • Table 11 Global Telematics Systems-on-Chips Market Outlook, By Core Component Integration (2024-2032) ($MN)
  • Table 12 Global Telematics Systems-on-Chips Market Outlook, By Modem Integration (2024-2032) ($MN)
  • Table 13 Global Telematics Systems-on-Chips Market Outlook, By 4G/LTE (2024-2032) ($MN)
  • Table 14 Global Telematics Systems-on-Chips Market Outlook, By 5G (NSA and SA) (2024-2032) ($MN)
  • Table 15 Global Telematics Systems-on-Chips Market Outlook, By C-V2X (PC5 and Uu Interfaces) (2024-2032) ($MN)
  • Table 16 Global Telematics Systems-on-Chips Market Outlook, By GNSS Integration (2024-2032) ($MN)
  • Table 17 Global Telematics Systems-on-Chips Market Outlook, By Connectivity Integration (2024-2032) ($MN)
  • Table 18 Global Telematics Systems-on-Chips Market Outlook, By Safety and Security Integration (2024-2032) ($MN)
  • Table 19 Global Telematics Systems-on-Chips Market Outlook, By Vehicle Type (2024-2032) ($MN)
  • Table 20 Global Telematics Systems-on-Chips Market Outlook, By Passenger Cars (PV) (2024-2032) ($MN)
  • Table 21 Global Telematics Systems-on-Chips Market Outlook, By Light Commercial Vehicles (LCV) (2024-2032) ($MN)
  • Table 22 Global Telematics Systems-on-Chips Market Outlook, By Heavy Commercial Vehicles (HCV) (2024-2032) ($MN)
  • Table 23 Global Telematics Systems-on-Chips Market Outlook, By Application (2024-2032) ($MN)
  • Table 24 Global Telematics Systems-on-Chips Market Outlook, By Safety and Security (2024-2032) ($MN)
  • Table 25 Global Telematics Systems-on-Chips Market Outlook, By Infotainment and Navigation (2024-2032) ($MN)
  • Table 26 Global Telematics Systems-on-Chips Market Outlook, By Vehicle Management (2024-2032) ($MN)
  • Table 27 Global Telematics Systems-on-Chips Market Outlook, By Fleet Management and Tracking (2024-2032) ($MN)
  • Table 28 Global Telematics Systems-on-Chips Market Outlook, By Usage-Based Insurance (UBI) (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.