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1844254

遠端資訊處理半導體市場機會、成長動力、產業趨勢分析及 2025 - 2034 年預測

Telematics Semiconductors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034
出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024 年全球遠端資訊處理半導體市場價值為 149 億美元，預計到 2034 年將以 10.9% 的複合年成長率成長至 419 億美元。

遠端資訊處理半導體市場 - IMG1

這項快速擴張的動力源自於連網汽車技術的蓬勃發展、人工智慧與遠端資訊處理控制單元 (TCU) 的整合、車聯網 (V2X) 通訊系統的普及以及嵌入式 GNSS 模組的廣泛應用。汽車製造商正增加對高性能、高能源效率遠端資訊處理半導體的投資，以支援即時追蹤、車隊安全合規、預測分析、無線更新和保固最佳化等功能。隨著互聯汽車平台和智慧交通網路的發展，遠端資訊處理晶片正成為整個出行領域數位轉型的核心組成部分。汽車原始設備製造商 (OEM) 正在整合遠端資訊處理功能，以符合安全法規、提高營運效率並支援下一代出行即服務模式。對安全即時資料處理和更佳車輛系統整合的需求日益成長，促使先進的遠端資訊處理 SoC、低功耗無線收發器和汽車級微控制器廣泛應用。智慧出行生態系統和數位化車輛生命週期平台在多個地區和車型領域的興起進一步推動了這一轉變。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 149億美元
預測值 419億美元
複合年成長率 10.9%

系統單晶片 (SoC) 解決方案佔 34.2% 的市場佔有率，預計 2025 年至 2034 年的複合年成長率為 10.5%。 SoC 因其能夠將處理、連接和安全功能整合到一個緊湊的解決方案中而日益受到青睞。其整合架構可提升效能、降低功耗並減少硬體佔用空間。汽車製造商正轉向 SoC，因為 SoC 具有可擴展性、低延遲設計以及處理即時資料的能力，可用於預測性維護、車輛診斷、位置追蹤和 OTA 韌體更新等應用。連網汽車架構的日益普及進一步推動了對基於 SoC 的遠端資訊處理解決方案的需求。

嵌入式遠端資訊處理領域在2024年佔據了55%的市場佔有率，預計到2034年將實現9.6%的複合年成長率。嵌入式解決方案憑藉其原廠安裝的特性、高可靠性以及符合嚴格的資料保護要求，在原始設備製造商（OEM）和大型車隊營運商中日益受到青睞。這些整合模組可在各種車輛平台和地理區域實現無縫追蹤、遠端診斷和改進的車隊治理。嵌入式遠端資訊處理模組還支援先進的車輛電子基礎設施，被認為是現代車隊管理的關鍵，尤其是在商用和電動車領域。

美國遠端資訊處理半導體市場佔83%的市場佔有率，2024年市場規模達45億美元。美國市場的強勁表現得益於連網汽車平台的快速普及、監管機構對車輛安全和資料透明度的重視，以及對下一代遠端資訊處理基礎設施的快速投資。人工智慧SoC、V2X通訊模組和嵌入式晶片組的使用日益增多，正在推動乘用車、商用車隊和電動車之間遠端資訊處理的整合。美國市場在汽車半導體領域的創新、可擴展性和即時連接性方面繼續保持領先地位。

全球遠端資訊處理半導體市場的領導公司包括高通、聯發科、瑞薩電子、義法半導體、亞德諾半導體、德州儀器、村田製作所、廣和通、恩智浦半導體和英飛凌科技。為了鞏固市場地位，遠端資訊處理半導體領域的公司正專注於技術創新、策略合作夥伴關係和產品組合擴展等多種方式。許多公司正在投資開發低功耗、高效能晶片組，以支援人工智慧遠端資訊處理功能、網路安全和V2X通訊。與汽車原始設備製造商和一級供應商的合作有助於確保更緊密地整合到車輛平台中。各公司也正在擴大研發活動，以縮短設計週期並增強即時處理能力。

目錄

第1章：方法論

  • 市場範圍和定義
  • 研究設計
    • 研究方法
    • 資料收集方法
  • 資料探勘來源
    • 全球的
    • 地區/國家
  • 基礎估算與計算
    • 基準年計算
    • 市場評估的主要趨勢
  • 初步研究和驗證
    • 主要來源
  • 預報
  • 研究假設和局限性

第 2 章：執行摘要

第3章：行業洞察

  • 產業生態系統分析
    • 供應商格局
      • 晶片製造商
      • 連接和通訊模組提供者
      • 平台和軟體供應商
      • 分銷商和聚合商
      • 原始設備製造商
      • 系統整合商和服務提供者
      • 最終用途
    • 利潤率分析
    • 每個階段的增值
    • 影響價值鏈的因素
    • 中斷
  • 產業衝擊力
    • 成長動力
      • 連網汽車的快速普及
      • 監理推動安全和合規
      • OEM注重營運效率
      • OTA和雲端整合系統需求不斷成長
    • 產業陷阱與挑戰
      • 開發和整合成本高
      • 網路安全與資料隱私風險
    • 機會
      • 新興市場和區域擴張
      • 與電動汽車和自動駕駛平台的整合
      • 轉向軟體定義汽車
      • 出行即服務 (MaaS) 和車隊遠端資訊處理的成長
  • 監管格局
    • 全球規範架構概述
    • 區域合規要求
    • 新興監管趨勢
    • 監理合規成本分析
    • 政策變化對市場動態的影響
  • 技術與創新格局
    • 當前技術趨勢
    • 新興技術評估
    • 技術採用曲線
    • 創新熱點分析
    • 科技融合趨勢
    • 顛覆性技術的影響
    • 研發投資模式
    • 技術路線圖分析
  • 定價分析
    • 按地區
    • 按產品
  • 專利分析
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析
  • 永續性和環境方面
    • 永續生產實踐
    • 減少廢棄物的策略
    • 生產中的能源效率
    • 環保材料的使用
    • 循環經濟實施
    • 環境合規成本
  • 風險評估框架
    • 技術風險分析
    • 供應鏈風險評估
    • 市場風險評估
    • 監理風險分析
    • 財務風險評估
    • 營運風險因素
    • 風險緩解策略
  • 供應鏈彈性評估
    • 供應鏈脆弱性分析
    • 單點故障識別
    • 多元化策略
    • 供應鏈透明度
    • 風險緩解框架
    • 替代採購選項

第4章：競爭格局

  • 介紹
  • 公司市佔率分析
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 多邊環境協定
  • 主要市場參與者的競爭分析
  • 競爭定位矩陣
  • 戰略展望矩陣
  • 關鍵進展
    • 併購
    • 夥伴關係與合作
    • 新產品發布
    • 擴張計劃和資金

第5章：市場估計與預測：按類型，2021 - 2034

  • 主要趨勢
  • 微控制器（MCU）
  • 系統單晶片（SoC）
  • 通訊IC
  • 電源管理IC（PMIC）
  • 記憶體和儲存

第6章：市場估計與預測：依連結性，2021 - 2034

  • 主要趨勢
  • 嵌入式
  • 繫留
  • 融合的

第7章：市場估計與預測：依車型，2021 - 2034

  • 主要趨勢
  • 搭乘用車
    • 袖珍的
    • 中型
    • 奢華
    • SUV
  • 商用車
    • 輕型商用車（LCV）
    • 重型商用車（HCV）
    • 公車
  • 電動和混合動力車

第8章：市場估計與預測：按地區，2021 - 2034

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 義大利
    • 俄羅斯
    • 北歐人
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 東南亞
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中東和非洲
    • 阿拉伯聯合大公國
    • 沙烏地阿拉伯
    • 南非

第9章：公司簡介

  • 全球參與者
    • Analog Devices
    • Broadcom
    • Infineon Technologies
    • Microchip Technology
    • NXP Semiconductors
    • ON Semiconductor
    • Qualcomm
    • Renesas Electronics
    • STMicroelectronics
    • Texas Instruments
  • 區域參與者
    • Fibocom Wireless
    • MediaTek
    • Murata Manufacturing
    • Quectel Wireless Solutions
    • ROHM Semiconductor
    • Samsung Semiconductor
    • Sierra Wireless
    • Sony Semiconductor Solutions
    • Telit Communications
    • u-blox AG
  • 新興玩家
    • Altair Semiconductor
    • Cavli Wireless
    • Nordic Semiconductor
    • Sequans Communications
    • Silicon Labs
簡介目錄
Product Code: 14795

The Global Telematics Semiconductors Market was valued at USD 14.9 billion in 2024 and is estimated to grow at a CAGR of 10.9% to reach USD 41.9 billion by 2034.

Telematics Semiconductors Market - IMG1

The rapid expansion is fueled by the surge in connected vehicle technologies, the integration of AI in telematics control units (TCUs), the adoption of vehicle-to-everything (V2X) communication systems, and the widespread use of embedded GNSS modules. Automakers are increasingly investing in high-performance, energy-efficient telematics semiconductors to support features like real-time tracking, fleet safety compliance, predictive analytics, over-the-air updates, and warranty optimization. As connected vehicle platforms and intelligent transportation networks evolve, telematics chips are becoming a core component of digital transformation across the mobility landscape. Automotive OEMs are incorporating telematics capabilities to align with safety regulations, improve operational efficiencies, and enable next-gen mobility-as-a-service models. Growing demand for secure, real-time data processing and better integration of vehicle systems has led to widespread adoption of advanced telematics SoCs, low-power wireless transceivers, and automotive-grade microcontrollers. This transition is further supported by the rise of smart mobility ecosystems and digital vehicle lifecycle platforms across multiple regions and vehicle segments.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$14.9 Billion
Forecast Value$41.9 Billion
CAGR10.9%

The system-on-chip (SoC) solutions segment held 34.2% share and is expected to grow at a CAGR of 10.5% from 2025 through 2034. SoCs are increasingly favored due to their ability to combine processing, connectivity, and security features into a single compact solution. Their integrated architecture allows for improved performance, lower power consumption, and reduced hardware footprint. Automakers are turning to SoCs for their scalability, low-latency design, and ability to handle real-time data for applications such as predictive maintenance, vehicle diagnostics, location tracking, and OTA firmware updates. The increasing shift to connected vehicle architectures is further driving the demand for SoC-based telematics solutions.

The embedded telematics segment held a 55% share in 2024 and is expected to register a CAGR of 9.6% through 2034. Embedded solutions are gaining momentum among OEMs and large fleet operators due to their factory-installed nature, high reliability, and compliance with stringent data protection requirements. These integrated modules enable seamless tracking, remote diagnostics, and improved fleet governance across a wide range of vehicle platforms and geographical regions. Embedded telematics modules also support advanced vehicle electronics infrastructure and are considered essential for modern-day fleet management, especially in commercial and electric vehicle segments.

United States Telematics Semiconductors Market held an 83% share, generating USD 4.5 billion in 2024. The strong performance of the U.S. market is attributed to the fast adoption of connected vehicle platforms, regulatory emphasis on vehicle safety and data transparency, and rapid investments in next-gen telematics infrastructure. Increased use of AI-powered SoCs, V2X communication modules, and embedded chipsets is driving the integration of telematics across passenger cars, commercial fleets, and electric vehicles. The U.S. market continues to lead in terms of innovation, scalability, and real-time connectivity in the automotive semiconductor space.

Leading companies in the Global Telematics Semiconductors Market include Qualcomm, MediaTek, Renesas Electronics, STMicroelectronics, Analog Devices, Texas Instruments, Murata Manufacturing, Fibocom Wireless, NXP Semiconductors, and Infineon Technologies. To strengthen their foothold, companies operating in the telematics semiconductors space are focusing on a mix of technological innovation, strategic partnerships, and product portfolio expansion. Many are investing in the development of low-power, high-performance chipsets tailored to support AI-enabled telematics functions, cybersecurity, and V2X communication. Collaborations with automotive OEMs and Tier-1 suppliers help ensure tighter integration into vehicle platforms. Firms are also scaling R&D activities to shorten design cycles and enhance real-time processing capabilities.

Table of Contents

Chapter 1 Methodology

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis, 2021-2034
  • 2.2 Key market trends
    • 2.2.1 Regional
    • 2.2.2 Type
    • 2.2.3 Connectivity
    • 2.2.4 Vehicle
  • 2.3 TAM Analysis, 2025-2034
  • 2.4 CXO perspectives: Strategic imperatives
    • 2.4.1 Key decision points for industry executives
    • 2.4.2 Critical success factors for market players
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier landscape
      • 3.1.1.1 Chip Manufacturers
      • 3.1.1.2 Connectivity and Communication Module Providers
      • 3.1.1.3 Platform and Software Vendors
      • 3.1.1.4 Distributors and Aggregators
      • 3.1.1.5 OEMs
      • 3.1.1.6 System Integrators and Service Providers
      • 3.1.1.7 End use
    • 3.1.2 Profit margin analysis
    • 3.1.3 Value addition at each stage
    • 3.1.4 Factor affecting the value chain
    • 3.1.5 Disruptions
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Rapid connected vehicle adoption
      • 3.2.1.2 Regulatory push for safety and compliance
      • 3.2.1.3 OEM focus on operational efficiency
      • 3.2.1.4 Rising Demand for OTA and Cloud-Integrated Systems
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High development and integration costs
      • 3.2.2.2 Cybersecurity and data privacy risks
    • 3.2.3 Opportunities
      • 3.2.3.1 Emerging markets & regional expansion
      • 3.2.3.2 Integration with EV and autonomous platforms
      • 3.2.3.3 Shift to software-defined vehicles
      • 3.2.3.4 Growth of Mobility-as-a-Service (MaaS) and Fleet Telematics
  • 3.3 Regulatory Landscape
    • 3.3.1 Global Regulatory Framework Overview
    • 3.3.2 Regional Compliance Requirements
    • 3.3.3 Emerging Regulatory Trends
    • 3.3.4 Regulatory Compliance Costs Analysis
    • 3.3.5 Impact of Policy Changes on Market Dynamics
  • 3.4 Technology & Innovation Landscape
    • 3.4.1 Current Technological Trends
    • 3.4.2 Emerging Technologies Assessment
    • 3.4.3 Technology Adoption Curves
    • 3.4.4 Innovation Hotspots Analysis
    • 3.4.5 Technology Convergence Trends
    • 3.4.6 Disruptive Technology Impact
    • 3.4.7 R&D Investment Patterns
    • 3.4.8 Technology Roadmap Analysis
  • 3.5 Pricing analysis
    • 3.5.1 By Region
    • 3.5.2 By Product
  • 3.6 Patent analysis
  • 3.7 Growth potential analysis
  • 3.8 Porter’s analysis
  • 3.9 PESTEL analysis
  • 3.10 Sustainability & Environmental Aspects
    • 3.10.1 Sustainable Manufacturing Practices
    • 3.10.2 Waste Reduction Strategies
    • 3.10.3 Energy Efficiency in Production
    • 3.10.4 Eco-friendly Material Usage
    • 3.10.5 Circular Economy Implementation
    • 3.10.6 Environmental Compliance Costs
  • 3.11 Risk Assessment Framework
    • 3.11.1 Technology Risk Analysis
    • 3.11.2 Supply Chain Risk Assessment
    • 3.11.3 Market Risk Evaluation
    • 3.11.4 Regulatory Risk Analysis
    • 3.11.5 Financial Risk Assessment
    • 3.11.6 Operational Risk Factors
    • 3.11.7 Risk Mitigation Strategies
  • 3.12 Supply Chain Resilience Assessment
    • 3.12.1 Supply Chain Vulnerability Analysis
    • 3.12.2 Single Point of Failure Identification
    • 3.12.3 Diversification Strategies
    • 3.12.4 Supply Chain Transparency
    • 3.12.5 Risk Mitigation Frameworks
    • 3.12.6 Alternative Sourcing Options

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 North America
    • 4.2.2 Europe
    • 4.2.3 Asia Pacific
    • 4.2.4 LATAM
    • 4.2.5 MEA
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategic outlook matrix
  • 4.6 Key developments
    • 4.6.1 Mergers & acquisitions
    • 4.6.2 Partnerships & collaborations
    • 4.6.3 New Product Launches
    • 4.6.4 Expansion Plans and funding

Chapter 5 Market Estimates & Forecast, By Type, 2021 - 2034 ($Bn, Units)

  • 5.1 Key trends
  • 5.2 Microcontrollers (MCUs)
  • 5.3 System-on-Chip (SoC)
  • 5.4 Communication ICs
  • 5.5 Power Management ICs (PMICs)
  • 5.6 Memory and Storage

Chapter 6 Market Estimates & Forecast, By Connectivity, 2021 - 2034 ($Bn, Units)

  • 6.1 Key trends
  • 6.2 Embedded
  • 6.3 Tethered
  • 6.4 Integrated

Chapter 7 Market Estimates & Forecast, By Vehicle, 2021 - 2034 ($Bn, Units)

  • 7.1 Key trends
  • 7.2 Passenger Vehicles
    • 7.2.1 Compact
    • 7.2.2 Mid-Size
    • 7.2.3 Luxury
    • 7.2.4 SUV
  • 7.3 Commercial Vehicles
    • 7.3.1 Light Commercial Vehicles (LCV)
    • 7.3.2 Heavy Commercial Vehicles (HCV)
    • 7.3.3 Buses
  • 7.4 Electric & Hybrid Vehicles

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2034 ($Bn, Units)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 France
    • 8.3.3 UK
    • 8.3.4 Spain
    • 8.3.5 Italy
    • 8.3.6 Russia
    • 8.3.7 Nordics
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 ANZ
    • 8.4.6 Southeast Asia
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
    • 8.5.3 Argentina
  • 8.6 Middle East and Africa
    • 8.6.1 UAE
    • 8.6.2 Saudi Arabia
    • 8.6.3 South Africa

Chapter 9 Company Profiles

  • 9.1 Global Players
    • 9.1.1 Analog Devices
    • 9.1.2 Broadcom
    • 9.1.3 Infineon Technologies
    • 9.1.4 Microchip Technology
    • 9.1.5 NXP Semiconductors
    • 9.1.6 ON Semiconductor
    • 9.1.7 Qualcomm
    • 9.1.8 Renesas Electronics
    • 9.1.9 STMicroelectronics
    • 9.1.10 Texas Instruments
  • 9.2 Regional Players
    • 9.2.1 Fibocom Wireless
    • 9.2.2 MediaTek
    • 9.2.3 Murata Manufacturing
    • 9.2.4 Quectel Wireless Solutions
    • 9.2.5 ROHM Semiconductor
    • 9.2.6 Samsung Semiconductor
    • 9.2.7 Sierra Wireless
    • 9.2.8 Sony Semiconductor Solutions
    • 9.2.9 Telit Communications
    • 9.2.10 u-blox AG
  • 9.3 Emerging Players
    • 9.3.1 Altair Semiconductor
    • 9.3.2 Cavli Wireless
    • 9.3.3 Nordic Semiconductor
    • 9.3.4 Sequans Communications
    • 9.3.5 Silicon Labs