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1716431

臨時黏合劑市場至2032年的預測：按產品類型、材料、應用、最終用戶和地區的全球分析

Temporary Bonding Adhesive Market Forecasts to 2032 - Global Analysis By Product Type Material, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的資料，全球臨時黏合劑市場預計在2025年達到 2.691億美元，到2032年將達到 4.763億美元，預測期內的年複合成長率為 8.5%。

臨時黏合劑是用於晶圓層次電子構裝、3D IC 整合和微電子組裝等先進製造流程的特殊材料。臨時黏合劑利用熱釋放、紫外線照射或化學溶解等機制來提供牢固但可釋放的黏合。這些黏合劑以其精確度和耐熱性而聞名，有助於在嚴苛的條件下穩定精密的基板。它對於實現設備小型化、先進封裝和高效高產量比率製造非常重要。

根據世界半導體貿易統計，到2023年，歐洲將佔全球晶片製造市場的9%，高於 1990年的44%。

晶圓級封裝和 3D IC 整合的採用率不斷提高

晶圓級封裝和 3D IC 整合的日益普及大幅推動了對臨時黏合劑的需求。這些先進的封裝技術需要高效的鍵合解決方案，以促進多個組件的無縫整合，提高設備性能並降低成本。此外，向更小、更輕的電子設備的轉變也增強了黏合劑在先進製造流程中的使用。此外，高溫穩定性和精密客製化黏合劑配方的進步推動市場的發展。

相容性問題

相容性問題仍然是臨時黏合劑市場面臨的主要挑戰，尤其是在包括不同基材和熱處理流程的應用中。黏合劑和基材之間的材料特性不匹配會導致性能劣化，影響製造效率和產品可靠性。此外，剝離過程中對黏合劑去除的嚴格要求進一步使相容性問題複雜化。這些限制阻礙了某些行業的廣泛採用，例如汽車和航太，因為這些行業的複雜設計需要多功能的黏合解決方案。

開發永續、環保的黏合劑

監管審查的加強和消費者對環保解決方案的需求推動製造商透過生物分解性和無溶劑的黏合配方進行創新。這項進展符合全球減少碳足跡和推廣綠色技術的計劃。將生物基聚合物和再生原料整合到臨時黏合劑中，有可能徹底改變產業標準，為電子和醫療保健等領域開闢新的途徑。

乾式處理或機械晶圓支撐方面的進步

乾式處理方法和機械晶圓支撐系統的技術進步對臨時黏合劑市場構成了重大威脅。這些替代方法減少了對基於黏合劑的黏合的依賴，簡化了生產流程並最大限度地減少了與黏合劑去除相關的併發症。隨著領先公司對晶圓處理機械解決方案的投資，無黏合劑技術的採用整個產業中獲得越來越大的吸引力。

COVID-19的影響：

由於新冠疫情，臨時黏合劑市場受到了多方面的影響。供應鏈中斷和製造能力下降影響了黏合劑的生產，導致關鍵時刻出現短缺。然而，遠距工作趨勢推動電子和通訊設備需求激增，抵消了部分負面影響。疫情期間，黏合劑技術的創新為高性能應用奠定了基礎，並確保了對不確定性的抵禦能力。

預測期內，熱釋放臨時黏合劑市場預計將成為最大的市場

預計在預測期內，熱釋放臨時黏合劑部分將佔據最大的市場佔有率。這些黏合劑在精度和效率方面具有明顯的優勢，能夠在受控的熱條件下簡化脫粘過程。其在半導體製造和晶圓級封裝解決方案中的廣泛應用證明了其重要性。熱釋放黏合劑的進步推動黏合強度和熱穩定性的提高，以滿足業界對高性能黏合劑的需求。

預計在預測期內，先進封裝領域將以最高的年複合成長率成長。

由於半導體封裝領域迅速採用最尖端科技，預計先進封裝領域將在預測期內呈現最高的成長率。臨時黏合劑支援 3D IC 整合和扇出晶圓層次電子構裝等過程，在增強設備功能和降低生產成本方面發揮著非常重要的作用。電子設備創新包裝設計的日益成長的趨勢推動該市場的需求。

佔比最大的地區：

由於亞太地區在半導體製造和電子產品生產領域佔據主導地位，預計預測期內亞太地區將佔據最大的市場佔有率。中國、台灣和韓國等國家已成為先進技術開發的中心，推動了該地區的黏合劑採用。優惠的政府政策和強大的產業生態系統促進該地區的持續成長。此外，本地製造商和國際參與者之間的合作加強黏合劑供應鏈，進一步支持亞太地區的市場擴張。

年複合成長率最高的地區：

在預測期內，由於黏合劑技術的進步和研發投資，預計北美將呈現最高的年複合成長率。該地區對永續實踐和創新製造解決方案的關注增強其競爭地位。汽車、航太和醫療設備領域對精密黏合劑的強勁需求支撐了該地區的成長。此外，關鍵行業參與者的存在和致力於材料科學的資金籌措推動臨時黏合劑的採用率。

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訂閱此報告的客戶可享有以下免費自訂選項之1：

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  • 地理細分
    • 根據客戶興趣對主要國家市場進行估計、預測和年複合成長率（註：基於可行性檢查）
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    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章 執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 研究範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章 市場走勢分析

  • 促進因素
  • 限制因素
  • 機會
  • 威脅
  • 產品分析
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買家的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭敵對

第5章 全球臨時黏合劑市場（依產品類型）

  • 熱剝離臨時黏合劑
  • 紫外線固化臨時黏合劑
  • 機械剝離膠黏劑
  • 雷射剝離膠
  • 可移除臨時性黏合劑
  • 壓敏臨時黏合劑
  • 可溶性臨時黏合劑
  • 其他產品類型

第6章 全球臨時黏合劑市場（依材料）

  • 旋塗
  • 噴塗
  • 輥塗
  • 模版印刷
  • 其他材料

第7章 全球臨時黏合劑市場（依應用）

  • 先進封裝
  • MEMS（電子機械系統）
  • CMOS（互補型金屬氧化物半導體）
  • 光電子
  • 其他應用

第8章 全球臨時黏合劑市場（依最終用戶）

  • 電子產品
  • 半導體
  • 車輛
  • 航太
  • 醫療設備
  • 其他最終用戶

第9章 全球臨時黏合劑市場（依地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第10章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第11章 公司概況

  • 3M
  • AI Technology, Inc.
  • Brewer Science, Inc
  • Daetec
  • Daxin Materials Corp.
  • Dow Inc.
  • Elmer
  • HD MicroSystems, Ltd.
  • IncE Advanced Materials
  • Micro Materials Inc
  • Nissan Chemical Corporation
  • Promerus
  • TAiCHEM Materials Corporation
  • Tokyo Ohka Kogyo Co., Ltd.
  • YINCAE Advanced Materials, LLC
Product Code: SMRC29242

According to Stratistics MRC, the Global Temporary Bonding Adhesive Market is accounted for $269.1 million in 2025 and is expected to reach $476.3 million by 2032 growing at a CAGR of 8.5% during the forecast period. Temporary bonding adhesives are specialized materials used in advanced manufacturing processes such as wafer-level packaging, 3D IC integration, and microelectronic assembly. They provide secure yet removable adhesion, using mechanisms like thermal release, UV exposure, or chemical dissolution. Known for their high precision and thermal resistance, these adhesives support the stability of delicate substrates under demanding conditions. Their role is essential in enabling device miniaturization, advanced packaging, and efficient high-yield production.

According to World Semiconductor Trade Statistics, Europe held 9% of the global chip manufacturing market in 2023, a sharp appreciable growth of 44% in 1990.

Market Dynamics:

Driver:

Increasing adoption of wafer-level packaging and 3D IC integration

Rising adoption of wafer-level packaging and 3D IC integration has significantly propelled the demand for temporary bonding adhesives. These advanced packaging techniques require efficient adhesive solutions to facilitate seamless integration of multiple components, improving device performance and reducing costs. Moreover, the shift towards miniaturization and lightweight electronic devices has bolstered the use of bonding adhesives in sophisticated manufacturing processes. Furthermore, advancements in adhesive formulations tailored for high-temperature stability and precision are driving the market forward.

Restraint:

Compatibility issues

Compatibility issues remain a major challenge for the temporary bonding adhesive market, particularly in applications involving diverse substrates and thermal processes. The mismatch of material properties between adhesives and substrates can lead to performance degradation, affecting manufacturing efficiency and product reliability. Additionally, stringent requirements for adhesive removal during debonding processes further complicate compatibility concerns. Such limitations hinder broader adoption in certain industries, such as automotive and aerospace, where complex designs necessitate versatile bonding solutions.

Opportunity:

Development of sustainable and environmentally friendly adhesives

Increasing regulatory scrutiny and consumer demand for eco-friendly solutions are encouraging manufacturers to innovate with biodegradable and solvent-free adhesive formulations. Such advancements align with global initiatives toward reducing carbon footprints and promoting green technologies. The integration of bio-based polymers and renewable raw materials into temporary adhesives could revolutionize industry standards, opening new avenues in sectors like electronics and healthcare.

Threat:

Advances in dry handling or mechanical wafer support

Technological advances in dry handling methods or mechanical wafer support systems pose a significant threat to the temporary bonding adhesive market. These alternative approaches reduce reliance on adhesive-based bonding, streamlining production processes and minimizing complications related to adhesive removal. With major players investing in mechanical solutions for wafer handling, the adoption of adhesive-free technologies is gaining traction across industries.

Covid-19 Impact:

The temporary bonding adhesive market experienced mixed consequences due to the COVID-19 pandemic. Supply chain disruptions and reduced manufacturing capacities impacted adhesive production, creating shortages during critical times. However, the surge in demand for electronics and telecommunication devices, fuelled by remote working trends, counterbalanced some of the negative impacts. Innovations in adhesive technologies during the pandemic period supported high-performance applications, ensuring resilience against uncertainties.

The thermal release temporary bonding adhesives segment is expected to be the largest during the forecast period

The thermal release temporary bonding adhesives segment is expected to account for the largest market share during the forecast period. These adhesives offer distinct advantages in terms of precision and efficiency, enabling simplified debonding processes under controlled thermal conditions. Their widespread application across semiconductor manufacturing and wafer-level packaging solutions underscores their significance. Advancements in thermal release adhesives are fostering improved bonding strength and heat stability, meeting industry demands for high-performance adhesives.

The advanced packaging segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the advanced packaging segment is predicted to witness the highest growth rate driven by the rapid adoption of cutting-edge technologies in semiconductor packaging. Temporary bonding adhesives play a pivotal role in supporting processes like 3D IC integration and fan-out wafer-level packaging, enhancing device functionality and reducing production costs. The growing trend toward innovative packaging designs for electronic devices bolsters demand within this market.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by its dominance in semiconductor manufacturing and electronics production. Countries such as China, Taiwan, and South Korea serve as hubs for advanced technology development, driving adhesive adoption in the region. Favorable government policies and robust industrial ecosystems contribute to sustained growth in this region. Additionally, collaborations among local manufacturers and international players strengthen the adhesive supply chain, further boosting market expansion in Asia Pacific.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR fueled by advancements in adhesive technologies and investments in research and development. The region's focus on sustainable practices and innovative manufacturing solutions enhances its competitive edge. Strong demand for high-precision adhesives in automotive, aerospace, and medical device sectors supports regional growth. Furthermore, the presence of key industry players and dedicated funding for material sciences drive adoption rates of temporary bonding adhesives.

Key players in the market

Some of the key players in Temporary Bonding Adhesive Market include 3M, AI Technology, Inc., Brewer Science, Inc., Daetec, Daxin Materials Corp., Dow Inc., Elmer, HD MicroSystems, Ltd., IncE Advanced Materials, Micro Materials Inc, Nissan Chemical Corporation, Promerus, TAiCHEM Materials Corporation, Tokyo Ohka Kogyo Co., Ltd and YINCAE Advanced Materials, LLC.

Key Developments:

In December 2024, Dow launched DOWSIL(TM) EA-3838 Fast Adhesive, a fast-curing silicone adhesive that achieves bond strength in just five minutes. This innovation aims to reduce energy usage and enhance manufacturing efficiency.

In April 2024, Nissan Chemical began mass production of a temporary bonding adhesive used in 3D semiconductor packaging. This adhesive facilitates the attachment of silicon wafers to glass substrates during polishing and stacking processes, allowing for damage-free removal.

Product Types Covered:

  • Thermal Release Temporary Bonding Adhesives
  • UV-Curable Temporary Bonding Adhesives
  • Mechanical Debonding Adhesives
  • Laser Debonding Adhesives
  • Peelable Temporary Bonding Adhesives
  • Pressure-Sensitive Temporary Bonding Adhesives
  • Dissolvable Temporary Bonding Adhesives
  • Other Product Types

Materials Covered:

  • Spin Coating
  • Spray Coating
  • Roll Coating
  • Stencil Printing
  • Other Materials

Applications Covered:

  • Advanced Packaging
  • MEMS (Micro-Electro-Mechanical Systems)
  • CMOS (Complementary Metal-Oxide-Semiconductor)
  • Optoelectronics
  • Other Applications

End Users Covered:

  • Electronics
  • Semiconductor
  • Automotive
  • Aerospace
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Temporary Bonding Adhesive Market, By Product Type

  • 5.1 Introduction
  • 5.2 Thermal Release Temporary Bonding Adhesives
  • 5.3 UV-Curable Temporary Bonding Adhesives
  • 5.4 Mechanical Debonding Adhesives
  • 5.5 Laser Debonding Adhesives
  • 5.6 Peelable Temporary Bonding Adhesives
  • 5.7 Pressure-Sensitive Temporary Bonding Adhesives
  • 5.8 Dissolvable Temporary Bonding Adhesives
  • 5.9 Other Product Types

6 Global Temporary Bonding Adhesive Market, By Material

  • 6.1 Introduction
  • 6.2 Spin Coating
  • 6.3 Spray Coating
  • 6.4 Roll Coating
  • 6.5 Stencil Printing
  • 6.6 Other Materials

7 Global Temporary Bonding Adhesive Market, By Application

  • 7.1 Introduction
  • 7.2 Advanced Packaging
  • 7.3 MEMS (Micro-Electro-Mechanical Systems)
  • 7.4 CMOS (Complementary Metal-Oxide-Semiconductor)
  • 7.5 Optoelectronics
  • 7.6 Other Applications

8 Global Temporary Bonding Adhesive Market, By End User

  • 8.1 Introduction
  • 8.2 Electronics
  • 8.3 Semiconductor
  • 8.4 Automotive
  • 8.5 Aerospace
  • 8.6 Medical Devices
  • 8.7 Other End Users

9 Global Temporary Bonding Adhesive Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 3M
  • 11.2 AI Technology, Inc.
  • 11.3 Brewer Science, Inc
  • 11.4 Daetec
  • 11.5 Daxin Materials Corp.
  • 11.6 Dow Inc.
  • 11.7 Elmer
  • 11.8 HD MicroSystems, Ltd.
  • 11.9 IncE Advanced Materials
  • 11.10 Micro Materials Inc
  • 11.11 Nissan Chemical Corporation
  • 11.12 Promerus
  • 11.13 TAiCHEM Materials Corporation
  • 11.14 Tokyo Ohka Kogyo Co., Ltd.
  • 11.15 YINCAE Advanced Materials, LLC

List of Tables

  • Table 1 Global Temporary Bonding Adhesive Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Temporary Bonding Adhesive Market Outlook, By Product Type (2024-2032) ($MN)
  • Table 3 Global Temporary Bonding Adhesive Market Outlook, By Thermal Release Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 4 Global Temporary Bonding Adhesive Market Outlook, By UV-Curable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 5 Global Temporary Bonding Adhesive Market Outlook, By Mechanical Debonding Adhesives (2024-2032) ($MN)
  • Table 6 Global Temporary Bonding Adhesive Market Outlook, By Laser Debonding Adhesives (2024-2032) ($MN)
  • Table 7 Global Temporary Bonding Adhesive Market Outlook, By Peelable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 8 Global Temporary Bonding Adhesive Market Outlook, By Pressure-Sensitive Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 9 Global Temporary Bonding Adhesive Market Outlook, By Dissolvable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 10 Global Temporary Bonding Adhesive Market Outlook, By Other Product Types (2024-2032) ($MN)
  • Table 11 Global Temporary Bonding Adhesive Market Outlook, By Material (2024-2032) ($MN)
  • Table 12 Global Temporary Bonding Adhesive Market Outlook, By Spin Coating (2024-2032) ($MN)
  • Table 13 Global Temporary Bonding Adhesive Market Outlook, By Spray Coating (2024-2032) ($MN)
  • Table 14 Global Temporary Bonding Adhesive Market Outlook, By Roll Coating (2024-2032) ($MN)
  • Table 15 Global Temporary Bonding Adhesive Market Outlook, By Stencil Printing (2024-2032) ($MN)
  • Table 16 Global Temporary Bonding Adhesive Market Outlook, By Other Materials (2024-2032) ($MN)
  • Table 17 Global Temporary Bonding Adhesive Market Outlook, By Application (2024-2032) ($MN)
  • Table 18 Global Temporary Bonding Adhesive Market Outlook, By Advanced Packaging (2024-2032) ($MN)
  • Table 19 Global Temporary Bonding Adhesive Market Outlook, By MEMS (Micro-Electro-Mechanical Systems) (2024-2032) ($MN)
  • Table 20 Global Temporary Bonding Adhesive Market Outlook, By CMOS (Complementary Metal-Oxide-Semiconductor) (2024-2032) ($MN)
  • Table 21 Global Temporary Bonding Adhesive Market Outlook, By Optoelectronics (2024-2032) ($MN)
  • Table 22 Global Temporary Bonding Adhesive Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 23 Global Temporary Bonding Adhesive Market Outlook, By End User (2024-2032) ($MN)
  • Table 24 Global Temporary Bonding Adhesive Market Outlook, By Electronics (2024-2032) ($MN)
  • Table 25 Global Temporary Bonding Adhesive Market Outlook, By Semiconductor (2024-2032) ($MN)
  • Table 26 Global Temporary Bonding Adhesive Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 27 Global Temporary Bonding Adhesive Market Outlook, By Aerospace (2024-2032) ($MN)
  • Table 28 Global Temporary Bonding Adhesive Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 29 Global Temporary Bonding Adhesive Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.