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導熱箔黏合劑市場－全球產業規模、佔有率、趨勢、機會和預測（按類型、應用、地區和競爭細分，2020-2030 年）

Thermally Conductive Foil Adhesive Market-Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented by Type, By Application, By Region and Competition, 2020-2030F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年，導熱箔黏合劑市值為7.7386億美元，預計到2030年將達到9.3533億美元，複合年成長率為3.39%。全球黏合劑產業是一個充滿活力且不斷發展的產業，也是各行各業各種應用的關鍵組成部分。在專用黏合劑產品中，導熱箔黏合劑因其獨特的高效導熱能力和強大的黏合性能而備受矚目。電子產業的快速發展，以設備尺寸不斷縮小和功率密度不斷提高為特徵，催生了對高效散熱的需求。導熱箔黏合劑能夠有效地將電子元件的熱傳導出去。

市場概況
預測期 2026-2030
2024年市場規模 7.7386億美元
2030年市場規模 9.3533億美元
2025-2030年複合年成長率 3.39%
成長最快的領域 醫療保健
最大的市場 亞太地區

隨著電子設備變得越來越小、越來越緊湊，管理密集組件產生的熱量成為一項重大挑戰。導熱箔黏合劑在散熱方面發揮著至關重要的作用，確保了小型化電子產品的可靠性和性能。汽車和航太等行業面臨著提高能源效率同時保持高性能標準的壓力。在這些領域，導熱箔黏合劑用於增強熱管理並有助於節能。實現對包括金屬、陶瓷和塑膠在內的各種基材的有效黏合，對導熱箔黏合劑提出了挑戰。客製化黏合配方以確保與特定材料的兼容性至關重要。隨著電子設備變得越來越小、越來越複雜，確保導熱箔黏合劑的精確應用和均勻厚度在技術上可能具有挑戰性。

預計市場對永續環保的導熱箔黏合劑的需求將持續成長。黏合劑製造商將繼續探索減少環境影響的配方。隨著電子設備的不斷發展，導熱箔黏合劑將在先進的熱管理解決方案中發揮關鍵作用。這些黏合劑需要提供更高的導熱性和更強的耐用性。電動車的日益普及預計將推動汽車產業對導熱箔黏合劑的需求，尤其是在電池熱管理方面，以確保安全且有效率的運作。

全球導熱箔黏合劑市場是各行各業的重要貢獻者，確保電子設備、汽車應用等領域的高效熱管理和散熱。隨著各行各業持續重視能源效率、小型化和熱性能，導熱箔黏合劑仍將是提昇技術能力的關鍵要素。為了在這個充滿活力的市場中脫穎而出，黏合劑製造商應優先考慮創新，重點關注永續性、先進的導熱性和材料相容性。隨著技術的不斷發展以及各行各業對高效熱管理解決方案的追求，導熱箔黏合劑在塑造電子設備和熱應用的未來方面預計將繼續發揮關鍵作用。

關鍵市場促進因素

電子產業的不斷發展是導熱箔黏合劑市場成長的主要因素

主要市場挑戰

小型化複雜性

主要市場趨勢

先進的熱管理

目錄

第 1 章：產品概述

第2章：研究方法

第3章：執行摘要

第4章：干擾：衝突、流行病與貿易壁壘

第5章：全球導熱箔黏合劑市場展望

  • 市場規模和預測
    • 按價值和數量
  • 市場佔有率和預測
    • 按類型（單面、雙面、其他）
    • 按應用（電腦、通訊、工業、醫療保健和其他）
    • 按地區
    • 按公司分類（2024 年）
  • 市場地圖

第6章：亞太導熱箔黏合劑市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 澳洲
    • 日本
    • 韓國

第7章：歐洲導熱箔黏合劑市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 歐洲：國家分析
    • 法國
    • 德國
    • 西班牙
    • 義大利
    • 英國

第8章：北美導熱箔黏合劑市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 北美：國家分析
    • 美國
    • 墨西哥
    • 加拿大

第9章：南美洲導熱箔黏合劑市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 南美洲：國家分析
    • 巴西
    • 阿根廷
    • 哥倫比亞

第10章：中東和非洲導熱箔黏合劑市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • MEA：國家分析
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 科威特
    • 土耳其
    • 埃及

第 11 章：市場動態

  • 驅動程式
  • 挑戰

第 12 章：市場趨勢與發展

  • 最新動態
  • 產品發布
  • 併購

第13章：全球導熱箔黏合劑市場：SWOT分析

第 14 章：定價分析

第 15 章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的力量
  • 顧客的力量
  • 替代產品的威脅

第 16 章： 大環境分析

第 17 章：競爭格局

  • Fischer Elektronik
  • AMEC Thermasol
  • Katecho Inc
  • 3M Company
  • Teraoka Seisakusho Co Ltd
  • Can-Do National Tape (Tape Holding Co Inc)
  • Dexerials Corporation
  • Nitto Denko Corp
  • T-Global Technology

第 18 章：策略建議

第 19 章：關於我們與免責聲明

簡介目錄
Product Code: 17669

Thermally Conductive Foil Adhesive Market was valued at USD 773.86 Million in 2024 and is expected to reach USD 935.33 Million by 2030 with a CAGR of 3.39%. The global adhesive industry is a dynamic and evolving sector that serves as a critical component in various applications across industries. Among the specialized adhesive products, thermally conductive foil adhesives have gained prominence due to their unique ability to transfer heat efficiently while providing strong bonding properties. The rapid evolution of the electronics industry, characterized by shrinking device sizes and increasing power densities, has created a need for efficient heat dissipation. Thermally conductive foil adhesives enable the effective transfer of heat away from electronic components.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 773.86 Million
Market Size 2030USD 935.33 Million
CAGR 2025-20303.39%
Fastest Growing SegmentMedical Care
Largest MarketAsia Pacific

As electronic devices become smaller and more compact, managing heat generated by densely packed components becomes a significant challenge. Thermally conductive foil adhesives play a vital role in dissipating heat, ensuring the reliability and performance of miniaturized electronics. Industries such as automotive and aerospace are under pressure to improve energy efficiency while maintaining high-performance standards. Thermally conductive foil adhesives are utilized in these sectors to enhance thermal management and contribute to energy savings. Achieving effective adhesion to a wide range of substrates, including metals, ceramics, and plastics, poses a challenge for thermally conductive foil adhesives. Tailoring adhesive formulations to ensure compatibility with specific materials is essential. As electronic devices become smaller and more intricate, ensuring precise application and uniform thickness of thermally conductive foil adhesives can be technically challenging.

The market is expected to witness a growing demand for sustainable and environmentally friendly thermally conductive foil adhesives. Adhesive manufacturers will continue to explore formulations that reduce environmental impact. As electronic devices continue to evolve, thermally conductive foil adhesives will play a pivotal role in advanced thermal management solutions. These adhesives will need to deliver higher thermal conductivity and improved durability. The growing adoption of electric vehicles is expected to drive demand for thermally conductive foil adhesives in the automotive sector, particularly for battery thermal management to ensure safe and efficient operation.

The global thermally conductive foil adhesive market is positioned as an essential contributor to various industries, ensuring efficient heat management and thermal dissipation in electronic devices, automotive applications, and more. As industries continue to prioritize energy efficiency, miniaturization, and thermal performance, thermally conductive foil adhesives will remain a critical element in advancing technological capabilities. To excel in this dynamic market, adhesive manufacturers should prioritize innovation, with a focus on sustainability, advanced thermal conductivity, and material compatibility. As technology continues to evolve and industries seek solutions for efficient thermal management, the role of thermally conductive foil adhesives in shaping the future of electronic devices and thermal applications is expected to remain pivotal.

Key Market Drivers

Growing Advancement in Electronic Industry is Major Factor for Thermally Conductive Foil Adhesive Market Growth

The global thermally conductive foil adhesive market is experiencing significant growth, primarily driven by the continuous advancement in the electronic industry. The electronic industry is characterized by rapid innovation, with manufacturers constantly seeking ways to enhance the performance and reliability of electronic components and devices. Efficient heat dissipation is a critical concern in electronics manufacturing. As electronic devices become more powerful and compact, managing heat generation is essential to ensure their longevity and reliability. The rapid expansion of the consumer electronics industry, with global demand for electronic products projected to double by 2050, is driving the need for advanced thermal management solutions. This surge in electronic device production directly supports the growing adoption of thermally conductive foil adhesives, which are essential for efficient heat dissipation and maintaining the performance and reliability of increasingly compact and high-powered electronic components.

Thermally conductive foil adhesives play a vital role in electronic applications by providing both thermal conductivity and adhesive properties. They facilitate the efficient transfer of heat away from electronic components to ensure proper functioning. With the increasing demand for smaller and more powerful electronic devices, there is a growing need for effective heat management solutions to prevent overheating and component failure. Thermally conductive foil adhesives are designed to bond various electronic components, including heat sinks, LEDs, integrated circuits (ICs), and power modules, to heat-spreading substrates such as metal, ceramic, or printed circuit boards (PCBs).

The electronic industry requires precise and reliable thermal solutions. Thermally conductive foil adhesives provide consistent and efficient heat transfer while ensuring the structural integrity of electronic assemblies. Ongoing research and development efforts in the adhesive industry have led to advanced formulations of thermally conductive foil adhesives. These formulations offer improved thermal conductivity, adhesion strength, and resistance to environmental factors. The growing advancement in the electronic industry's demand for efficient heat management solutions is driving the need for specialized thermally conductive foil adhesives. Electronics manufacturers seek adhesives that can dissipate heat in allowing for the development of more powerful and compact electronic devices.

The global thermally conductive foil adhesive market is experiencing robust growth, primarily driven by the continuous advancement in the electronic industry. These adhesives have become indispensable in the electronic manufacturing process, ensuring efficient heat management and the reliability of electronic components and devices. As the electronic industry continues to innovate and evolve, the market for thermally conductive foil adhesives is expected to thrive. Manufacturers and suppliers in this market must continue to innovate and provide high-quality solutions to meet the evolving demands of the electronic industry, ensuring continued growth and the development of cutting-edge electronic devices worldwide.

Key Market Challenges

Miniaturization Complexity

The global thermally conductive foil adhesive market faces a significant impediment in the form of miniaturization complexity. As electronic devices continue to shrink in size while simultaneously increasing in complexity and power, the demand for efficient heat management solutions has surged. Thermally conductive foil adhesives play a vital role in dissipating heat from electronic components to prevent overheating and ensure optimal performance.

However, miniaturization introduces complexities in the design and application of these adhesives. Smaller components mean tighter spaces, making it challenging to apply and secure thermally conductive foils effectively. Ensuring precise alignment and uniform adhesive coverage in these confined areas becomes a technical challenge.

To address this, manufacturers in the thermally conductive foil adhesive market must invest in research and development to create adhesive solutions that are compatible with miniaturized electronics. This includes formulations that offer exceptional thermal conductivity while also being flexible, easy to handle, and resistant to environmental factors. By meeting the demands of miniaturization complexity, the market can provide reliable solutions for the evolving electronics industry and drive its growth.

Key Market Trends

Advanced Thermal Management

Advanced thermal management techniques have emerged as a key trend driving the growth of the global thermally conductive foil adhesive market. In today's technology-driven world, electronic components are becoming increasingly powerful and compact, generating higher levels of heat. Efficient heat dissipation is crucial to ensure the reliability and longevity of these components.

Thermally conductive foil adhesive plays a vital role in thermal management solutions. These adhesives are designed to bond heat sinks, thermal interface materials, and foil tapes to electronic components, effectively conducting and dissipating heat away from sensitive areas. This enables better temperature control, preventing overheating and potential damage to electronics.

As industries like electronics, telecommunications, and automotive continue to demand smaller, more powerful devices, the need for advanced thermal management solutions grows. Thermally conductive foil adhesives that offer excellent thermal conductivity and adhesive properties are in high demand. Companies that innovate and provide these advanced adhesive solutions are poised to benefit from this trend, contributing to the development of more efficient and reliable electronic systems.

Key Market Players

  • Fischer Elektronik
  • AMEC Thermasol
  • Katecho Inc
  • 3M Company
  • Teraoka Seisakusho Co Ltd
  • Can-Do National Tape (Tape Holding Co Inc)
  • Dexerials Corporation
  • Nitto Denko Corp
  • T-Global Technology

Report Scope:

In this report, the Global Thermally Conductive Foil Adhesive Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Thermally Conductive Foil Adhesive Market, By Type:

  • One Side
  • Two Side
  • Other

Thermally Conductive Foil Adhesive Market, By Application:

  • Computer
  • Communication
  • Industry
  • Medical Care
  • Others

Thermally Conductive Foil Adhesive Market, By Region:

  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Kuwait
    • Turkey
    • Egypt

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Thermally Conductive Foil Adhesive Market.

Available Customizations:

Global Thermally Conductive Foil Adhesive market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Disruptions: Conflicts, Pandemics, and Trade Barriers

5. Global Thermally Conductive Foil Adhesive Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value & Volume
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (One Side, Two Side, and Other)
    • 5.2.2. By Application (Computer, Communication, Industry, Medical Care, and Other)
    • 5.2.3. By Region
    • 5.2.4. By Company (2024)
  • 5.3. Market Map

6. Asia Pacific Thermally Conductive Foil Adhesive Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value & Volume
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. Asia Pacific: Country Analysis
    • 6.3.1. China Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value & Volume
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. India Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value & Volume
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Australia Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value & Volume
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application
    • 6.3.4. Japan Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.4.1. Market Size & Forecast
        • 6.3.4.1.1. By Value & Volume
      • 6.3.4.2. Market Share & Forecast
        • 6.3.4.2.1. By Type
        • 6.3.4.2.2. By Application
    • 6.3.5. South Korea Thermally Conductive Foil Adhesive Market Outlook
      • 6.3.5.1. Market Size & Forecast
        • 6.3.5.1.1. By Value & Volume
      • 6.3.5.2. Market Share & Forecast
        • 6.3.5.2.1. By Type
        • 6.3.5.2.2. By Application

7. Europe Thermally Conductive Foil Adhesive Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value & Volume
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. France Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value & Volume
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. Germany Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value & Volume
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. Spain Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value & Volume
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value & Volume
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. United Kingdom Thermally Conductive Foil Adhesive Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value & Volume
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. North America Thermally Conductive Foil Adhesive Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value & Volume
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. North America: Country Analysis
    • 8.3.1. United States Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value & Volume
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. Mexico Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value & Volume
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Canada Thermally Conductive Foil Adhesive Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value & Volume
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application

9. South America Thermally Conductive Foil Adhesive Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value & Volume
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value & Volume
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. Argentina Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value & Volume
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. Colombia Thermally Conductive Foil Adhesive Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value & Volume
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. Middle East and Africa Thermally Conductive Foil Adhesive Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1.By Value & Volume
  • 10.2. Market Share & Forecast
    • 10.2.1.By Type
    • 10.2.2.By Application
    • 10.2.3.By Country
  • 10.3. MEA: Country Analysis
    • 10.3.1.South Africa Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value & Volume
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2.Saudi Arabia Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value & Volume
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3.UAE Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value & Volume
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application
    • 10.3.4.Kuwait Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value & Volume
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Type
        • 10.3.4.2.2. By Application
    • 10.3.5.Turkey Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value & Volume
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Type
        • 10.3.5.2.2. By Application
    • 10.3.6.Egypt Thermally Conductive Foil Adhesive Market Outlook
      • 10.3.6.1. Market Size & Forecast
        • 10.3.6.1.1. By Value & Volume
      • 10.3.6.2. Market Share & Forecast
        • 10.3.6.2.1. By Type
        • 10.3.6.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Recent Developments
  • 12.2. Product Launches
  • 12.3. Mergers & Acquisitions

13. Global Thermally Conductive Foil Adhesive Market: SWOT Analysis

14. Pricing Analysis

15. Porter's Five Forces Analysis

  • 15.1. Competition in the Industry
  • 15.2. Potential of New Entrants
  • 15.3. Power of Suppliers
  • 15.4. Power of Customers
  • 15.5. Threat of Substitute Products

16. PESTLE Analysis

17. Competitive Landscape

  • 17.1. Fischer Elektronik
    • 17.1.1.Business Overview
    • 17.1.2.Company Snapshot
    • 17.1.3.Products & Services
    • 17.1.4.Financials (In case of listed companies)
    • 17.1.5.Recent Developments
    • 17.1.6.SWOT Analysis
  • 17.2. AMEC Thermasol
  • 17.3. Katecho Inc
  • 17.4. 3M Company
  • 17.5. Teraoka Seisakusho Co Ltd
  • 17.6. Can-Do National Tape (Tape Holding Co Inc)
  • 17.7. Dexerials Corporation
  • 17.8. Nitto Denko Corp
  • 17.9. T-Global Technology

18. Strategic Recommendations

19. About us and Disclaimer