封面
市場調查報告書
商品編碼
1447007

到 2030 年印刷電路板市場預測 - 依類型、基板、層壓材料、原料、最終用戶和地理位置的全球分析

Printed Circuit Board Market Forecasts to 2030 - Global Analysis By Type, Substrate, Laminate Material, Raw Material, End User and by Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據,2023 年全球印刷電路板 (PCB) 市場規模為 861.8 億美元,預計到 2030 年將達到 1,439.1 億美元,預測期內CAGR為 7.6%。作為電子設備的結構基礎,印刷電路板或 PCB 是當代電子產品的重要組成部分。它是一塊平板,上面蝕刻或印刷有導電路徑,通常由玻璃纖維或其他非導電材料製成。這些通常由銅組成的路徑連接電阻器、電容器和積體電路以及其他電子元件,形成一個網路。

國際電子工程師協會 (IAEE) 表示,技術的快速發展需要印刷電路板 (PCB) 的設計和製造不斷創新,並強調這些組件在推動不同行業的電子系統方面發揮關鍵作用。

市場動態:

驅動因素:

對緊湊、高效電子產品的需求

從智慧型手機到智慧手錶,消費者對功能更強大、更輕、更小的電子設備的持續需求推動了對複雜印刷電路板 (PCB) 的需求。此外,PCB製造商被迫設計具有更高性能和更高元件密度的PCB,以滿足緊湊但功能豐富的電子設備不斷變化的需求,這推動PCB市場在小型化和技術能力方面不斷創新。

阻礙因素:

製造複雜性和成本不斷增加

由於對具有更高性能和小型化的複雜 PCB 的持續需求,製造程序變得越來越複雜。此外,複雜設計和尖端材料的使用在成本和複雜性方面給生產帶來了困難。為了滿足這些需求,製造商必須投資最先進的機械和高技能勞動力,這可能會導致生產成本增加,然後轉嫁給客戶。

機會:

5G基礎設施發展

5G技術的廣泛部署為P​​CB產業提供了巨大的機會。 5G 網路的部署需要具有高頻功能和低訊號損失的先進印刷電路板 (PCB)。此外,對基地台、天線和通訊設備等5G基礎設施零件的需求不斷成長,為PCB製造商帶來了商機,並將刺激高頻PCB技術的進步。

威脅:

缺乏必需的原料

製造所需的銅和稀土元素等關鍵原料可能會變得稀缺,對 PCB 產業構成威脅。此外,這些材料的可用性和成本可能會因供應鏈中斷、地緣政治緊張局勢和需求增加而波動,這可能會影響生產成本並延遲 PCB 的製造。

Covid-19 影響:

COVID-19 大流行對印刷電路板 (PCB) 市場產生了深遠影響,顛覆了需求動態和供應鏈。全球範圍內的封鎖和限制導致製造業務中斷,導致生產延誤和關鍵零件短缺。 PCB市場受到供應鏈問題、消費者支出下降和經濟不確定性的影響,從而減少了對電子設備的需求。此外,整個市場努力適應前所未有的破壞,這促使供應鏈策略的重新評估,更加重視數位化,以及產業內的彈性和靈活性。

多層區隔市場預計將在預測期內成為最大的區隔市場

預計多層PCB類別將佔據最大的市場佔有率。夾在一起的多層絕緣材料和銅跡線定義了多層印刷電路板 (PCB),從而實現了複雜的電路設計和改進的功能。這些 PCB 廣泛用於需要有效訊號路由和空間最佳化的複雜電子設備,例如電腦、網路設備和智慧型手機。此外,多層 PCB 的市場主導地位是對小型、功能豐富的電子設備的需求不斷成長的結果。

預計醫療保健領域在預測期內的CAGR最高

預計醫療保健領域的市場CAGR最高。醫療保健產業的強勁擴張歸因於醫療器材、診斷工具和醫療保健設施領域尖端技術的日益整合。在醫療保健領域,對感測器、監視器和通訊系統等電子元件的需求不斷增加。此外,遠距醫療趨勢、智慧醫療設備的創建以及對患者監測和診斷的關注是推動醫療保健領域在電子市場快速擴張的一些因素。

佔比最大的地區:

亞太地區所佔佔有率最大。該地區強大的製造生態系統,尤其是韓國、台灣、中國、日本和韓國這些全球電子產業的主要參與者,是推動其主導地位的原因。該地區在市場上的主導地位得益於其在依賴 PCB 的消費性電子產品、汽車零件和其他電子機器製造領域的強大地位。此外,該地區是 PCB 製造和創新的中心,因為它還擁有高技能的勞動力、先進的製造能力和廣泛的供應網路。

複合CAGR最高的地區:

由於歐洲地區先進的技術和充滿活力的電子產業,印刷電路板(PCB)市場預計將以最高的CAGR成長。在歐洲 PCB 領域,法國、德國和英國等國家對於促進製造業的創新和卓越發揮重要作用。對尖端 PCB 的需求特別受到汽車產業的推動,它們用於自動駕駛系統、電動車和車內連接。此外,歐洲對工業自動化、航空航太和再生能源的重視也促進了先進 PCB 技術的廣泛使用。

主要進展:

2023 年 11 月,總部位於聖塔安娜的印刷電路板生產商 TTM Technologies Inc. 和聖荷西的數位支付公司 Paypal Holdings Inc. 均公佈了超出華爾街預期的第三季收益。 TTM Technologies 披露第三季虧損 3,710 萬美元,即每股虧損 36 美分。然而,在根據資產減損和攤銷成本進行調整後,每股收益升至 43 美分,超過 Zacks Investment Research 三位分析師每股 28 美分的平均預期。

2023 年 10 月,安費諾公司收購 PCTEL 公司。全球無線技術解決方案提供商 PCTEL Inc 表示,它已達成最終協議,將被 Ampheno Corp 收購。該交易為全現金交易,PCTEL Inc 的估值接近 1.397 億美元。根據 PCTEL 董事會批准的交易條款,PCTEL 股東所擁有的每股普通股將獲得 7 美元現金。

2023 年 3 月,住友電工株式會社和 US Conec Ltd. 宣布執行最終許可協議,使住友電工 Lightwave, Corp. 能夠製造 MMC 連接器和 TMT 插芯組件,用於部署下一代高密度、多光纖佈線解決方案。 US Conec 的 MMC 連接器將新穎的、佔用空間減小的多光纖插芯與非常小的外形 (VSFF) 連接器佔用空間(尺寸為 MPO 格式的 1/3)結合在一起。

我們的報告提供了什麼:

  • 區域和國家層面的市場佔有率評估
  • 對新進入者的策略建議
  • 涵蓋2021年、2022年、2023年、2026年及2030年的市場資料
  • 市場趨勢(促進因素、限制因素、機會、威脅、課題、投資機會和建議)
  • 根據市場預測提出關鍵業務部門的策略建議
  • 競爭性景觀美化繪製主要共同趨勢
  • 公司概況,包括詳細的策略、財務狀況和最新發展
  • 反映最新技術進步的供應鏈趨勢

免費客製化產品:

本報告的所有客戶都將有權獲得以下免費自訂選項之一:

  • 公司簡介
    • 其他市場參與者的綜合分析(最多 3 個)
    • 關鍵參與者的 SWOT 分析(最多 3 個)
  • 區域區隔
    • 根據客戶的興趣對任何主要國家的市場估計、預測和CAGR(註:取決於可行性檢查)
  • 競爭基準化分析
    • 根據產品組合、地理分佈和策略聯盟對主要參與者基準化分析

目錄

第 1 章:執行摘要

第 2 章:前言

  • 抽象的
  • 股東
  • 研究範圍
  • 研究方法論
    • 資料探勘
    • 數據分析
    • 數據驗證
    • 研究方法
  • 研究來源
    • 主要研究來源
    • 二手研究來源
    • 假設

第 3 章:市場趨勢分析

  • 介紹
  • 促進要素
  • 限制
  • 機會
  • 威脅
  • 最終用戶分析
  • 新興市場
  • Covid-19 的影響

第 4 章:波特五力分析

  • 供應商的議價能力
  • 買家的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭競爭

第 5 章:全球印刷電路板 (PCB) 市場:依類型

  • 介紹
  • 單方面的
  • 兩面性
  • 多層
  • 高密度互連 (HDI)
  • 其他類型

第 6 章:全球印刷電路板 (PCB) 市場:依基材分類

  • 介紹
  • 死板的
  • 靈活的
  • 剛柔結合

第 7 章:全球印刷電路板 (PCB) 市場:依層壓材料分類

  • 介紹
  • 阻燃劑(FR-4)
    • 阻燃劑(FR-4)高Tg
    • 阻燃劑 (FR-4) 無鹵
    • 標準及其他
  • 軟性(PI、PET)
  • 複合材料
  • 其他層壓材料

第 8 章:全球印刷電路板 (PCB) 市場:依原料分類

  • 介紹
  • 玻璃布
  • 環氧樹脂
  • 牛皮紙
  • 酚醛樹脂
  • 聚醯亞胺薄膜
  • 其他原料

第 9 章:全球印刷電路板 (PCB) 市場:依最終用戶分類

  • 介紹
  • 工業電子
  • 衛生保健
  • 航太和國防
  • 汽車
  • 資訊科技與電信
  • 消費性電子產品
  • 其他最終用戶

第 10 章:全球印刷電路板 (PCB) 市場:依地理位置

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太地區其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 中東和非洲其他地區

第 11 章:主要進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 擴充
  • 其他關鍵策略

第 12 章:公司概況

  • Nippon Mektron, Ltd.
  • Sumitomo Electric Industries Ltd
  • Amphenol Corporation
  • Zhen Ding Technology Holding Limited
  • Fujikura Ltd.
  • Nitto Denko Corporation
  • Tripod Technology Corporation
  • Advanced Circuits Inc.
  • TTM Technologies Inc.
  • Wurth elektronik group (Wurth group)
  • Auter Elektronics Ltd.
  • Unimicron Technology Corporation
Product Code: SMRC25268

According to Stratistics MRC, the Global Printed Circuit Board (PCB) Market is accounted for $86.18 billion in 2023 and is expected to reach $143.91 billion by 2030 growing at a CAGR of 7.6% during the forecast period. As the structural foundation of electronic devices, printed circuit boards, or PCBs, are essential parts of contemporary electronics. It's a flat board with conductive pathways etched or printed onto it that is typically made of fiberglass or another non-conductive material. Connecting resistors, capacitors, and integrated circuits, among other electronic components, these pathways, which are typically composed of copper, create a network.

According to the International Association of Electronics Engineers (IAEE), the rapid evolution of technology necessitates constant innovation in the design and fabrication of Printed Circuit Boards (PCBs), emphasizing the critical role these components play in advancing electronic systems across diverse industries.

Market Dynamics:

Driver:

Demand for compact and high-efficiency electronics

The need for sophisticated printed circuit boards (PCBs) is driven by the ongoing consumer demand for more powerful, lighter, and smaller electronic devices, from smartphones to smart watches. Furthermore, PCB manufacturers are forced to design PCBs with improved performance and higher component density to meet the ever-changing demands of compact yet feature-rich electronic devices, which drives the PCB market to continuously innovate in terms of miniaturization and technological capabilities.

Restraint:

Growing manufacturing complexity and cost

Manufacturing procedures are becoming more complicated as a result of the ongoing demand for sophisticated PCBs with greater performance and miniaturization. Additionally, the use of sophisticated designs and cutting-edge materials presents difficulties for production in terms of cost and complexity. To meet these demands, manufacturers must make investments in state-of-the-art machinery and highly skilled labor, which may lead to increased production costs that are then passed on to customers.

Opportunity:

Development of 5G infrastructure

The broad deployment of 5G technology offers the PCB industry a substantial window of opportunity. Advanced printed circuit boards (PCBs) with high-frequency capabilities and low signal loss are necessary for the deployment of 5G networks. Moreover, the increasing need for 5G infrastructure parts, such as base stations, antennas, and communication devices, presents a business opportunity for PCB manufacturers and will spur advancements in high-frequency PCB technology.

Threat:

Lack of essential raw materials

Critical raw materials like copper and rare earth elements, which are necessary for manufacturing, could become scarce, posing a threat to the PCB industry. Furthermore, the availability and cost of these materials can fluctuate due to supply chain disruptions, geopolitical tensions, and increased demand, which could have an effect on production costs and delay the manufacture of PCBs.

Covid-19 Impact:

The COVID-19 pandemic had a profound effect on the printed circuit board (PCB) market, upending demand dynamics and the supply chain. Production delays and shortages of critical components resulted from the disruption of manufacturing operations caused by the worldwide lockdowns and restrictions. The PCB market was impacted by supply chain issues, declining consumer spending, and economic uncertainty, which reduced demand for electronic devices. Additionally, the market as a whole struggled to adjust to the unprecedented disruptions, which led to a re-evaluation of supply chain strategies, a greater emphasis on digitalization, and an increased focus on resilience and flexibility within the industry.

The Multi-Layer segment is expected to be the largest during the forecast period

It is projected that the multi-layer PCB category will command the largest market share. Multiple layers of insulating material and copper traces sandwiched together define multi-layer printed circuit boards (PCBs), which enable complex circuit designs and improved functionality. These PCBs are widely used in sophisticated electronic devices that require effective signal routing and space optimization, like computers, networking equipment, and smartphones. Moreover, the market dominance of multi-layer PCBs is a result of the growing demand for small, feature-rich electronic devices.

The Healthcare segment is expected to have the highest CAGR during the forecast period

The market's highest CAGR is predicted for the healthcare segment. The strong expansion of the healthcare industry is ascribed to the growing amalgamation of cutting-edge technologies in medical apparatus, diagnostic tools, and healthcare facilities. In the healthcare sector, there is an increasing need for electronic components such as sensors, monitors, and communication systems. Additionally, the telemedicine trend, the creation of smart medical devices, and the focus on patient monitoring and diagnostics are some of the factors driving the healthcare segment's rapid expansion in the electronics market.

Region with largest share:

The Asia-Pacific region has the largest share. The robust manufacturing ecosystem in this region, especially in South Korea, Taiwan, China, Japan, and South Korea, which are major players in the global electronics industry, is what propels its dominance. The region's dominance in the market is supported by its robust standing in the manufacturing of PCB-dependent consumer electronics, auto parts, and other electronic machines. Furthermore, the area is a hub for PCB manufacturing and innovation because it also has a highly skilled labor force, sophisticated manufacturing capabilities, and an extensive supply network.

Region with highest CAGR:

The printed circuit board (PCB) market is expected to grow at the highest CAGR in the Europe region due to the region's advanced technology and dynamic electronics industry. In the European PCB landscape, nations like France, Germany, and the United Kingdom are important for fostering innovation and excellence in manufacturing. Demand for cutting-edge PCBs is driven by the automotive industry in particular, where they are used in autonomous driving systems, electric vehicles, and in-car connectivity. Additionally, the growing use of advanced PCB technologies is facilitated by Europe's emphasis on industrial automation, aerospace, and renewable energy.

Key players in the market

Some of the key players in Printed Circuit Board (PCB) market include Nippon Mektron, Ltd., Sumitomo Electric Industries Ltd, Amphenol Corporation, Zhen Ding Technology Holding Limited, Fujikura Ltd., Nitto Denko Corporation, Tripod Technology Corporation, Advanced Circuits Inc., TTM Technologies Inc., Wurth elektronik group (Wurth group), Auter Elektronics Ltd. and Unimicron Technology Corporation.

Key Developments:

In November 2023, Santa Ana-based TTM Technologies Inc., a printed circuit board producer, and San Jose's digital payments company, Paypal Holdings Inc., both reported third-quarter earnings that beat Wall Street expectations. TTM Technologies disclosed a Q3 loss of $37.1 million or 36 cents per share. However, when adjusted for asset impairment and amortization costs, earnings rose to 43 cents per share, exceeding the average estimate of 28 cents per share by Zacks Investment Research's three analysts.

In October 2023, Amphenol Corp to acquire the company PCTEL. PCTEL Inc, a global provider of wireless technology solutions, said that it had reached a definitive agreement to be purchased by Amphenol Corp. The deal, which is structured as an all cash transaction, values PCTEL Inc at nearly $139.7 million. Under the terms of the deal, approved by PCTEL's board of directors, PCTEL shareholders will receive $7.00 in cash for every share of common stock they own.

In March 2023, Sumitomo Electric Industries, Ltd. and US Conec Ltd. announce the execution of a definitive license agreement enabling Sumitomo Electric Lightwave, Corp. to manufacture MMC connector and TMT ferrule components for the deployment of next-generation, high-density, multi-fiber cabling solutions. US Conec's MMC connector combines a novel, reduced footprint multi-fiber ferrule with a very small Form factor (VSFF) connector footprint which is 1/3 the size of the MPO format.

Types Covered:

  • Single Sided
  • Double Sided
  • Multi-Layer
  • High Density Interconnect (HDI)
  • Other Types

Substrates Covered:

  • Rigid
  • Flexible
  • Rigid-Flex

Laminate Materials Covered:

  • Flame Retardant (FR-4)
  • Flexible (PI,PET)
  • Paper
  • Composites
  • Other Laminate Materials

Raw Materials Covered:

  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Phenolic Resin
  • Polyimide Film
  • Other Raw Materials

End Users Covered:

  • Industrial Electronics
  • Healthcare
  • Aerospace and Defense
  • Automotive
  • IT & Telecom
  • Consumer Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 End User Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Printed Circuit Board (PCB) Market, By Type

  • 5.1 Introduction
  • 5.2 Single Sided
  • 5.3 Double Sided
  • 5.4 Multi-Layer
  • 5.5 High Density Interconnect (HDI)
  • 5.6 Other Types

6 Global Printed Circuit Board (PCB) Market, By Substrate

  • 6.1 Introduction
  • 6.2 Rigid
  • 6.3 Flexible
  • 6.4 Rigid-Flex

7 Global Printed Circuit Board (PCB) Market, By Laminate Material

  • 7.1 Introduction
  • 7.2 Flame Retardant (FR-4)
    • 7.2.1 Flame Retardant (FR-4) high Tg
    • 7.2.2 Flame Retardant (FR-4) halogen Free
    • 7.2.3 Standard & Others
  • 7.3 Flexible (PI,PET)
  • 7.4 Paper
  • 7.5 Composites
  • 7.6 Other Laminate Materials

8 Global Printed Circuit Board (PCB) Market, By Raw Material

  • 8.1 Introduction
  • 8.2 Glass Fabric
  • 8.3 Epoxy Resin
  • 8.4 Kraft Paper
  • 8.5 Phenolic Resin
  • 8.6 Polyimide Film
  • 8.7 Other Raw Materials

9 Global Printed Circuit Board (PCB) Market, By End User

  • 9.1 Introduction
  • 9.2 Industrial Electronics
  • 9.3 Healthcare
  • 9.4 Aerospace and Defense
  • 9.5 Automotive
  • 9.6 IT & Telecom
  • 9.7 Consumer Electronics
  • 9.8 Other End Users

10 Global Printed Circuit Board (PCB) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Nippon Mektron, Ltd.
  • 12.2 Sumitomo Electric Industries Ltd
  • 12.3 Amphenol Corporation
  • 12.4 Zhen Ding Technology Holding Limited
  • 12.5 Fujikura Ltd.
  • 12.6 Nitto Denko Corporation
  • 12.7 Tripod Technology Corporation
  • 12.8 Advanced Circuits Inc.
  • 12.9 TTM Technologies Inc.
  • 12.10 Wurth elektronik group (Wurth group)
  • 12.11 Auter Elektronics Ltd.
  • 12.12 Unimicron Technology Corporation

List of Tables

  • Table 1 Global Printed Circuit Board (PCB) Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Printed Circuit Board (PCB) Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Printed Circuit Board (PCB) Market Outlook, By Single Sided (2021-2030) ($MN)
  • Table 4 Global Printed Circuit Board (PCB) Market Outlook, By Double Sided (2021-2030) ($MN)
  • Table 5 Global Printed Circuit Board (PCB) Market Outlook, By Multi-Layer (2021-2030) ($MN)
  • Table 6 Global Printed Circuit Board (PCB) Market Outlook, By High Density Interconnect (HDI) (2021-2030) ($MN)
  • Table 7 Global Printed Circuit Board (PCB) Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 8 Global Printed Circuit Board (PCB) Market Outlook, By Substrate (2021-2030) ($MN)
  • Table 9 Global Printed Circuit Board (PCB) Market Outlook, By Rigid (2021-2030) ($MN)
  • Table 10 Global Printed Circuit Board (PCB) Market Outlook, By Flexible (2021-2030) ($MN)
  • Table 11 Global Printed Circuit Board (PCB) Market Outlook, By Rigid-Flex (2021-2030) ($MN)
  • Table 12 Global Printed Circuit Board (PCB) Market Outlook, By Laminate Material (2021-2030) ($MN)
  • Table 13 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) (2021-2030) ($MN)
  • Table 14 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) high Tg (2021-2030) ($MN)
  • Table 15 Global Printed Circuit Board (PCB) Market Outlook, By Flame Retardant (FR-4) halogen Free (2021-2030) ($MN)
  • Table 16 Global Printed Circuit Board (PCB) Market Outlook, By Standard & Others (2021-2030) ($MN)
  • Table 17 Global Printed Circuit Board (PCB) Market Outlook, By Flexible (PI, PET) (2021-2030) ($MN)
  • Table 18 Global Printed Circuit Board (PCB) Market Outlook, By Paper (2021-2030) ($MN)
  • Table 19 Global Printed Circuit Board (PCB) Market Outlook, By Composites (2021-2030) ($MN)
  • Table 20 Global Printed Circuit Board (PCB) Market Outlook, By Other Laminate Materials (2021-2030) ($MN)
  • Table 21 Global Printed Circuit Board (PCB) Market Outlook, By Raw Material (2021-2030) ($MN)
  • Table 22 Global Printed Circuit Board (PCB) Market Outlook, By Glass Fabric (2021-2030) ($MN)
  • Table 23 Global Printed Circuit Board (PCB) Market Outlook, By Epoxy Resin (2021-2030) ($MN)
  • Table 24 Global Printed Circuit Board (PCB) Market Outlook, By Kraft Paper (2021-2030) ($MN)
  • Table 25 Global Printed Circuit Board (PCB) Market Outlook, By Phenolic Resin (2021-2030) ($MN)
  • Table 26 Global Printed Circuit Board (PCB) Market Outlook, By Polyimide Film (2021-2030) ($MN)
  • Table 27 Global Printed Circuit Board (PCB) Market Outlook, By Other Raw Materials (2021-2030) ($MN)
  • Table 28 Global Printed Circuit Board (PCB) Market Outlook, By End User (2021-2030) ($MN)
  • Table 29 Global Printed Circuit Board (PCB) Market Outlook, By Industrial Electronics (2021-2030) ($MN)
  • Table 30 Global Printed Circuit Board (PCB) Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 31 Global Printed Circuit Board (PCB) Market Outlook, By Aerospace and Defense (2021-2030) ($MN)
  • Table 32 Global Printed Circuit Board (PCB) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 33 Global Printed Circuit Board (PCB) Market Outlook, By IT & Telecom (2021-2030) ($MN)
  • Table 34 Global Printed Circuit Board (PCB) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 35 Global Printed Circuit Board (PCB) Market Outlook, By Other End Users (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.