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市場調查報告書
商品編碼
1418051

高性能剛性 PCB 市場報告：2030 年趨勢、預測與競爭分析

High Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

高性能剛性 PCB 趨勢與預測

預計2024年至2030年全球高性能剛性PCB市場將以4.6%的複合年成長率成長。該市場的主要促進因素是消費性電子、汽車、航太和通訊等各行業對高性能剛性 PCB 的需求不斷成長，電子產品、雲端運算、物聯網、5G 等領域的技術不斷發展和改進。以資料為中心的技術和應用（例如人工智慧）的快速成長。全球高性能剛性 PCB 市場的未來前景廣闊，航太、消費性電子、汽車、通訊、醫療和工業市場充滿機會。

Lucintel 預測，多層板將由多層導電材料與絕緣層粘合而成，從而實現單層或兩層基板不可能實現的具有高元件密度的高度複雜電路。預計在此期間將出現最高成長。

在預測期內，亞太地區可能仍然是最大的地區，因為它是中國、台灣和韓國等主要電子製造地的所在地。

常問問題

Q1.市場成長預測如何？

A1. 2024年至2030年，全球高性能剛性PCB市場預計將以4.6%的複合年成長率成長。

Q2.影響市場成長的主要促進因素有哪些？

A2. 該市場的主要促進因素是消費性電子、汽車、航太和通訊等各行業對高性能剛性PCB的需求不斷成長，電子產品和雲端運算的不斷技術發展和改進。以資料為中心的技術和應用（例如物聯網、5G 和人工智慧）的成長。

Q3.市場的主要細分市場有哪些？

A3. 全球高性能剛性PCB市場前景廣闊，航太、消費性電子、汽車、通訊、醫療和工業市場充滿機會。

Q4.市場上主要企業有哪些？

A4. 主要高性能剛性PCB公司如下。

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

Q5.未來最大的細分市場是什麼？

A5.Lucintel認為，在預測期內，多層板由多層導電材料與絕緣層粘合而成，可以實現具有高密度元件的極其複雜的電路，這是單層或雙層基板無法實現的.預計將出現最高成長。

Q6. 未來五年預計哪個地區將成為最大的市場？

A6. 由於中國、台灣和韓國等主要電子製造地，預計亞太地區在預測期內仍將是最大的地區。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球高性能剛性PCB市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球高性能剛性PCB市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球高性能剛性 PCB 市場
    • 單層
    • 雙層
    • 多層
  • 全球高性能剛性 PCB 市場（按應用）
    • 航太
    • 家用電器
    • 車
    • 溝通
    • 藥品
    • 工業的
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球高性能剛性PCB市場區域分佈
  • 北美高性能剛性PCB市場
  • 歐洲高性能剛性PCB市場
  • 亞太高性能剛性 PCB 市場
  • 其他地區高性能剛性PCB市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球高性能剛性 PCB 市場成長機會
    • 全球高性能剛性 PCB 市場成長機會（按應用）
    • 全球高性能剛性 PCB 市場成長機會（按地區）
  • 全球高性能剛性PCB市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球高性能剛性PCB市場產能
    • 全球高性能剛性PCB市場的併購和合資企業
    • 認證和許可

第7章主要企業概況

  • Ibiden
  • PCBMay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • AT&S
  • SEMIKRON
  • Kinwong
  • AVARY HOLDING
  • HannStar Board
簡介目錄

High Performance Rigid PCB Trends and Forecast

The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets. The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030. The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.

A more than 150-page report is developed to help in your business decisions.

High Performance Rigid PCB by Segment

The study includes a forecast for the global high performance rigid PCB by type, application, and region.

High Performance Rigid PCB Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single-Layer
  • Double-Layer
  • Multi-Layer

High Performance Rigid PCB Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Aerospace
  • Consumer Electronics
  • Automobile
  • Communications
  • Medical
  • Industrial
  • Others

High Performance Rigid PCB Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of High Performance Rigid PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies high performance rigid PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the high performance rigid PCB companies profiled in this report include-

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

High Performance Rigid PCB

Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.

APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.

Features of the Global High Performance Rigid PCB Market

Market Size Estimates: High performance rigid pcb market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: High performance rigid pcb market size by type, application, and region in terms of value ($B).

Regional Analysis: High performance rigid pcb market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the high performance rigid PCB market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the high performance rigid PCB market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for high performance rigid PCB market?

Answer: The global high performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the high performance rigid PCB market?

Answer: The major drivers for this market are growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.

Q3. What are the major segments for high performance rigid PCB market?

Answer: The future of the global high performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets.

Q4. Who are the key high performance rigid PCB market companies?

Answer: Some of the key high performance rigid PCB companies are as follows.

  • Ibiden
  • PCBmay
  • TTM
  • Unimicron Technology
  • Tripod Technology
  • At&S
  • SEMIKRON
  • Kinwong
  • AVARY Holding
  • Hannstar Board

Q5. Which high performance rigid PCB market segment will be the largest in future?

Answer: Lucintel forecasts that multi-layer is expected to witness highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.

Q6. In high performance rigid PCB market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the high performance rigid PCB market by type (single-layer, double-layer, and multi-layer), application (aerospace, consumer electronics, automobile, communications, medical, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global High Performance Rigid PCB Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global High Performance Rigid PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Performance Rigid PCB Market by Type
    • 3.3.1: Single-layer
    • 3.3.2: Double-layer
    • 3.3.3: Multi-layer
  • 3.4: Global High Performance Rigid PCB Market by Application
    • 3.4.1: Aerospace
    • 3.4.2: Consumer Electronics
    • 3.4.3: Automobile
    • 3.4.4: Communications
    • 3.4.5: Medical
    • 3.4.6: Industrial
    • 3.4.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Performance Rigid PCB Market by Region
  • 4.2: North American High Performance Rigid PCB Market
    • 4.2.2: North American High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.3: European High Performance Rigid PCB Market
    • 4.3.1: European High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.3.2: European High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.4: APAC High Performance Rigid PCB Market
    • 4.4.1: APAC High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.4.2: APAC High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others
  • 4.5: ROW High Performance Rigid PCB Market
    • 4.5.1: ROW High Performance Rigid PCB Market by Type: Single-layer, Double-layer, and Multi-layer
    • 4.5.2: ROW High Performance Rigid PCB Market by Application: Aerospace, Consumer Electronics, Automobile, Communications, Medical, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Performance Rigid PCB Market by Type
    • 6.1.2: Growth Opportunities for the Global High Performance Rigid PCB Market by Application
    • 6.1.3: Growth Opportunities for the Global High Performance Rigid PCB Market by Region
  • 6.2: Emerging Trends in the Global High Performance Rigid PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global High Performance Rigid PCB Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global High Performance Rigid PCB Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ibiden
  • 7.2: PCBMay
  • 7.3: TTM
  • 7.4: Unimicron Technology
  • 7.5: Tripod Technology
  • 7.6: AT&S
  • 7.7: SEMIKRON
  • 7.8: Kinwong
  • 7.9: AVARY HOLDING
  • 7.10: HannStar Board