全球多層印刷電路基板市場規模、佔有率、成長分析（按產品、物質和類型）- 2024-2031 年產業預測

Global Multilayer Printed Circuit Board Market Size, Share, Growth Analysis, By Product(Rigid PCBs, Standard multilayer), By Substance(Rigid, Flexible), By Type(FR-4, FR-4 high Tg) - Industry Forecast 2024-2031

出版日期: 2024年04月01日 | 出版商:

SkyQuest | 英文 197 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

全球多層印刷基板市值2022年為833.8 億美元，從2023年的881.2億美元增至，預計到2031年將達到1370.9 億美元，複合年成長率為5.68%。

多層印刷電路基板(PCB) 因其眾多的技術優勢而廣受認可，包括尺寸較小、重量較輕、品質較高、耐用性較高、彈性較強以及簡化的連接性。這些特性完全符合智慧型手機和電腦等現代電子設備對小型輕量設計的需求。這些PCB廣泛應用於各個領域，包括電氣設備、軍事設備、醫療保健小型化以及整合到智慧家居系統中的智慧型設備市場的快速成長。在單基板整合多個層可增強功能，同時保持緊湊的佔地面積。其獨特的電氣特性可實現高容量和高速度，對於尋求高效、強大的電子解決方案的製造商來說至關重要。此外，它的適應性允許以剛性和軟性配置進行生產。然而，儘管有許多優點，但諸如服務成本上升以及與壓縮多塊基板相關的複雜性等挑戰可能會阻礙多層印刷電路基板市場的成長。全球多層印刷電路基板（PCB）市場目前正在經歷各種趨勢和動態推動的變革時期。通訊、汽車、醫療保健和消費性電子等行業對先進電子產品的需求不斷成長，正在推動市場成長。連網型設備、物聯網應用的普及以及向 5G 技術的過渡進一步推動了對複雜多層 PCB 的需求，這些 PCB 在有限的空間中提供增強的功能。汽車產業正在將電子設備整合到車輛中，從資訊娛樂系統到 ADAS（高級駕駛輔助系統），為市場擴張做出了巨大貢獻。特別是，人們正在轉向高頻材料，以幫助提高資料傳輸速度、減少訊號損失並提高整體效能。對軟性和軟硬複合PCB 的需求也在增加，特別是對於需要緊湊和可彎曲電路的應用。在這個充滿活力的格局中，領先的市場參與者專注於技術進步、產品創新和策略聯盟，以保持競爭力。然而，電子廢棄物的設計複雜性、小型化要求和環境問題等挑戰正在促使產業相關人員考慮。總體而言，全球多層PCB 市場受到電子設備的持續發展、5G 和物聯網應用的擴展以及多層PCB 在推動全球各行業先進電子系統發展方面的關鍵作用的推動，並為永續發展做好了準備。

Sumitomo Electric Industries
Nippon Mektron Ltd.
Compeq Manufacturing Co. Ltd.
Amphenol
ZD Tech
TTM Technologies Inc.
TE Connectivity
Unimicron Technology Corporation
Molex
AT&S
Hon Hai Precision Industry Co., Ltd.
Sumitomo Denko
Wurth elektronik group（Wurth group）
Becker & Muller Schaltungsdruck GmbH
Advanced Circuits Inc
Murrietta Circuits
Zhen Ding Technology Holding Limited
Tripod Technology Corporation.

簡介目錄

Product Code: SQMIG45K2083

Global multilayer printed circuit boards market was valued at USD 83.38 billion in 2022 and is expected to grow from USD 88.12 billion in 2023 to reach USD 137.09 billion by 2031, at a CAGR of 5.68% during the forecast period (2024-2031).

Multilayer printed circuit boards (PCBs) are gaining widespread recognition due to their myriad technical advantages, including compact size, lightweight construction, high quality, enhanced durability, flexibility, and streamlined connectivity. These attributes perfectly address the demand for compactness and lightweight design in modern electronic devices like smartphones and computers. These PCBs find extensive use across various sectors, including electrical devices, military equipment, healthcare miniaturization, and the burgeoning market for smart devices integrated into home automation systems. By incorporating multiple layers into a single board, they amplify functionality while maintaining a compact footprint. Their inherent electrical properties enable high capacity and speed, making them indispensable for manufacturers seeking efficient and powerful electronic solutions. Moreover, their adaptability allows for production in both rigid and flexible configurations. However, despite their numerous advantages, challenges such as higher service costs and the complexity associated with compacting multiple boards can hinder the growth of the multilayer PCB market. The global multilayer printed circuit boards (PCBs) market is currently witnessing a transformative phase, driven by various trends and dynamics. The increasing demand for advanced electronics across industries like telecommunications, automotive, healthcare, and consumer electronics is fueling market growth. The proliferation of connected devices, IoT applications, and the transition to 5G technology further propel the demand for sophisticated multilayer PCBs that offer enhanced functionality within limited space. The automotive industry is a significant contributor to market expansion, with the integration of electronics in vehicles ranging from infotainment systems to advanced driver-assistance systems (ADAS). Notably, there is a shift towards high-frequency materials to facilitate increased data transfer rates, reduced signal loss, and overall improved performance. The demand for flexible and rigid-flex PCBs is also on the rise, particularly for applications requiring compact and bendable circuitry. In this dynamic landscape, key market players are focusing on technological advancements, product innovations, and strategic collaborations to maintain a competitive edge. However, challenges such as design complexity, miniaturization requirements, and environmental concerns related to electronic waste pose considerations for industry stakeholders. Overall, the global multilayer PCBs market is poised for sustained growth, driven by the continuous evolution of electronic devices, the expansion of 5G and IoT applications, and the pivotal role of multilayer PCBs in enabling the development of advanced electronic systems across diverse industries worldwide.

Top-down and bottom-up approaches were used to estimate and validate the size of the global multilayer printed circuit boards market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Boards Market Segmental Analysis

Global multilayer printed circuit board market is segmented based on product, substance, laminate material, end user and region. By product, the market is segmented into rigid PCBs, standard multilayer, HDI/build-up/microtia, flexible circuits, IC substrate, and others. By substance, the market is segmented into rigid, flexible, and rigid-flex. By laminate, the market is segmented into FR-4, FR-4 high Tg, FR-4 halogen free, standard & others, flexible (pi,pet), paper, composites, others. By end use, the market is segmented into IT & telecommunication, consumer electronics, industrial electronics, automotive, aerospace and defence, and others. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Multilayer Printed Circuit Boards Market

The surge in the usage and demand for electronic devices like smartphones, laptops, and smart televisions worldwide is a primary driver fueling the growth of the printed circuit board (PCB) market, particularly the multilayer segment. Automated machinery and cell towers play a crucial role in meeting the escalating demand for these indispensable gadgets. The increasing global population has led to a widespread adoption of electronic devices, contributing to a surge in the demand for printed circuit boards. These devices are not only prevalent in households but also find extensive use in aerospace, military, and various government institutions, where they are essential for ensuring optimal efficiency. This widespread adoption across diverse sectors is expected to further bolster the growth of the multilayer printed circuit board market.

Restraints in the Global Multilayer Printed Circuit Boards Market

The manufacturing, design, and depaneling costs are significant factors in the production of multilayer printed circuit boards, often leading to higher expenses. This higher cost aspect encourages the utilization of cheaper alternatives by major electrical device manufacturers. Additionally, the production time required for multilayer printed circuit boards is considerably longer compared to traditional single or double-layer PCBs, further contributing to the overall cost of the final product.

Market Trends of the Global Multilayer Printed Circuit Boards Market

The introduction of AI, IoT, and 5G technologies is expected to significantly drive the growth of multilayer PCBs. In today's digitized era, these technological advancements represent major trends, closely aligned with the need to transmit, transfer, manage, and process vast amounts of data efficiently. The integration of AI, IoT, and 5G relies on seamless communication with minimal latency, a requirement that can be effectively addressed with the utilization of multilayer PCBs.

Executive Summary

Market Overview
Wheel of Fortune

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Parent Market Analysis

Market Overview
Market Size
Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges

Key Market Insights

Technology Analysis
Pricing Analysis
Supply Chain Analysis
Value Chain Analysis
Ecosystem of the Market
IP Analysis
Trade Analysis
Startup Analysis
Raw Material Analysis
Innovation Matrix
Pipeline Product Analysis
Macroeconomic Indicators
Top Investment Analysis
Key Success Factor
Degree of Competition

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Regulatory Landscape
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers
Skyquest Special Insights on Future Disruptions
- Political Impact
- Economic Impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact

Global Multilayer Printed Circuit Board Market by Product

Market Overview
Rigid PCBs
Standard multilayer
HDI/build-up/microtia
Flexible circuits
IC substrate
Others

Global Multilayer Printed Circuit Board Market by Substance

Market Overview
Rigid
Flexible
Rigid-flex

Global Multilayer Printed Circuit Board Market by Type

Market Overview
FR-4
FR-4 high Tg
FR-4 halogen free
Standard & Others
Flexible (PI
PET)
Paper
Composites
Others

Global Multilayer Printed Circuit Board Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2021
Strategies Adopted by Key Market Players
Top Winning Strategies
- By Development
- By Company
- By Year
Recent Activities in the Market
Key Companies Market Share (%), 2021

Key Company Profiles

Sumitomo Electric Industries
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nippon Mektron Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Compeq Manufacturing Co. Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Amphenol
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ZD Tech
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TTM Technologies Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TE Connectivity
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Unimicron Technology Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Molex
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AT&S
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Hon Hai Precision Industry Co., Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Sumitomo Denko
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Wurth elektronik group (Wurth group)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Becker & Muller Schaltungsdruck GmbH
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Circuits Inc
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Murrietta Circuits
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Zhen Ding Technology Holding Limited
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Tripod Technology Corporation.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments