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市場調查報告書
商品編碼
1745801
全球基板市場:市場佔有率和排名、總銷售額和需求預測(至2025年)Molded Interconnect Substrate (MIS) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025 |
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全球基板市場規模預計將從2024年的9,754萬美元成長到2031年的2.97億美元,2025年至2031年的年複合成長率為 15.78%。
2024年北美 MIS基板市場規模價值 2,440萬美元。預計到2031年該市場規模將達到 6,980萬美元,預測期內(2025-2031年)的年複合成長率為 14.73%。
2024年亞太地區 MIS基板市場規模價值 5,645萬美元。預計到2031年,該市場規模將達到 1.8984億美元,預測期內(2025-2031年)的年複合成長率為 17.22%。
2024年歐洲 MIS基板市場規模價值 1,513萬美元。預計到2031年,該市場規模將達到 3,394萬美元,預測期內(2025-2031年)的年複合成長率為 11.43%。
從數量來看,2024年全球MIS基板出貨量將達到354.5萬片,2031年將達到1,180.4萬片。
目前全球生產MIS基板的公司僅有三家:台灣的PPt、中國的MiSpak Technology、馬來西亞的QDOS。
PPt目前可提供1層、2層、3層、4層、6層MIS基板。 MiSpak Technology可提供1層、2層MIS基板。 QDOS可提供1層、2層、3層MIS基板。
MIS產品在基板應用市場的成長潛力來自於伺服器、資料中心等網路通訊產品、電動車和汽車智慧化驅動的汽車電子控制裝置,以及5G、AIoT等領域。隨著這些相關產品的推出,對半導體封裝用基板的要求也將大幅提升,要求具有較高的設計自由度、更佳的性能和高可靠性。
在先進的導線架產品方面,MIS廠商(PPt、MiSpak、QDOS)主要供應的產品不僅限於單層基板,PPt還可以提供用於多晶片封裝的多層基板捲繞導線架產品,這是傳統導線架廠商難以提供的。
目前MIS基板主要應用於電源/PMIC/模擬、汽車電子產品、RF/5G、光學防手震(OIS)、指紋辨識、第三代半導體、LED等領域,其中MIS基板大部分應用於電源領域,在第三代半導體中,MIS基板主要用於GaN元件。
隨著技術不斷更新,5G需要高速率、低延遲、穩定的訊號。隨著電腦化、智慧化的需求,家用電子電器和工業市場不斷湧現新的應用。因此,對半導體晶片的性能要求正朝著高速運算、高性能、低損耗等方向發展。
此外,受此發展趨勢帶動,對IC構裝基板的要求也不斷提升,如精細化、窄間距化、高散熱性等。 MIS基板廠商深耕產品生產技術力已久,目前開發窄間距、捲繞、多層基板生產技術,預計將應用於5G、物聯網、電動車等領域。
此外,在家用電子電器智慧型手機的應用領域,全球知名品牌行動電話廠商在市場上佔有較大的佔有率,隨著新款行動電話的上市,相機模組的規格也不斷提升,高規格相機模組不斷湧現。此外,受中美貿易戰影響,新行動電話的滲透加速了中國各大行動電話廠商的發展,MIS基板廠商透過引進本土原料供應,在行動電話相機模組應用領域展開多項佈局。隨著新款行動電話陸續上市,預計MIS基板廠商產品的市場滲透率將會提升。
本報告目的是全面概述全球 MIS基板市場,重點關注總銷售量、銷售收益、價格、市場佔有率和主要企業的排名,並依地區、國家、細分市場和應用對 MIS基板進行分析。
本文提供MIS基板市場規模、估值和預測,涵蓋2020年至2031年的歷史及預測資料,包括銷售量(千台)及銷售收益(百萬美元),並以2024年為基準年。定量和定性分析有助於讀者制定業務/成長策略,評估市場競爭格局,分析公司在當前市場中的地位,並就MIS基板做出明智的業務決策。
The global Molded Interconnect Substrate (MIS) market is projected to reach US$ 297 million by 2031 from an estimated US$ 97.54 million in 2024, at a CAGR of 15.78% during 2025 and 2031.
North American market for MIS Substrates was valued at $ 24.4 million in 2024 and will reach $ 69.8 million by 2031, at a CAGR of 14.73 % during the forecast period of 2025 through 2031.
Asia-Pacific market for MIS Substrates was valued at $ 56.45 million in 2024 and will reach $ 189.84 million by 2031, at a CAGR of 17.22 % during the forecast period of 2025 through 2031.
Europe market for MIS Substrates was valued at $ 15.13 million in 2024 and will reach $ 33.94 million by 2031, at a CAGR of 11.43 % during the forecast period of 2025 through 2031.
In terms of volume, in 2024 the global MIS substrates shipments were 3,545 kk pieces, and will reach 11,804 kk pieces in 2031.
Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates
The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.
The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.
In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.
This report aims to provide a comprehensive presentation of the global market for MIS Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of MIS Substrates by region & country, by Layer, and by Application.
The MIS Substrates market size, estimations, and forecasts are provided in terms of sales volume (KK pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding MIS Substrates.
Market Segmentation
By Company
Segment by Layer
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of MIS Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Layer, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of MIS Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of MIS Substrates in country level. It provides sigmate data by Layer, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.