中國資料中心冷卻市場：市場佔有率分析、產業趨勢與統計及成長預測（2026-2031年）

根據 Mordor Intelligence 預測，中國資料中心冷卻市場規模預計將從 2025 年的 3.7163 億美元成長到 2026 年的 4.351 億美元，然後從 2026 年到 2031 年以 17.08% 的複合年成長，到 2031 年達到 9.9.99.99.00 億美元。

本報告按資料中心類型（超大規模資料中心業者資料中心（自有和租賃）、企業級和邊緣資料中心、託管資料中心）、層級（Tier 1 和 Tier 2、Tier 3、Tier 4）、冷卻技術（風冷、液冷）以及元件（服務、設備）進行細分。市場預測以美元計價。

中國資料中心冷卻市場趨勢及洞察。

快速成長的超大規模和人工智慧主導的機架密度

最新的AI機櫃功耗高達20-130kW，而傳統伺服器的功耗僅為5-10kW，這使得風冷散熱捉襟見肘，加速了液冷技術的普及應用。華為的密封液冷機櫃可將散熱功耗降低96%，並將設施的PUE值降至1.1，充分展現了其在超大規模資料中心環境下的實用性。在貴安、烏蘭察布和蕪湖的國家級旗艦AI計算叢集中，液冷解決方案已從建設階段就被納入規劃，這凸顯了資料中心規劃的結構性轉變——散熱設計與晶片性能同等重要。

政府對新建設的PUE（公共事業使用效率）有限制

北京的「十四五」規劃要求所有新建資料中心到2025年PUE值低於1.5，上海進一步將這一標準收緊至1.3。2023年綠色資料中心標準擴大了合規要求，將用水率和可再生能源採購納入其中，鞏固了液冷作為實現大規模能效目標的唯一可行手段的地位。

高昂的電費削弱了總擁有成本優勢。

預計資料中心的電力消耗量將從2025年的200太瓦時(TWh)增加到2030年的400-600太瓦時(TWh)。江蘇和浙江兩省不斷上漲的電價導致營運成本增加，甚至超過了舊設備折舊免稅額的成本節約。 「東方數據，西方計算」舉措旨在透過將負荷轉移到可再生能源豐富的省份來緩解這一壓力，但營運商需要克服延遲和光纖回程傳輸的局限性。

細分市場分析

預計到2025年，超大規模資料中心業者資料中心將佔中國資料中心冷卻市場營收的46.02%，其對中國資料中心冷卻市場規模的貢獻預計將以17.62%的複合年成長率成長至2031年。這些公司正在建造單機架功率超過100千瓦的人工智慧叢集，因此液冷技術對於確保熱裕度和PUE合規性至關重要。其龐大的規模也降低了單機架的冷卻成本，樹立了企業和邊緣營運商正在效仿的標竿。然而，由於空間和維護方面的限制，在邊緣站點，緊湊型後門式熱交換器更受歡迎。儘管由於超大規模資料中心業者的崛起，風冷系統在維修市場仍保持著一定的市場需求，但液冷基礎設施被認為是新建資料中心的首選。

託管服務供應商順應這一趨勢，將專用液冷區域作為加值服務打包出售，從而將高密度配置轉化為盈利能力和差異化的客戶體驗。雖然企業級設施在全面採用浸沒式冷卻技術方面略顯滯後，但它們正在試行晶片級冷卻迴路，以最大限度地提高現有冷卻器系統的容量。所有這些發展，以及各業者向人工智慧驅動的溫度控管架構的轉變，共同推動中國資料中心冷卻市場保持高速成長。

三級資料中心憑藉其成熟的設計框架和良好的運作與資本支出（CAPEX）平衡，預計到2025年將佔總支出的66.55%。然而，由於人工智慧訓練工作負載無法容忍即使幾分鐘的意外停機，四級資料中心的建設正以18.83%的複合年成長率快速成長。因此，隨著投資人優先考慮能夠將機架溫度維持在30 度C以下（即使在維護期間）的容錯性強、可並行維護的液冷系統，中國資料中心冷卻市場中四級資料中心的市場規模將迅速擴大。

一級和二級資料中心的市場佔有率正在穩步下降，因為它們的機架功率和冷卻能力已穩定在15千瓦以下。同時，三級資料中心正在維修到雙迴路液冷基礎設施，使營運商能夠在無需投入新建設中心預算的情況下，滿足客戶新的密度需求。這種分級演進進一步凸顯了液冷技術在中國資料中心冷卻市場的重要性，它已成為所有以人工智慧為中心的資料中心的基礎。

其他好處：

• Excel格式的市場預測（ME）表
• 3個月的分析師支持

目錄

第1章：引言

• 研究假設和市場定義
• 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

• 市場概覽
• 市場促進因素
  • 超大規模資料中心和人工智慧推動了機架密度的激增
  • 政府對新建設施的PUE（能源使用效率）有限制。
  • 託管業務快速擴張（機架市佔率年增 51.7%）
  • 水冷供應鏈的成熟與本地OEM廠商的擴張
  • 東部數據和西部計算項目利用寒冷氣候下的自然冷卻區。
  • 利用伺服器產生的廢熱，將其用於區域供熱網路。
• 市場限制因素
  • 高昂的電費正在削弱總擁有成本優勢。
  • 由於水資源短缺日益嚴重，蒸發冷卻的使用受到限制。
  • 由於各州電力分配上限的限制，超大規模項目被推遲。
  • 對進口氟基冷媒的依賴正面臨關稅風險。
• 供應鏈分析
• 監理情勢
• 技術展望
• 波特五力模型
• 宏觀經濟因素對市場的影響

第5章 市場規模與成長預測

• 依資料中心類型
  • 超大規模資料中心業者（自有和租賃）
  • 企業和邊緣運算
  • 搭配
• 層級特定
  • 一級和二級
  • 三級
  • 第四級
• 按類型分類的冷卻技術
  • 空氣冷卻
    • 冷卻器和節熱器（直接膨脹系統）
    • CRAH
    • 冷卻塔（包括直接冷卻、間接冷卻和兩級冷卻）
    • 其他
  • 液冷
    • 浸沒式冷卻
    • 直接冷卻至尖端
    • 後門式熱交換器
• 按組件
  • 按服務
    • 諮詢和培訓
    • 引言和部署
    • 維護和支援
  • 透過裝置

第6章 競爭情勢

• 市場集中度
• 策略趨勢
• 市佔率分析
• 公司簡介
  • Schneider Electric SE
  • Johnson Controls International plc
  • GIGA-BYTE Technology Co. Ltd.
  • Vertiv Group Corp.
  • Carrier Global Corporation
  • Rittal GmbH and Co. KG
  • Munters Group AB
  • Stulz GmbH
  • Kstar Science and Technology Co. Ltd.
  • Alfa Laval AB
  • Huawei Technologies Co. Ltd.
  • Hangzhou Envicool Technology Co. Ltd.
  • Shenzhen Yimikang Technology Co. Ltd.
  • Inspur Group Co. Ltd.
  • Lenovo Group Ltd.
  • CoolIT Systems Inc.
  • Asetek A/S
  • Sugon（Dawning Information Industry）
  • Midea Group Co. Ltd.（Clivet Division）
  • Iceotope Technologies Ltd.

第7章 市場機會與未來展望

According to Mordor Intelligence, the China data center cooling market size is expected to grow from USD 371.63 million in 2025 to USD 435.1 million in 2026 and is forecast to reach USD 957.21 million by 2031 at 17.08% CAGR over 2026-2031.

This report is Segmented by Data Center Type (Hyperscalers (Owned and Leased), Enterprise and Edge, Colocation), Tier Type (Tier 1 and 2, Tier 3, Tier 4), Cooling Technology (Air Based Cooling, Liquid Based Cooling), Component (Service, Equipment). The Market Forecasts are Provided in Terms of Value (USD).

China Data Center Cooling Market Trends and Insights

Surging hyperscale and AI-driven rack densities

Modern AI cabinets consume 20-130 kW versus 5-10 kW for legacy servers, rendering air cooling insufficient and propelling mass adoption of liquid technologies. Huawei's closed liquid-cooled cabinet cuts cooling power by 96% and lowers facility PUE to 1.1, proving viability at the hyperscale level. National flagship AI compute clusters in Gui'an, Ulanqab, and Wuhu now specify liquid solutions at the build-out stage, underscoring a structural shift that places thermal design on par with chip performance in data-center planning.

Government-mandated PUE caps for new builds

Beijing's 14th Five-Year plan requires all new data centers to operate below 1.5 PUE by 2025, while Shanghai tightens the threshold to 1.3. The 2023 Green Data Center standard expands compliance to water-consumption ratios and renewable-energy sourcing, cementing liquid cooling as the only practical route to meet efficiency targets at scale.

High electricity tariffs eroding TCO advantages

Data center power draw is expected to climb from 200 TWh in 2025 toward 400-600 TWh by 2030, with tariffs in Jiangsu and Zhejiang raising operating costs enough to negate savings from legacy equipment depreciation. The Eastern Data and Western Compute initiative counterbalances the burden by relocating load to renewable-rich provinces but requires operators to reconcile latency and fibre-backhaul constraints.

Other drivers and restraints analyzed in the detailed report include:

1. Rapid colocation expansion
2. Maturing liquid-cooling supply chain and local OEM scale-up
3. Growing water-stress curbing evaporative-cooling permits

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Hyperscalers accounted for 46.02% of 2025 revenue, and their contribution to the China data center cooling market size is forecast to expand at 17.62% CAGR through 2031. These firms build AI clusters that exceed 100 kW per rack, making liquid technology non-negotiable for thermal headroom and PUE compliance. Their scale also drives down per-rack cooling cost, creating a benchmark that enterprise and edge operators now emulate. Edge sites, however, favour compact rear-door heat exchangers due to space and maintenance limits. The hyperscaler wave ensures that liquid infrastructure will dominate new capacity additions, even though air systems retain a retrofit niche.

Colocation operators mirror this trajectory by bundling dedicated liquid zones as premium services, converting density into both margin and differentiated customer experience. Enterprise facilities lag on full immersion adoption but are piloting direct-to-chip loops to stretch existing chiller plants. Combined, these moves keep the China data center cooling market on a high-growth path as every operator segment advances toward AI-ready thermal architectures.

Tier 3 sites captured 66.55% of spending in 2025 thanks to their mature design frameworks and competitive balance of uptime vs. capex. Yet Tier 4 builds are growing at 18.83% CAGR because AI training workloads cannot afford even minutes of unplanned downtime. The China data center cooling market size for Tier 4 facilities will therefore rise swiftly as investors prioritise fault-tolerant, concurrently maintainable liquid systems that keep racks within 30 °C even during maintenance.

Tier 1 and Tier 2 footprints are steadily cannibalised as their power and cooling envelopes top out below 15 kW per rack. Meanwhile, Tier 3 specifications are being retrofitted with dual-loop liquid infrastructure so operators can satisfy new customer density requirements without a green-field Tier 4 budget. This tier evolution reinforces liquid technology as the baseline for any AI-centric build in China's data center cooling market.

Complete Report Scope:

• By Data Center Type
  • Hyperscalers (owned and Leased)
  • Enterprise and Edge
  • Colocation
• By Tier Type
  • Tier 1 and 2
  • Tier 3
  • Tier 4
• By Cooling Technology
  • Air-based Cooling
    • Chiller and Economizer (DX Systems)
    • CRAH
    • Cooling Tower (covers direct, indirect and two-stage cooling)
    • Others
  • Liquid-based Cooling
    • Immersion Cooling
    • Direct-to-Chip Cooling
    • Rear-Door Heat Exchanger
• By Component
  • By Service
    • Consulting and Training
    • Installation and Deployment
    • Maintenance and Support
  • By Equipment

List of Companies Covered in this Report:

1. Schneider Electric SE
2. Johnson Controls International plc
3. GIGA-BYTE Technology Co. Ltd.
4. Vertiv Group Corp.
5. Carrier Global Corporation
6. Rittal GmbH and Co. KG
7. Munters Group AB
8. Stulz GmbH
9. Kstar Science and Technology Co. Ltd.
10. Alfa Laval AB
11. Huawei Technologies Co. Ltd.
12. Hangzhou Envicool Technology Co. Ltd.
13. Shenzhen Yimikang Technology Co. Ltd.
14. Inspur Group Co. Ltd.
15. Lenovo Group Ltd.
16. CoolIT Systems Inc.
17. Asetek A/S
18. Sugon (Dawning Information Industry)
19. Midea Group Co. Ltd. (Clivet Division)
20. Iceotope Technologies Ltd.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 Surging hyperscale and AI-driven rack densities
  • 4.2.2 Government-mandated PUE caps for new builds
  • 4.2.3 Rapid colocation expansion (+51.7 % rack share YoY)
  • 4.2.4 Maturing liquid-cooling supply chain and local OEM scale-up
  • 4.2.5 Eastern Data and Western Compute programme exploiting cold-climate free-cooling zones
  • 4.2.6 Monetisation of server waste-heat into district-heating grids
• 4.3 Market Restraints
  • 4.3.1 High electricity tariffs eroding TCO advantages
  • 4.3.2 Growing water-stress curbing evaporative-cooling permits
  • 4.3.3 Provincial power-quota caps delaying hyperscale projects
  • 4.3.4 Import dependency on fluorinated coolants facing tariff risk
• 4.4 Supply-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Porter's Five Forces
  • 4.7.1 Threat of New Entrants
  • 4.7.2 Bargaining Power of Buyers
  • 4.7.3 Bargaining Power of Suppliers
  • 4.7.4 Threat of Substitutes
  • 4.7.5 Competitive Rivalry
• 4.8 Impact of Macroeconomic Factors on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Data Center Type
  • 5.1.1 Hyperscalers (owned and Leased)
  • 5.1.2 Enterprise and Edge
  • 5.1.3 Colocation
• 5.2 By Tier Type
  • 5.2.1 Tier 1 and 2
  • 5.2.2 Tier 3
  • 5.2.3 Tier 4
• 5.3 By Cooling Technology
  • 5.3.1 Air-based Cooling
    • 5.3.1.1 Chiller and Economizer (DX Systems)
    • 5.3.1.2 CRAH
    • 5.3.1.3 Cooling Tower (covers direct, indirect and two-stage cooling)
    • 5.3.1.4 Others
  • 5.3.2 Liquid-based Cooling
    • 5.3.2.1 Immersion Cooling
    • 5.3.2.2 Direct-to-Chip Cooling
    • 5.3.2.3 Rear-Door Heat Exchanger
• 5.4 By Component
  • 5.4.1 By Service
    • 5.4.1.1 Consulting and Training
    • 5.4.1.2 Installation and Deployment
    • 5.4.1.3 Maintenance and Support
  • 5.4.2 By Equipment

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
  • 6.4.1 Schneider Electric SE
  • 6.4.2 Johnson Controls International plc
  • 6.4.3 GIGA-BYTE Technology Co. Ltd.
  • 6.4.4 Vertiv Group Corp.
  • 6.4.5 Carrier Global Corporation
  • 6.4.6 Rittal GmbH and Co. KG
  • 6.4.7 Munters Group AB
  • 6.4.8 Stulz GmbH
  • 6.4.9 Kstar Science and Technology Co. Ltd.
  • 6.4.10 Alfa Laval AB
  • 6.4.11 Huawei Technologies Co. Ltd.
  • 6.4.12 Hangzhou Envicool Technology Co. Ltd.
  • 6.4.13 Shenzhen Yimikang Technology Co. Ltd.
  • 6.4.14 Inspur Group Co. Ltd.
  • 6.4.15 Lenovo Group Ltd.
  • 6.4.16 CoolIT Systems Inc.
  • 6.4.17 Asetek A/S
  • 6.4.18 Sugon (Dawning Information Industry)
  • 6.4.19 Midea Group Co. Ltd. (Clivet Division)
  • 6.4.20 Iceotope Technologies Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-space and Unmet-need Assessment