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市場調查報告書
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2119212

亞太地區半導體製造設備：市場佔有率分析、產業趨勢與統計及成長預測（2026-2031）

Asia-Pacific Semiconductor Manufacturing Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 150 Pages | 商品交期: 2-3個工作天內

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簡介目錄

根據 Mordor Intelligence 預測，亞太地區半導體製造設備市場規模將從 2025 年的 921.4 億美元成長到 2026 年的 1013.5 億美元，然後在 2031 年達到 1810.2 億美元，2026 年至 2031 年的複合年成長率為 12.30%。

亞太半導體製造設備市場-IMG1

本報告按設備類型（晶圓製造設備/前端設備等）、裝置類型（邏輯和微組件、記憶體、類比元件等）、最終用戶（整合設備製造商 (IDM)、代工廠等）和地區（中國大陸、台灣、日本等）進行細分。報告提供了上述所有細分市場的市場規模和市場價值（美元）預測。

亞太地區半導體製造設備市場趨勢及洞察。

擴大人工智慧、高效能運算和人腦磁振造影的產能

人工智慧和高效能運算 (HPC) 正在推動台灣和韓國對相關設備的需求成長，這兩個地區集中規劃擴大先進邏輯和 HBM 的產能。 SEMI 預測，2026 年至 2028 年全球 300 毫米晶圓廠的資本支出總合將達到 3,740 億美元，這表明為支持人工智慧工作負載而進行的產能投資將長期持續。 SEMI 也預測，同期 DRAM 相關資本支出將超過 790 億美元，顯示對儲存設備的需求與人工智慧系統日益成長的需求密切相關。隨著 HBM 堆疊高度的增加，需要增加沉積、蝕刻、TSV（穿透矽通孔工廠和記憶體製造商的存在，這些製造商為上述項目提供了支援。

向 GAA 和 2nm 級生產進行高階節點遷移

向環柵（GAA）結構和2奈米級製程的轉變，推動了對微影術、沉積、蝕刻、測量和檢測設備的需求成長。台積電計畫於2025年開始量產N2技術，該技術採用奈米片電晶體，其製程整合比傳統的FinFET設計更為複雜。三星也在持續推進用於邏輯應用的2奈米GAA製造，這仍然需要先進設備的開發和認證。先進節點專案對製程窗口有著嚴格的控制要求，因此設備性能、製程控制和現場支援至關重要。這些要求有利於那些能夠與晶圓廠在漫長的認證週期中緊密合作的供應商。亞太地區的半導體製造設備市場正受益於此轉變，因為台灣、韓國和日本在先進節點生產和相關材料供應方面發揮核心作用。

出口限制和技術取得限制

出口限制使得特定最終用途及終端用戶難以取得某些半導體製造設備、組件、軟體及相關技術。美國工業與安全局 (BIS) 宣布將於 2024 年推出半導體製造設備相關法規，進一步擴大先進半導體生產的限制。這些限制可能會影響供應商的銷售計劃、交貨時間、產品配置、客戶支援和合規流程。這些法規也加劇了技術發展的分化，中國晶圓廠日益專注於國產設備，而其他地區的晶圓廠則繼續使用成熟的國際設備平台。美國國會研究服務處 (CRS) 指出，盟友之間的協調會影響半導體相關法規的範圍和有效性。亞太地區半導體製造設備市場正面臨客戶格局日益分散的局面，因為獲得先進設備取決於許可證和跨境政策的協調一致。

細分市場分析

到2025年，前端晶圓製造設備將佔據68.30%的市場。這是因為邏輯和記憶體的生產依賴光刻、沉積、蝕刻、清洗和製程控制等一系列製程的重複進行。與前幾代製程節點相比，先進節點製程需要更嚴格的層控制和更頻繁的測量。原子層沉積和電漿蝕刻對於奈米片結構和高深長寬比微結構的製造至關重要。供應商也提供計量和檢測系統以提高良率。這些要求使得採購前端設備成為長期的製造決策。

隨著晶片設計人員將邏輯、記憶體和互連整合到複雜的封裝中，封裝設備預計將成為成長最快的領域，到2031年年複合成長率（CAGR）將達到14.50%。亞太地區的半導體製造設備產業正透過提供混合鍵結、晶圓凸塊、成型、檢測、切割和最終測試等工具來滿足這一需求。異質整合需要在多個晶片和基板上進行精確對準和缺陷控制。測試設備也至關重要，因為HBM堆疊和AI裝置在出貨前需要更複雜的檢驗。晶圓廠自動化、化學品供應和無塵室系統透過幫助大批量晶圓廠管理污染和材料移動來支援這些資本投資。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 擴大人工智慧、高效能運算和人腦磁振造影的產能
    • 先進節點遷移至GAA和2nm級大規模生產
    • 政府主導的半導體本地化和製造工廠吸引措施
    • 先進的封裝和異構整合
    • 在中國成熟節點實現設備本地化和產能擴張。
    • 電力、汽車和化合物半導體產業的設備需求
  • 市場限制因素
    • 出口限制和技術取得限制
    • 資本密集度極高，且資本投資回收期很長
    • 現場服務人員和應用工程方面的瓶頸
    • 國內及第二來源工具認證延誤
  • 價值和供應鏈分析
  • 監理情勢和政策趨勢
  • 科技與創新趨勢
  • 亞太地區半導體製造廠擴建及產能提升分析
  • 深入了解半導體製造領域的人工智慧和自動化
  • 依製造階段（晶圓製造、組裝/封裝、測試、晶圓廠設備和自動化）預測設備需求
  • 評估地緣政治事件對市場的影響

第5章 市場規模與成長預測

  • 依設備類型
    • 晶圓製造設備/前端設備（微影術、薄膜沉積、蝕刻、清洗、CMP、熱處理、前端測量和檢測設備等）
    • 組裝與封裝設備（晶片貼裝、焊線、覆晶鍵結、晶圓凸塊形成、減薄、切割、成型等）
    • 半導體測試設備（自動化測試設備、晶圓探針、測試處理設備、老化測試設備、最終測試設備）
    • 晶圓製造設備、自動化和輔助設備（自動化系統、晶圓處理系統、自動維護和儲存系統、化學品和氣體供應系統、冷卻器、無塵室輔助設備等）
  • 依設備類型
    • 邏輯元件和微型元件（邏輯積體電路、微處理器等）
    • 記憶體（DRAM、NAND、HBM、NOR 等）
    • 微處理器（MPU）
    • 類比電路（電源管理積體電路、訊號鏈、介面積體電路等）
    • 分立元件和功率元件（二極體、電晶體、MOSFET 等）
    • 感測器、微機電系統和光電裝置（影像感測器、微機電系統感測器等）
  • 最終用戶
    • 垂直整合設備製造商（IDM）
    • 鑄造廠
    • 半導體組裝和測試合約公司（OSAT）
    • 其他（研發和中試生產線）
  • 按地區
    • 中國
    • 台灣
    • 韓國
    • 日本
    • 新加坡
    • 印度
    • 其他亞太國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
    • Capacity Expansion and Localization Partnerships
    • Advanced-Node and Advanced-Packaging Collaborations
    • Product Launches and Platform Extensions
    • Mergers, Acquisitions and Minority Investments
  • 市佔率分析
  • 公司簡介
    • Applied Materials, Inc.
    • ASML Holding NV
    • LAM RESEARCH CORPORATION
    • Tokyo Electron Limited
    • KLA Corporation
    • SCREEN Holdings Co., Ltd.
    • ADVANTEST CORPORATION
    • Teradyne, Inc.
    • Hitachi High-Tech Corporation
    • ASM International NV
    • Canon Inc.
    • Nikon Corporation
    • Onto Innovation Inc.
    • Nova Ltd.
    • DISCO Corporation
    • BE Semiconductor Industries NV
    • Kulicke & Soffa Industries, Inc.
    • FormFactor, Inc.
    • Veeco Instruments Inc.
    • ASMPT Limited
    • Kokusai Electric Corporation
    • Advanced Micro-Fabrication Equipment Inc.
    • Naura Technology Group Co., Ltd.
    • Hanmi Semiconductor Co., Ltd.
    • SuSS MicroTec SE
    • EV Group

第7章 市場機會與未來展望

簡介目錄
Product Code: 101387

According to Mordor Intelligence, the Asia-Pacific semiconductor manufacturing equipment market size is expected to grow from USD 92.14 billion in 2025 to USD 101.35 billion in 2026 and is forecast to reach USD 181.02 billion by 2031 at 12.30% CAGR over 2026-2031.

Asia-Pacific Semiconductor Manufacturing Equipment - Market - IMG1

This report is Segmented by Equipment Type (Wafer Fab Equipment / Front-End Equipment, and More), by Device Type (Logic and Micro-Components, Memory, Analog, and More), by End-User (Integrated Device Manufacturers (IDMs), Foundries, and More), and by Geography (China, Taiwan, Japan, and More). The Report Offers Market Size and Value (USD) Forecasts for all the Above Segments.

Asia-Pacific Semiconductor Manufacturing Equipment Market Trends and Insights

AI, HPC, and HBM Capacity Expansion

AI and high-performance computing are raising equipment demand across Taiwan and South Korea, where advanced logic and HBM capacity programs are concentrated. SEMI expects global 300 mm fab equipment spending to total USD 374 billion from 2026 to 2028, signaling a sustained period of investment in capacity that supports AI workloads.SEMI also expects DRAM-related equipment investment to exceed USD 79 billion over the same period, linking demand for memory equipment to growing requirements for AI systems. Taller HBM stacks require additional deposition, etch, through-silicon-via, bonding, inspection, and test steps. This raises equipment content per unit of memory output and provides suppliers with greater visibility into planned capacity additions. The Asia-Pacific semiconductor manufacturing equipment market benefits from the region's key logic foundries and memory producers that serve these programs.

Advanced-Node Migration to GAA and 2 nm-Class Production

The move to gate-all-around structures and 2 nm-class production is increasing demand for lithography, deposition, etch, metrology, and inspection equipment. TSMC began volume production of its N2 technology in 2025, using nanosheet transistors that require more complex process integration than earlier FinFET designs. Samsung is continuing work on 2 nm GAA manufacturing for logic applications, which still requires the development and qualification of advanced equipment. Advanced-node programs need tightly controlled process windows, making tool performance, process control, and field support critical. These requirements favor suppliers that can work with fabs through long qualification cycles. The Asia-Pacific semiconductor manufacturing equipment market gains from this shift because Taiwan, South Korea, and Japan are central to advanced-node production and to the supply of supporting materials.

Export Controls and Technology-Access Restrictions

Export controls limit access to certain semiconductor manufacturing equipment, components, software, and related technology for specified end uses and end users. The United States Bureau of Industry and Security issued controls on semiconductor manufacturing equipment in 2024, expanding restrictions on advanced semiconductor production. These restrictions can alter supplier sales plans, delivery schedules, product configurations, customer support, and compliance processes. They also encourage separate technology paths, with Chinese fabs giving greater attention to domestic equipment while other regional fabs retain access to established international tool platforms. The Congressional Research Service notes that allied coordination affects the reach and effectiveness of semiconductor-related controls. The Asia-Pacific semiconductor manufacturing equipment market faces a more fragmented customer environment, as access to advanced tools depends on licensing and cross-border policy alignment.

Other drivers and restraints analyzed in the detailed report include:

  1. Government-Led Semiconductor Localization and Fab Incentives
  2. Advanced Packaging and Heterogeneous Integration
  3. Extreme Capital Intensity and Long Tool Payback Periods

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Front-end wafer fabrication equipment accounted for 68.30% of the market share in 2025 because logic and memory production depend on repeated lithography, deposition, etching, cleaning, and process-control steps. Advanced-node flows require tightly controlled layers and more frequent measurement than earlier node generations. Atomic layer deposition and plasma etch are important for nanosheet structures and high-aspect-ratio features. Suppliers also provide metrology and inspection systems to support yield learning. These requirements make front-end equipment procurement a long-term manufacturing decision.

Assembly and Packaging equipment is projected to be the fastest-growing segment, with a 14.50% CAGR through 2031 as chip designers integrate logic, memory, and interconnects into complex packages. The Asia-Pacific semiconductor manufacturing equipment industry is responding by providing tools for hybrid bonding, wafer bumping, molding, inspection, dicing, and final testing. Heterogeneous integration requires accurate alignment and defect control across multiple dies and substrates. Test equipment is also important because HBM stacks and AI devices need more complex validation before shipment. Fab automation, chemical delivery, and cleanroom systems support these purchases by helping high-volume fabs control contamination and material movement.

Complete Report Scope:

  • By Equipment Type
    • Wafer Fab Equipment / Front-End Equipment (lithography, deposition, etching, cleaning, CMP, thermal processing, front-end metrology & inspection equipment, etc.)
    • Assembly and Packaging Equipment (die attach, wire bonding, flip-chip bonding, wafer bumping, thinning, dicing, molding, etc.)
    • Semiconductor Test Equipment (automated test equipment, wafer probers, test handlers, burn-in equipment, and final test equipment)
    • Fab Facility, Automation and Support Equipment (automation systems, wafer handling systems, AMHS, chemical & gas delivery systems, chillers, cleanroom support equipment, etc.)
  • By Device Type
    • Logic and Microcomponents (logic ICs, microprocessors, etc.)
    • Memory (DRAM, NAND, HBM, NOR, etc.)
    • Microprocessors (MPUs)
    • Analog (Power management ICs, signal chain, interface Ics, etc.)
    • Discrete and Power Devices (Diodes, transistors, MOSFETs, etc.)
    • Sensors, MEMS and Optoelectronic Devices (Image sensors, MEMS sensors, etc.)
  • By End User
    • Integrated Device Manufacturers (IDMs)
    • Foundries
    • Outsourced Semiconductor Assembly and Test (OSAT) Companies
    • Others (Research & Development (R&D) and Pilot Lines)
  • By Geography
    • China
    • Taiwan
    • South Korea
    • Japan
    • Singapore
    • India
    • Rest of Asia-Pacific

List of Companies Covered in this Report:

  1. Applied Materials, Inc.
  2. ASML Holding N.V.
  3. LAM RESEARCH CORPORATION
  4. Tokyo Electron Limited
  5. KLA Corporation
  6. SCREEN Holdings Co., Ltd.
  7. ADVANTEST CORPORATION
  8. Teradyne, Inc.
  9. Hitachi High-Tech Corporation
  10. ASM International N.V.
  11. Canon Inc.
  12. Nikon Corporation
  13. Onto Innovation Inc.
  14. Nova Ltd.
  15. DISCO Corporation
  16. BE Semiconductor Industries N.V.
  17. Kulicke & Soffa Industries, Inc.
  18. FormFactor, Inc.
  19. Veeco Instruments Inc.
  20. ASMPT Limited
  21. Kokusai Electric Corporation
  22. Advanced Micro-Fabrication Equipment Inc.
  23. Naura Technology Group Co., Ltd.
  24. Hanmi Semiconductor Co., Ltd.
  25. SuSS MicroTec SE
  26. EV Group

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 AI, HPC and HBM Capacity Expansion
    • 4.2.2 Advanced-Node Migration to GAA and 2 nm-Class Production
    • 4.2.3 Government-Led Semiconductor Localization and Fab Incentives
    • 4.2.4 Advanced Packaging and Heterogeneous Integration
    • 4.2.5 China Equipment Localization and Mature-Node Capacity Build-Out
    • 4.2.6 Equipment Demand from Power, Automotive and Compound Semiconductors
  • 4.3 Market Restraints
    • 4.3.1 Export Controls and Technology-Access Restrictions
    • 4.3.2 Extreme Capital Intensity and Long Tool Payback Periods
    • 4.3.3 Field-Service Talent and Applications-Engineering Bottlenecks
    • 4.3.4 Qualification Delays for Domestic and Second-Source Tools
  • 4.4 Value and Supply-Chain Analysis
  • 4.5 Regulatory and Policy Landscape
  • 4.6 Technology and Innovation Trends
  • 4.7 Insights on Asia-Pacific Semiconductor Fab Expansion and Capacity Additions
  • 4.8 Insights on AI and Automation in Semiconductor Manufacturing
  • 4.9 Equipment Demand Outlook by Manufacturing Stage (Wafer fabrication, Assembly and packaging, Testing, Fab facility and automation)
  • 4.10 Impact Assessment of Geopolitical Events on the Market

5 MARKET SIZE AND GROWTH FORECASTS

  • 5.1 By Equipment Type
    • 5.1.1 Wafer Fab Equipment / Front-End Equipment (lithography, deposition, etching, cleaning, CMP, thermal processing, front-end metrology & inspection equipment, etc.)
    • 5.1.2 Assembly and Packaging Equipment (die attach, wire bonding, flip-chip bonding, wafer bumping, thinning, dicing, molding, etc.)
    • 5.1.3 Semiconductor Test Equipment (automated test equipment, wafer probers, test handlers, burn-in equipment, and final test equipment)
    • 5.1.4 Fab Facility, Automation and Support Equipment (automation systems, wafer handling systems, AMHS, chemical & gas delivery systems, chillers, cleanroom support equipment, etc.)
  • 5.2 By Device Type
    • 5.2.1 Logic and Microcomponents (logic ICs, microprocessors, etc.)
    • 5.2.2 Memory (DRAM, NAND, HBM, NOR, etc.)
    • 5.2.3 Microprocessors (MPUs)
    • 5.2.4 Analog (Power management ICs, signal chain, interface Ics, etc.)
    • 5.2.5 Discrete and Power Devices (Diodes, transistors, MOSFETs, etc.)
    • 5.2.6 Sensors, MEMS and Optoelectronic Devices (Image sensors, MEMS sensors, etc.)
  • 5.3 By End User
    • 5.3.1 Integrated Device Manufacturers (IDMs)
    • 5.3.2 Foundries
    • 5.3.3 Outsourced Semiconductor Assembly and Test (OSAT) Companies
    • 5.3.4 Others (Research & Development (R&D) and Pilot Lines)
  • 5.4 By Geography
    • 5.4.1 China
    • 5.4.2 Taiwan
    • 5.4.3 South Korea
    • 5.4.4 Japan
    • 5.4.5 Singapore
    • 5.4.6 India
    • 5.4.7 Rest of Asia-Pacific

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
    • 6.2.1 Capacity Expansion and Localization Partnerships
    • 6.2.2 Advanced-Node and Advanced-Packaging Collaborations
    • 6.2.3 Product Launches and Platform Extensions
    • 6.2.4 Mergers, Acquisitions and Minority Investments
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (Includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
    • 6.4.1 Applied Materials, Inc.
    • 6.4.2 ASML Holding N.V.
    • 6.4.3 LAM RESEARCH CORPORATION
    • 6.4.4 Tokyo Electron Limited
    • 6.4.5 KLA Corporation
    • 6.4.6 SCREEN Holdings Co., Ltd.
    • 6.4.7 ADVANTEST CORPORATION
    • 6.4.8 Teradyne, Inc.
    • 6.4.9 Hitachi High-Tech Corporation
    • 6.4.10 ASM International N.V.
    • 6.4.11 Canon Inc.
    • 6.4.12 Nikon Corporation
    • 6.4.13 Onto Innovation Inc.
    • 6.4.14 Nova Ltd.
    • 6.4.15 DISCO Corporation
    • 6.4.16 BE Semiconductor Industries N.V.
    • 6.4.17 Kulicke & Soffa Industries, Inc.
    • 6.4.18 FormFactor, Inc.
    • 6.4.19 Veeco Instruments Inc.
    • 6.4.20 ASMPT Limited
    • 6.4.21 Kokusai Electric Corporation
    • 6.4.22 Advanced Micro-Fabrication Equipment Inc.
    • 6.4.23 Naura Technology Group Co., Ltd.
    • 6.4.24 Hanmi Semiconductor Co., Ltd.
    • 6.4.25 SuSS MicroTec SE
    • 6.4.26 EV Group

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment