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市場調查報告書
商品編碼
2119136

半導體製造設備：市場佔有率分析、產業趨勢與統計、成長預測（2026-2031）

Semiconductor Manufacturing Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 150 Pages | 商品交期: 2-3個工作天內

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簡介目錄

根據 Mordor Intelligence 預測，半導體製造設備市場預計將從 2025 年的 1,431.8 億美元成長到 2026 年的 1,684.5 億美元，到 2031 年達到 2,832.1 億美元，2026 年至 2031 年的複合成長率預計為 10.95%。

半導體製造設備市場-IMG1

本報告按設備類型（晶圓製造設備/前端設備等）、裝置類型（邏輯和微組件、記憶體、類比元件等）、最終用戶（整合設備製造商 (IDM)、代工廠等）和地區（亞太地區、歐洲等）進行細分。報告提供了上述所有細分市場的市場規模和預測（以美元計）。

全球半導體製造設備市場趨勢及洞察

對人工智慧、HBM、晶片組和先進封裝的需求

人工智慧加速器、高頻寬記憶體（HBM）、晶片組和先進封裝技術正在改變設備投資格局。 SEMI預測，到2026年，全球300毫米記憶體製造設備的支出將達到520億美元，其中DRAM設備的支出預計將達到370億美元。半導體製造設備市場正受益於HBM的生產，HBM的生產需要蝕刻、沉積、填充、檢測和封裝等專門製程。即使不考慮記憶體產量的成長，這些需求也已推動了對設備的需求。晶片組的設計也增加了對精確晶片放置、鍵合、測試和檢測的需求。這一因素在台灣、韓國和北美尤為顯著，因為這些地區集中了主要的邏輯和記憶體生產能力。因此，半導體製造設備市場將繼續受益於高附加價值製造和封裝投資。

向高階節點遷移和流程複雜性

向2nm環柵（GAA）設計的轉變增加了製造製程的數量和精度。 SEMI預測，到2026年，晶圓代工廠和邏輯晶圓廠的資本支出將達到780億美元，比2025年增加18.9%。環柵結構比傳統的FinFET設計需要更多選擇性的蝕刻和沈積操作。此外，每增加一個製程步驟，對測量和製程控制設備的需求都會增加。 2026年7月，英特爾晶圓代工展示了其新的微影術平台已投入量產，並採用了ASML的高數值孔徑EUV系統用於其量產邏輯產品。因此，隨著製造商轉向更複雜的製程節點，半導體製造設備市場受益於設備密集度的提高。這意味著半導體製造設備市場對新建晶圓廠的依賴性正在降低。

出口限制、關稅和貿易碎片化

出口限制正在縮小可供應至特定目的地的設備及相關技術的範圍。 2024年12月，美國工業與安全局 (BIS) 擴大了監管範圍，涵蓋24種半導體製造設備、3種半導體開發軟體、HBM相關規則以及實體清單中的140項新增項目。 2025年1月發布的臨時最終規則擴大了某些先進計算積體電路及相關製造流程的授權要求。這些規則對多個國家的供應商和客戶提出了合規要求，並可能影響產品配置、客戶認證、出貨時間和售後服務合約。半導體製造設備市場也面臨這些法規可能促使企業發展替代國內供應鏈的風險。

細分市場分析

到2025年，前端設備市佔率將達到65.45%。前端設備仍然是先進邏輯和記憶體晶圓廠支出的主要驅動力，因為微影術、沉積、蝕刻、清洗、平坦化、熱處理、測量和檢測等工序都需要用到前端設備。 SEMI預測，2026年，晶圓廠設備支出將達到1,439億美元，比2025年成長23.1%。半導體製造設備市場的發展動力不僅來自先進的邏輯和記憶體生產能力，也來自更先進的製程。 2026年6月，應用材料公司宣布推出先進邏輯和記憶體深窄3D結構的沉積和選擇性蝕刻系統。 ASML也計劃持續擴大其EUV和DUV產能，以滿足客戶需求。這些舉措表明，對前端設備的需求既包括新增產能，也包括更先進製程節點的設備升級。

組裝、封裝和測試設備是利潤最高的行業，預計到2031年將以13.50%的年複合成長率（CAGR）成長，並且隨著人工智慧設備和HBM堆疊需要更複雜的後端工藝，這些行業的重要性日益凸顯。根據SEMI的報告，測試設備的銷售額預計將在2025年成長55%，並在2026年達到153億美元。封裝設備還支援混合鍵合、晶片貼裝、基板檢測和其他專業操作。應用材料公司於2026年6月發布了用於穿透矽通孔(TSV)填充、微凸塊形成和缺陷分析的系統。晶圓廠設施、自動化和配套設備對於需要化學品供應、氣體系統、物料輸送和無塵室基礎設施的新建設廠址仍然至關重要。這些活動共同推動了對晶圓加工主要階段之外的設備的需求。

區域分析

預計亞太地區仍將是半導體製造設備最大的區域市場，到2025年將佔64.35%的市場。在中國大陸、台灣、韓國和日本的帶動下，這四個國家和地區佔了全球設備銷售額的大部分，預計年複合成長率將達到12.30%。在台灣，受先進邏輯和先進封裝產能持續投資的推動，預計2024年至2025年間，半導體製造設備的訂單將增加90%，達到315億美元。在韓國，受HBM和DRAM產能擴張的推動，預計訂單將成長26%，達到258億美元。在日本，受國內晶圓廠建設項目以及成熟的半導體材料和設備生態系統（有利於資本投資）的支撐，預計銷售額將成長22%，達到95億美元。預計中國仍將是全球最大的設備市場，銷售額預計將達到 493 億美元，略微下降 0.5%，反映出對成熟節點製造、特種半導體和國內供應鏈發展的持續投資。

預計北美半導體製造設備銷售額將達到109億美元，年減20%。然而，在《晶片與科學法案》的支持下，新建晶圓廠的建設和試運行預計將增加設備的安裝數量，因為該項目將從場地開發推進到生產階段。在歐洲，預計2025年銷售額將達29億美元，比2024年下降41%。不過，《歐洲晶片法案》將繼續支持全部區域半導體製造和技術擴張的戰略投資。新興製造地，例如透過印度半導體計畫的印度和投資先進封裝和特種半導體的新加坡，正在加強其在全球半導體製造生態系統中的地位。展望未來，SEMI預測，到2031年，中國、台灣和韓國仍將是半導體製造設備的三大市場，這反映了全球晶圓製造能力的持續集中以及對先進製程節點的投資。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 對人工智慧、HBM、晶片組和先進封裝的需求
    • 向先進節點的過渡以及流程複雜性的增加
    • 內存技術升級及HBM產能提升
    • 政府支持的製造和補貼計劃
    • 在多個地區擴大晶圓廠產能
    • 成熟製程節點、功率半導體和特種晶圓廠的投資
  • 市場限制因素
    • 出口限制、關稅和貿易碎片化
    • 半導體設備投資的週期性以及晶圓廠投資的延遲
    • 光學元件、真空元件、精密元件和特殊原料供不應求。
    • 模具成本極高，前置作業時間長，投資回收期也長。
  • 價值和供應鏈分析
  • 監理情勢和政策趨勢
  • 科技與創新趨勢
  • 全球半導體晶圓廠擴張與產能成長分析
  • 深入了解半導體製造領域的人工智慧和自動化
  • 依製造階段（晶圓製造、組裝和封裝、測試、晶圓廠設施和自動化）預測設備需求
  • 評估地緣政治事件對市場的影響

第5章 市場規模與成長預測

  • 依設備類型
    • 晶圓製造設備/前端設備（微影術、薄膜沉積、蝕刻、清洗、CMP、熱處理、前端測量和檢測設備等）
    • 組裝與封裝設備（晶片貼裝、焊線、覆晶鍵結、晶圓凸塊形成、減薄、切割、成型等）
    • 半導體測試設備（自動化測試設備、晶圓探針、測試處理設備、老化測試設備、最終測試設備）
    • 晶圓製造設備、自動化和輔助設備（自動化系統、晶圓處理系統、自動維護和儲存系統、化學品和氣體供應系統、冷卻器、無塵室輔助設備等）
  • 依設備類型
    • 邏輯元件和微型元件（邏輯積體電路、微處理器等）
    • 記憶體（DRAM、NAND、HBM、NOR 等）
    • 微處理器（MPU）
    • 類比電路（電源管理積體電路、訊號鏈、介面積體電路等）
    • 分立元件和功率元件（二極體、電晶體、MOSFET 等）
    • 感測器、微機電系統和光電裝置（影像感測器、微機電系統感測器等）
  • 最終用戶
    • 垂直整合設備製造商（IDM）
    • 鑄造廠
    • 半導體組裝和測試外包公司（OSAT）
    • 其他（研發和中試生產線）
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 其他南美國家
    • 歐洲
      • 德國
      • 法國
      • 愛爾蘭
      • 義大利
      • 荷蘭
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 台灣
      • 韓國
      • 日本
      • 新加坡
      • 印度
      • 其他亞太國家
    • 中東和非洲

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Applied Materials, Inc.
    • ASML Holding NV
    • Lam Research Corporation
    • Tokyo Electron Limited
    • KLA Corporation
    • SCREEN Holdings Co., Ltd.
    • Advantest Corporation
    • ASM International NV
    • Teradyne, Inc.
    • Hitachi High-Tech Corporation
    • Onto Innovation Inc.
    • Cohu, Inc.
    • BE Semiconductor Industries NV
    • EV Group
    • Kokusai Electric Corporation
    • ASMPT Limited
    • ACM Research, Inc.
    • Disco Corporation
    • Canon Inc.
    • Nikon Corporation
    • Axcelis Technologies, Inc.
    • Nova Ltd.
    • Lasertec Corporation
    • SUSS MicroTec SE
    • Tokyo Seimitsu Co., Ltd./ACCRETECH

第7章 市場機會與未來展望

簡介目錄
Product Code: 101311

According to Mordor Intelligence, the semiconductor manufacturing equipment market size is expected to increase from USD 143.18 billion in 2025 to USD 168.45 billion in 2026 and reach USD 283.21 billion by 2031, growing at a CAGR of 10.95% over 2026-2031.

Semiconductor Manufacturing Equipment - Market - IMG1

This report is Segmented by Equipment Type (Wafer Fab Equipment / Front-End Equipment, and More), by Device Type (Logic and Micro-Components, Memory, Analog, and More), by End-User (Integrated Device Manufacturers (IDMs), Foundries, and More), and by Geography (Asia-Pacific, Europe, and More). The Report Offers Market Size and Forecasts in Value (USD) for all the Above Segments.

Global Semiconductor Manufacturing Equipment Market Trends and Insights

AI, HBM, Chiplets, and Advanced Packaging Demand

AI accelerators, high-bandwidth memory, chiplets, and advanced packaging are changing the pattern of equipment investment. SEMI projected USD 52 billion in global 300 mm memory fab equipment spending for 2026, with DRAM equipment spending expected to reach USD 37 billion. The semiconductor manufacturing equipment market benefits from HBM production, which requires specialized processes for etch, deposition, fill, inspection, and packaging. These requirements add tool demand before considering any increase in memory output. Chiplet designs also increase the need for precise die placement, bonding, test, and inspection. This driver is strongest in Taiwan, South Korea, and North America, where leading logic and memory capacity is concentrated. It provides the semiconductor manufacturing equipment market with sustained exposure to high-value manufacturing and packaging investments.

Advanced Node Migration and Rising Process Complexity

The move toward 2 nm gate-all-around designs increases the number and precision of fabrication steps. SEMI expects foundry and logic wafer fab equipment spending to reach USD 78 billion in 2026, up 18.9% from 2025. Gate-all-around structures require more selective etch and deposition work than earlier FinFET designs. Each additional step can also increase the need for metrology and process-control equipment. Intel Foundry used ASML's High NA EUV system for a high-volume logic product in July 2026, demonstrating that new lithography platforms are entering production. The semiconductor manufacturing equipment market, therefore, benefits from higher equipment intensity as manufacturers move to more complex process nodes. This leaves the semiconductor manufacturing equipment market less dependent on new fab buildings alone.

Export Controls, Tariffs, and Trade Fragmentation

Export controls have narrowed the range of equipment and related technologies that can be supplied to certain destinations. In December 2024, the United States Bureau of Industry and Security added controls covering 24 types of semiconductor manufacturing equipment, 3 types of semiconductor development software, HBM-related rules, and 140 additions to the Entity List. A January 2025 interim final rule extended licensing requirements for certain advanced computing integrated circuits and covered manufacturing routes. These rules create compliance requirements for suppliers and customers across several countries. They can affect product configuration, customer qualification, shipment timing, and service arrangements. The semiconductor manufacturing equipment market also faces the risk that restrictions support the development of alternative domestic supply chains.

Other drivers and restraints analyzed in the detailed report include:

  1. Memory Technology Upgrades and HBM Capacity Expansion
  2. Government Fab Localization and Subsidy Programs
  3. Semiconductor Capex Cyclicality and Fab Investment Delays

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Front-end equipment accounted for 65.45% of the market share in 2025. It remained the main driver of spending because advanced logic and memory fabs require lithography, deposition, etch, cleaning, planarization, thermal processing, metrology, and inspection. SEMI forecasts wafer fab equipment spending of USD 143.9 billion in 2026, a 23.1% rise from 2025. The semiconductor manufacturing equipment market size is supported by leading-edge logic and memory capacity, as well as by more demanding process flows. Applied Materials introduced deposition and selective-etch systems in June 2026 for deep, narrow 3D structures used in advanced logic and memory. ASML also plans to continue expanding EUV and DUV capacity to serve customer demand. These actions show that front-end demand includes both new capacity and tool replacement at more advanced nodes.

Assembly, packaging, and test equipment registered the fastest 13.50% CAGR through 2031 and have become increasingly important as AI devices and HBM stacks require more complex back-end operations. SEMI reported that test equipment increased 55% in 2025 and projected USD 15.3 billion in test equipment sales for 2026. Packaging equipment also supports hybrid bonding, die attach, substrate inspection, and other specialized work. Applied Materials introduced systems for through-silicon via fill, microbump formation, and defect analysis in June 2026. Fab facility, automation, and support equipment remain necessary for greenfield sites that require chemical delivery, gas systems, material handling, and cleanroom infrastructure. Together, these activities broaden demand for equipment beyond the primary wafer-processing stage.

Complete Report Scope:

  • By Equipment Type
    • Wafer Fab Equipment / Front-End Equipment (lithography, deposition, etching, cleaning, CMP, thermal processing, front-end metrology & inspection equipment, etc.)
    • Assembly and Packaging Equipment (die attach, wire bonding, flip-chip bonding, wafer bumping, thinning, dicing, molding, etc.)
    • Semiconductor Test Equipment (automated test equipment, wafer probers, test handlers, burn-in equipment, and final test equipment)
    • Fab Facility, Automation and Support Equipment (automation systems, wafer handling systems, AMHS, chemical & gas delivery systems, chillers, cleanroom support equipment, etc.)
  • By Device Type
    • Logic and Microcomponents (logic ICs, microprocessors, etc.)
    • Memory (DRAM, NAND, HBM, NOR, etc.)
    • Microprocessors (MPUs)
    • Analog (Power management ICs, signal chain, interface Ics, etc.)
    • Discrete and Power Devices (Diodes, transistors, MOSFETs, etc.)
    • Sensors, MEMS and Optoelectronic Devices (Image sensors, MEMS sensors, etc.)
  • By End User
    • Integrated Device Manufacturers (IDMs)
    • Foundries
    • Outsourced Semiconductor Assembly and Test (OSAT) Companies
    • Others (Research & Development (R&D) and Pilot Lines)
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Rest of South America
    • Europe
      • Germany
      • France
      • Ireland
      • Italy
      • Netherlands
      • Rest of Europe
    • Asia-Pacific
      • China
      • Taiwan
      • South Korea
      • Japan
      • Singapore
      • India
      • Rest of Asia-Pacific
    • Middle East and Africa

Geography Analysis

Asia-Pacific accounted for 64.35% of the market share in 2025 and is expected to remain the largest regional market for semiconductor manufacturing equipment, registering a 12.30% CAGR, led by China, Taiwan, South Korea, and Japan, which together account for the majority of global equipment billings. Taiwan is projected to record USD 31.5 billion in semiconductor equipment billings, a 90% increase from 2024, driven by continued investments in advanced logic and advanced packaging capacity. South Korea is expected to reach USD 25.8 billion, up 26%, supported by expansions in HBM and DRAM capacity. Japan's billings are projected to increase by 22% to USD 9.5 billion, as domestic fabrication projects and its established semiconductor materials and equipment ecosystem sustain capital investment. China is expected to remain the world's largest equipment market, with USD 49.3 billion in billings, despite a marginal 0.5% decline, reflecting continued investment in mature-node manufacturing, specialty semiconductors, and domestic supply chain development.

North America is projected to record USD 10.9 billion in equipment billings, down 20% year over year. However, the construction and commissioning of new fabs supported by the CHIPS and Science Act are expected to drive higher equipment installations as projects advance from site development to production. Europe is expected to generate USD 2.9 billion in billings in 2025, a 41% decline from 2024. However, the European Chips Act continues to support strategic investments in semiconductor manufacturing and technology expansion across the region. Emerging manufacturing hubs, including India through the Semicon India Programme and Singapore through investments in advanced packaging and specialty semiconductors, are strengthening their positions within the global semiconductor manufacturing ecosystem. Looking ahead, SEMI projects China, Taiwan, and South Korea to remain the three largest semiconductor equipment markets through 2031, reflecting the continued concentration of global wafer fabrication capacity and advanced-node investments.

  1. Applied Materials, Inc.
  2. ASML Holding N.V.
  3. Lam Research Corporation
  4. Tokyo Electron Limited
  5. KLA Corporation
  6. SCREEN Holdings Co., Ltd.
  7. Advantest Corporation
  8. ASM International N.V.
  9. Teradyne, Inc.
  10. Hitachi High-Tech Corporation
  11. Onto Innovation Inc.
  12. Cohu, Inc.
  13. BE Semiconductor Industries N.V.
  14. EV Group
  15. Kokusai Electric Corporation
  16. ASMPT Limited
  17. ACM Research, Inc.
  18. Disco Corporation
  19. Canon Inc.
  20. Nikon Corporation
  21. Axcelis Technologies, Inc.
  22. Nova Ltd.
  23. Lasertec Corporation
  24. SUSS MicroTec SE
  25. Tokyo Seimitsu Co., Ltd. / ACCRETECH

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 AI, HBM, Chiplets, and Advanced Packaging Demand
    • 4.2.2 Advanced Node Migration and Rising Process Complexity
    • 4.2.3 Memory Technology Upgrades and HBM Capacity Expansion
    • 4.2.4 Government Fab Localization and Subsidy Programs
    • 4.2.5 Multi-Region Fab Capacity Expansion
    • 4.2.6 Mature-Node, Power Semiconductor, and Specialty Fab Investments
  • 4.3 Market Restraints
    • 4.3.1 Export Controls, Tariffs, and Trade Fragmentation
    • 4.3.2 Semiconductor Capex Cyclicality and Fab Investment Delays
    • 4.3.3 Supplier Bottlenecks in Optics, Vacuum, Precision Components, and Specialty Inputs
    • 4.3.4 Extreme Tool Cost, Long Lead Times, and Long Payback Cycles
  • 4.4 Value and Supply-Chain Analysis
  • 4.5 Regulatory and Policy Landscape
  • 4.6 Technology and Innovation Trends
  • 4.7 Insights on Global Semiconductor Fab Expansion and Capacity Additions
  • 4.8 Insights on AI and Automation in Semiconductor Manufacturing
  • 4.9 Equipment Demand Outlook by Manufacturing Stage (Wafer fabrication, Assembly and packaging, Testing, Fab facility and automation)
  • 4.10 Impact Assessment of Geopolitical Events on the Market

5 MARKET SIZE AND GROWTH FORECASTS (Value, In USD Billion)

  • 5.1 By Equipment Type
    • 5.1.1 Wafer Fab Equipment / Front-End Equipment (lithography, deposition, etching, cleaning, CMP, thermal processing, front-end metrology & inspection equipment, etc.)
    • 5.1.2 Assembly and Packaging Equipment (die attach, wire bonding, flip-chip bonding, wafer bumping, thinning, dicing, molding, etc.)
    • 5.1.3 Semiconductor Test Equipment (automated test equipment, wafer probers, test handlers, burn-in equipment, and final test equipment)
    • 5.1.4 Fab Facility, Automation and Support Equipment (automation systems, wafer handling systems, AMHS, chemical & gas delivery systems, chillers, cleanroom support equipment, etc.)
  • 5.2 By Device Type
    • 5.2.1 Logic and Microcomponents (logic ICs, microprocessors, etc.)
    • 5.2.2 Memory (DRAM, NAND, HBM, NOR, etc.)
    • 5.2.3 Microprocessors (MPUs)
    • 5.2.4 Analog (Power management ICs, signal chain, interface Ics, etc.)
    • 5.2.5 Discrete and Power Devices (Diodes, transistors, MOSFETs, etc.)
    • 5.2.6 Sensors, MEMS and Optoelectronic Devices (Image sensors, MEMS sensors, etc.)
  • 5.3 By End User
    • 5.3.1 Integrated Device Manufacturers (IDMs)
    • 5.3.2 Foundries
    • 5.3.3 Outsourced Semiconductor Assembly and Test (OSAT) Companies
    • 5.3.4 Others (Research & Development (R&D) and Pilot Lines)
  • 5.4 By Geography
    • 5.4.1 North America
      • 5.4.1.1 United States
      • 5.4.1.2 Canada
      • 5.4.1.3 Mexico
    • 5.4.2 South America
      • 5.4.2.1 Brazil
      • 5.4.2.2 Rest of South America
    • 5.4.3 Europe
      • 5.4.3.1 Germany
      • 5.4.3.2 France
      • 5.4.3.3 Ireland
      • 5.4.3.4 Italy
      • 5.4.3.5 Netherlands
      • 5.4.3.6 Rest of Europe
    • 5.4.4 Asia-Pacific
      • 5.4.4.1 China
      • 5.4.4.2 Taiwan
      • 5.4.4.3 South Korea
      • 5.4.4.4 Japan
      • 5.4.4.5 Singapore
      • 5.4.4.6 India
      • 5.4.4.7 Rest of Asia-Pacific
    • 5.4.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
    • 6.4.1 Applied Materials, Inc.
    • 6.4.2 ASML Holding N.V.
    • 6.4.3 Lam Research Corporation
    • 6.4.4 Tokyo Electron Limited
    • 6.4.5 KLA Corporation
    • 6.4.6 SCREEN Holdings Co., Ltd.
    • 6.4.7 Advantest Corporation
    • 6.4.8 ASM International N.V.
    • 6.4.9 Teradyne, Inc.
    • 6.4.10 Hitachi High-Tech Corporation
    • 6.4.11 Onto Innovation Inc.
    • 6.4.12 Cohu, Inc.
    • 6.4.13 BE Semiconductor Industries N.V.
    • 6.4.14 EV Group
    • 6.4.15 Kokusai Electric Corporation
    • 6.4.16 ASMPT Limited
    • 6.4.17 ACM Research, Inc.
    • 6.4.18 Disco Corporation
    • 6.4.19 Canon Inc.
    • 6.4.20 Nikon Corporation
    • 6.4.21 Axcelis Technologies, Inc.
    • 6.4.22 Nova Ltd.
    • 6.4.23 Lasertec Corporation
    • 6.4.24 SUSS MicroTec SE
    • 6.4.25 Tokyo Seimitsu Co., Ltd. / ACCRETECH

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment