查看購物車
  • English
  • Japanese
封面
市場調查報告書
商品編碼
2099435

高階GPU封裝：市佔率分析、產業趨勢與統計及成長預測（2026-2031年）

GPU Advanced Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 169 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

據 Mordor Intelligence 稱，GPU 先進封裝市場預計將從 2025 年的 83 億美元成長到 2026 年的 137 億美元，到 2031 年達到 375 億美元，2026 年至 2031 年的複合年成長率為 22.31%。

GPU先進封裝市場-IMG1

本報告依封裝技術（2.5D封裝、扇出/RDL封裝、嵌入式橋接封裝等）、GPU配置（單片GPU封裝、晶片級GPU封裝等）、應用（用於AI訓練的GPU、用於高效能運算的GPU等）、服務供應商（晶圓代工廠主導的封裝等）及地區進行細分。市場預測以美元（USD）為單位。

全球GPU先進封裝市場趨勢與洞察

對人工智慧GPU和HBM整合日益成長的需求正在推動封裝需求。

隨著人工智慧加速器對GPU邏輯和高頻寬記憶體（HBM）在同一封裝內緊密整合的需求日益成長，GPU先進封裝市場正在不斷擴張。這項需求進一步凸顯了中介層、晶片佈局、散熱路徑設計以及封裝級供電的重要性，因為所有這些都直接影響訓練和推理系統的實際性能。 2025年，SK海力士宣布其iHBM解決方案透過將散熱功能直接置於D2D PHY區域（熱量最集中的區域），在嚴苛的封裝環境下實現了30%的熱阻降低。這項轉變意義重大，因為記憶體堆疊不再只是組件選擇的問題；它正在改變整個GPU封裝的設計、認證和定價方式。隨著HBM堆疊密度的增加，封裝決策在設計週期的早期階段就已確定，並且與客戶的長期認證計劃緊密相關。這為先進封裝供應商帶來了更清晰的收入前景。因此，封裝層不再只是下游組裝工藝，而是成為了實現人工智慧系統的關鍵技術入口之一。

基於晶片組的GPU架構的成長增加了封裝的複雜性。

GPU先進封裝市場也受惠於晶片級GPU佈局的普及。這種佈局將大規模功能拆分成小型模組，並將它們重新連接在單一封裝內。雖然這種設計方法有助於供應商避免光阻限制和良率壓力，但也增加了對高密度晶片互連、更嚴格的對準和更複雜的組裝流程的需求。 2025年發表在IEEE固態電路期刊上的一項研究展示了一個可擴展的異構2.5D系統，該系統擁有300MB的SRAM、20Tb/s的頻寬，並可跨20個晶片同時進行推理，這表明多晶片設計正在超越簡單的並行整合。英特爾在其2025年11月發布的Foveros Direct 3D技術概述中也指出，混合鍵合技術支援極細間距互連和更高密度的垂直整合，這進一步印證了先進封裝將在下一代運算架構中發揮核心作用的原因。從實際角度來看，晶片組的採用使得人工智慧訓練、高效能運算和高階推理產品所需的封裝類型更加多樣化，從而打破了對單一封裝格式的依賴。隨著產品藍圖變得更加模組化，這種多樣化將為GPU先進封裝市場創造更廣泛、更永續的需求基礎。

CoWoS 和類似的產能瓶頸限制了其轉化為獲利能力。

由於對尖端封裝格式的需求仍集中在少數經過認證的平台和生產線上，GPU先進封裝市場面臨供應瓶頸。即使終端用戶需求強勁，除非基板供應、中介層產能、記憶體整合和終端封裝產能同步成長，否則無法確保足夠的收入。美國商務部在宣布大規模政府津貼以建構國內生態系統時，將先進封裝列為半導體供應鏈中的策略缺口。這證實了目前供應仍存在結構性限制的觀點。這種限制對旗艦級人工智慧專案的影響最為顯著，因為這些產品依賴最先進的封裝工藝，一旦設計認證完成，就很難輕易切換到複雜度較低的替代方案。這種情況也導致客戶集中在少數幾家已處於領先地位的供應商，從而限制了需要快速大規模生產的GPU設計人員的議價能力。在更多經過認證的生產線投入運作之前，無論來自哪個地區或供應商，GPU先進封裝市場都將繼續面臨需求超過實際封裝產能的局面。

細分市場分析

2025年，2.5D矽中介層封裝佔了70.11%的市場佔有率，持續維持其在先進GPU封裝市場量產核心組件的地位。這一地位反映了其作為先進GPU和HBM組合預設整合方式的作用，此類封裝必須支援高密度互連、大規模記憶體佔用和穩定的散熱特性。實施認證設計流程的成熟經驗也是關鍵因素，因為客戶已經在高價值專案中依賴這種封裝形式，並且在產品量產擴展階段難以承受漫長的重新認證週期。事實上，2.5D之所以能夠保持領先地位，是因為它在頻寬密度、客戶熟悉的技術以及為大型AI部署提供短期量產準備方面實現了最佳平衡。

此外，先進GPU封裝市場正向混合式2.5D+3D封裝轉型，預計到2031年將以23.21%的複合年成長率成長。該細分市場之所以擴張，是因為水平整合和垂直堆疊的結合使其能夠突破純中介層設計的實際限制。這一方向與整個行業在細間距混合鍵合、高密度垂直連接和更先進的異構整合方面的努力相一致。扇出和重分佈層（RDL）方案仍然適用於需要更薄外形尺寸和成本控制的項目，而嵌入式橋接解決方案正在客戶尋求超越最大尺寸中介層平台的可靠路徑時發揮其作用。從長遠來看，這意味著先進GPU封裝產業正從單一的主流封裝轉向更精細的技術組合，以滿足工作負載需求、散熱限制和客戶預算。

到2025年，基於晶片組的GPU封裝將佔55.33%的構成比，成為先進GPU封裝市場的主導配置。這一佔有率反映了設計邏輯的結構性轉變，因為將功能分類到更小的晶片上，使供應商更容易管理良率、光罩邊界以及跨多個性能層級的產品擴展。這也與研究結果相符，研究表明，晶片組密集的2.5D系統可以在眾多主動晶片上提供極高的頻寬和廣泛的配置柔軟性。這種組合使晶片組佈局在最高價值的AI加速器領域比單一大型晶片擁有更強大的長期基礎。

預計到2031年，採用堆疊式快取和I/O晶片的GPU封裝將以23.62%的複合年成長率成長，使其成為新興設計層級中GPU先進封裝市場規模討論中成長最快的配置。這種成長與在不超出現有基板、電源和散熱系統承載能力的前提下，提高頻寬和降低延遲的需求密切相關。超細間距混合鍵合技術透過實現更高密度的垂直連接和更緊湊的異構堆疊，正在推動這一發展方向。單片GPU封裝在遊戲、視覺化和其他對成本敏感的領域仍發揮重要作用，因為在這些領域，拆卸式配置並非總是經濟高效。然而，隨著人工智慧運算需求的成長，GPU先進封裝市場的設計重點正轉向更多多層和模組化的封裝結構。

區域分析

2025年，GPU先進封裝市場仍將集中在亞太地區，佔全球供需總量的68.44%。這一主導地位源自於該地區完善的晶圓代工廠、記憶體供應、基板技術能力以及OSAT規模，這些優勢使客戶能夠縮短設計、組裝和認證之間的反饋週期。韓國憑藉其在先進記憶體和封裝聯合開發方面的緊密合作，仍然是該市場的重要參與者。 2026年6月，NVIDIA和SK海力士正式簽署了一項多年期AI內存平台技術合作協議，進一步加強了雙方的合作關係。亞太地區也擁有成熟的供應商網路，能夠以商業規模支援多種封裝技術，從基於中介層的封裝製程到更具實驗性的下一代封裝形式。因此，即使其他地區加快了投資步伐，GPU先進封裝市場在亞太地區仍將保持蓬勃發展。

預計到2031年，北美將以23.42%的複合年成長率成長，成為GPU先進封裝市場規模展望中成長最快的區域市場。這一成長得益於直接的公共資金支持、試點基礎設施建設以及旨在增強半導體韌性的全新國內封裝計劃。美國商務部於2025年1月宣布的14億美元最終津貼方案，使先進封裝從供應鏈的次要環節躍升為更廣泛的半導體政策的核心。對安姆科公司計劃在亞利桑那州建設的園區的初步支持，將這項政策延伸至商業生產能力，表明美國正在尋求在國內建立一個功能完善、高產能的OSAT（外包半導體製造和技術）基地。對於國防、超大規模運算和國家基礎設施領域的客戶而言，本地生產能力的價值不僅體現在成本上，還體現在可靠性、前置作業時間和風險管理方面。

歐洲、南美洲以及中東和非洲地區繼續塑造先進GPU封裝市場，儘管它們的直接生產規模仍然較小，但這種影響主要體現在設備、材料和下游需求方面。尤其值得一提的是，歐洲在製程製程設備和生態系統發展方面發揮著至關重要的作用，其供應商支持著下一代封裝形式的進步，這些封裝形式正被整合到全球生產鏈中。 2025年4月，LPKF和Onto Innovation宣佈建立合作夥伴關係，以加速玻璃芯基板的量產，這進一步印證了歐洲將在未來封裝架構的建構中發揮作用，而非主導GPU的大規模生產組裝。南美洲和中東及非洲地區作為人工智慧基礎設施應用市場的重要性日益凸顯，而非主要的封裝生產中心。即使當地的製造地相對較小，這些應用仍推動著對來自主要供應地區的先進封裝GPU的需求。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 人工智慧領域對GPU和HBM整合的需求日益成長。
    • 基於晶片組的GPU架構的發展
    • 透過晶圓代工廠和OSAT擴大產能
    • 政府對國內包裝供應鏈的支持措施
    • 採用混合鍵結技術實現更高的佈線密度。
    • 資料中心GPU的功耗和散熱效率面臨壓力
  • 市場限制因素
    • CoWoS 及同等先進封裝技術的產能瓶頸。
    • 2.5D 和 3D 線型產品存在高資本投入和收益風險。
    • 高密度多晶片封裝中溫度控管的複雜性
    • 玻璃和麵板層面生態系統發展的差距
  • 產業價值鏈分析
  • 產業供應鏈分析
  • 科技趨勢
  • 監理情勢
  • 宏觀經濟因素對市場的影響
  • 波特五力分析

第5章 市場規模與成長預測

  • 產品技術
    • 2.5D包裝
    • 3D包裝
    • 基於扇出/RDL的封裝
    • 嵌入式橋接封裝
    • 混合型 2.5D + 3D 包裝
  • GPU 配置
    • 單晶片GPU封裝
    • 基於晶片組的GPU封裝
    • 整合 HBM 的 GPU 封裝
    • 具有堆疊快取的GPU封裝/I/O晶片
  • 透過使用
    • 用於人工智慧訓練的GPU
    • 用於人工智慧推理的GPU
    • 用於高效能運算的GPU
    • 用於可視化的專業級GPU
    • 遊戲與消費級GPU
    • 邊緣運算、工業和汽車GPU
  • 透過包裝服務供應商
    • 晶圓代工廠主導的包裝
    • OSAT主導的包裝
    • IDM/內部包裝
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 歐洲
      • 德國
      • 英國
      • 法國
      • 義大利
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 印度
      • 東南亞
      • 其他亞太國家
    • 南美洲
    • 中東和非洲

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Taiwan Semiconductor Manufacturing Company Limited
    • Intel Corporation
    • Samsung Electronics Co., Ltd.
    • ASE Technology Holding Co., Ltd.
    • Amkor Technology, Inc.
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Powertech Technology Inc.
    • Siliconware Precision Industries Co., Ltd.
    • Micron Technology, Inc.
    • SK hynix Inc.
    • NVIDIA Corporation
    • Advanced Micro Devices, Inc.
    • Broadcom Inc.
    • Synopsys, Inc.
    • Cadence Design Systems, Inc.
    • Tokyo Electron Limited
    • Applied Materials, Inc.
    • Lam Research Corporation
    • Onto Innovation Inc.
    • EV Group（EVG）
    • Universal Chiplet Interconnect Express Consortium

第7章 市場機會與未來展望

簡介目錄
Product Code: 100197

According to Mordor Intelligence, the GPU advanced packaging market size is expected to increase from USD 8.30 billion in 2025 to USD 13.70 billion in 2026 and reach USD 37.50 billion by 2031, growing at a CAGR of 22.31% over 2026-2031.

GPU Advanced Packaging - Market - IMG1

This report is Segmented by Packaging Technology (2. 5D Packaging, Fan-Out / RDL-Based Packaging, Embedded Bridge Packaging, and More), GPU Configuration (Monolithic GPU Packages, Chiplet-Based GPU Packages, and More), Application (AI Training GPUs, HPC GPUs, and More), Service Provider (Foundry-Led Packaging, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global GPU Advanced Packaging Market Trends and Insights

Rising AI GPU and HBM Integration Needs Drive Packaging Demand

The GPU advanced packaging market is expanding because AI accelerators now need tight integration between GPU logic and high-bandwidth memory inside the same package. This requirement raises the value of interposers, die placement, thermal path design, and package level power delivery, because each one directly affects usable performance in training and inference systems. SK hynix stated in 2025 that its iHBM solution placed cooling features directly in the D2D PHY area, where heat concentration is highest, and this reduced thermal resistance by 30% in demanding package environments. That shift matters because memory stacking is no longer just a component choice, and it now changes how the full GPU package is engineered, qualified, and priced. As HBM stacks become denser, packaging decisions move earlier in the design cycle and stay tied to long customer qualification programs, which supports stronger revenue visibility for advanced package suppliers. The result is that the packaging layer has become one of the main technical gates for AI system deployment, rather than a downstream assembly step.

Growth of Chiplet-Based GPU Architectures Expands Packaging Complexity

The GPU advanced packaging market is also gaining from the wider use of chiplet-based GPU layouts that break large functions into smaller tiles and then reconnect them inside one package. This design path helps vendors work around reticle limits and yield pressure, but it also increases the need for dense die-to-die interconnects, tighter alignment, and more complex assembly flows. An IEEE Journal of Solid-State Circuits study published in 2025 described a scalable heterogeneous 2.5D system with 300 MB SRAM, 20 Tb/s bandwidth, and simultaneous inferencing across 20 chiplets, which shows how far multi-chip designs are moving beyond simple side-by-side integration. Intel also noted in its November 2025 Foveros Direct 3D technology brief that hybrid bonding supports very fine pitch interconnects and denser vertical integration, reinforcing why advanced packaging is central to next-generation compute architecture. In practical terms, chiplet adoption broadens the mix of packages needed across AI training, HPC, and high-end inference products, instead of keeping demand tied to one package format. That broadening effect gives the GPU advanced packaging market a wider and more durable demand base as product roadmaps become more modular.

CoWoS And Comparable Capacity Bottlenecks Limit Revenue Conversion

The GPU advanced packaging market still faces a supply ceiling because demand for leading-edge package formats remains heavily concentrated in a narrow set of qualified platforms and production lines. Even when end demand is strong, revenue cannot fully convert if substrate availability, interposer capacity, memory integration, and final package throughput do not scale together. The U.S. Department of Commerce framed advanced packaging as a strategic gap in the semiconductor supply chain when it announced large public awards for domestic ecosystem buildout, which supports the view that current supply remains structurally constrained. This constraint matters most for flagship AI programs, because those products rely on the most advanced packaging flows and cannot easily switch to lower-complexity alternatives once design qualification is complete. It also reinforces customer concentration around a few suppliers that already operate at the leading edge, which limits bargaining power for GPU designers that need fast volume ramps. Until more qualified lines come online across regions and providers, the GPU advanced packaging market will continue to face periods when demand runs ahead of practical package output.

Other drivers and restraints analyzed in the detailed report include:

  1. Government Incentives for Domestic Packaging Supply Chains Shift Investment
  2. Power and Thermal Efficiency Pressure Makes Packaging a Design Lever
  3. High Capex and Yield Risk Raise the Barrier to New Capacity

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

2.5D silicon-interposer packaging held 70.11% of the market in 2025, which kept it as the volume anchor of the GPU advanced packaging market. That position reflects its role as the default integration route for advanced GPU and HBM combinations, where the package must support dense interconnects, large memory footprints, and stable thermal behavior. The installed base of qualified design flows also matters, because customers already rely on this format for high-value programs and cannot easily absorb long requalification cycles during active product ramps. In effect, 2.5D kept its lead because it offers the best balance between bandwidth density, customer familiarity, and near-term production readiness for top AI deployments.

The GPU advanced packaging market is also shifting toward hybrid 2.5D + 3D packaging, which is projected to expand at a 23.21% CAGR through 2031. This segment is gaining because it combines horizontal integration and vertical stacking in a way that can push beyond the practical limits of pure interposer designs. The direction is consistent with broader industry work on fine-pitch hybrid bonding, denser vertical links, and more advanced heterogeneous integration. Fan-out and redistribution-layer approaches continue to fit programs that need thinner form factors or more controlled cost, while embedded bridge solutions are building a role where customers want a credible path outside the largest interposer-based platforms. Over time, this means the GPU advanced packaging industry is moving from one dominant package choice toward a more segmented technology mix that maps to workload needs, thermal limits, and customer budgets.

Chiplet-based GPU packages commanded 55.33% of the configuration mix in 2025, and this made them the leading configuration in the GPU advanced packaging market. The share reflects a structural shift in design logic, because breaking functions into smaller dies helps vendors manage yield, reticle boundaries, and product scaling across multiple performance tiers. It also aligns with research results that show chiplet-rich 2.5D systems can deliver very high bandwidth and broader configuration flexibility across many active dies. That mix gives chiplet layouts a stronger long-term foundation than single large dies in the highest-value AI accelerator classes.

GPU packages with stacked cache and I/O dies are projected to expand at a 23.62% CAGR through 2031, making them the fastest-growing configuration in the GPU advanced packaging market size discussion for emerging design layers. This growth is tied to the need to lift bandwidth and reduce latency without expanding package footprint beyond what current board, power, and cooling systems can handle. Very fine pitch hybrid bonding supports that direction by enabling closer vertical links and more compact heterogeneous stacks. Monolithic GPU packages still matter in gaming, visualization, and other cost-sensitive areas where disaggregation does not always pay off. Even so, the broader design center of gravity inside the GPU advanced packaging market is moving toward more layered and more modular package structures as AI compute demand intensifies.

Complete Report Scope:

  • By Packaging Technology
    • 2.5D Packaging
    • 3D Packaging
    • Fan-Out / RDL-Based Packaging
    • Embedded Bridge Packaging
    • Hybrid 2.5D + 3D Packaging
  • By GPU Configuration
    • Monolithic GPU Packages
    • Chiplet-Based GPU Packages
    • GPU Packages with HBM Integration
    • GPU Packages with Stacked Cache / I/O Dies
  • By Application
    • AI Training GPUs
    • AI Inference GPUs
    • HPC GPUs
    • Professional Visualization GPUs
    • Gaming and Consumer GPUs
    • Edge, Industrial, and Automotive GPUs
  • By Packaging Service Provider
    • Foundry-Led Packaging
    • OSAT-Led Packaging
    • IDM / Captive Packaging
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • Europe
      • Germany
      • United Kingdom
      • France
      • Italy
      • Rest of Europe
    • Asia-Pacific
      • China
      • Japan
      • South Korea
      • India
      • Southeast Asia
      • Rest of Asia-Pacific
    • South America
    • Middle East and Africa

Geography Analysis

The GPU advanced packaging market remained concentrated in Asia-Pacific in 2025, with the region holding 68.44% share of global demand and supply activity. This lead came from the region's combination of foundry depth, memory supply, substrate capability, and OSAT scale, which gives customers shorter feedback loops between design, assembly, and qualification. South Korea remains important because advanced memory and package co-development are tightly linked, and NVIDIA and SK hynix formalized that linkage further through their June 2026 multiyear technology partnership for AI memory platforms. Asia-Pacific also benefits from a mature supplier web that can support multiple package technologies at commercial scale, from interposer-based flows to more experimental next-generation formats. This keeps the GPU advanced packaging market centered in the region even as other geographies increase their investment pace.

North America is projected to grow at a 23.42% CAGR through 2031, and this makes it the fastest-growing regional layer of the GPU advanced packaging market size outlook. That expansion is being supported by direct public funding, pilot infrastructure, and new domestic packaging plans intended to strengthen semiconductor resilience. The U.S. Department of Commerce's January 2025 package of USD 1.4 billion in final awards placed advanced packaging at the center of broader chip policy, rather than treating it as a secondary part of the supply chain. Preliminary support for Amkor's planned Arizona campus extends that policy into commercial capacity and signals that the United States wants a functioning high-volume OSAT base onshore. For customers in defense, hyperscale computing, and national infrastructure, the value of local capacity is not only cost related, but also tied to assurance, lead times, and risk management.

Europe, South America, and the Middle East and Africa remain smaller in direct manufacturing scale, but they still shape the GPU advanced packaging market through equipment, materials, and downstream demand. Europe is especially relevant in process equipment and ecosystem development, where suppliers help advance next-generation packaging formats that feed into global production chains. LPKF and Onto Innovation announced a collaboration in April 2025 to accelerate mass production of glass core substrates, and that supports Europe's role in enabling future package architectures rather than in dominating high-volume GPU assembly. South America and the Middle East and Africa remain more important as end markets for AI infrastructure deployments than as major packaging production hubs. Even without large local manufacturing footprints, those deployments still add to demand for advanced-packaged GPUs shipped from the main supply regions.

  1. Taiwan Semiconductor Manufacturing Company Limited
  2. Intel Corporation
  3. Samsung Electronics Co., Ltd.
  4. ASE Technology Holding Co., Ltd.
  5. Amkor Technology, Inc.
  6. Jiangsu Changjiang Electronics Technology Co., Ltd.
  7. Powertech Technology Inc.
  8. Siliconware Precision Industries Co., Ltd.
  9. Micron Technology, Inc.
  10. SK hynix Inc.
  11. NVIDIA Corporation
  12. Advanced Micro Devices, Inc.
  13. Broadcom Inc.
  14. Synopsys, Inc.
  15. Cadence Design Systems, Inc.
  16. Tokyo Electron Limited
  17. Applied Materials, Inc.
  18. Lam Research Corporation
  19. Onto Innovation Inc.
  20. EV Group (EVG)
  21. Universal Chiplet Interconnect Express Consortium

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Rising AI GPU and HBM Integration Needs
    • 4.2.2 Growth of Chiplet-Based GPU Architectures
    • 4.2.3 Capacity Expansion by Foundries and OSATs
    • 4.2.4 Government Incentives for Domestic Packaging Supply Chains
    • 4.2.5 Hybrid Bonding Adoption for Higher Interconnect Density
    • 4.2.6 Power and Thermal Efficiency Pressure in Data Center GPUs
  • 4.3 Market Restraints
    • 4.3.1 CoWoS and Comparable Advanced Packaging Capacity Bottlenecks
    • 4.3.2 High Capex and Yield Risk in 2.5D and 3D Lines
    • 4.3.3 Thermal Management Complexity in Dense Multi-Die Packages
    • 4.3.4 Glass and Panel-Level Ecosystem Readiness Gaps
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Supply Chain Analysis
  • 4.6 Technology Outlook
  • 4.7 Regulatory Landscape
  • 4.8 Impact of Macroeconomic Factors on the Market
  • 4.9 Porter's Five Forces Analysis
    • 4.9.1 Bargaining Power of Suppliers
    • 4.9.2 Bargaining Power of Buyers
    • 4.9.3 Threat of New Entrants
    • 4.9.4 Threat of Substitutes
    • 4.9.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Packaging Technology
    • 5.1.1 2.5D Packaging
    • 5.1.2 3D Packaging
    • 5.1.3 Fan-Out / RDL-Based Packaging
    • 5.1.4 Embedded Bridge Packaging
    • 5.1.5 Hybrid 2.5D + 3D Packaging
  • 5.2 By GPU Configuration
    • 5.2.1 Monolithic GPU Packages
    • 5.2.2 Chiplet-Based GPU Packages
    • 5.2.3 GPU Packages with HBM Integration
    • 5.2.4 GPU Packages with Stacked Cache / I/O Dies
  • 5.3 By Application
    • 5.3.1 AI Training GPUs
    • 5.3.2 AI Inference GPUs
    • 5.3.3 HPC GPUs
    • 5.3.4 Professional Visualization GPUs
    • 5.3.5 Gaming and Consumer GPUs
    • 5.3.6 Edge, Industrial, and Automotive GPUs
  • 5.4 By Packaging Service Provider
    • 5.4.1 Foundry-Led Packaging
    • 5.4.2 OSAT-Led Packaging
    • 5.4.3 IDM / Captive Packaging
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 Europe
      • 5.5.2.1 Germany
      • 5.5.2.2 United Kingdom
      • 5.5.2.3 France
      • 5.5.2.4 Italy
      • 5.5.2.5 Rest of Europe
    • 5.5.3 Asia-Pacific
      • 5.5.3.1 China
      • 5.5.3.2 Japan
      • 5.5.3.3 South Korea
      • 5.5.3.4 India
      • 5.5.3.5 Southeast Asia
      • 5.5.3.6 Rest of Asia-Pacific
    • 5.5.4 South America
    • 5.5.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
    • 6.4.1 Taiwan Semiconductor Manufacturing Company Limited
    • 6.4.2 Intel Corporation
    • 6.4.3 Samsung Electronics Co., Ltd.
    • 6.4.4 ASE Technology Holding Co., Ltd.
    • 6.4.5 Amkor Technology, Inc.
    • 6.4.6 Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 6.4.7 Powertech Technology Inc.
    • 6.4.8 Siliconware Precision Industries Co., Ltd.
    • 6.4.9 Micron Technology, Inc.
    • 6.4.10 SK hynix Inc.
    • 6.4.11 NVIDIA Corporation
    • 6.4.12 Advanced Micro Devices, Inc.
    • 6.4.13 Broadcom Inc.
    • 6.4.14 Synopsys, Inc.
    • 6.4.15 Cadence Design Systems, Inc.
    • 6.4.16 Tokyo Electron Limited
    • 6.4.17 Applied Materials, Inc.
    • 6.4.18 Lam Research Corporation
    • 6.4.19 Onto Innovation Inc.
    • 6.4.20 EV Group (EVG)
    • 6.4.21 Universal Chiplet Interconnect Express Consortium

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment