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市場調查報告書
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1851772

OSAT（半導體外包組裝和測試）：市場佔有率分析、行業趨勢、統計數據、成長預測（2025-2030 年）

Outsourced Semiconductor Assembly And Test (OSAT) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 187 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計到 2025 年，OSAT（外包半導體組裝和測試）市場規模將達到 470.9 億美元，到 2030 年將達到 714.4 億美元，年複合成長率為 8.69%。

外包半導體組裝和測試 (OSAT) 市場-IMG1

人工智慧、高效能運算和汽車電氣化的持續進步推動了對先進封裝和安全關鍵型測試流程的需求，從而擴大了專業後端服務供應商的潛在市場。亞太地區的供應商憑藉成熟的生態系統保持了價格競爭力，而北美和歐洲受政策主導的產能擴張已開始重塑全球供應格局。混合晶片架構提升了異質整合的重要性，促使企業對扇出型晶圓級和2.5D/3D平台進行策略性投資。同時，日益嚴格的貿易法規和永續性要求鼓勵客戶將部分工作負載轉移到地理位置分散、單位吞吐量能耗更低的地區。由於晶圓代工產能持續緊張，小型晶圓廠半導體公司繼續將後端營運外包，這進一步鞏固了外包半導體組裝測試（OSAT）市場在下一個規劃週期中的結構性重要性。

全球OSAT（半導體外包組裝與測試）市場趨勢與洞察

每車半導體產量快速成長

隨著汽車原始設備製造商 (OEM) 向軟體定義平台轉型，每輛車的半導體元件數量不斷增加，從而推動了對高可靠性封裝的需求。大眾汽車集團與安森美半導體 (ON Semiconductor) 在牽引逆變器夥伴關係凸顯了碳化矽元件的日益普及，而碳化矽元件需要具有良好散熱性能的功率封裝。這家透過 AEC-Q100 和 ISO 26262 認證的 OSAT 供應商贏得了新的設計訂單，並與電動車供應商簽訂了多年產能預訂協議。

5G推動對先進射頻封裝的需求

商用5G基地台部署已將無線電前端推進毫米波領域，這需要低損耗基板、共形屏蔽和緊湊的SiP封裝。 Finwave Semiconductor在GLOBALFOUNDRIES完成的E型MISHEMT整合標誌著一種新型氮化鎵裝置的商業化部署，該裝置需要特殊的射頻封裝，預計將於2026年完成量產認證。 6G測試平台已開始採用共封裝光元件，這促使OSAT公司擴展其混合訊號組裝能力和先進的熱感解決方案。

主要晶圓代工廠與整合元件製造商之間的垂直整合

台積電的晶圓廠2.0策略整合了封裝和測試流程，並提供承包服務，降低了獨立OSAT廠商的產能。三星也採取了類似的策略，英特爾則擴展了其代工服務，涵蓋了先進的中介層裝置。這些措施降低了第三方廠商在高利潤領域的市場佔有率，迫使OSAT廠商專注於汽車安全和光電等細分領域。

細分市場分析

預計2025年至2030年，其複合年成長率將達到10.8%，超過封裝產業的擴張速度，但其基數較小。人工智慧和高效能運算設計需要系統級測試覆蓋率，以檢驗晶片互連延遲、動態熱節流以及深度熱感工作負載在不同電壓下的性能。半導體組裝和測試外包市場已透過將自適應機器學習演算法整合到自動化測試設備中來應對這一挑戰，從而縮短測試時間並提高故障隔離能力。

2024年，封裝業務仍佔總收入的77.5%，但其產品組合已轉向扇出型面板、2.5D中介層和共封裝光學元件。隨著客戶整合供應商，OSAT集團推出了整合夾具設計、最終測試和物流的承包產品。愛德萬測試在其V93000系列產品中加入了人工智慧分析功能，連續第六年蟬聯組裝檢測設備市場第一。

球柵陣列（BGA）技術面向主流消費和工業平台，這些平台優先考慮機械強度，預計到2024年其市場佔有率將維持在24.3%。然而，隨著行動處理器和人工智慧加速器向高密度線路重布遷移，扇出型晶圓級封裝（FAP）將以11.5%的複合年成長率成長。這一趨勢強化了半導體組裝和測試市場的外包需求，因為只有少數供應商能夠在不影響產量比率的情況下處理大尺寸面板。

日月光(ASE)斥資2億美元拓展310mm x 310mm玻璃面板業務，彰顯了其在經濟高效的大面積製造方面的資本投入。在高頻寬記憶體堆疊技術中，穿透矽通孔和玻璃通孔等多種通孔技術已被廣泛應用。 FC-BGA基板受益於先進製程節點的採用，彌合了有機層壓板和矽中介層在網路ASIC晶片中的差距。

OSAT（外包半導體組裝和測試）市場按服務類型（封裝、測試）、封裝類型（球柵陣列、晶片級封裝、其他）、應用（通訊、消費性電子、汽車、運算/網路、其他）、技術節點（≥28 奈米、16/14 奈米、10/7 北美、其他）和地區（≥28 奈米、16/14 奈米、10/7 北美、其他）和地區（北北美、南美細分。

區域分析

預計到2024年，亞太地區將維持其在OSAT（半導體外包組裝和測試）市場收入中73.5%的佔有率，並在2030年之前以9.6%的複合年成長率成長。台灣、中國大陸和韓國因其靠近晶圓代工廠和基板製造商而成為產業叢集的支撐地，但不斷升級的貿易緊張局勢正促使企業將生產基地多元化轉移至馬來西亞、越南和菲律賓。印度已加快推出激勵措施，核准了凱恩斯科技公司在古吉拉突邦投資4.13億美元的工廠項目以及塔塔電子公司在阿薩姆邦投資30億美元的封裝測試一體化工廠項目。

得益於《晶片技術創新法案》（CHIPS Act）的資金支持，北美地區重獲戰略地位。安姆科（Amcor）在亞利桑那州破土動工興建先進封裝工廠，為美國國內汽車和人工智慧客戶供貨。德克薩斯）累計600億美元用於建造多個晶圓廠及相應的後端產能，而Skyhar以9,300萬美元收購英飛凌（Infineon）位於奧斯汀的晶圓廠，進一步增強了其自主研發能力。

歐洲已從利基研發轉向大規模生產。 Silicon Box公司在義大利投資13億歐元（約14.7億美元）建造面板級晶圓廠，目標年產能超過1億片SiP晶片，並已獲得歐盟核准。泰雷茲、Radiall和富士康尋求在法國建立OSAT聯盟，為國防和航空航太用戶提供服務。安森美半導體在捷克共和國投資20億美元建造碳化矽生產線，以確保電動車計劃的本地供應。中東和非洲仍然是新興市場，以色列和阿拉伯聯合大公國正在評估相關政策框架，以吸引後端投資者。

其他福利：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場情勢

  • 市場概覽
  • 市場促進因素
    • 每輛車半導體含量不斷提高
    • 5G主導了先進射頻封裝的需求
    • AI/HPC Chiplet 架構需要異質整合
    • 晶圓代工產能不足導致輕晶圓廠外包模式興起
    • 美國《晶片製造和整合產品法案》（CHIPS Act）和歐盟《晶片製造和整合產品法案》（CHIPS Act）為建立區域性外包半導體製造和測試中心（OSAT）提供了獎勵。
    • 永續性要求推動晶圓級扇出型晶片的普及
  • 市場限制
    • 主要晶圓代工廠與整合元件製造商之間的垂直整合
    • 資本投資強度和設備前置作業時間
    • 對先進工具的地緣政治出口管制
    • 先進封裝工程領域熟練勞工短缺
  • 價值鏈分析
  • 監管環境
  • 技術展望
  • 宏觀經濟因素的影響
  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭

第5章 市場規模與成長預測

  • 按服務類型
    • 包裝
    • 測試
  • 按包裝類型
    • 球柵陣列（BGA）
    • 晶片級封裝（CSP）
    • 四方扁平封裝/雙列直插封裝 (QFP/DIP)
    • 多晶片模組（MCM）
    • 晶圓層次電子構裝（WLP）
    • 扇出型封裝（FO-WLP/FO-BGA）
    • 系統級封裝（SiP）
    • 矽穿孔電極（2.5D/3D TSV）
    • 覆晶（FC-BGA/FC-CSP）
  • 透過使用
    • 通訊
    • 消費性電子產品
    • 車
    • 電腦與網路
    • 產業
    • 其他用途
  • 依技術節點
    • 28奈米或以上
    • 16/14 nm
    • 10/7 nm
    • 5奈米或更小
    • 傳統（90-65 奈米）
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲國家
    • 歐洲
      • 德國
      • 法國
      • 英國
      • 義大利
      • 荷蘭
      • 俄羅斯
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 台灣
      • 韓國
      • 日本
      • 新加坡
      • 馬來西亞
      • 印度
      • 亞太其他地區
    • 中東和非洲
      • 中東
      • 以色列
      • 阿拉伯聯合大公國
      • 沙烏地阿拉伯
      • 土耳其
      • 其他中東地區
      • 非洲
      • 南非
      • 奈及利亞
      • 其他非洲地區

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • ASE Technology Holding Co., Ltd.
    • Amkor Technology, Inc.
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Siliconware Precision Industries Co., Ltd.
    • Powertech Technology Inc.
    • King Yuan Electronics Co., Ltd.
    • Tongfu Microelectronics Co., Ltd.
    • Tianshui Huatian Technology Co., Ltd.
    • UTAC Holdings Ltd.
    • Unisem（M）Berhad
    • Hana Micron Inc.
    • ChipMOS Technologies Inc.
    • Formosa Advanced Technologies Co., Ltd.
    • Chipbond Technology Corporation
    • Lingsen Precision Industries, Ltd.
    • Suchi Semicon Pvt. Ltd.
    • Nepes Corporation
    • Silicon Box Pte. Ltd.
    • Shinko Electric Industries Co., Ltd.
    • Carsem（M）Sdn. Bhd.
    • SFA Semicon Co., Ltd.
    • Stats ChipPAC Pte. Ltd.
    • Orient Semiconductor Electronics, Ltd.
    • Integra Technologies LLC
    • Anam Semiconductor Inc.

第7章 市場機會與未來展望

簡介目錄
Product Code: 66300

The outsourced semiconductor assembly and test market size reached USD 47.09 billion in 2025 and is forecast to attain USD 71.44 billion by 2030, advancing at an 8.69% CAGR.

Outsourced Semiconductor Assembly And Test (OSAT) - Market - IMG1

Sustained progress in artificial intelligence, high-performance computing, and automotive electrification raised demand for advanced packages and safety-critical test flows, thereby widening the total addressable opportunity for specialized backend service providers. Asia-Pacific suppliers preserved pricing leverage owing to mature ecosystems, yet policy-driven capacity build-outs in North America and Europe began to reshape global supply allocation. Hybrid chiplet architectures elevated the importance of heterogeneous integration, motivating strategic investments in fan-out wafer-level and 2.5D/3D platforms. Meanwhile, tighter trade controls and sustainability mandates encouraged customers to shift part of the workload to geographically diversified sites that can demonstrate lower energy use per unit throughput. As foundry capacity remained strained, fab-lite semiconductor companies continued to outsource backend steps, reinforcing the structural relevance of the outsourced semiconductor assembly and test market in the next planning cycle.

Global Outsourced Semiconductor Assembly And Test (OSAT) Market Trends and Insights

Soaring Semiconductor Content Per Vehicle

Automotive OEMs transitioned toward software-defined platforms, lifting semiconductor bill-of-materials per car and intensifying demand for high-reliability packages. Volkswagen Group's traction inverter partnership with onsemi highlighted the rising adoption of silicon carbide devices that need thermally robust power packages.Imec's Automotive Chiplet Program, supported by ASE, BMW, and Bosch, illustrated cross-value-chain alignment on standardized chiplet packaging for functional safety compliance. OSAT providers that qualify to AEC-Q100 and ISO 26262, therefore, captured new design wins and secured multiyear capacity reservations with electric-vehicle suppliers.

5G-Led Demand for Advanced RF Packages

Commercial 5G base-station roll-outs moved the radio front-end into millimetre-wave territory, necessitating low-loss substrates, conformal shielding, and compact SiP footprints. Finwave Semiconductor's E-mode MISHEMT integration at GlobalFoundries signalled commercial deployment of novel gallium-nitride devices that require specialised RF packaging, with mass qualification targeted for 2026. The pipeline for 6G testbeds already incorporates co-packaged optics, urging OSAT firms to expand mixed-signal assembly capabilities and advanced thermal solutions.

Vertical Integration by Leading Foundries and IDMs

TSMC's Wafer Manufacturing 2.0 strategy integrated packaging and testing flows, offering turnkey services that reduced addressable volume for stand-alone OSAT companies. Samsung pursued a similar path, while Intel grew its foundry services to include advanced interposers. These moves compressed third-party share in high-margin segments and obliged OSAT firms to double down on niches such as automotive safety or photonics.

Other drivers and restraints analyzed in the detailed report include:

  1. AI/HPC Chiplet Architectures Needing Heterogeneous Integration
  2. Foundry Capacity Shortages Driving Fab-Lite Outsourcing
  3. Cap-Ex Intensity and Long Equipment Lead-Times

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Testing captured a 10.8% CAGR forecast for 2025-2030, a pace outstripping packaging's expansion yet starting from a smaller base. AI and high-performance computing designs demanded system-level test coverage that verifies chiplet interconnect latency, dynamic thermal throttling, and deep-learning workload performance under varied voltages. The outsourced semiconductor assembly and test market responded by integrating adaptive machine-learning algorithms in automatic test equipment, cutting test time while improving fault isolation.

Packaging retained 77.5% of 2024 revenue, but its composition evolved toward fan-out panel-level, 2.5D interposer, and co-packaged optics lines. As customers consolidated suppliers, OSAT groups bundled turnkey offerings that merge fixture design, final test, and logistics. Advantest secured its sixth consecutive leadership in assembly test equipment after adding AI-enabled analytics to its V93000 series.

Ball grid array technology maintained a 24.3% share in 2024 by serving mainstream consumer and industrial platforms that value mechanical robustness. However, fan-out wafer-level packages expanded at 11.5% CAGR as mobile processors and AI accelerators transitioned to high-density redistribution layers. This trend strengthened the outsourced semiconductor assembly and test market because only a limited pool of vendors can process larger panel formats without yield drift.

ASE's USD 200 million panel-level expansion to 310 mm X 310 mm glass panels illustrated a cap-ex commitment toward cost-effective, large-area builds. Through-silicon-via and through-glass-via variants proliferated in high-bandwidth memory stacks. FC-BGA substrates benefited from advanced node adoption, bridging the gap between organic laminates and silicon interposers for networking ASICs.

Outsourced Semiconductor Assembly and Test (OSAT) Market is Segmented by Service Type (Packaging, and Testing), Packaging Type (Ball Grid Array, Chip-Scale Package, and More), Application (Communication, Consumer Electronics, Automotive, Computing and Networking, and More), Technology Node (>=28 Nm, 16/14 Nm, 10/7 Nm, and More), and Geography (North America, South America, Europe, Asia-Pacific, and Middle East and Africa).

Geography Analysis

Asia-Pacific retained 73.5% share of outsourced semiconductor assembly and test market revenue in 2024 and posted a 9.6% CAGR outlook through 2030. Taiwan, China, and South Korea anchored the cluster owing to proximity to foundries and substrate makers, yet escalating trade frictions prompted diversification into Malaysia, Vietnam, and the Philippines. India accelerated incentive programmes, endorsing Kaynes Technology's USD 413 million plant in Gujarat and Tata Electronics' USD 3 billion Assam package-test complex.

North America regained strategic weight following the CHIPS Act funding. Amkor broke ground on an advanced packaging facility in Arizona designed to supply domestic automotive and AI customers. Texas Instruments earmarked USD 60 billion for multiple wafer fabs and corresponding backend capacity, while SkyWater's USD 93 million acquisition of Infineon's Austin fab added sovereign redundancy.

Europe moved from niche R&D toward scaled production. Silicon Box obtained EU approval for a EUR 1.3 billion (USD 1.47 billion) panel-level plant in Italy, targeting >100 million SiP units per year. Thales, Radiall, and Foxconn explored a French OSAT alliance to serve defence and aeronautics users. Onsemi committed USD 2 billion to a silicon-carbide line in the Czech Republic, assuring local supply for e-mobility projects. The Middle East and Africa remained an emerging frontier, with Israel and the UAE assessing policy frameworks to attract backend investors.

  1. ASE Technology Holding Co., Ltd.
  2. Amkor Technology, Inc.
  3. Jiangsu Changjiang Electronics Technology Co., Ltd.
  4. Siliconware Precision Industries Co., Ltd.
  5. Powertech Technology Inc.
  6. King Yuan Electronics Co., Ltd.
  7. Tongfu Microelectronics Co., Ltd.
  8. Tianshui Huatian Technology Co., Ltd.
  9. UTAC Holdings Ltd.
  10. Unisem (M) Berhad
  11. Hana Micron Inc.
  12. ChipMOS Technologies Inc.
  13. Formosa Advanced Technologies Co., Ltd.
  14. Chipbond Technology Corporation
  15. Lingsen Precision Industries, Ltd.
  16. Suchi Semicon Pvt. Ltd.
  17. Nepes Corporation
  18. Silicon Box Pte. Ltd.
  19. Shinko Electric Industries Co., Ltd.
  20. Carsem (M) Sdn. Bhd.
  21. SFA Semicon Co., Ltd.
  22. Stats ChipPAC Pte. Ltd.
  23. Orient Semiconductor Electronics, Ltd.
  24. Integra Technologies LLC
  25. Anam Semiconductor Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Soaring semiconductor content per vehicle
    • 4.2.2 5G-led demand for advanced RF packages
    • 4.2.3 AI/HPC chiplet architectures needing heterogeneous integration
    • 4.2.4 Foundry capacity shortages driving fab-lite outsourcing
    • 4.2.5 U.S. CHIPS and EU Chips Acts incentivising local OSAT build-out
    • 4.2.6 Sustainability mandates pushing wafer-level fan-out adoption
  • 4.3 Market Restraints
    • 4.3.1 Vertical integration by leading foundries and IDMs
    • 4.3.2 Cap-ex intensity and long equipment lead-times
    • 4.3.3 Geopolitical export controls on advanced tools
    • 4.3.4 Skilled-labour shortages in advanced packaging engineering
  • 4.4 Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Impact of Macroeconomic Factors
  • 4.8 Porter's Five Forces Analysis
    • 4.8.1 Bargaining Power of Suppliers
    • 4.8.2 Bargaining Power of Buyers
    • 4.8.3 Threat of New Entrants
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Service Type
    • 5.1.1 Packaging
    • 5.1.2 Testing
  • 5.2 By Packaging Type
    • 5.2.1 Ball Grid Array (BGA)
    • 5.2.2 Chip-Scale Package (CSP)
    • 5.2.3 Quad Flat / Dual-Inline (QFP/DIP)
    • 5.2.4 Multi-Chip Module (MCM)
    • 5.2.5 Wafer-Level Packaging (WLP)
    • 5.2.6 Fan-Out Packaging (FO-WLP / FO-BGA)
    • 5.2.7 System-in-Package (SiP)
    • 5.2.8 Through-Silicon Via (2.5D/3D TSV)
    • 5.2.9 Flip-Chip (FC-BGA / FC-CSP)
  • 5.3 By Application
    • 5.3.1 Communication
    • 5.3.2 Consumer Electronics
    • 5.3.3 Automotive
    • 5.3.4 Computing and Networking
    • 5.3.5 Industrial
    • 5.3.6 Other Applications
  • 5.4 By Technology Node
    • 5.4.1 >=28 nm
    • 5.4.2 16/14 nm
    • 5.4.3 10/7 nm
    • 5.4.4 5 nm and below
    • 5.4.5 Legacy (90-65 nm)
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 South America
      • 5.5.2.1 Brazil
      • 5.5.2.2 Argentina
      • 5.5.2.3 Rest of South America
    • 5.5.3 Europe
      • 5.5.3.1 Germany
      • 5.5.3.2 France
      • 5.5.3.3 United Kingdom
      • 5.5.3.4 Italy
      • 5.5.3.5 Netherlands
      • 5.5.3.6 Russia
      • 5.5.3.7 Rest of Europe
    • 5.5.4 Asia-Pacific
      • 5.5.4.1 China
      • 5.5.4.2 Taiwan
      • 5.5.4.3 South Korea
      • 5.5.4.4 Japan
      • 5.5.4.5 Singapore
      • 5.5.4.6 Malaysia
      • 5.5.4.7 India
      • 5.5.4.8 Rest of Asia-Pacific
    • 5.5.5 Middle East and Africa
      • 5.5.5.1 Middle East
      • 5.5.5.1.1 Israel
      • 5.5.5.1.2 United Arab Emirates
      • 5.5.5.1.3 Saudi Arabia
      • 5.5.5.1.4 Turkey
      • 5.5.5.1.5 Rest of Middle East
      • 5.5.5.2 Africa
      • 5.5.5.2.1 South Africa
      • 5.5.5.2.2 Nigeria
      • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
    • 6.4.1 ASE Technology Holding Co., Ltd.
    • 6.4.2 Amkor Technology, Inc.
    • 6.4.3 Jiangsu Changjiang Electronics Technology Co., Ltd.
    • 6.4.4 Siliconware Precision Industries Co., Ltd.
    • 6.4.5 Powertech Technology Inc.
    • 6.4.6 King Yuan Electronics Co., Ltd.
    • 6.4.7 Tongfu Microelectronics Co., Ltd.
    • 6.4.8 Tianshui Huatian Technology Co., Ltd.
    • 6.4.9 UTAC Holdings Ltd.
    • 6.4.10 Unisem (M) Berhad
    • 6.4.11 Hana Micron Inc.
    • 6.4.12 ChipMOS Technologies Inc.
    • 6.4.13 Formosa Advanced Technologies Co., Ltd.
    • 6.4.14 Chipbond Technology Corporation
    • 6.4.15 Lingsen Precision Industries, Ltd.
    • 6.4.16 Suchi Semicon Pvt. Ltd.
    • 6.4.17 Nepes Corporation
    • 6.4.18 Silicon Box Pte. Ltd.
    • 6.4.19 Shinko Electric Industries Co., Ltd.
    • 6.4.20 Carsem (M) Sdn. Bhd.
    • 6.4.21 SFA Semicon Co., Ltd.
    • 6.4.22 Stats ChipPAC Pte. Ltd.
    • 6.4.23 Orient Semiconductor Electronics, Ltd.
    • 6.4.24 Integra Technologies LLC
    • 6.4.25 Anam Semiconductor Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-Need Assessment