首頁 > 市場調查報告書 > 電子零件/半導體

半導體生產設備電子設備合同製造

市場調查報告書

商品編碼

1698484

半導體組裝和測試服務 (OSAT) 市場：2025-2030 年預測

Outsourced Semiconductor Assembly And Test Services (OSAT) Market - Forecasts from 2025 to 2030

出版日期: 2025年03月18日 | 出版商:

Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

OSAT 市場預計將從 2025 年的 46,217,376,000 美元成長到 2030 年的 79,913,859,000 美元，複合年成長率為 11.57%。

外包裝組裝和測試服務 (OSAT) 是一個行業術語，指向半導體企業提供專門的製造和測試服務。半導體製造商聘請 OSAT 公司來組裝、封裝和測試積體電路 (IC) 和其他設備。各個領域對尖端電子設備的需求不斷成長，推動了 OSAT 市場的發展。 OSAT 供應商為半導體企業進行組裝和測試，以降低成本並加快交貨速度。此外，這些專業服務的需求是由複雜的半導體組件（例如 SoC 設計和改進的封裝方法）所驅動的。

OSAT是指將半導體封裝、組裝、測試外包給IDM（整合設備製造商）和無廠半導體公司的第三方機構。 OSAT 執行關鍵的後製造步驟，以確保晶片具有所需的性能、可靠性和品質。隨著對先進封裝（例如 2.5D/3D IC、扇出型）的需求不斷成長，OSAT 將促進 AI、5G 和汽車電子市場的成本節約擴展。

市場趨勢：

小型化需求不斷增加：對更小、更緊湊技術的需求正在激發持續的研究和創新，從而產生推動產業成長的新產品、製造技術和半導體設計。例如，2023年9月，美國國家科學基金會宣布將向24項研究和教育舉措投資4,560萬美元，部分資金由2022年《晶片與科學法案》支持。這些計劃重點關注半導體技術的進步、生產和勞動力發展。
政府力度不斷加大：世界各國政府正採取大膽措施促進國內半導體生產。 2024年3月，印度政府推出了三個總價值約12.5兆浮噸的半導體計劃，旨在使印度成為半導體設計、製造和技術的全球領導者。這包括在古吉拉突邦Dholera 特別投資區（DSIR）建立半導體製造工廠；在阿薩姆邦莫里加奧恩建立外包半導體組裝和委託(OSAT) 設施；並在古吉拉突邦南德設立 OSAT 工廠。
亞太地區：中國大陸、台灣和韓國正成為半導體組裝和製造的重要中心。該地區的 OSAT 供應商提供組裝、封裝和測試方面的專業技能，提高效率，有助於加快產品推出並縮短上市時間。

本報告涉及的主要企業包括日月光集團、安靠科技、力成科技、南茂科技、京元電子、江蘇長電科技、聯合科技、菱森精密工業和通富微電子。

本報告的主要優點

深刻分析：獲得涵蓋主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
競爭格局：了解全球主要企業採取的策略策略，並了解正確策略的市場滲透潛力。
市場趨勢和促進因素：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
適用範圍廣：對於新興企業、研究機構、顧問公司、中小企業和大型企業來說，它都是實用且具有成本效益的。

它有什麼用途？

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、監管影響、新產品開發、競爭情報

研究範圍

2022 年至 2024 年的歷史數據和 2025 年至 2030 年的預測數據
成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
競爭定位、策略和市場佔有率分析
收益成長和預測包括國家在內的細分市場和地區分析
公司概況（策略、產品、財務資訊、主要趨勢等）

Outsourced semiconductor assembly and test services (OSAT) is the industry term for providing specialist manufacturing and testing services to semiconductor businesses. To assemble, package, and test integrated circuits (ICs) and other devices, semiconductor manufacturers employ OSAT companies. The rising demand for cutting-edge electronic gadgets across various sectors is driving the OSAT market. OSAT suppliers conduct assembly and testing for semiconductor businesses to save money and expedite delivery. Furthermore, the need for these specialized services is driven by complex semiconductor components such as SoC designs and improved packaging methods.

OSAT refers to a third-party semiconductor package, assembly, and test outsourcing for IDMs (Integrated Device Manufacturers) and fabless companies. OSATs carry out important post-fabrication processes to guarantee chips of desired performance, reliability, and quality. With the growing need for advanced packaging (e.g., 2.5D/3D IC, fan-out), OSATs facilitate cost-saving scaling for AI, 5G, and automotive electronics markets.

Market Trends:

Rising Demand for Miniaturization: The push for smaller, more compact technologies has sparked continuous research and innovation, leading to new products, manufacturing techniques, and semiconductor designs that propel industry growth. For example, in September 2023, the US National Science Foundation announced a $45.6 million investment to fund 24 research and education initiatives, supported in part by the "CHIPS and Science Act of 2022." These efforts focus on advancing semiconductor technology, production, and workforce training.
Growing Government Initiatives: Governments worldwide are taking bold steps to bolster domestic semiconductor production. In March 2024, the Indian government launched three semiconductor projects valued at approximately Rs 1.25 lakh crore, aiming to position India as a global leader in semiconductor design, manufacturing, and technology. This includes establishing a semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, an Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, and another OSAT facility in Sanand, Gujarat.
Asia Pacific: China, Taiwan, and South Korea are emerging as key hubs for semiconductor assembly and production. OSAT providers in the region enhance efficiency by offering specialized skills in assembly, packaging, and testing, helping to accelerate product launches and reduce time-to-market.

Some of the major players covered in this report include ASE Group, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., King Yuan Electronics Co. Ltd, Jiangsu Changjiang Electronics Technology Co. Ltd, UTAC Holdings Ltd, Lingsen Precision Industries Ltd, and Tongfu Microelectronics Co., among others.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

OSAT Market Segmentation:

By Service Type

Packaging
Testing
Other

By Packaging Type

Ball Grid Array (BGA) Packaging
Chip-scale Packaging (CSP)
Stacked Die Packaging
Multi-Chip Packaging
Quad Flat and Dual-inline Packaging

By Device Type

Logic Devices
Memory Devices
Analog and Mixed-Signal Devices
Others

By Application

Communication
Consumer Electronics
Automotive
Computing and Networking
Industrial
Others

By Region

Americas
USA
Europe, Middle East, and Africa
Germany
Netherlandss
Others
Asia Pacific
China
Japan
Taiwan
South Korea
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. OSAT MARKET BY SERVICE TYPE

5.1. Introduction
5.2. Packaging
5.3. Testing
5.4. Other

6. OSAT MARKET BY PACKAGING TYPE

6.1. Introduction
6.2. Ball Grid Array (BGA) Packaging
6.3. Chip-scale Packaging (CSP)
6.4. Stacked Die Packaging
6.5. Multi-Chip Packaging
6.6. Quad Flat and Dual-inline Packaging

7. OSAT MARKET BY DEVICE TYPE

7.1. Introduction
7.2. Logic Devices
7.3. Memory Devices
7.4. Analog and Mixed-Signal Devices
7.5. Others

8. OSAT MARKET BY APPLICATION

8.1. Introduction
8.2. Communication
8.3. Consumer Electronics
8.4. Automotive
8.5. Computing and Networking
8.6. Industrial
8.7. Others

9. OSAT MARKET BY GEOGRAPHY

9.1. Introduction
9.2. Americas
- 9.2.1. USA
9.3. Europe, Middle East, and Africa
- 9.3.1. Germany
- 9.3.2. Netherlandss
- 9.3.3. Others
9.4. Asia Pacific
- 9.4.1. China
- 9.4.2. Japan
- 9.4.3. Taiwan
- 9.4.4. South Korea
- 9.4.5. Others