全球功率元件新型封裝和材料市場（截至 2032 年）：按產品類型、應用和地區劃分

預計到 2032 年，全球功率元件新型封裝和材料市場規模將達到 59.287 億美元，複合年增長率為 9.44%。該市場涵蓋採用尖端封裝解決方案和先進材料，旨在支援下一代功率元件。這些創新技術能夠改善散熱性能、加快開關速度並增強耐用性，從而重塑從電動車到智慧電網等各種應用。

全球功率元件新型封裝和材料市場的主要驅動力是電力電子領域對效率和速度的日益關注。氮化鎵 (GaN) 和碳化矽 (SiC) 基元件的應用日益廣泛，正在改變汽車、家用電器和再生能源，使其能夠實現更快的充電速度、更低的能量損耗和卓越的熱性能。此外，3D 封裝、先進熱介面材料的使用以及緊湊的整合是推動整個產業轉型的關鍵因素。這種轉變在電動車 (EV) 領域尤其明顯，因為高效率和快速充電至關重要。

報告屬性詳情

• 市場規模 (2023 年)：25 億美元
• 市場規模 (2032 年)：59.287 億美元
• 複合年增長率 (2024-2032)：9.44%
• 基準年：2023 年
• 市場預測期：2024-2032 年

區域分析

受汽車、消費性電子和工業領域需求以及研發和先進封裝技術投資的推動，北美市場正在逐步擴張。預計到2023年，北美市場規模將達到4.6917億美元（美國），3,208萬美元（加拿大），主要得益於汽車和電子產業的創新。

歐洲市場主要受永續發展和能源效率目標的驅動，尤其是在汽車和工業自動化領域。意法半導體、英飛凌科技和恩智浦半導體等該領域的行業領導者，提供根據不斷變化的需求量身定制的解決方案。歐洲市場以德國（1.2573億美元）、法國（8,840萬美元）和英國（9,294萬美元）為主，體現了其強大的工業基礎和對永續發展的重視。

亞太地區擁有強大的半導體生態系統，在電動車製造和應用方面處於全球領先地位。該地區還在通訊和再生能源領域進行了大量投資。中國（7.3829億美元）、日本（1.0437億美元）和印度（2,920萬美元）是市場的主要推動力，其中亞太地區是成長最快的地區。

本報告研究了功率元件新型封裝和材料的全球市場，提供了市場定義和概述、影響市場成長的各種因素分析、市場規模趨勢和預測、按不同細分市場、地區和主要國家/地區進行的細分、競爭格局以及主要公司的概況。

目錄

第1章 摘要整理

第2章 市場概要

第3章 調查手法

第4章 市場動態

• 促進因素
  • 對更高效率和速度的需求
  • 公司間合作與夥伴關係
• 限制因素
  • 將新材料和封裝整合到功率元件中
• 機遇
  • 對永續和可擴展功率產品的需求不斷增長

第5章 市場要素分析

• 供應鏈分析
• 波特的五力分析
• COVID-19流行對全球電力設備新包裝及新素材市場帶來的影響
• 價格分析

第6章 電力設備新包裝及新素材市場:各產品類型

• 板上晶片 (COB)
• 引線鍵結封裝
• 砷化鎵 (GAAS)
• 氮化鎵 (GAN)
• 碳化矽 (SIC)
• 其他

第7章 電力設備新包裝及新素材市場:各用途

• 汽車
• CE產品
• 工業
• IT·通訊
• 軍事·航太
• 其他

第8章 電力設備新包裝及新素材市場:各地區

• 概要
• 北美
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 英國
  • 法國
  • 俄羅斯
  • 西班牙
  • 荷蘭
  • 其他
• 亞太地區
  • 中國
  • 日本
  • 印度
  • 韓國
  • 新加坡
  • 澳洲和紐西蘭
  • 其他
• 中東·非洲
  • 南非
  • GCC各國
  • 土耳其
  • 以色列
  • 其他
• 南美
  • 巴西
  • 墨西哥
  • 阿根廷
  • 其他

第9章 競爭情形

• 市場佔有率分析
• 比較分析:主要企業的財務
• 競爭儀表板
• 主要的展開

第10章 企業簡介

• INFINEON TECHNOLOGIES
• STMICROELECTRONICS
• TEXAS INSTRUMENTS
• MITSUBISHI ELECTRIC CORPORATION
• ROHM SEMICONDUCTOR
• NXP SEMICONDUCTORS N.V.
• ANALOG DEVICES
• ON SEMICONDUCTORS
• MICROCHIP TECHNOLOGY
• WOLFSPEED, INC.
• 資料引用

Global New Packages and Materials for Power Devices Market Research Report by Product Type [Chip-On-Board (COB), Wire Bonding Packaging, Silicon Carbide (SIC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Others], by Application (Automotive, Consumer Electronics, IT & Telecommunications, Military & Aerospace, Industrial, Others), and by Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) Forecast till 2032

Industry Overview

The global new packages and materials for power devices market is expected to achieve a value of USD 5,928.7 million, expanding at a 9.44% by the end of 2032. The term highlights the adoption of modern packaging solutions and advanced materials designed to support next-generation power devices. By enabling better heat dissipation, higher switching speeds, and improved durability, these innovations are reshaping applications from electric vehicles to smart grids.

The global New Packages and Materials for Power Devices Market is primarily driven by the rising emphasis on efficiency and speed in power electronics. The increasing use of GaN and SiC-based devices is changing the automotive, consumer electronics, and renewable energy sectors by allowing faster charging, lower energy losses, and better thermal performance. Besides that, 3D packaging, the use of advanced thermal interface materials, and compact integration are the main factors that are driving the industry-wide transitions. These transitions are more visible in electric vehicles (EVs), where higher efficiency and rapid charging are the most important.

Major Company Development

Between 2023 and 2024, Microchip Technology accelerated its expansion strategy with the help of an extension and two partnership agreements. To meet the demand for semiconductors in the United States, it invested $800 million to triple production in Oregon. In December 2023, it was decided to open a design center in Cambridge to facilitate innovation and gain access to engineering talent. By April 2024, Microchip was able to improve its supply chain through a strategic alliance with TSMC in Japan, allowing for additional capacity, geographical diversity, and semiconductor manufacturing that is more resilient.

Key Players

Major players in the global new packages and materials for power devices market are Infineon Technologies AG, STMicroelectronics, ROHM Semiconductor, Texas Instruments, Mitsubishi Electric Corporation, NXP Semiconductors, Analog Devices, ON Semiconductor, Microchip Technology Inc., and Wolfspeed.

Report Attribute Details

• Market Size 2023: USD 2,500 Million
• Market Size 2032: USD 5,928.7 Million
• CAGR (2024-2032): 9.44%
• Base Year: 2023
• Market Forecast Period: 2024-2032

Industry Segmentations

• By Product Type: Chip-On-Board (COB) - 9.66%, Wire Bonding Packaging - 8.56%.
• By Application: Automotive - 8.49%, Consumer Electronics - 10.18%.

Regional Analysis

The North American market is growing gradually, and this movement is led by the demand of the automotive, consumer electronics, and industrial sectors, along with the investments in R&D and advanced packaging technologies. The North American market was valued at USD 469.17 million in the U.S. and USD 32.08 million in Canada in 2023, driven by innovation in automotive and electronics.

The European region is seeing a market mainly based on sustainability and energy efficiency targets, which are the focus of demand, particularly in the areas of automotive and industrial automation. The industry leaders in this sector, namely STMicroelectronics, Infineon Technologies, and NXP Semiconductors, are providing custom-made solutions to match the changing requirements in this area. Germany (USD 125.73 million), France (USD 88.40 million), and the UK (USD 92.94 million) anchored Europe's market, reflecting its strong industrial and sustainability focus.

The Asia-Pacific region has a robust semiconductor ecosystem that has allowed the region to become a global leader in the manufacture and use of EVs (Electric Vehicles), and the region has also invested very heavily in telecom and the renewable energy sector. With China at USD 738.29 million, Japan at USD 104.37 million, and India at USD 29.20 million, Asia-Pacific stood out as the fastest-expanding hub for new materials and packaging.

The Middle East & Africa is the fastest-growing regional market, expanding from USD 126.00 million in 2023 to USD 314.81 million by 2032, at a CAGR of 10.08%. Infineon Technologies and ON Semiconductor are among the leading companies strengthening their presence, addressing requirements across the oil & gas, telecom, and defense sectors. This positions the region as a high-potential frontier for advanced power solutions.

South America's market is focusing on infrastructure development, renewable energy adoption, and telecom expansion, which are creating consistent demand for efficient power devices. ON Semiconductor and STMicroelectronics are leading efforts to expand through strategic partnerships and localized solutions. With steady investments, the region is expected to play a greater role in the global market.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

• 2.1 DEFINITION
• 2.2 SCOPE OF THE STUDY
• 2.3 RESEARCH OBJECTIVE
• 2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

• 3.1 OVERVIEW
• 3.2 DATA FLOW
  • 3.2.1 DATA MINING PROCESS
• 3.3 PURCHASED DATABASE:
• 3.4 SECONDARY SOURCES:
  • 3.4.1 SECONDARY RESEARCH DATA FLOW:
• 3.5 PRIMARY RESEARCH:
  • 3.5.1 PRIMARY RESEARCH DATA FLOW:
  • 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
  • 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
• 3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
  • 3.6.1 REVENUE ANALYSIS APPROACH
• 3.7 DATA FORECASTING
  • 3.7.1 DATA FORECASTING TECHNIQUE
• 3.8 DATA MODELING
  • 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
  • 3.8.2 DATA MODELING:
• 3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

• 4.1 INTRODUCTION
• 4.2 DRIVERS
  • 4.2.1 DEMAND OF BETTER EFFICIENCY AND SPEED
  • 4.2.2 COLLABORATION AND PARTNERSHIPS AMONG PLAYERS
• 4.3 RESTRAINTS
  • 4.3.1 INTEGRATION OF NEW MATERIAL AND PACKAGES INTO POWER DEVICES
• 4.4 OPPORTUNITIES
  • 4.4.1 RISING DEMAND OF SUSTAINABLE AND SCALABLE POWER PRODUCTS

5 MARKET FACTOR ANALYSIS

• 5.1 SUPPLY CHAIN ANALYSIS
  • 5.1.1 RAW MATERIAL SOURCING
  • 5.1.2 MANUFACTURING
  • 5.1.3 ASSEMBLY AND TESTING
  • 5.1.4 PACKAGING AND DISTRIBUTION
• 5.2 PORTER FIVE FORCES
  • 5.2.1 BARGAINING POWER OF SUPPLIERS
  • 5.2.2 BARGAINING POWER OF BUYERS
  • 5.2.3 THREAT OF NEW ENTRANTS
  • 5.2.4 THREAT OF SUBSTITUTES
  • 5.2.5 INTENSITY OF RIVALRY
• 5.3 IMPACT OF CORONAVIRUS OUTBREAK ON THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• 5.4 PRICING ANALYSIS OF THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET

6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE

• 6.1 INTRODUCTION
• 6.2 CHIP-ON-BOARD (COB)
• 6.3 WIRE BONDING PACKAGING
• 6.4 GALLIUM ARSENIDE (GAAS)
• 6.5 GALLIUM NITRIDE (GAN)
• 6.6 SILICON CARBIDE (SIC)
• 6.7 OTHER PACKAGES/ MATERIALS

7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION

• 7.1 INTRODUCTION
• 7.2 AUTOMOTIVE
• 7.3 CONSUMER ELECTRONICS
• 7.4 INDUSTRIAL
• 7.5 IT AND TELECOMMUNICATIONS
• 7.6 MILITARY & AEROSPACE
• 7.7 OTHER APPLICATIONS

8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY REGION

• 8.1 OVERVIEW
• 8.2 NORTH AMERICA
  • 8.2.1 U.S
  • 8.2.2 CANADA
• 8.3 EUROPE
  • 8.3.1 GERMANY
  • 8.3.2 U.K.
  • 8.3.3 FRANCE
  • 8.3.4 RUSSIA
  • 8.3.5 SPAIN
  • 8.3.6 NETHERLANDS
  • 8.3.7 REST OF EUROPE
• 8.4 ASIA-PACIFIC
  • 8.4.1 CHINA
  • 8.4.2 JAPAN
  • 8.4.3 INDIA
  • 8.4.4 SOUTH KOREA
  • 8.4.5 SINGAPORE
  • 8.4.6 AUSTRALIA AND NEW ZEALAND
  • 8.4.7 REST OF ASIA-PACIFIC
• 8.5 MIDDLE EAST AND AFRICA
  • 8.5.1 SOUTH AFRICA
  • 8.5.2 GCC COUNTRIES
  • 8.5.3 TURKEY
  • 8.5.4 ISRAEL
  • 8.5.5 REST OF MIDDLE EAST & AFRICA
• 8.6 LATIN AMERICA
  • 8.6.1 BRAZIL
  • 8.6.2 MEXICO
  • 8.6.3 ARGENTINA
  • 8.6.4 REST OF LATIN AMERICA

9 COMPETITIVE LANDSCAPE

• 9.1 MARKET SHARE ANALYSIS
• 9.2 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
• 9.3 COMPETITOR DASHBOARD
• 9.4 KEY DEVELOPMENTS

10 COMPANY PROFILES

• 10.1 INFINEON TECHNOLOGIES
  • 10.1.1 COMPANY OVERVIEW
  • 10.1.2 FINANCIAL OVERVIEW
  • 10.1.3 PRODUCTS OFFERED
  • 10.1.4 KEY DEVELOPMENTS
  • 10.1.5 SWOT ANALYSIS
  • 10.1.6 KEY STRATEGY
• 10.2 STMICROELECTRONICS
  • 10.2.1 COMPANY OVERVIEW
  • 10.2.2 FINANCIAL OVERVIEW
  • 10.2.3 PRODUCTS OFFERED
  • 10.2.4 KEY DEVELOPMENTS
  • 10.2.5 SWOT ANALYSIS
  • 10.2.6 KEY STRATEGY
• 10.3 TEXAS INSTRUMENTS
  • 10.3.1 COMPANY OVERVIEW
  • 10.3.2 FINANCIAL OVERVIEW
  • 10.3.3 PRODUCTS OFFERED
  • 10.3.4 KEY DEVELOPMENTS
  • 10.3.5 SWOT ANALYSIS
  • 10.3.6 KEY STRATEGY
• 10.4 MITSUBISHI ELECTRIC CORPORATION
  • 10.4.1 COMPANY OVERVIEW
  • 10.4.2 FINANCIAL OVERVIEW
  • 10.4.3 PRODUCTS OFFERED
  • 10.4.4 KEY DEVELOPMENTS
  • 10.4.5 SWOT ANALYSIS
  • 10.4.6 KEY STRATEGY
• 10.5 ROHM SEMICONDUCTOR
  • 10.5.1 COMPANY OVERVIEW
  • 10.5.2 FINANCIAL OVERVIEW
  • 10.5.3 PRODUCTS OFFERED
  • 10.5.4 KEY DEVELOPMENTS
  • 10.5.5 SWOT ANALYSIS
  • 10.5.6 KEY STRATEGY
• 10.6 NXP SEMICONDUCTORS N.V.
  • 10.6.1 COMPANY OVERVIEW
  • 10.6.2 FINANCIAL OVERVIEW
  • 10.6.3 PRODUCTS OFFERED
  • 10.6.4 KEY DEVELOPMENTS
  • 10.6.5 SWOT ANALYSIS
  • 10.6.6 KEY STRATEGY
• 10.7 ANALOG DEVICES
  • 10.7.1 COMPANY OVERVIEW
  • 10.7.2 FINANCIAL OVERVIEW
  • 10.7.3 PRODUCTS OFFERED
  • 10.7.4 KEY DEVELOPMENTS
  • 10.7.5 SWOT ANALYSIS
  • 10.7.6 KEY STRATEGY
• 10.8 ON SEMICONDUCTORS
  • 10.8.1 COMPANY OVERVIEW
  • 10.8.2 FINANCIAL OVERVIEW
  • 10.8.3 PRODUCTS OFFERED
  • 10.8.4 KEY DEVELOPMENTS
  • 10.8.5 SWOT ANALYSIS
  • 10.8.6 KEY STRATEGY
• 10.9 MICROCHIP TECHNOLOGY
  • 10.9.1 COMPANY OVERVIEW
  • 10.9.2 FINANCIAL OVERVIEW
  • 10.9.3 PRODUCTS OFFERED
  • 10.9.4 KEY DEVELOPMENTS
  • 10.9.5 SWOT ANALYSIS
  • 10.9.6 KEY STRATEGY
• 10.10 WOLFSPEED, INC.
  • 10.10.1 COMPANY OVERVIEW
  • 10.10.2 FINANCIAL OVERVIEW
  • 10.10.3 PRODUCTS OFFERED
  • 10.10.4 KEY DEVELOPMENTS
  • 10.10.5 SWOT ANALYSIS
  • 10.10.6 KEY STRATEGY
• 10.11 DATA CITATIONS

LIST OF TABLES

• TABLE 1 QFD MODELING FOR MARKET SHARE ASSESSMENT
• TABLE 2 PRICING ANALYSIS
• TABLE 3 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 4 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CHIP-ON-BOARD (COB), BY REGION, 2018-2032 (USD MILLION)
• TABLE 5 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR WIRE BONDING PACKAGING, BY REGION, 2018-2032 (USD MILLION)
• TABLE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM ARSENIDE (GAAS), BY REGION, 2018-2032 (USD MILLION)
• TABLE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR GALLIUM NITRIDE (GAN), BY REGION, 2018-2032 (USD MILLION)
• TABLE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR SILICON CARBIDE (SIC), BY REGION, 2018-2032 (USD MILLION)
• TABLE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER PACKAGES/ MATERIALS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 11 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR AUTOMOTIVE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 12 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 13 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR INDUSTRIAL, BY REGION, 2018-2032 (USD MILLION)
• TABLE 14 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR IT AND TELECOMMUNICATIONS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 15 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR MILITARY & AEROSPACE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 16 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, FOR OTHER APPLICATIONS, BY REGION, 2018-2032 (USD MILLION)
• TABLE 17 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2018-2032 (USD MILLION)
• TABLE 18 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 19 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 20 NORTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 21 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 22 U.S.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 23 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 24 CANADA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 25 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 26 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 27 EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 28 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 29 GERMANY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 30 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 31 U.K.: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 32 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 33 FRANCE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 34 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 35 RUSSIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 36 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 37 SPAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 38 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 39 NETHERLANDS: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 40 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 41 REST OF EUROPE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 42 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 43 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 44 ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 45 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 46 CHINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 47 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 48 JAPAN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 49 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 50 INDIA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 51 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 52 SOUTH KOREA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 53 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 54 SINGAPORE: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 55 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 56 AUSTRALIA AND NEW ZEALAND: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 57 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 58 REST OF ASIA-PACIFIC: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 59 MEA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 60 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 61 MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 62 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 63 SOUTH AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 64 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 65 GCC COUNTRIES: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 66 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 67 TURKEY: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 68 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 69 ISRAEL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 70 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 71 REST OF MIDDLE EAST & AFRICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 72 SOUTH AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY COUNTRY, 2018-2032 (USD MILLION)
• TABLE 73 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 74 LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 75 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 76 BRAZIL: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 77 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 78 MEXICO: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 79 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 80 ARGENTINA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 81 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY PRODUCT TYPE, 2018-2032 (USD MILLION)
• TABLE 82 REST OF LATIN AMERICA: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY APPLICATION, 2018-2032 (USD MILLION)
• TABLE 83 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
• TABLE 84 KEY DEVELOPMENTS
• TABLE 85 INFINEON TECHNOLOGIES: PRODUCTS OFFERED
• TABLE 86 INFINEON TECHNOLOGIES: KEY DEVELOPMENTS
• TABLE 87 STMICROELECTRONICS: PRODUCTS OFFERED
• TABLE 88 STMICROELECTRONICS: KEY DEVELOPMENTS
• TABLE 89 TEXAS INSTRUMENTS: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 90 TEXAS INSTRUMENTS: KEY DEVELOPMENTS
• TABLE 91 MITSUBISHI ELECTRIC CORPORATION: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 92 MITSUBISHI ELECTRIC CORPORATION: KEY DEVELOPMENTS
• TABLE 93 ROHM SEMICONDUCTOR: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 94 ROHM SEMICONDUCTOR: KEY DEVELOPMENTS
• TABLE 95 NXP SEMICONDUCTORS N.V.: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 96 NXP SEMICONDUCTORS N.V.: KEY DEVELOPMENTS
• TABLE 97 ANALOG DEVICES: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 98 ON SEMICONDUCTORS: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 99 ON SEMICONDUCTORS: KEY DEVELOPMENTS
• TABLE 100 MICROCHIP TECHNOLOGY: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 101 MICROCHIP TECHNOLOGY: KEY DEVELOPMENTS
• TABLE 102 WOLFSPEED, INC.: PRODUCTS OFFERED AND MATERIAL USED
• TABLE 103 WOLFSPEED, INC.: KEY DEVELOPMENTS

LIST OF FIGURES

• FIGURE 1 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: STRUCTURE
• FIGURE 2 GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET: MARKET GROWTH FACTOR ANALYSIS (2023-2032)
• FIGURE 3 OPPORTUNITY IMPACT FORECAST
• FIGURE 4 SUPPLY CHAIN: NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 5 PORTER'S FIVE FORCES MODEL: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, SEGMENT ATTRACTIVENESS ANALYSIS
• FIGURE 7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE, 2023 (VALUE % SHARE)
• FIGURE 8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, SEGMENT ATTRACTIVENESS ANALYSIS
• FIGURE 9 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION, 2023 (VALUE % SHARE)
• FIGURE 10 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET VALUE, BY REGION, 2023 (VALUE % SHARE)
• FIGURE 11 NORTH AMERICA: SWOT ANALYSIS
• FIGURE 12 EUROPE: SWOT ANALYSIS
• FIGURE 13 ASIA-PACIFIC: SWOT ANALYSIS
• FIGURE 14 MEA: SWOT ANALYSIS
• FIGURE 15 LATIN AMERICA: SWOT ANALYSIS
• FIGURE 16 MARKET SHARE ANALYSIS,
• FIGURE 17 COMPETITOR DASHBOARD: GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
• FIGURE 18 INFINEON TECHNOLOGIES: SWOT ANALYSIS
• FIGURE 19 STMICROELECTRONICS: SWOT ANALYSIS
• FIGURE 20 TEXAS INSTRUMENTS: SWOT ANALYSIS
• FIGURE 21 MITSUBISHI ELECTRIC CORPORATION: SWOT ANALYSIS
• FIGURE 22 ROHM SEMICONDUCTOR: SWOT ANALYSIS
• FIGURE 23 NXP SEMICONDUCTORS N.V.: SWOT ANALYSIS
• FIGURE 24 ANALOG DEVICES: SWOT ANALYSIS
• FIGURE 25 ON SEMICONDUCTORS: SWOT ANALYSIS
• FIGURE 26 MICROCHIP TECHNOLOGY: SWOT ANALYSIS
• FIGURE 27 WOLFSPEED, INC.: SWOT ANALYSIS