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1417364

無線連接晶片組市場報告：2030 年趨勢、預測與競爭分析

Wireless Connectivity Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

無線連接晶片組趨勢和預測

到 2030 年，全球無線連接晶片組市場預計將達到 128 億美元，2024 年至 2030 年複合年成長率為 7.8%。該市場的主要促進因素是高速網際網路的普及、汽車行業不斷成長的連接需求以及由於無線網路技術的進步而導致的智慧家庭自動化的日益普及。全球無線連接晶片組市場的未來前景廣闊，為消費者、企業、行動電話、汽車和工業市場帶來機會。

無線連接晶片組市場洞察

Lucintel 預測，在預測期內，獨立 Wi-Fi 仍將是最大的市場區隔。各個行業都在走向數位化，擴大採用數位技術來保持競爭力、提高生產力並提供卓越的客戶體驗。

由於網路服務需求不斷成長、5G智慧型手機的可用性和成本不斷上升，以及智慧型手機在該地區都市區和農村地區的快速普及，預計亞太地區在預測期內將經歷最高的成長。

常問問題

Q.1 無線連接晶片組的市場規模有多大？

A1. 到 2030 年，全球無線連接晶片組市場預計將達到 128 億美元。

Q.2 無線連接晶片組市場的成長預測是什麼？

A2. 2024年至2030年，全球無線連接晶片組市場預計將以7.8%的複合年成長率成長。

Q.3 影響無線連接晶片組市場成長的關鍵因素有哪些？

A3. 該市場的主要促進因素是高速網際網路的日益普及、汽車行業對連接的需求不斷增加以及由於無線網路技術的進步而導致的智慧家庭自動化的日益普及。

Q4.市場的主要細分市場是什麼？

A4. 全球無線連接晶片組市場前景廣闊，為消費者、企業、行動電話、汽車和工業市場帶來機會。

Q5.市場上主要企業有哪些？

A5. 一些主要的無線連接晶片公司是：

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計 Wi-Fi 獨立設備在預測期間內仍將是最大的細分市場。各個行業都在走向數位化，擴大採用數位技術來保持競爭力、提高生產力並提供卓越的客戶體驗。

Q7. 預計未來五年哪個地區將成為最大的市場？

A7. 由於網路服務需求不斷成長、5G 智慧型手機的可用性和成本不斷上升，以及智慧型手機在該地區都市區和農村地區的快速普及，預計亞太地區將經歷最高的成長。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章全球無線連接晶片組市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球無線連接晶片組市場趨勢（2018-2023）與預測（2024-2030）
  • 按類型分類的全球無線連接晶片組市場
    • 獨立 Wi-Fi
    • 藍牙獨立
    • Wi-Fi 與藍牙組合
    • 低功耗無線IC
  • 全球無線連接晶片組市場（依最終用途）
    • 消費者
    • 公司
    • 行動電話
    • 車
    • 工業的
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 全球無線連接晶片組市場（按地區）
  • 北美無線連接晶片組市場
  • 歐洲無線連接晶片組市場
  • 亞太無線連接晶片組市場
  • 其他地區的無線連接晶片組市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按類型分類的全球無線連接晶片組市場成長機會
    • 全球無線連接晶片組市場成長機會（依最終用途）
    • 全球無線連接晶片組市場成長機會（按地區）
  • 全球無線連接晶片組市場的新興趨勢
  • 戰略分析
    • 新產品開發
    • 全球無線連接晶片組市場產能擴張
    • 全球無線連接晶片組市場的合併、收購和合資企業
    • 認證和許可

第7章主要企業概況

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology
簡介目錄

Wireless Connectivity Chipset Trends and Forecast

The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets. The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030 with a CAGR of 7.8% from 2024 to 2030. The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

A more than 150-page report is developed to help in your business decisions.

Wireless Connectivity Chipset by Segment

The study includes a forecast for the global wireless connectivity chipset by type, end use, and region.

Wireless Connectivity Chipset Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Wi-Fi Standalone
  • Bluetooth Standalone
  • Wi-Fi and Bluetooth Combo
  • Low-Power Wireless Ic

Wireless Connectivity Chipset Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer
  • Enterprise
  • Mobile Handsets
  • Automotive
  • Industrial
  • Others

Wireless Connectivity Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Wireless Connectivity Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies wireless connectivity chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the wireless connectivity chipset companies profiled in this report include-

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Wireless Connectivity Chipset Market Insights

Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Features of the Global Wireless Connectivity Chipset Market

Market Size Estimates: Wireless connectivity chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Wireless connectivity chipset market size by type, end use, and region in terms of value ($B).

Regional Analysis: Wireless connectivity chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, end use, and regions for the wireless connectivity chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the wireless connectivity chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the wireless connectivity chipset market size?

Answer: The global wireless connectivity chipset market is expected to reach an estimated $12.8 billion by 2030.

Q.2 What is the growth forecast for wireless connectivity chipset market?

Answer: The global wireless connectivity chipset market is expected to grow with a CAGR of 7.8% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the wireless connectivity chipset market?

Answer: The major drivers for this market are growing penetration of high-speed internet, increasing demands for connectivity in the automobile industry and the growing popularity of smart home automation, along with the advancement of wireless network technologies.

Q4. What are the major segments for wireless connectivity chipset market?

Answer: The future of the global wireless connectivity chipset market looks promising with opportunities in the consumer, enterprise, mobile handsets, automotive, and industrial markets.

Q5. Who are the key wireless connectivity chipset market companies?

Answer: Some of the key wireless connectivity chipset companies are as follows.

  • Broadcom
  • Qualcomm Incorporated
  • Mediatek
  • Intel Corporation
  • Texas Instruments Incorporated
  • STMicroelectronics
  • NXP Semiconductors
  • On Semiconductor Corporation
  • Infineon Technologies
  • Microchip Technology

Q6. Which wireless connectivity chipset market segment will be the largest in future?

Answer: Lucintel forecasts that Wi-Fi standalone will remain the largest segment over the forecast period growing digitalization across various industries, as well as, growing adoption of digital technology in order to maintain competitiveness, boost productivity, and provide superior customer experiences.

Q7. In wireless connectivity chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because of growing demand for internet services, rising 5G smartphone availability and cost, as well as the quick uptake of smartphones in both urban and rural locations in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the wireless connectivity chipset market by type (Wi-Fi standalone, bluetooth standalone, Wi-Fi and bluetooth combo, low-power wireless IC), end use (consumer, enterprise, mobile handsets, automotive, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Wireless Connectivity Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Wireless Connectivity Chipset Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Wireless Connectivity Chipset Market by Type
    • 3.3.1: Wi-Fi Standalone
    • 3.3.2: Bluetooth Standalone
    • 3.3.3: Wi-Fi and Bluetooth Combo
    • 3.3.4: Low-power Wireless IC
  • 3.4: Global Wireless Connectivity Chipset Market by End Use
    • 3.4.1: Consumer
    • 3.4.2: Enterprise
    • 3.4.3: Mobile Handsets
    • 3.4.4: Automotive
    • 3.4.5: Industrial
    • 3.4.6: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Wireless Connectivity Chipset Market by Region
  • 4.2: North American Wireless Connectivity Chipset Market
    • 4.2.2: North American Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.3: European Wireless Connectivity Chipset Market
    • 4.3.1: European Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.3.2: European Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.4: APAC Wireless Connectivity Chipset Market
    • 4.4.1: APAC Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.4.2: APAC Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others
  • 4.5: ROW Wireless Connectivity Chipset Market
    • 4.5.1: ROW Wireless Connectivity Chipset Market by Type: Wi-Fi Standalone, Bluetooth Standalone, Wi-Fi and Bluetooth Combo, and Low-power Wireless IC
    • 4.5.2: ROW Wireless Connectivity Chipset Market by End Use: Consumer, Enterprise, Mobile Handsets, Automotive, Industrial, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Type
    • 6.1.2: Growth Opportunities for the Global Wireless Connectivity Chipset Market by End Use
    • 6.1.3: Growth Opportunities for the Global Wireless Connectivity Chipset Market by Region
  • 6.2: Emerging Trends in the Global Wireless Connectivity Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Wireless Connectivity Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Wireless Connectivity Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Qualcomm Incorporated
  • 7.3: Mediatek
  • 7.4: Intel Corporation
  • 7.5: Texas Instruments Incorporated
  • 7.6: STMicroelectronics
  • 7.7: NXP Semiconductors
  • 7.8: On Semiconductor Corporation
  • 7.9: Infineon Technologies
  • 7.10: Microchip Technology