無線連線的市場資料概要:2025年第3季

Wireless Connectivity Market Data Overview: 3Q 2025

出版日期: 2025年07月09日 | 出版商:

ABI Research | 英文 29 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

本報告深入研究無線連接市場，提供無線設備和晶片組市場規模趨勢和預測訊息，以及晶片組供應商的市場佔有率。

實際優勢：

識別並更好地鎖定 Wi-Fi、藍牙、UWB、NFC、GNSS、802.15.4 和 Z-Wave 等細分市場中最大的成長機會。
根據預期的市場滲透率，為無線產品製定最佳路線圖和產品時間表。
識別 WiGig 和 HaLow 晶片組及設備的最大發展機會，了解銷售和行銷資源的分配方向，建立更具可擴展性的部署，並幫助證明技術投資的合理性。
識別現有無線產品線和晶片組組合中的潛在差距以及更廣泛的競爭格局，以規劃未來的技術部署。
了解消費性電子和物聯網應用從舊版 Wi-Fi 和藍牙技術遷移到 Wi-Fi 6 和 BLE 的時間表，從而有效地規劃新晶片組和產品的推出。
了解晶片組供應商格局，以協助建立關鍵合作夥伴關係並識別競爭威脅。

回答關鍵問題：

無線設備和晶片組的當前和未來五年市場規模是多少？
UWB 的短期和長期機會是什麼？
Wi-Fi 6 在各終端市場的採用速度有多快？
60GHz WiGig 有哪些機會？
Wi-Fi HaLow 有未來嗎？
哪種 Wi-Fi 技術最適合物聯網應用？
未來 Wi-Fi AP 和設備將採用哪些 MIMO 配置？
各終端市場的連線格局如何？
領先的無線晶片組供應商有哪些？
無線科技的新成長機會在哪裡？

調查亮點:

市場數據和預測：Wi-Fi、WiGig、HaLow、藍牙、UWB、NFC、NFC 標籤、GNSS、802.15.4 和 Z-Wave 設備（按行業）
MIMO 配置（2x2、4x4、8x8 等）預測：依產業
Wi-Fi 晶片組協定（例如 802.11n、802.11ac、802.11ax、802.11ad、802.11ay、802.11ah）預測：依產業
獨立式、組合式（例如藍牙和 Wi-Fi）和整合平台（無線 + 蜂窩）晶片組預測
以無線技術劃分的晶片組供應商佔有率（季度）

Actionable Benefits:

Identify and better target the largest growth opportunities for Wi-Fi, Bluetooth, Ultra-wideband, NFC, GNSS, 802.15.4 and Z-Wave by market segment.
Prepare optimal roadmap and product timelines for wireless products based on projected market penetration.
Identify largest opportunities for WiGig and HaLow chipsets and devices. Understand where sales and marketing resources should be devoted to help build more scalable deployments and justify technology investment.
Identify potential gaps in existing wireless portfolios and chipset combinations, the wider wireless competitive landscape, and plan for future technology rollouts.
Understand the timeline for the transition from legacy Wi-Fi and Bluetooth technologies towards Wi-Fi 6 and BLE in both consumer and IoT applications, and be able to effectively plan for the introduction of new chipsets and products accordingly.
Understand chipset vendor landscape to help form critical partnerships and understand competitive threats.

Critical Questions Answered:

What is the total market size for wireless devices and chipsets today and over the next 5 years?
What are the opportunities for Ultra-wideband in the short and longer term?
How rapid will adoption of Wi-Fi 6 be across different end markets?
What opportunities will 60GHz WiGig have?
Is there a future for Wi-Fi HaLow?
What Wi-Fi technology is best suited to IoT applications?
What MIMO configurations will Wi-Fi APs and devices leverage going forward?
What is the connectivity landscape across different end markets?
Who are the leading wireless chipset vendors?
Where are the new growth opportunities for wireless technologies to be found?

Research Highlights:

Market data and forecasts for Wi-Fi, WiGig, HaLow, Bluetooth, Ultra-wideband, NFC, NFC Tags, GNSS, 802.15.4 and Z-Wave devices by vertical market.
Forecasts for MIMO configurations (e.g. 2x2, 4x4, 8x8) by vertical market.
Forecasts for Wi-Fi chipsets by protocol (e.g. 802.11n, 802.11ac, 802.11ax, 802.11ad, 802.11ay, 802.11ah) by vertical market.
Forecasts for standalone, combo (e.g. Bluetooth and Wi-Fi) and integrated platform (wireless + cellular) chipsets.
Quarterly chipset vendor shares by wireless technology.

Who Should Read This?

Wireless chipset and module vendors (marketing, product managers, sales).
OEMs across numerous sectors, including smart home, IoT, consumer electronics, networking (product designers and decision makers).
Connectivity IP providers (marketing and product managers).
Connectivity consortiums and members, e.g. Wi-Fi Alliance, Bluetooth SIG, ZigBee Alliance, UWB Alliance, FiRa Consortium.

This product is meant to be read in conjunction with Wireless Connectivity Technology Segmentation and Addressable Markets MD-WCMT-198 Wi-Fi Market Update MD-WMT-106 and Bluetooth Market Update MD-BMT-106

Key Findings

Whats New

Methodology

Definitions

Significant Forecasts

Wireless Connectivity Market Overview

Bluetoothreg Market Update

UWB Market Update

Wi-Fi Market Update

IEEE 802154 Market Update

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