AI資料中心光連接模組市場規模、佔有率和成長預測（2026-2032年）

2026年人工智慧資料中心光連接模組市場規模估計為145億美元，預計到2032年將達到458億美元。這意味著從2026年到2032年，複合年成長率將達到21.1%。

光連接已成為擴展人工智慧叢集的主要物理限制之一。加速器透過網路交換梯度、參數、啟動值、查核點資料和推理流量，網路必須在保證可預測延遲的同時維持高吞吐量。隨著加速器數量的增加，連接到每個交換器的總頻寬成長速度超過了傳統電通道在電路板、機架和建築物上的擴展速度。因此，光纖正逐漸接近運算資源，連結速度從 400G 和 800G 提升至 1.6T 甚至 3.2T。這導致了針對距離、功耗、可維護性和頻寬密度進行最佳化的分層互連產品套件的出現，而不是單一的光架構。到 2026 年，由於可插拔收發器具有現場可更換、多供應商採購和成熟的操作實踐等優勢，它們仍將是市場的核心。思科截至 2026 年 2 月的產品系列清晰地展現了這一轉變。 1.6T OSFP光學模組主要用於交換器和網路卡之間以及交換器和伺服器之間的連結。 800G 線性可插拔光模組旨在降低 AI 橫向擴展架構中的功耗。 Lumentum 已將 1.6T 2xDR4 OSFP 模組商業化，傳輸距離可達 500 公尺。 Marvell 的 Ara 和 Nova 平台支援跨乙太網路和 InfiniBand 架構的 1.6T 模組生態系統。市場也不斷擴展，不再局限於典型的建築內可插拔模組。連貫相干架構支援連接大規模AI 園區內建築物的 2 至 20 公里連結。這在短距離 PAM4 模組和傳統連貫資料中心互連之間形成了一種中間層級的產品。 Ciena 和 Marvell 都在開發這一層級的產品，並專注於 800G 和 1.6T 技術。對於更遠距離的連接，800G 和 1.6T 相干連貫正擴大用於連接多個 AI 站點，建構單一的分散式運算環境。光纖傳輸距離的擴大降低了每個傳輸位元的成本，同時提高了每個人工智慧園區的光纖傳輸容量。

市場促進因素

• 人工智慧（AI）網路架構正從800G向1.6T和3.2T過渡。 AI橫向擴展網路正面臨頻寬的重大轉變。博通（Broadcom）的400G/通道「Taurus」光DSP旨在支援1.6T插件模組，同時為未來的3.2T模組建立實體層。 Marvell也進行類似的升級，從200G/通道的1.6T產品擴展到400G/通道的技術。連貫）已成功展示了一種使用八條425G PAM4光通道的3.2T插件架構。頻寬的提升將透過引入新一代模組、更高密度的交換器配置以及替換低速鏈路，推動光纖通訊產業的收入成長。由於半導體整合和製造良率的提高，每位元成本正在逐步降低。
• 光鏈路正在擴展到橫向擴展網路和園區網路。橫向擴展乙太網路和InfiniBand仍然是光鏈路應用最廣泛的領域。人工智慧架構正在將光連接擴展到新的應用場景。隨著緊密耦合加速器域跨越更多機架且通道速度不斷提升，使用銅纜變得越來越困難。大規模人工智慧園區需要在建築物之間建立高容量鏈路，但對於典型的短距離直讀光學模組而言，傳輸距離過長，而它們不一定需要城域級連貫系統。連貫光和新興的近封裝光技術透過將光纖引入人工智慧網路的短距離和長距離鏈路，正在擴大目標市場。
• 每位元功耗是推動新型可插拔架構發展的關鍵因素。網路功耗正成為一個至關重要的經濟因素，因為收發器和交換基礎設施消耗的每一瓦功率都會減少分配給加速器的設施電力。思科表示，其 800G LPO 架構與重定光學模組相比，可將光學模組功耗降低 50%。 Marvell 的傳送端重定時方法可透過消除部分接收端 DSP 功能來降低模組功耗。這些架構不會在所有應用中取代支援重定時的可插拔模組，因為鏈路裕量、診斷和互通性仍然非常重要。然而，在電信業者優先考慮電源效率的領域，它們正在創造新的收入來源。
• 隨著人工智慧光纖通訊的需求日益成長，製造能力也不斷擴大。光纖通訊供應鏈也在擴展，以適應更大規模的人工智慧部署。英偉達和康寧於2026年5月宣布了一項多年合作計劃，根據該計劃，康寧計劃將其在美國的光連接設備製造能力提高十倍，光纖產能提高50%以上。組件和模組供應商也正在提高其在雷射器、光子裝置、封裝和收發器組裝的產能。這些投資將提高超大規模部署的供應穩定性，並消除阻礙向上一代光纖通訊快速過渡的關鍵限制因素之一。

市場限制因素

• 產品快速的世代更迭帶來了技術和商業性風險。電信業者必須在各種交換器ASIC、網路卡、光纖網路和散熱環境下對800G、1.6T以及即將推出的3.2T模組進行認證，同時也要維持多廠商互通性。此外，更高速度的光學模組可能會導致更嚴格的鏈路預算、散熱限制和更嚴格的連接器清潔度要求。隨著每一代產品規模的擴大，平均售價都會下降，即使出貨頻寬成長更快，營收成長也將受到限制。第二個結構性挑戰是架構的多樣性。線性可插拔光學模組、共封裝光學模組和光I/O在特定連結類別中展開競爭。因此，供應商很難假設到2032年之前所有高速連接都將採用相同的模組架構。

目錄

第1章執行摘要

• 市場機會與主要發現
• 光連接模組遷移計劃
• 主要收入來源

第2章 市場概覽

• 人工智慧資料傳輸和網路頻寬要求
• 從 400G 和 800G 演進到 1.6T 和 3.2T
• 插入式、線性、連貫光學架構
• 透過向上擴展、向外擴展和橫向擴展實現連接

第3章 市場規模及預測（2026-2032 年）

• 全球市場銷售
• 年增率分析
• 按鏈路頻寬的收入
• 按網路角色分類的銷售額

第4章 市場：依互連產品分類

• 相容於重定時功能的插入式收發器
• 線性插入光學模組
• 發射和重定光學模組
• 主動光纜和專用短距離鏈路
• Coherent-Lite 插入光學模組
• 連貫資料中心互連模組

第5章 市場：依資料傳輸速度分類

• 400G
• 800G
• 1.6T
• 3.2噸或以上

第6章 市場：依網路角色分類

• AI橫向擴展網路
• 人工智慧規模化和網路化
• 校園/規模跨連接
• 資料中心之間的互連

第7章 市場：依覆蓋範圍分類

• 不到100米
• 100-500米
• 500公尺至2公里
• 2至20公里
• 超過20公里

第8章 市場：依客戶類型分類

• 超大規模雲端供應商
• Neocloud 和 GPU 雲端供應商
• 託管服務提供者
• 主權人工智慧基礎設施
• 企業和高效能運算

第9章：地方市場

• 北美洲
  • 美國
  • 加拿大
• 歐洲
• 亞太地區
• 中東和世界其他地區

第10章 市場動態

• 促進因素
  • 網路從 800G 遷移到 1.6T
  • 擴展和部署光纖通訊到校園網路
  • 降低每比特功耗
  • 人工智慧光學製造的擴展
• 抑制因子
  • 快速的世代更迭和合格風險
  • 降低每比特成本，對平均售價（ASP）構成壓力
  • 互通性和鏈路預算的複雜性
  • 因整合光學而引發的建築競賽

第11章 競爭格局

• 價值鏈
• 網路和交換平台
• 光DSP和半導體供應商
• 收發器和模組製造商
• 連貫和園區互連供應商
• 光纖、連接和製造生態系統

第12章：公司簡介

• Cisco
• NVIDIA
• Broadcom
• Marvell Technology
• Coherent
• Lumentum
• Ciena
• Arista Networks
• Innolight
• Eoptolink Technology
• Fabrinet
• Corning
• Intel
• TSMC
• Accelink Technologies

第13章 近期趨勢

第14章附錄

The AI Data Center Optical Interconnects Market is estimated at USD 14.5 billion in 2026 and is projected to reach USD 45.8 billion by 2032, representing a CAGR of 21.1% during 2026-2032.

Optical connectivity has become one of the main physical limits on AI cluster scale. Accelerators exchange gradients, parameters, activations, checkpoint data and inference traffic across networks that must preserve high throughput with predictable latency. As the number of accelerators increases, the aggregate bandwidth attached to each switch rises faster than conventional electrical channels can extend across boards, racks and buildings. Fiber therefore moves progressively closer to compute, while link speeds transition from 400G and 800G toward 1.6T and later 3.2T. The result is not a single optical architecture but a hierarchy of interconnect products optimized around distance, power, serviceability and bandwidth density. Pluggable transceivers remain the commercial center of the market in 2026 because they combine field replaceability, multi-vendor procurement and established operational practices. Cisco's February 2026 portfolio illustrates this transition. 1.6T OSFP optics are positioned for switch-to-network-interface-card and switch-to-server links. 800G Linear Pluggable Optics target lower power consumption in AI scale-out fabrics. Lumentum is commercializing 1.6T 2xDR4 OSFP modules with reaches up to 500 metres. Marvell's Ara and Nova platforms support 1.6T module ecosystems across Ethernet and InfiniBand architectures. The market is also extending beyond ordinary intra-building pluggables. Coherent-lite architectures address roughly 2 to 20 kilometre links between buildings on large AI campuses. This creates an intermediate class between short-reach PAM4 modules and conventional coherent data center interconnect. Ciena and Marvell are both developing this layer around 800G and 1.6T. Longer scale-across connections increasingly use 800G and 1.6T coherent pluggables to connect multiple AI sites as one distributed computing environment. This broadening of optical reach increases optical content per AI campus even as cost per transmitted bit declines.

Market Drivers

• AI fabrics are moving from 800G toward 1.6T and 3.2T. AI scale-out networks are entering a major bandwidth transition. Broadcom's 400G-per-lane Taurus optical DSP is designed to support 1.6T pluggables while establishing the physical layer for future 3.2T modules. Marvell is similarly extending from 200G-per-lane 1.6T products toward 400G-per-lane technologies. Coherent has demonstrated 3.2T pluggable architectures using eight 425G PAM4 optical lanes. Higher bandwidth increases optical revenue through new module generations, denser switch configurations and replacement of lower-speed links. Improving semiconductor integration and manufacturing yields gradually reduce cost per bit.
• Optical links are expanding into scale-up and campus networks. Scale-out Ethernet and InfiniBand remain the largest optical link domains. AI architectures are adding optical connectivity in new locations. Copper becomes increasingly difficult to use as tightly coupled accelerator domains span more racks and lane speeds rise. Large AI campuses require high-capacity links between buildings that are too long for ordinary short-reach direct-detect optics but do not always need metro-class coherent systems. Coherent-lite and emerging near-package optical approaches expand the addressable market by moving fiber into both shorter and longer portions of the AI network.
• Power per bit is driving new pluggable architectures. Networking power is becoming economically important because every watt consumed by transceivers and switching infrastructure reduces the facility power available for accelerators. Cisco states that its 800G LPO architecture can reduce optical-module power by 50% compared with retimed optics. Marvell's transmit-retimed approach removes selected receive-side DSP functions to lower module power. These architectures do not displace retimed pluggables in every application because link margin, diagnostics and interoperability still matter. They create an additional revenue pool where operators prioritize power efficiency.
• Manufacturing capacity is scaling with AI optical demand. Optical supply chains are expanding to support much larger AI deployments. NVIDIA and Corning announced a multiyear partnership in May 2026 under which Corning plans to increase U.S. optical-connectivity manufacturing capacity tenfold and fiber production capacity by more than 50%. Component and module suppliers are also adding capacity across lasers, photonic devices, packaging and transceiver assembly. These investments improve availability for hyperscale deployments and reduce one of the principal constraints that limited rapid transitions to earlier optical generations.

Market Restraints

• Rapid product transitions create both technical and commercial risk. Operators must qualify 800G, 1.6T and later 3.2T modules across different switch ASICs, network-interface cards, fiber plants and thermal environments while maintaining multi-vendor interoperability. Higher-speed optics can also introduce tighter link budgets, thermal constraints and connector-cleanliness requirements. Average selling prices decline as each generation scales, limiting revenue growth even when shipped bandwidth rises faster. A second structural challenge is architectural substitution. Linear pluggables, transmit-retimed optics, co-packaged optics and optical I/O compete for selected link classes. This makes it difficult for suppliers to assume that every high-speed connection will retain the same module architecture through 2032.

Technology and Segment Insights

• 800G represents the largest revenue pool in 2026 because it is widely deployed across current AI scale-out fabrics and is supported by a mature supplier ecosystem. 1.6T is the fastest-growing speed class through the first half of the forecast period. Cisco, Marvell, Broadcom, Coherent and Lumentum all have 1.6T product roadmaps or commercial products. 102.4-terabit-per-second switch platforms increase the number of 1.6T ports available per system. 3.2T remains an emerging category in 2026 but becomes increasingly relevant after 2028 as 400G-per-lane electrical and optical interfaces mature.
• AI scale-out remains the largest network role because every accelerator cluster requires high-bandwidth switch-to-switch and switch-to-network-interface connectivity. Scale-up optical interconnect is expected to record the fastest growth from a smaller base as tightly coupled compute domains extend beyond copper's practical reach. Scale-across connectivity also expands as operators distribute AI capacity across multiple campus buildings or separate sites. These links need coherent or coherent-lite connections that preserve bandwidth and operational simplicity.
• 800G pluggable optics form the largest speed class with strong growth. Their primary demand logic is current AI scale-out deployments and broad switch support. 1.6T pluggable optics are at early volume ramp with the fastest growth through 2030. Their primary demand logic is 102.4T switches and 200G-per-lane electrical interfaces. 3.2T optics are pre-commercial or demonstration stage with acceleration after 2028. Their primary demand logic is 400G-per-lane interfaces and 204.8T switching. Scale-out links form the largest network role with strong growth. Their primary demand logic is switch-to-switch and switch-to-network-interface accelerator fabrics. Scale-up optical links have a smaller 2026 base but are the fastest network role. Their primary demand logic is copper reach limitations across larger accelerator domains. Scale-across and data center interconnect form an established high-value niche with expanding growth. Their primary demand logic is campus and multi-site AI infrastructure.
• The market is segmented by interconnect product, data rate, network role, reach, customer type and geography. Interconnect products include retimed pluggable transceivers, linear pluggable optics, transmit-retimed optical modules, active optical cables and specialized short-reach links, coherent-lite pluggable optics, and coherent data center interconnect modules. Data rates include 400G, 800G, 1.6T, and 3.2T and higher. Network roles include AI scale-out networking, AI scale-up networking, campus and scale-across connectivity, and data center interconnect. Reach categories include under 100 metres, 100-500 metres, 500 metres to 2 kilometres, 2-20 kilometres, and above 20 kilometres. Customer types include hyperscale cloud providers, neocloud and GPU-cloud operators, colocation providers, sovereign AI infrastructure, and enterprise and high-performance computing.
• 800G remains the largest 2026 optical interconnect speed across AI scale-out networks. 1.6T modules are entering broad deployment as 102.4T switching platforms scale globally. 3.2T optical links move from demonstrations toward commercialization after 2028. Linear and transmit-retimed optics reduce module power across dense AI fabrics. Coherent-lite creates a new optical tier for two-to-twenty-kilometre campus links. Scale-out networking remains the largest revenue pool across accelerator clusters worldwide. Scale-up optical links grow fastest as copper reach shortens at higher speeds. North America leads demand through hyperscaler, neocloud and sovereign AI investment. Asian suppliers remain critical to transceiver assembly, lasers and module manufacturing capacity. Broadcom and Marvell are moving optical DSPs toward 400G-per-lane architectures. Cisco is commercializing 1.6T OSFP and lower-power 800G linear pluggable optics. NVIDIA Spectrum-X Photonics production signals deeper optical integration inside AI factories.

Competitive and Strategic Outlook

• Competition spans networking-system companies, optical-component specialists, photonic-device suppliers and module manufacturers. Cisco, NVIDIA and Broadcom influence optical architecture through switching platforms and tightly integrated AI networking systems. Marvell supplies optical DSPs, drivers, transimpedance amplifiers and coherent technology used by a broad module ecosystem. Coherent and Lumentum participate across lasers, photonic devices and complete datacom transceivers. Ciena has a strong position in coherent and scale-across connectivity. Arista Networks remains an important system-level buyer and integrator of pluggable optics across large Ethernet fabrics.
• Manufacturing and component depth also matter. Innolight and Eoptolink are major high-speed optical-module suppliers. Fabrinet provides advanced optical manufacturing services. Corning supplies fiber and high-density connectivity. Intel participates through silicon photonics and optical compute interconnect technology. TSMC is increasingly relevant through advanced photonics and packaging platforms that support integrated optics. Competitive advantage depends on power per bit, qualification with leading switch and accelerator platforms, manufacturing yield, thermal performance, module availability and the ability to support multiple architectural paths as retimed, linear, coherent-lite and integrated optics coexist.
• North America is the largest demand center for AI data center optical interconnects. The region contains the highest concentration of hyperscale cloud providers, neocloud operators, frontier-model developers and networking-platform suppliers. The United States is also where the transition to 1.6T is becoming commercially visible across multiple architectures. Cisco is introducing 1.6T OSFP modules and 800G LPO alongside its 102.4T switching systems. NVIDIA is ramping Spectrum-X Ethernet Photonics with Vera Rubin. Major optical suppliers including Coherent, Lumentum, Marvell and Broadcom are aligning new product generations with U.S.-led AI infrastructure deployments.
• Demand is broadening from links inside a single data hall to campus and multi-site connectivity. Large AI campuses increasingly comprise several buildings, creating a need for coherent-lite and high-density optical links across intermediate reaches. Distributed AI infrastructure and capacity constraints encourage scale-across networking between sites. This supports both short-reach PAM4 optics and higher-value coherent pluggables within the same customer base. The region therefore has unusually high optical content per deployed megawatt because AI clusters require dense east-west connectivity in addition to conventional front-end networking.
• Supply-chain localization is also becoming important. NVIDIA and Corning's 2026 agreement includes a tenfold expansion of U.S. optical-connectivity manufacturing capacity and more than 50% additional U.S. fiber-production capacity. This does not eliminate Asia's central role in module assembly and photonic-device manufacturing. It reduces regional supply risk for some hyperscale programs. Through 2032, North American market growth is expected to be led by 1.6T scale-out deployments, lower-power pluggable architectures, campus coherent-lite links and the gradual introduction of optical scale-up connectivity.
• Asia Pacific remains the principal manufacturing ecosystem for many transceivers, lasers, packaging operations and electronics assembly. China, Taiwan, Japan, Malaysia and other regional hubs contribute to global supply. Europe participates through optical equipment, coherent transport and sovereign or hyperscale data-center demand. The Middle East is becoming an important deployment region for large greenfield AI campuses. New facilities can adopt 1.6T and later optical architectures without a large installed base of older network equipment.
• Recent developments confirm accelerating market activity. In September 2026, Marvell demonstrated 2nm 400G-per-lane optical technology designed to enable 3.2T data-center connectivity. In September 2026, Coherent demonstrated a 3.2T OSFP-size transceiver architecture and a 6.4T near-packaged optical engine. In May 2026, NVIDIA announced Spectrum-X Ethernet Photonics had entered production with the Vera Rubin AI platform. In May 2026, NVIDIA and Corning announced a multiyear partnership targeting a tenfold increase in U.S. optical-connectivity manufacturing capacity. In March 2026, Lumentum demonstrated 1.6T DR4 optics using 400G electro-absorption-modulated lasers for next-generation AI data centers. In March 2026, Marvell expanded its 1.6T optical DSP portfolio for scale-out, front-end and campus AI connectivity. In March 2026, Broadcom introduced a 400G-per-lane optical DSP supporting 1.6T modules and future 3.2T transceivers. In February 2026, Cisco introduced 1.6T OSFP optics and 800G Linear Pluggable Optics for high-density AI scale-out networks.

Conclusion

• The AI data center optical interconnects market is growing rapidly as bandwidth demand and cluster scale outpace copper's practical reach. Growth is driven by the 800G-to-1.6T transition, optical expansion into scale-up and campus networks, power-per-bit reduction and AI optical manufacturing expansion. 800G remains the largest speed class. 1.6T is the fastest-growing speed class. 3.2T becomes increasingly relevant after 2028. Scale-out networking remains the largest revenue pool. Scale-up optical links grow fastest. North America leads demand. Asia Pacific remains critical to manufacturing capacity. Rapid generation transitions, falling cost per bit and architectural competition remain the key restraints. The market is projected to grow from USD 14.5 billion in 2026 to USD 45.8 billion by 2032 at a CAGR of 21.1%.

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TABLE OF CONTENTS

1. Executive Summary

• 1.1. Market Opportunity and Key Findings
• 1.2. Optical Interconnect Transition Timeline
• 1.3. Principal Revenue Pools

2. Market Overview

• 2.1. AI Data Movement and Network Bandwidth Requirements
• 2.2. Evolution from 400G and 800G to 1.6T and 3.2T
• 2.3. Pluggable, Linear and Coherent Optical Architectures
• 2.4. Scale-Up, Scale-Out and Scale-Across Connectivity

3. Market Size and Forecast, 2026-2032

• 3.1. Global Market Revenue
• 3.2. Annual Growth Analysis
• 3.3. Revenue by Link Bandwidth
• 3.4. Revenue by Network Role

4. Market by Interconnect Product

• 4.1. Retimed Pluggable Transceivers
• 4.2. Linear Pluggable Optics
• 4.3. Transmit-Retimed Optical Modules
• 4.4. Active Optical Cables and Specialized Short-Reach Links
• 4.5. Coherent-Lite Pluggable Optics
• 4.6. Coherent Data Center Interconnect Modules

5. Market by Data Rate

• 5.1. 400G
• 5.2. 800G
• 5.3. 1.6T
• 5.4. 3.2T and Higher

6. Market by Network Role

• 6.1. AI Scale-Out Networking
• 6.2. AI Scale-Up Networking
• 6.3. Campus / Scale-Across Connectivity
• 6.4. Data Center Interconnect

7. Market by Reach

• 7.1. Under 100 Metres
• 7.2. 100-500 Metres
• 7.3. 500 Metres-2 Kilometres
• 7.4. 2-20 Kilometres
• 7.5. Above 20 Kilometres

8. Market by Customer Type

• 8.1. Hyperscale Cloud Providers
• 8.2. Neocloud and GPU-Cloud Operators
• 8.3. Colocation Providers
• 8.4. Sovereign AI Infrastructure
• 8.5. Enterprise and High-Performance Computing

9. Regional Market

• 9.1. North America
  • 9.1.1. United States
  • 9.1.2. Canada
• 9.2. Europe
• 9.3. Asia Pacific
• 9.4. Middle East and Rest of World

10. Market Dynamics

• 10.1. Drivers
  • 10.1.1. 800G-to-1.6T Network Transition
  • 10.1.2. Optical Expansion into Scale-Up and Campus Networks
  • 10.1.3. Power-per-Bit Reduction
  • 10.1.4. AI Optical Manufacturing Expansion
• 10.2. Restraints
  • 10.2.1. Rapid Generation Transitions and Qualification Risk
  • 10.2.2. Falling Cost per Bit and ASP Pressure
  • 10.2.3. Interoperability and Link-Budget Complexity
  • 10.2.4. Architectural Competition from Integrated Optics

11. Competitive Landscape

• 11.1. Value Chain
• 11.2. Networking and Switching Platforms
• 11.3. Optical DSP and Semiconductor Suppliers
• 11.4. Transceiver and Module Manufacturers
• 11.5. Coherent and Campus Interconnect Suppliers
• 11.6. Fiber, Connectivity and Manufacturing Ecosystem

12. Company Profiles

• 12.1. Cisco
• 12.2. NVIDIA
• 12.3. Broadcom
• 12.4. Marvell Technology
• 12.5. Coherent
• 12.6. Lumentum
• 12.7. Ciena
• 12.8. Arista Networks
• 12.9. Innolight
• 12.10. Eoptolink Technology
• 12.11. Fabrinet
• 12.12. Corning
• 12.13. Intel
• 12.14. TSMC
• 12.15. Accelink Technologies

13. Recent Developments

14. Appendix

• 14.1. Definitions and Abbreviations
• 14.2. Optical Interconnect Architecture Classification
• 14.3. Link-Speed and Reach Classification
• 14.4. Source and Data Notes