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市場調查報告書
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1878279

功率模組封裝市場－2025-2030年預測

Power Module Packaging Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 151 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計功率模組封裝市場將從 2025 年的 29.46 億美元成長到 2030 年的 47.55 億美元，複合年成長率為 10.05%。

功率模組封裝市場分析

功率模組封裝是將電晶體、二極體、電容器和電感器等功率電子元件封裝在保護殼或封裝體中的關鍵製程。這種封裝為內部電子元件提供機械支撐、電氣隔離、溫度控管和環境防護等重要功能。功率模組封裝對功率電子系統的效率、可靠性和耐久性有顯著影響，因此是系統設計和效能最佳化中必須考慮的基本因素。

市場成長的驅動力在於高效分散式冷卻技術的應用、減少能源廢棄物的措施以及由此帶來的功率密度提升。這些技術進步使得電力電子系統更加緊湊高效，同時維持甚至提升了工業、汽車和消費性電子等高要求應用所需的性能特性和可靠性標準。

主要市場促進因素

電子設備的需求

工業和消費性電子領域對功率模組日益成長的需求預計將推動功率模組封裝市場的發展。需要高功率和高電壓處理的電子設備需要合適的功率模組封裝，以保護其免受濕度、溫度波動和物理損壞等環境因素的影響。功率模組廣泛應用於照明系統、電源、轉換器和馬達控制等領域，在各種應用領域都有廣泛的需求。

根據印度消費電子和電器製造商協會（CEAMA）的數據，印度家用電器和電子產品產業預計在2020年至2025年間將以10%的年均複合成長率成長，顯示該地區市場將強勁擴張。電子產品銷售額的年成長正轉化為對功率模組封裝解決方案日益成長的需求，以支持此生產擴張。

可再生能源應用

由於風力發電機逆變器、太陽能光伏逆變器和微型逆變器等設備的廣泛應用，預計再生能源來源中功率模組的使用將顯著成長。美國能源資訊署 (EIA) 預測，到 2022 年，美國的大規模太陽能發電裝置容量將有所成長，這表明市場發展勢頭強勁。據美國太陽能產業協會 (SEIA) 稱，政府正在實施包括淨計量和扶持太陽能政策在內的相關立法，以促進太陽能板技術在發電領域的應用發展。

光伏組件使控制系統能夠確保穩定運行，同時直接從太陽能電池板獲取電力。太陽能的日益普及推動了對功​​率模組封裝解決方案的需求，以支援可再生能源基礎設施的部署。這一趨勢與全球脫碳努力以及已開發市場和發展中市場擴大可再生能源產能的努力相一致。

汽車產業的成長

在推廣電動車（EV）的推動下，汽車產業正經歷快速成長，這也帶動了汽車功率模組封裝市場的發展。根據國際能源總署（IEA）統計，2020年美國註冊的電動車數量約為180萬輛，是2016年的三倍多。這一顯著的成長勢頭表明電動車市場滲透率正在加速提升，並由此帶動了對支援電動推進系統的電力電子產品的需求成長。

根據國際能源總署（IEA）的數據，2016年至2020年間，歐洲電動車銷量成長最為強勁，年複合成長率（CAGR）高達60%，超過了中國（36%）和美國（17%）。這種區域性成長模式表明，全球汽車電氣化進程持續強勁，推動了對功​​率模組封裝解決方案的持續需求。電動車需要先進的電力電子技術來實現電池管理、馬達控制和充電系統，而所有這些都需要先進的功率模組封裝技術來確保在嚴苛的汽車使用環境下可靠運作。

區域市場動態

預計亞太地區在預測期內將繼續保持顯著的市場佔有率。該地區囊括了全球成長最快的經濟體，並一直在大力投資功率模組封裝技術的進步。亞太地區的主要參與者，例如中國、日本、韓國和台灣，正致力於改善電動車基礎設施，預計將進一步推動市場成長。

2022年1月至11月，中國電動車充電基礎設施促進聯盟（EVCIPA）宣布，新增充電樁233萬個，是去年同期的兩倍。這項基礎設施的擴張將帶動電動車充電應用領域對功率模組封裝需求的同步成長，從而支持該地區的電動出行轉型。

台灣政府已宣布一項戰略計劃，目標是到2025年使可再生能源佔國內能源結構的20%，這將增加對太陽能和風能應用領域功率模組封裝的需求。這項政策承諾體現了政府對可再生能源發展的支持，也為功率模組封裝市場的擴張創造了有利條件。

這些因素共同推動了全部區域功率模組封裝市場的成長，預計在預測期內也將成為全球市場擴張的主要驅動力。製造能力、技術研發舉措以及政府扶持政策的結合，使亞太地區成為功率模組封裝創新和生產的關鍵中心。

本報告的主要優勢：

  • 深入分析：提供對主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、行業垂直領域和其他細分市場。
  • 競爭格局：了解全球主要參與者的策略舉措，並了解透過正確的策略進入市場的機會。
  • 市場促進因素與未來趨勢：探索市場促進因素和關鍵趨勢，以及它們將如何塑造未來的市場發展。
  • 可操作的建議：利用這些見解，在動態環境中做出策略決策，並開拓新的商機和收入來源。
  • 受眾廣泛：對Start-Ups、研究機構、顧問公司、中小企業和大型企業都很有用且經濟實惠。

公司如何使用我們的報告範例

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

  • 2022年至2024年的歷史數據和2025年至2030年的預測數據
  • 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
  • 公司概況（策略、產品、財務資訊、關鍵發展等）

目錄

第1章執行摘要

第2章 市場概覽

  • 市場概覽
  • 市場定義
  • 調查範圍
  • 市場區隔

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策與法規
  • 策略建議

第4章 技術展望

第5章 功率模組封裝市場（按類型分類）

  • 介紹
  • 氮化鎵模組
  • SiC模組
  • IGBT模組
  • FET模組
  • 閘流體

第6章 依應用分類的功率模組封裝市場

  • 介紹
  • 車
  • 電子設備
  • 醫療保健
  • 其他

第7章 各地區功率模組封裝市場

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼
    • 泰國
    • 其他

第8章 競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀錶板

第9章：公司簡介

  • ABB
  • DyDac Controls
  • Fuji Electric Co Ltd
  • Infineon Technologies AG
  • IXYS Corporation
  • Mitsubishi Electric Corporation
  • Semikron
  • Texas Instruments Inc

第10章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 調查方法
  • 簡稱
簡介目錄
Product Code: KSI061614854

The Power Module Packaging Market is projected to expand at a 10.05% CAGR, achieving USD 4.755 billion by 2030 from USD 2.946 billion in 2025.

Power Module Packaging Market Analysis

Power module packaging represents the critical procedure of enclosing power electronic components including transistors, diodes, capacitors, and inductors within protective casings or packages. The packaging provides essential functions including mechanical support, electrical insulation, thermal management, and environmental protection for enclosed electronic components. Power module packaging significantly influences the efficiency, reliability, and durability of power electronic systems, making it a fundamental consideration in system design and performance optimization.

Market growth is being driven by the implementation of effective distributed cooling techniques, waste reduction initiatives, and resulting increases in power density capabilities. These technological advancements enable more compact and efficient power electronic systems while maintaining or improving performance characteristics and reliability standards essential for demanding applications across industrial, automotive, and consumer electronics sectors.

Primary Market Drivers

Electronic Device Demand

The power module packaging market is expected to be propelled by expanding demand for power modules across industrial and consumer electronics sectors. Electronic devices requiring high power and voltage handling capabilities necessitate proper power module packaging to safeguard devices from environmental factors including humidity, temperature variations, and physical damage. Power modules are deployed in systems including lighting systems, power supplies, converters, and motor control applications, creating diverse demand across multiple application categories.

According to the Consumer Electronics and Appliances Manufacturers Association (CEAMA), the consumer electronics and home appliances industry in India is expected to grow at a 10% rate over the 2020-2025 period, demonstrating robust regional market expansion. Annual growth in electronics sales has increased demand for power module packaging solutions supporting this production volume expansion.

Renewable Energy Applications

Power module utilization in renewable energy sources is anticipated to grow substantially, as these components are employed in wind turbine inverters, photovoltaic inverters, and micro-inverters. The U.S. Energy Information Administration (EIA) predicted utility-scale solar capacity in the United States would increase by 2022, indicating strong market momentum. The US Solar Energy Industries Association (SEIA) noted that government legislation including net metering and solar promotion policies has been implemented to advance solar panel technology for power generation applications.

Photovoltaic power modules enable control systems to receive power directly from solar panels while guaranteeing steady operational performance. The increasing adoption of solar energy is driving demand for power module packaging solutions supporting renewable energy infrastructure deployment. This trend aligns with global decarbonization efforts and renewable energy capacity expansion initiatives across developed and developing markets.

Automotive Sector Growth

The automotive industry has experienced rapid growth driven by efforts promoting electric vehicle (EV) adoption, propelling the automotive power module packaging market forward. According to the International Energy Agency (IEA), approximately 1.8 million electric vehicles were registered in the United States in 2020, representing more than triple the 2016 registration volume. This substantial growth trajectory demonstrates accelerating EV market penetration and corresponding demand for power electronics supporting electric propulsion systems.

IEA data indicated Europe experienced the largest increase in EV sales from 2016 to 2020, achieving a compound annual growth rate of 60%, compared to gains of 36% in China and 17% in the United States. These regional growth patterns demonstrate global momentum toward vehicle electrification creating sustained demand for power module packaging solutions. Electric vehicles require sophisticated power electronics for battery management, motor control, and charging systems, all requiring advanced power module packaging to ensure reliable operation under demanding automotive environmental conditions.

Regional Market Dynamics

During the forecast period, the Asia Pacific region is expected to maintain significant market share dominance. Asia Pacific encompasses the fastest-growing economies worldwide and has made substantial investments in power module packaging technology advancement. Key participants in the Asia Pacific power module packaging market including China, Japan, South Korea, and Taiwan are focusing on improving electric vehicle infrastructure, which is expected to propel market growth further.

In 2022 from January to November, the China Electric Vehicle Charging Infrastructure Promotion Alliance (EVCIPA) announced that 2.33 million charging points were added, representing double the previous year's installation volume. This infrastructure expansion will create parallel increases in demand for power module packaging in EV charging applications, supporting the region's electric mobility transition.

The Taiwanese government presented a strategic plan for incorporating 20% renewable energy in the nation's energy mix by 2025, which will increase demand for power module packaging in solar and wind energy applications. This policy commitment demonstrates governmental support for renewable energy development creating favorable conditions for power module packaging market expansion.

These factors collectively contribute to power module packaging market growth throughout the Asia Pacific region, positioning it as the primary driver of global market expansion throughout the forecast period. The combination of manufacturing capabilities, technology development initiatives, and supportive governmental policies establishes Asia Pacific as the critical hub for power module packaging innovation and production.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

  • POWER MODULE PACKAGING MARKET BY TYPE
  • GaN Module
  • SiC Module
  • IGBT Module
  • FET Module
  • Thyristor
  • POWER MODULE PACKAGING MARKET BY APPLICATION
  • Automotive
  • Electronics
  • Medical
  • Others
  • POWER MODULE PACKAGING MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. POWER MODULE PACKAGING MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. GaN Module
  • 5.3. SiC Module
  • 5.4. IGBT Module
  • 5.5. FET Module
  • 5.6. Thyristor

6. POWER MODULE PACKAGING MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Automotive
  • 6.3. Electronics
  • 6.4. Medical
  • 6.5. Others

7. POWER MODULE PACKAGING MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. ABB
  • 9.2. DyDac Controls
  • 9.3. Fuji Electric Co Ltd
  • 9.4. Infineon Technologies AG
  • 9.5. IXYS Corporation
  • 9.6. Mitsubishi Electric Corporation
  • 9.7. Semikron
  • 9.8. Texas Instruments Inc

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key Benefits for the Stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations