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商品編碼

1775487

液體封裝市場：2025-2030 年預測

Liquid Encapsulation Market - Forecasts from 2025 to 2030

出版日期: 2025年06月30日 | 出版商:

Knowledge Sourcing Intelligence | 英文 143 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

液體封裝市場預計將從 2025 年的 19.4 億美元成長到 2030 年的 24.4 億美元，複合年成長率為 4.73%。

半導體應用的成長

由於液體封裝能夠提升複雜組件的耐用性和功能性，因此微型半導體裝置需求的激增是主要促進因素。 2024年，全球半導體產業對積體電路 (IC) 和電子機械系統 (MEMS) 的需求成長了15%，尤其是在消費性電子和汽車領域。液體封裝技術（例如底部填充和球頂封裝）可保護精密組件免受衝擊和潮濕的影響，從而確保智慧型手機、穿戴式裝置和汽車感測器的可靠性。這一趨勢將透過實現高性能、緊湊型設備來推動市場成長。

技術進步

封裝技術的創新正在推動市場擴張。 2023年6月，滑鐵盧大學推出了一種液-液封裝系統，其能耗比傳統方法低5,000倍，並消除了微塑膠，從而提高了永續性。這項突破性技術支援快速原型製作和生產環保封裝設備，可為製造商降低高達12%的成本，並擴大其在醫療和穿戴式科技領域的應用。

汽車產業的成長

在汽車行業，向電動車 (EV) 和高級駕駛輔助系統 (ADAS) 的轉變正在推動對液體封裝的需求。到 2024 年，用於慣性、壓力和光學應用的 MEMS 感測器在汽車製造業中的應用將增加 10%，這需要堅固的封裝來抵禦環境因素的影響。台灣作為汽車製造業的重要市場，其汽車生產正支持這一趨勢，液體封裝技術可以提高電動車中引線接合法元件的機械強度。

政府舉措

政府的扶持政策正在推動市場成長，尤其是在半導體中心地區。 2023年，台灣國家科學技術委員會啟動了舉措加強積體電路製造的計劃，推動了板載晶片和電晶體應用對液體封裝的需求。這些政策旨在使台灣成為全球半導體生產的領導者，間接促進了封裝市場的發展。

市場挑戰

生產成本高

液體封裝採用的複雜製程和材料（例如環氧樹脂和導電聚合物）導致製造成本高昂：到 2024 年，封裝單一 MEMS 設備的平均成本將達到 50 美元，這限制了發展中地區小型製造商採用該技術。

技術複雜性

將液體封裝整合到先進的半導體設計中需要專業知識。高密度積體電路的兼容性問題已經減緩了亞太地區的生產速度，導致2023年某些細分市場的市場成長放緩。

供應鏈約束

特種聚合物等高品質封裝供應有限，擾亂了供應鏈，供不應求導致材料成本在 2024 年上漲 8%，影響中東和非洲的擴充性。

市場區隔分析

按材質

環氧樹脂憑藉其在半導體和汽車應用的多功能性和耐用性，在2024年佔據了60%的市場佔有率，佔據了主導地位。受穿戴式裝置和醫療設備靈活性的推動，聚合物基封裝正在經歷快速成長。

按用途

積體電路佔據主導地位，在消費性電子和汽車產業需求的推動下，到2024年將佔市場收益的45%。受電動車和物聯網設備中感測器應用的推動，MEMS應用正在快速成長。光電子技術也是重要的貢獻者，為顯示和照明技術提供動力。

按最終用戶

電子產業佔據主導地位，智慧型手機和穿戴式裝置推動了需求成長。汽車產業是一個快速成長的領域，受電動車和高級駕駛輔助系統 (ADAS) 的推動。包括醫療植入在內的醫療保健應用正在穩步擴張。

地理洞察力

亞太地區佔最大佔有率，2024 年市場收益佔 50%。在日東電工 (Nitto Denko) 和台灣 PU 等公司的支持下，台灣的積體電路生產正在推動該地區的成長。其次是北美，美國專注於汽車和醫療應用。在消費性電子產品的推動下，歐洲正經歷穩定成長。

競爭格局

漢高、日東電工、信越化學和松下等主要企業正透過研發和策略擴張推動技術創新。 2024年，漢高推出了一種用於MEMS封裝的新型低能耗環氧樹脂，將製造成本降低了10%。日東電工則擴大了台灣業務，瞄準汽車感測器應用。

本報告的主要優點

深刻分析：獲得深入的市場洞察，重點關注客戶細分、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場，涵蓋主要地區和新興地區。
競爭格局：了解主要企業採用的策略策略，並了解正確策略的市場滲透潛力。
市場趨勢和促進因素：探索動態因素和關鍵市場趨勢以及它們將如何影響未來的市場發展。
可行的建議：利用洞察力來提供策略決策，在動態環境中開闢新的業務流和收益。
受眾範圍廣：對於新興企業、研究機構、顧問、中小企業和大型企業來說都是有益且具成本效益的。

它有什麼用途？

產業與市場考量、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

調查範圍

實際數據為2022年至2024年，預測數據為2025年至2030年
成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
競爭定位、策略和市場佔有率分析
收益成長和預測細分市場和區域分析（包括國家）
公司概況（策略、產品、財務、主要發展等）

The surge in demand for miniaturized semiconductor devices is a primary driver, as liquid encapsulation enhances the durability and functionality of intricate components. In 2024, the global semiconductor industry saw a 15% increase in demand for integrated circuits (ICs) and microelectromechanical systems (MEMS), particularly in consumer electronics and automotive sectors. Liquid encapsulation techniques, such as under-filling and glob-top encapsulation, protect delicate components from shocks and moisture, ensuring reliability in smartphones, wearables, and automotive sensors. This trend drives market growth by enabling high-performance, compact devices.

Technological Advancements

Innovations in encapsulation technologies are propelling market expansion. In June 2023, the University of Waterloo introduced a liquid-liquid encapsulation system, which consumes 5,000 times less energy than traditional methods and eliminates microplastics, enhancing sustainability. This breakthrough supports rapid prototyping and production of eco-friendly encapsulated devices, reducing costs by up to 12% for manufacturers and broadening applications in medical and wearable technologies.

Automotive Sector Growth

The automotive industry's shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) is boosting demand for liquid encapsulation. In 2024, MEMS-based sensors for inertia, pressure, and optical applications saw a 10% adoption increase in automotive manufacturing, requiring robust encapsulation to protect against environmental factors. Taiwan's automotive production, a key market, supported this trend, with liquid encapsulation enhancing the mechanical strength of wire-bonded devices in EVs.

Government Initiatives

Supportive government policies are fostering market growth, particularly in semiconductor hubs. In 2023, Taiwan's National Science and Technology Council launched initiatives to strengthen IC manufacturing, driving demand for liquid encapsulation in chip-on-board and transistor applications. These policies aim to position Taiwan as a global leader in semiconductor production, indirectly boosting the encapsulation market.

Market Challenges

High Production Costs

The complex processes and materials, such as epoxy resins and conductive polymers, used in liquid encapsulation result in high production costs. In 2024, the average cost of encapsulating a single MEMS device was USD 50, limiting adoption among smaller manufacturers in developing regions.

Technical Complexity

The integration of liquid encapsulation with advanced semiconductor designs requires specialized expertise. In 2023, compatibility issues with high-density ICs delayed production in Asia-Pacific, slowing market growth in some segments.

Supply Chain Constraints

Limited availability of high-quality encapsulation materials, such as specialized polymers, disrupts supply chains. In 2024, supply shortages increased material costs by 8%, impacting scalability in the Middle East and Africa.

Market Segmentation Analysis

By Material

Epoxy resins dominate, holding a 60% market share in 2024, due to their versatility and durability in semiconductor and automotive applications. Polymer-based encapsulants are growing rapidly, driven by their flexibility in wearable and medical devices.

By Application

Integrated circuits lead, accounting for 45% of market revenue in 2024, driven by demand in consumer electronics and automotive sectors. MEMS applications are the fastest-growing, fueled by their use in sensors for EVs and IoT devices. Optoelectronics also contribute significantly, supporting display and lighting technologies.

By End-User

The electronics sector dominates, with smartphones and wearables driving demand. The automotive industry is the fastest-growing segment, supported by EV and ADAS adoption. Healthcare applications, including medical implants, are expanding steadily.

Geographical Insights

Asia-Pacific holds the largest share, contributing 50% of market revenue in 2024, with Taiwan and China leading due to their robust semiconductor industries. Taiwan's IC production, supported by companies like Nitto Denko and Taiwan PU Corporation, drives regional growth. North America follows, with the U.S. focusing on automotive and medical applications. Europe is growing steadily, supported by advancements in consumer electronics.

Competitive Landscape

Key players, including Henkel, Nitto Denko, Shin-Etsu Chemical, and Panasonic, drive innovation through R&D and strategic expansions. In 2024, Henkel introduced a new low-energy epoxy resin for MEMS encapsulation, reducing production costs by 10%. Nitto Denko expanded its Taiwan operations, targeting automotive sensor applications.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Liquid Encapsulation Market Segmentation

By Resin Type

Epoxy Resin
Silicone Resin
Polyurethane Resin
Others

By Application

Integrated Circuits (IC)
Optoelectronics
Sensors
Others

By End-User

Automotive
IT & Telecommunication
Electronics
Manufacturing
Others

By Geography

Americas
USA
Others
Europe, Middle East and Africa
Germany
UK
France
Others
Asia Pacific
China
Japan
Taiwan
South Korea
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. LIQUID ENCAPSULATION MARKET BY RESIN TYPE

5.1. Introduction
5.2. Epoxy Resin
5.3. Silicon Resin
5.4. Polyurethane Resin
5.5. Others

6. LIQUID ENCAPSULATION MARKET BY APPLICATION

6.1. Introduction
6.2. Integrated Circuits (ICs)
6.3. Optoelectronics
6.4. Sensors
6.5. Others

7. LIQUID ENCAPSULATION MARKET BY END-USER

7.1. Introduction
7.2. Automotive
7.3. IT & Telecommunication
7.4. Electronics
7.5. Manufacturing
7.6. Others

8. LIQUID ENCAPSULATION MARKET BY GEOGRAPHY

8.1. Introduction
8.2. Americas
- 8.2.1. USA
- 8.2.2. Others
8.3. Europe Middle East and Africa
- 8.3.1. Germany
- 8.3.2. France
- 8.3.3. United Kingdom
- 8.3.4. Others
8.4. Asia Pacific
- 8.4.1. China
- 8.4.2. Japan
- 8.4.3. South Korea
- 8.4.4. Taiwan
- 8.4.5. Others