全球電子基板級底部填充和封裝市場

預計到 2030 年全球電子基板級底部填充和封裝市場規模將達到 4.043 億美元

全球電子基板級底部填充和封裝市場規模預計在2024年為3.33億美元，預計到2030年將達到4.043億美元，2024年至2030年的複合年成長率為3.3%。底部填充類型是本報告分析的細分市場之一，預計其複合年成長率為2.7%，到分析期結束時規模將達到2.581億美元。在分析期間內，頂部灌封類型細分市場的複合年成長率預計為4.5%。

美國市場規模估計為 9,070 萬美元，而中國市場預計複合年成長率為 6.0%

美國電子基板級底部填充和封裝市場規模預計在2024年達到9,070萬美元。作為世界第二大經濟體，中國市場規模預計到2030年將達到7,950萬美元，在2024-2030年的分析期間內，複合年成長率為6.0%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間內，這兩個市場的複合年成長率分別為1.3%和2.5%。在歐洲，預計德國市場的複合年成長率為1.9%。

全球電子基板級底部填充和封裝市場—主要趨勢和促進因素摘要

為什麼底部填充和封裝解決方案對於 PCB 和微電子組裝如此重要？

電子基板級底部填充和封裝材料對於確保半導體封裝和印刷電路基板(PCB) 的機械完整性、熱穩定性和長期可靠性至關重要。隨著電子設備體積越來越小、功率越來越大，它們對焊點、互連線和晶粒表面施加的應力也越來越大，尤其是在球柵陣列 (BGA)、晶片級封裝 (CSP) 和覆晶配置中。

底部填充材料通常為環氧樹脂基配方，用於晶片和基板之間，以增強焊點、緩解熱膨脹係數 (CTE) 失配並吸收機械衝擊。封裝用於包覆成型和灌封，以防止濕氣、化學物質和顆粒污染。這些材料可延長暴露於汽車、航太、工業或消費級環境中的電子設備的使用壽命。

底部填充材料和封裝在智慧型手機、汽車電子控制單元 (ECU) 和穿戴式電子設備等易受熱循環、振動和跌落衝擊的設備中，充當物理緩衝和熱通道。在 2.5D/3DIC 和系統級封裝(SiP) 等先進封裝架構中，底部填充材料解決方案有助於管理多個晶粒和內插器層的內部應力負載，已成為半導體封裝中不可或缺的關鍵材料。

哪些材料創新和應用技術正在塑造這一領域？

底部填充和封裝領域的材料創新著重於提高導熱性、降低固化溫度、增強流動特性以及縮短點膠週期。傳統的毛細管底部填充系統已發展為無流動底部填充、預塗底部填充 (PAUF) 以及可返工的變體，以適應多樣化的工藝流程和組裝限制。

含有氧化鋁、氮化硼和銀片等填充材的導熱底部填充材料在高功率設備和射頻模組中的應用日益廣泛。這些配方兼具低黏度和高散熱性，可實現快速固化並最大程度地減少空隙形成。在高產量製造環境中，週期時間是關鍵的性能指標，而紫外線固化和快速固化系統正被廣泛應用。

封裝正朝著混合樹脂系統發展，該系統融合了環氧樹脂、矽樹脂和聚氨酯的特性，以提高柔韌性以及對高難度基板的附著力。低應力、光學透明且低釋氣性的封裝正成為MEMS裝置和光學感測器的主流。在行動和家用電子電器中，噴射點膠和模板印刷等大批量生產技術正變得日益普遍。

哪些最終用途領域和包裝趨勢將推動需求？

半導體產業仍然是底部填充和封裝解決方案的最大消費領域。代工廠和OSAT廠商在覆晶構裝、晶圓級晶片尺寸封裝（CSP）以及新興的3D堆疊架構中使用這些材料。組裝、日月光和安靠等領先公司為人工智慧晶片、射頻前端模組以及邏輯和記憶體整合指定客製化底部填充材料。

消費性電子產品是第二大終端應用領域，包括智慧型手機、穿戴式裝置、平板電腦、遊戲設備等。隨著設備變得越來越輕薄、越來越密集，熱可靠性和機械可靠性對於使用者體驗和保固週期至關重要。先進的封裝可用於防止水浸和熱劣化，尤其適用於 IP 等級的設備。

由於電子控制單元 (ECU)、感測器和電源模組數量的不斷增加，汽車電子領域正快速發展。底部填充材料對於確保在嚴苛的汽車環境中具有抗振性和熱循環耐久性至關重要。其主要應用包括 ADAS 處理器、資訊娛樂系統和電動車的電池控制單元。工業自動化、醫療用電子設備和航太應用也進一步豐富了其需求。

哪些因素推動了底部填充和封裝市場的成長？

電子基板級底部填充和封裝市場的成長受到多種因素的推動，例如電子產品的小型化、半導體功率密度的增加、惡劣環境下的可靠性要求以及封裝技術中異質整合的興起。

首先，追求更小、更輕、功能更強大的電子產品需要更堅固的保護材料。隨著焊點間距越來越小，元件堆疊越來越緊密，底部填充材料提供的機械加固對於避免過早失效至關重要，尤其是在跌落測試和熱循環過程中。

其次，5G、汽車和高效能運算中使用的功率半導體和射頻組件會產生大量熱量。導熱性較高的底部填充材料和封裝可以幫助有效地散熱，防止熱點故障並確保長期可靠性，尤其是在受限的PCB佈局中。

第三，汽車和航太產業的可靠性閾值正在不斷提高。這些環境中的設備必須能夠承受劇烈的溫度變化、振動以及腐蝕性介質的侵蝕。高溫穩定、化學惰性的封裝和可返工的底部填充材料必須符合AEC-Q100和MIL-STD-883等特定產業標準。

最後，扇出型晶圓級封裝 (FOWLP)、系統級封裝 (SiP) 和晶片級 (chiplet) 架構的興起，迫使材料工程師開發高度可客製化、低熱膨脹係數 (CTE)、無空洞的底部填充材料。這些架構將邏輯、記憶體和類比模組整合在一個模組中，高度依賴精確的材料沉積來確保訊號保真度和物理完整性。

部分

產品類型（底部填充型、GOB頂封裝型）、材料（石英/矽膠材料、氧化鋁基材料、環氧基材料、胺甲酸乙酯基材料、丙烯酸基材料、其他材料）、基板類型（晶片級構裝基板、球柵陣列基板、覆晶基板）

調查企業範例（共41家企業）

• Ablestik Laboratories
• AI Technology Inc.
• Advanced Technology & Materials Co., Ltd.
• Dow Inc.
• Dupont Electronics & Imaging
• Henkel AG & Co. KGaA
• Hitachi Chemical Co., Ltd.
• JSR Corporation
• Kyocera Corporation
• LORD Corporation
• Nagase ChemteX Corporation
• Namics Corporation
• NuSil Technology LLC
• Panacol-Elosol GmbH
• Sika AG
• Shin-Etsu Chemical Co., Ltd.
• Sumitomo Bakelite Company, Limited
• Techsil Ltd
• Trelleborg AB
• UMC Electronics Co., Ltd.

人工智慧整合

我們正在利用可操作的專家內容和人工智慧工具來改變市場和競爭情報。

Global 特定產業SLM 的典型規範，而是建立了一個從全球專家收集的內容庫，其中包括視訊錄影、部落格、搜尋引擎研究以及大量的公司、產品/服務和市場數據。

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口狀況（成品和原始OEM）預測其競爭態勢的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括銷貨成本成本 (COGS) 上升、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

目錄

第1章調查方法

第2章執行摘要

• 市場概覽
• 主要企業
• 市場趨勢和促進因素
• 全球市場展望

第3章市場分析

• 美國
• 加拿大
• 日本
• 中國
• 歐洲
• 法國
• 德國
• 義大利
• 英國
• 西班牙
• 俄羅斯
• 其他歐洲國家
• 亞太地區
• 澳洲
• 印度
• 韓國
• 其他亞太地區
• 拉丁美洲
• 阿根廷
• 巴西
• 墨西哥
• 其他拉丁美洲
• 中東
• 伊朗
• 以色列
• 沙烏地阿拉伯
• 阿拉伯聯合大公國
• 其他中東地區
• 非洲

第4章 比賽

Global Electronic Board Level Underfill and Encapsulation Market to Reach US$404.3 Million by 2030

The global market for Electronic Board Level Underfill and Encapsulation estimated at US$333.0 Million in the year 2024, is expected to reach US$404.3 Million by 2030, growing at a CAGR of 3.3% over the analysis period 2024-2030. Underfills Type, one of the segments analyzed in the report, is expected to record a 2.7% CAGR and reach US$258.1 Million by the end of the analysis period. Growth in the Gob Top Encapsulations Type segment is estimated at 4.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$90.7 Million While China is Forecast to Grow at 6.0% CAGR

The Electronic Board Level Underfill and Encapsulation market in the U.S. is estimated at US$90.7 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$79.5 Million by the year 2030 trailing a CAGR of 6.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.3% and 2.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.9% CAGR.

Global Electronic Board Level Underfill and Encapsulation Market - Key Trends & Drivers Summarized

Why Are Underfill and Encapsulation Solutions Crucial in PCB and Microelectronics Assembly?

Electronic board-level underfill and encapsulation materials are critical to ensuring the mechanical integrity, thermal stability, and long-term reliability of semiconductor packages and printed circuit boards (PCBs). As electronic devices become more compact and powerful, the stresses exerted on solder joints, interconnects, and die surfaces intensify, particularly in ball grid arrays (BGAs), chip-scale packages (CSPs), and flip-chip configurations.

Underfill materials are typically epoxy-based formulations applied between the chip and substrate to reinforce solder joints, mitigate coefficient of thermal expansion (CTE) mismatch, and absorb mechanical shock. Encapsulation compounds-used for overmolding or potting-offer protection from moisture, chemicals, and particulate contamination. These materials extend the operational life of electronics exposed to automotive, aerospace, industrial, or consumer-grade environments.

In devices subject to thermal cycling, vibration, or drop impact-such as smartphones, automotive ECUs, and wearable electronics-underfill and encapsulants serve as a physical buffer and a thermal path. In advanced packaging architectures like 2.5D/3D ICs and system-in-package (SiP), underfill solutions help manage internal stress loads across multiple dies and interposer layers, making them indispensable in semiconductor packaging.

What Material Innovations and Application Techniques Are Reshaping the Segment?

Material innovations in underfill and encapsulation are focused on improving thermal conductivity, lowering curing temperatures, enhancing flow characteristics, and enabling faster dispense cycles. Conventional capillary underfill systems have evolved into no-flow underfills, pre-applied underfills (PAUF), and reworkable variants to suit diverse process flows and assembly line constraints.

Thermally conductive underfills with filler materials like alumina, boron nitride, and silver flakes are increasingly used in high-power devices and RF modules. These formulations combine low viscosity with high heat dissipation, allowing for rapid curing and minimal void formation. UV-curable and snap-cure systems are being adopted for high-throughput manufacturing environments where cycle time is a key performance metric.

Encapsulation materials are transitioning toward hybrid resin systems combining epoxy, silicone, and polyurethane characteristics for better flexibility and adhesion on challenging substrates. For MEMS devices and optical sensors, low-stress, optically clear encapsulants with low outgassing profiles are becoming mainstream. Jet-dispensing and stencil printing techniques are now common for volume production in mobile and consumer electronics.

Which End-Use Segments and Packaging Trends Are Driving Demand?

The semiconductor industry remains the largest consumer of underfill and encapsulation solutions. Foundries and OSATs (Outsourced Semiconductor Assembly and Test providers) use these materials in flip-chip packaging, wafer-level CSPs, and emerging 3D-stacked architectures. Leading players like TSMC, ASE, and Amkor are specifying custom underfills for AI chips, RF front-end modules, and logic-memory integration.

Consumer electronics is the second-largest end-use segment, encompassing smartphones, wearables, tablets, and gaming devices. As devices become thinner and more densely packed, thermal and mechanical reliability become central to user experience and warranty cycles. Advanced encapsulants are used to safeguard against water ingress and thermal degradation-especially in IP-rated devices.

Automotive electronics is a rapidly growing segment, driven by the increasing number of ECUs, sensors, and power modules. Underfill materials are essential for ensuring vibration resistance and thermal cycling endurance in harsh automotive environments. Key applications include ADAS processors, infotainment systems, and battery control units in EVs. Industrial automation, medical electronics, and aerospace applications further diversify demand.

What Factors Are Accelerating Growth in the Underfill and Encapsulation Market?

The growth in the electronic board level underfill and encapsulation market is driven by several factors including miniaturization of electronics, increasing power density in semiconductors, reliability requirements in harsh environments, and the rise of heterogeneous integration in packaging technologies.

First, the push toward smaller, lighter, and multifunctional electronic devices necessitates more robust protective materials. As solder joint pitch narrows and component stacking increases, mechanical reinforcement via underfill becomes critical to avoid premature failures, especially during drop tests and thermal cycles.

Second, power semiconductors and RF components used in 5G, automotive, and high-performance computing generate substantial heat. Underfill and encapsulants with enhanced thermal conductivity help dissipate this heat efficiently, preventing hot-spot failures and ensuring long-term reliability-especially in confined PCB layouts.

Third, the automotive and aerospace sectors are increasing reliability thresholds. Devices in these environments must endure wide temperature swings, vibrations, and exposure to corrosive agents. High-temperature stable, chemically inert encapsulants and reworkable underfills are being demanded to meet industry-specific standards such as AEC-Q100 and MIL-STD-883.

Lastly, the emergence of fan-out wafer-level packaging (FOWLP), system-in-package (SiP), and chiplet architectures is pushing material engineers to develop highly customizable, low-CTE, and void-free underfills. These architectures, which blend logic, memory, and analog blocks on a single module, rely heavily on precision material deposition to ensure signal fidelity and physical integrity.

SCOPE OF STUDY:

The report analyzes the Electronic Board Level Underfill and Encapsulation market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (Underfills Type, Gob Top Encapsulations Type); Material (Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material, Other Materials); Board Type (Chip Scale Package Board, Ball Grid array Board, Flip Chips Board)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 41 Featured) -

• Ablestik Laboratories
• AI Technology Inc.
• Advanced Technology & Materials Co., Ltd.
• Dow Inc.
• Dupont Electronics & Imaging
• Henkel AG & Co. KGaA
• Hitachi Chemical Co., Ltd.
• JSR Corporation
• Kyocera Corporation
• LORD Corporation
• Nagase ChemteX Corporation
• Namics Corporation
• NuSil Technology LLC
• Panacol-Elosol GmbH
• Sika AG
• Shin-Etsu Chemical Co., Ltd.
• Sumitomo Bakelite Company, Limited
• Techsil Ltd
• Trelleborg AB
• UMC Electronics Co., Ltd.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Tariff Impact on Global Supply Chain Patterns
  • Electronic Board Level Underfill and Encapsulation - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Rise in High-Density Chip Packaging Drives Demand for Underfill and Encapsulation Materials
  • Growth in Mobile and Wearable Electronics Throws Spotlight on Board-Level Mechanical Protection
  • Increased Use of Flip-Chip and BGA Components Strengthens Business Case for Capillary Underfill
  • Expansion of 5G and High-Frequency Applications Spurs Innovation in Low-Dielectric Encapsulants
  • OEM Focus on Product Miniaturization Encourages Development of Thin and Conformal Coatings
  • Increased Use of High-Performance Processors in Consumer Electronics Drives Thermal Cycling Protection
  • Integration With SMT and Wafer-Level Packaging Technologies Expands Adoption in Advanced PCBs
  • Use in Harsh Environment Applications Spurs Demand for Moisture and Chemical Resistant Formulations
  • Growing EV and Power Electronics Segments Fuel Demand for High-Voltage Underfill Materials
  • Development of Reworkable and UV-Curable Underfill Systems Supports Cost-Effective Manufacturing
  • Increased Importance of Reliability in Medical and Aerospace Electronics Boosts Encapsulation Standards
  • Emergence of AI and Edge Computing Devices Strengthens Need for Stress-Absorbing Materials
  • OEM and OSAT Partnerships Accelerate Commercialization of Custom Underfill Chemistries
  • Surge in Chiplet and 3D IC Architectures Expands Scope of Multi-Component Encapsulation
  • Stringent Thermal Shock and Drop Test Requirements Propel Focus on Mechanical Shock Absorption
  • Regulatory Push for Lead-Free and Halogen-Free Materials Encourages Eco-Friendly Encapsulant Development
  • Expansion of Smart Cards and RFID Devices Fuels Use in Secure Microelectronic Modules
  • Material Innovation in Epoxy Resins and Silicones Enhances Long-Term Reliability
  • Shift Toward Automation in Assembly Processes Drives Demand for Dispense-Friendly Formulations
  • Increasing PCB Complexity in Automotive Electronics Promotes Advanced Encapsulation Strategies
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Electronic Board Level Underfill and Encapsulation Market Analysis of Annual Sales in US$ Thousand for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 4: World 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for Underfills Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 7: World 16-Year Perspective for Underfills Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for Gob Top Encapsulations Type by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 10: World 16-Year Perspective for Gob Top Encapsulations Type by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for Ball Grid array Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 13: World 16-Year Perspective for Ball Grid array Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for Flip Chips Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 16: World 16-Year Perspective for Flip Chips Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Chip Scale Package Board by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 19: World 16-Year Perspective for Chip Scale Package Board by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Quartz / Silicone Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 22: World 16-Year Perspective for Quartz / Silicone Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 24: World Historic Review for Alumina Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 25: World 16-Year Perspective for Alumina Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 27: World Historic Review for Epoxy Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 28: World 16-Year Perspective for Epoxy Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Urethane Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 31: World 16-Year Perspective for Urethane Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 32: World Recent Past, Current & Future Analysis for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 33: World Historic Review for Acrylic Based Material by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 34: World 16-Year Perspective for Acrylic Based Material by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 35: World Recent Past, Current & Future Analysis for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 36: World Historic Review for Other Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 37: World 16-Year Perspective for Other Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 38: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 39: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 40: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 41: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 42: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 43: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 44: USA Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 45: USA Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 46: USA 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• CANADA
  • TABLE 47: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 48: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 49: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 50: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 51: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 52: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 53: Canada Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 54: Canada Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 55: Canada 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• JAPAN
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 56: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 57: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 58: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 59: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 60: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 61: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 62: Japan Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Japan Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 64: Japan 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• CHINA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 65: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 66: China Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 67: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 68: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 69: China Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 70: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 71: China Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 72: China Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 73: China 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• EUROPE
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 74: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 75: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 76: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
  • TABLE 77: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 78: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 79: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 80: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 82: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 83: Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 84: Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 85: Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• FRANCE
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 86: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 87: France Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 88: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 89: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 90: France Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 91: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 92: France Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 93: France Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 94: France 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• GERMANY
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 95: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 97: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 98: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 100: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 101: Germany Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Germany Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 103: Germany 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ITALY
  • TABLE 104: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 105: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 106: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 107: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 108: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 109: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 110: Italy Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 111: Italy Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 112: Italy 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• UNITED KINGDOM
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 113: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 114: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 115: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 116: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 117: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 118: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 119: UK Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 120: UK Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 121: UK 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SPAIN
  • TABLE 122: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 123: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 124: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 125: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 126: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 127: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 128: Spain Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 129: Spain Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 130: Spain 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• RUSSIA
  • TABLE 131: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 132: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 133: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 134: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 135: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 136: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 137: Russia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 138: Russia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 139: Russia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF EUROPE
  • TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 141: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 142: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 144: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 145: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 147: Rest of Europe Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 148: Rest of Europe 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ASIA-PACIFIC
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 150: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 151: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
  • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 153: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 154: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 156: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 157: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 159: Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 160: Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• AUSTRALIA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
  • TABLE 161: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 162: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 163: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 164: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 165: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 166: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 167: Australia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 168: Australia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 169: Australia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• INDIA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
  • TABLE 170: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 171: India Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 172: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 173: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 174: India Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 175: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 176: India Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 177: India Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 178: India 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SOUTH KOREA
  • TABLE 179: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 180: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 181: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 182: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 183: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 184: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 185: South Korea Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 186: South Korea Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 187: South Korea 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF ASIA-PACIFIC
  • TABLE 188: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 189: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 190: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 192: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 195: Rest of Asia-Pacific Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• LATIN AMERICA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
  • TABLE 197: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 198: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 199: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
  • TABLE 200: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 201: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 202: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 203: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 204: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 205: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 206: Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 207: Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 208: Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ARGENTINA
  • TABLE 209: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 210: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 211: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 212: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 213: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 214: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 215: Argentina Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 216: Argentina Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 217: Argentina 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• BRAZIL
  • TABLE 218: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 219: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 220: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 221: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 222: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 223: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 224: Brazil Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 225: Brazil Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 226: Brazil 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• MEXICO
  • TABLE 227: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 228: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 229: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 230: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 231: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 232: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 233: Mexico Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 234: Mexico Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 235: Mexico 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF LATIN AMERICA
  • TABLE 236: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 237: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 238: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 240: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 241: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 243: Rest of Latin America Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 244: Rest of Latin America 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• MIDDLE EAST
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
  • TABLE 245: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 246: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 247: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
  • TABLE 248: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 249: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 250: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 251: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 252: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 253: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 254: Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 255: Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 256: Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• IRAN
  • TABLE 257: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 258: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 259: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 260: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 261: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 262: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 263: Iran Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 264: Iran Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 265: Iran 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• ISRAEL
  • TABLE 266: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 267: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 268: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 269: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 270: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 271: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 272: Israel Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 273: Israel Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 274: Israel 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• SAUDI ARABIA
  • TABLE 275: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 276: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 277: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 279: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 280: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 282: Saudi Arabia Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 283: Saudi Arabia 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• UNITED ARAB EMIRATES
  • TABLE 284: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 285: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 286: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 287: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 288: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 289: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 290: UAE Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 291: UAE Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 292: UAE 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• REST OF MIDDLE EAST
  • TABLE 293: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 294: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 295: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 297: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 298: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 300: Rest of Middle East Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 301: Rest of Middle East 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030
• AFRICA
  • Electronic Board Level Underfill and Encapsulation Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
  • TABLE 302: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 303: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Product Type - Underfills Type and Gob Top Encapsulations Type Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 304: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Product Type - Percentage Breakdown of Value Sales for Underfills Type and Gob Top Encapsulations Type for the Years 2014, 2025 & 2030
  • TABLE 305: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 306: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Board Type - Ball Grid array Board, Flip Chips Board and Chip Scale Package Board Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 307: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Board Type - Percentage Breakdown of Value Sales for Ball Grid array Board, Flip Chips Board and Chip Scale Package Board for the Years 2014, 2025 & 2030
  • TABLE 308: Africa Recent Past, Current & Future Analysis for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 309: Africa Historic Review for Electronic Board Level Underfill and Encapsulation by Material - Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2023 and % CAGR
  • TABLE 310: Africa 16-Year Perspective for Electronic Board Level Underfill and Encapsulation by Material - Percentage Breakdown of Value Sales for Quartz / Silicone Material, Alumina Based Material, Epoxy Based Material, Urethane Based Material, Acrylic Based Material and Other Materials for the Years 2014, 2025 & 2030

IV. COMPETITION