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市場調查報告書
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1676811

PCB封裝市場按產品、材料、固化類型、黏度和應用分類 - 2025-2030 年全球預測

PCB Encapsulation Market by Product, Material, Curing Type, Viscosity, Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 185 Pages | 商品交期: 最快1-2個工作天內

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PCB封裝市場規模在2023年預計為47.8億美元，預計2024年成長至51.5億美元，複合年成長率為7.89%，預計到2030年將達到81.4億美元。

主要市場統計數據
基準年 2023 年 47.8億美元
預計 2024 年 51.5億美元
預測年份 2030 81.4億美元
複合年成長率（%） 7.89％

印刷基板（PCB）封裝市場是技術創新與工業需求的交會點。在當今快速發展的電子領域，封裝過程不僅僅是一種保護手段；它也是支持電子組件的可靠性、性能和壽命的關鍵因素。製造商依靠封裝來保護精密電路免受濕氣、灰塵和機械應力等環境因素的影響，確保其設備即使在惡劣條件下也能如預期運作。

隨著全球工業追求更高的精度和耐用性，封裝技術變得越來越複雜，整合了適用於不同應用的新材料和新方法。該製造業目前正在積極研究和開發，以探索各種保護解決方案。從高性能三防膠到強力黏合劑，當今可用的產品範圍體現了對高科技產業所面臨的挑戰的深刻理解。

本報告將首先闡述​​PCB封裝的全面意義。探索推動產業發展的顯著優勢，包括增強的溫度控管、卓越的耐化學性和增強的機械強度。本次討論以不斷發展的行業趨勢為組裝，旨在幫助經驗豐富的專業人士和新手了解為什麼 PCB封裝是電子製造的基石。

PCB封裝市場的轉型

在當今的市場環境下，PCB封裝的規則正在發生重大變化。小型化、可靠性和性能驅動的世界推動著新的創新解決方案。隨著各行各業都在努力實現先進功能和環境抵抗力之間的微妙平衡，製造商正在採用新穎的封裝方法來直接滿足特定的技術要求。

最近的轉變明顯體現在，人們正積極採用自動化製造程序，以提高封裝精度和一致性。此外，材料科學的技術進步正在推動能夠承受極端溫度變化和腐蝕環境的專門配方的開發。這種演變是由嚴格的市場需求推動的，其中可靠性和擴充性已成為生產週期中不可協商的因素。

此外，全球向永續和生態友善製程的轉變也對封裝領域產生了影響。製造商現在面臨的挑戰不僅在於提供高性能的產品，還要確保生產過程符合嚴格的環境標準。這突破了研發的界限，激發了平衡品質、環保合規性和成本效益的創新。隨著企業將數位技術和預測分析融入生產線以最佳化封裝流程並提高最終產品的質量，該行業正在經歷策略調整。

關鍵細分市場洞察-詳細分析

PCB封裝市場區隔內容豐富，需要採用多方面的方法來研究其成長軌跡和市場動態。從產品角度，我們對各種保護解決方案進行了深入分析，包括三防膠、連接黏合、圍壩和填充物、頂部封裝、底部填充等。這些特定於產品的類別提供了重要的見解，說明不同的封裝方法如何支援更廣泛的電子製造流程。

從材料角度分析，市場材料頻譜繁多，包括丙烯酸樹脂、環氧樹脂、聚氨酯和矽膠。每種材料都具有獨特的性能，包括柔韌性、黏附性、耐熱性和化學穩定性。這些材料對於根據特定應用的需求客製化封裝流程至關重要，確保每個 PCB 元件根據其操作需求獲得最佳保護。

該分析還檢驗了封裝週期的一個關鍵方面：固化過程。根據固化類型，市場細分包括熱固化、室溫固化和紫外線固化製程。每種方法都針對不同的生產環境和周轉時間，並在處理速度和能源效率方面具有獨特的優勢。對固化類型的探索突出了公司如何調整生產技術以滿足產量目標和品質標準。

深入研究基於黏度的分割揭示了材料流動控制在封裝過程中的重要性。考慮的類別包括高、低和中黏度配方。封裝的黏度在決定應用的適用性和最終產品的可靠性方面起著關鍵作用，從而影響封裝模組的整體性能。無論 PCB 佈局的複雜程度如何，只要仔細控制這些屬性就能對基板提供統一的保護。

除了這些技術方面之外，市場還根據應用進行細分。航太和國防、汽車、家用電器、醫療保健、工業設備和通訊等各個工業領域正在推動對 PCB封裝解決方案的需求。對航太和國防部門進行了複雜的分析，涉及航空電子、通訊系統、太空探勘、無人機和武器系統等子類別。每個子子區隔都需要在耐用性和性能之間實現獨特的平衡，從而推動對客製化封裝解決方案的需求。

同樣，在汽車領域，人們重點關注 ADAS（高級駕駛輔助系統）、電動汽車零件、引擎控制單元、資訊娛樂系統和照明系統。這些應用表明，可靠性是效能和安全性的關鍵趨勢。在家用電子電器，封裝市場進一步細分為智慧家居設備、智慧型手機和平板電腦以及穿戴式裝置。因此，多方面的細分分析描繪出了全面的市場圖景，說明了產品類型、材料特性、固化製程、黏度參數和最終用途需求之間的相互作用，同時為相關人員提供了對消費行為、應用需求和未來成長前景的清晰見解。

目錄

第 1 章 簡介

第2章調查方法

第3章執行摘要

第4章 市場概況

第5章 市場洞察

  • 市場動態
    • 驅動程式
      • 全球範圍內自動化和智慧型設備的採用正在增加
      • 電動和混合動力汽車汽車的興起增加了對 PCB 保護的需求
      • 對永續封裝解決方案的監管要求日益提高
    • 限制因素
      • 客製化解決方案的擴充性有限，阻礙了其在各個行業的廣泛採用
    • 機會
      • 利用人工智慧和機器學習在 PCB封裝過程中進行智慧診斷和故障檢測
      • 加大對奈米技術主導的PCB封裝增強技術研究的投資
    • 任務
      • 人們越來越關注封裝材料的可回收性和環境處理
  • 市場區隔分析
    • 產品：使用三防膠來維持導電性
    • 材料：擴大使用丙烯酸塗料來提供對長時間暴露在陽光下的紫外線穩定性。
    • 固化類型：紫外線固化封裝方法因其固化時間短、精度高而受到歡迎。
    • 黏度：強黏附性和優異的保護性正在推動對高黏度封裝的需求。
    • 應用：航太和國防領域採用PCB封裝可確保導航和控制系統的穩定運作。
  • 波特五力分析
  • PESTEL 分析
    • 政治的
    • 經濟
    • 社會
    • 技術的
    • 合法的
    • 環境

第 6 章 PCB封裝市場（按產品）

  • 三防膠
  • 連線綁定
  • 水壩和掩埋
  • 環球頂級
  • 底部填充

第7章 PCB封裝材料市場

  • 丙烯酸纖維
  • 環氧樹脂
  • 聚氨酯
  • 矽膠

第 8 章 PCB封裝市場（依固化類型）

  • 熱固化
  • 室溫固化
  • 紫外線固化

第 9 章 PCB封裝市場（按黏度）

  • 高黏度
  • 低黏度
  • 中等黏度

第 10 章 PCB封裝市場（按應用）

  • 航太和國防
    • 航空電子設備
    • 通訊系統
    • 太空探勘
    • 無人駕駛飛行器
    • 武器系統
  • 車
    • 高級駕駛輔助系統
    • 電動車零件
    • 引擎控制單元
    • 資訊娛樂系統
    • 照明系統
  • 家電
    • 智慧家庭設備
    • 智慧型手機和平板電腦
    • 穿戴式裝置
  • 衛生保健
  • 工業設備
  • 通訊

第 11 章：美洲 PCB封裝市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

12. 亞太地區 PCB封裝市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

13. 歐洲、中東和非洲 PCB封裝市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第14章 競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023 年
  • 競爭情境分析
  • 戰略分析與建議

公司列表

  • 3M Company
  • AI Technology, Inc.
  • Chase Corporation
  • Compagnie de Saint-Gobain SA
  • Dow Inc
  • Dymax Corporation
  • Elantas GmbH by Altana AG
  • Exxon Mobil Corporation
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • Huntsman International LLC
  • Illinois Tool Works Inc.
  • MacDermid Alpha Electronics Solutions
  • Master Bond Inc.
  • Momentive Performance Materials Inc. by KCC CORPORATION
  • Nagase & Co., Ltd
  • Nordson Corporation
  • Panacol-Elosol GmbH by Hoenle Group
  • Parker Hannifin Corporation
  • Robnor ResinLab Ltd
  • Saudi Basic Industries Corporation
  • Scheugenpflug GmbH
  • Sika AG
  • Wacker Chemie AG
  • Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG
Product Code: MRR-9C4233EE76AF

The PCB Encapsulation Market was valued at USD 4.78 billion in 2023 and is projected to grow to USD 5.15 billion in 2024, with a CAGR of 7.89%, reaching USD 8.14 billion by 2030.

KEY MARKET STATISTICS
Base Year [2023] USD 4.78 billion
Estimated Year [2024] USD 5.15 billion
Forecast Year [2030] USD 8.14 billion
CAGR (%) 7.89%

The printed circuit board (PCB) encapsulation market stands at the confluence of technology innovation and industrial necessity. In today's rapidly evolving electronics landscape, the encapsulation process is not merely a protective measure but a critical element that underpins the reliability, performance, and longevity of electronic assemblies. Manufacturers rely on encapsulation to safeguard delicate circuitry from environmental hazards such as moisture, dust, and mechanical stress, ensuring that devices perform as expected even under extreme conditions.

As global industries push toward higher precision and durability, encapsulation technologies have become ever more advanced, integrating novel materials and methods tailored to diverse applications. This realm of manufacturing is now experiencing intensified research and development efforts that explore various protective solutions. From high-performance conformal coatings to robust bonding agents, the portfolio available today reflects a deep understanding of the challenges faced in high-tech industries.

This report begins by framing the overarching significance of PCB encapsulation. It explores the compelling benefits that drive the industry, including enhanced thermal management, superior chemical resistance, and improved mechanical robustness. The discussion is framed within the context of evolving industry trends, ensuring that both seasoned professionals and new entrants understand why PCB encapsulation is a cornerstone in the electronics manufacturing narrative.

Transformative Shifts in the PCB Encapsulation Landscape

In the current market landscape, transformative shifts are redefining the rules of engagement for PCB encapsulation. Emerging innovative solutions are set against the backdrop of a global push for miniaturization, higher reliability, and increased performance. As industries grapple with the delicate balance between advanced functionality and environmental resilience, manufacturers are embracing novel encapsulation approaches that address specific technical requirements head-on.

Recent shifts are evident in the dynamic movement towards increased adoption of automated fabrication processes, which enhance precision and consistency in encapsulation. Furthermore, technological breakthroughs in material science have spurred the development of specialized formulations that cater to extreme temperature variations and corrosive environments. This evolution has been spurred by rigorous market demands, where reliability and scalability have become non-negotiable factors in the production cycle.

Additionally, the global transition towards sustainable and eco-friendly processes is also making its mark on the encapsulation segment. Manufacturers are now tasked with the challenge of not only delivering high-performance products but also ensuring that production processes meet stringent environmental standards. This pushes the boundaries of R&D, stimulating innovations that balance quality, environmental compliance, and cost-effectiveness. The industry is witnessing a strategic realignment, as companies integrate digital technologies and predictive analytics into their production lines to optimize encapsulation processes and improve end-product quality.

Key Segmentation Insights - An In-Depth Analysis

The market for PCB encapsulation is rich with nuanced segmentation, demanding a multi-dimensional approach to study its growth trajectory and market dynamics. From the product perspective, the market analysis delves into various protective solutions such as conformal coatings, connect bonding, dam and fill, glob top, and underfill, all of which cater to diverse technical requirements and operational scenarios. These product-specific categories offer critical insights into how different encapsulation methods support the broader electronics manufacturing process.

When analyzed from a material standpoint, the market is characterized by a broad spectrum that includes acrylic, epoxy, polyurethanes, and silicone. Each material brings its own unique set of properties to the table, contributing to aspects such as flexibility, adhesion, thermal resistance, and chemical stability. These materials prove indispensable in tailoring encapsulation processes to specific application needs, ensuring that each PCB assembly receives optimal protection according to its operational demands.

The analysis further examines the curing process, a vital aspect of the encapsulation cycle. The market segmentation based on curing type includes heat cure, room temperature cure, and UV-cure processes. Each method caters uniquely to varying production environments and turnaround times, and offers distinct advantages in terms of processing speed and energy efficiency. The exploration of curing types highlights how companies are adapting production techniques to meet both production volume targets and quality benchmarks.

A deep dive into viscosity-based segmentation reveals the importance of controlling the material flow during the encapsulation process. Examined categories include high, low, and medium viscosity formulations. The viscosity of the encapsulant plays a key role in determining application suitability and final product reliability, thereby influencing the overall performance of the encapsulated module. Carefully controlling these properties ensures that PCBs are uniformly protected, irrespective of the complexity of their layout.

In addition to these technical facets, the market is also segmented based on application. Various industrial segments including aerospace and defense, automotive, consumer electronics, healthcare, industrial equipment, and telecommunications are driving demand for PCB encapsulation solutions. The aerospace and defense segment is intricately analyzed across subcategories such as avionics, communication systems, space exploration, unmanned aerial vehicles, and weapon systems. Each of these subsegments demands a unique balance of durability and performance, reinforcing the need for tailored encapsulation solutions.

Similarly, within the automotive sphere, the focus extends to advanced driver-assistance systems, electric vehicle components, engine control units, infotainment systems, and lighting systems. These applications underscore a critical trend where reliability is critical to both performance and safety. For consumer electronics, the encapsulation market is further dissected into smart home devices, smartphones and tablets, and wearable devices, reflecting evolving user expectations and the drive for higher integration densities. The multifaceted segmentation analysis thus presents a comprehensive picture of the market, providing stakeholders with clear insights on consumer behavior, application-specific requirements, and future growth prospects while showcasing the interplay between product type, material characteristics, curing process, viscosity parameters, and end-application needs.

Based on Product, market is studied across Conformal Coatings, Connect Bonding, Dam & Fill, Glob Top, and Underfill.

Based on Material, market is studied across Acrylic, Epoxy, Polyurethanes, and Silicone.

Based on Curing Type, market is studied across Heat Cure, Room Temperature Cure, and UV-Cure.

Based on Viscosity, market is studied across High Viscosity, Low Viscosity, and Medium Viscosity.

Based on Application, market is studied across Aerospace & Defense, Automotive, Consumer Electronics, Healthcare, Industrial Equipment, and Telecommunications. The Aerospace & Defense is further studied across Avionics, Communication Systems, Space Exploration, Unmanned Aerial Vehicles, and Weapon Systems. The Automotive is further studied across Advanced Driver-Assistance Systems, Electric Vehicle Components, Engine Control Units, Infotainment Systems, and Lighting Systems. The Consumer Electronics is further studied across Smart Home Devices, Smartphones & Tablets, and Wearable Devices.

Key Regional Insights - A Global Perspective

The PCB encapsulation market exhibits significant regional variations that are reflective of broader economic trends and localized industrial efficiencies. Analyzing the market from a global perspective unveils nuanced differences among diverse regions. In the Americas, mature industrial infrastructures, strong innovation ecosystems, and high-end manufacturing capabilities create a fertile landscape for advanced encapsulation technologies. This region benefits from both a deep reservoir of technical expertise and a well-established network of suppliers and end-users.

Turning attention to the Europe, Middle East & Africa region, a unique confluence of high regulatory standards and rigorous quality checks underlines the uptick in demand for sophisticated encapsulation solutions. In these markets, stringent environmental regulations and an emphasis on product reliability drive the adoption of cutting-edge encapsulation techniques. The region's commitment to sustainable manufacturing further fuels the development of next-generation encapsulation materials and processes that meet stringent safety and performance criteria.

In the dynamic Asia-Pacific market, rapid industrialization, coupled with large-scale production capabilities and a continuously evolving consumer electronics sector, plays a vital role in shaping the demand for PCB encapsulation. Here, the vast production scales and accelerated technological adoption result in an environment where cost-effective yet high-quality encapsulation solutions are in high demand. The diverse industrial footprint in this region, spanning from high-tech consumer devices to critical industrial equipment, reinforces the need for encapsulation strategies that are both robust and versatile.

Together, these regional insights underscore a global market that, while varied, is united by a shared trajectory toward enhanced performance and sustainability in electronics manufacturing. Each region brings distinct competitive advantages to the table, contributing to the overall evolution of encapsulation technologies and presenting unique opportunities for business growth and innovation.

Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across Arizona, California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Key Companies Insights - Industry Leaders in Focus

A critical element influencing the PCB encapsulation market is the presence and strategic initiatives of key industry players. The ecosystem is populated by innovation-driven organizations that continuously push the boundaries of what encapsulation materials and processes can achieve. Among these notable companies, 3M Company stands out with its robust portfolio of advanced materials and sustainable practices. Meanwhile, AI Technology, Inc. and Chase Corporation contribute significantly through agile product development and tailored customer solutions.

Compagnie de Saint-Gobain S.A. and Dow Inc have demonstrated strong capabilities in scaling production to meet the exponential demand for high-quality encapsulation, while Dymax Corporation adds value with its rapid-curing solutions tailored for advanced applications. Elantas GmbH by Altana AG and Exxon Mobil Corporation further enhance the market competitive landscape by offering innovative chemistries that improve the durability and flexibility of encapsulation applications.

H.B. Fuller Company, alongside Henkel AG & Co. KGaA, is recognized for their commitment to quality and reliability, underpinning the development of products that satisfy both performance and regulatory benchmarks. Huntsman International LLC joins this league by offering specialized formulations designed for critical industrial and consumer applications. Illinois Tool Works Inc. and MacDermid Alpha Electronics Solutions reinforce the market through sustained research and the integration of cutting-edge technologies into encapsulation practices.

Master Bond Inc., as well as Momentive Performance Materials Inc. by KCC CORPORATION, contribute to the expansion of the market through their relentless pursuit of innovative, high-performance solutions. Nagase & Co., Ltd and Nordson Corporation further position themselves as pioneers by introducing new methods that streamline production processes without compromising quality. Panacol-Elosol GmbH by Hoenle Group and Parker Hannifin Corporation are at the forefront of driving localized excellence while Robnor ResinLab Ltd and Saudi Basic Industries Corporation give the market a competitive edge with their unique product mixes and specialized materials.

In addition, companies such as Scheugenpflug GmbH and Sika AG exhibit strong global influence through comprehensive study and consistent technology updates, ensuring that encapsulation processes meet evolving industry standards. Complementary to these efforts are Wacker Chemie AG and Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG, whose progressive approaches in materials science and production methodologies serve as benchmarks for innovation and quality across the global supply chain. The collective contributions of these leading companies have not only catalyzed technological advancements in PCB encapsulation but have also set new standards in performance, manufacturing efficiency, and sustainability.

The report delves into recent significant developments in the PCB Encapsulation Market, highlighting leading vendors and their innovative profiles. These include 3M Company, AI Technology, Inc., Chase Corporation, Compagnie de Saint-Gobain S.A., Dow Inc, Dymax Corporation, Elantas GmbH by Altana AG, Exxon Mobil Corporation, H.B. Fuller Company, Henkel AG & Co. KGaA, Huntsman International LLC, Illinois Tool Works Inc., MacDermid Alpha Electronics Solutions, Master Bond Inc., Momentive Performance Materials Inc. by KCC CORPORATION, Nagase & Co., Ltd, Nordson Corporation, Panacol-Elosol GmbH by Hoenle Group, Parker Hannifin Corporation, Robnor ResinLab Ltd, Saudi Basic Industries Corporation, Scheugenpflug GmbH, Sika AG, Wacker Chemie AG, and Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG. Actionable Recommendations for Industry Leaders

For industry leaders aiming to consolidate their position in the PCB encapsulation market, strategic initiatives must be rooted in a thorough understanding of both technical parameters and market dynamics. Companies should invest in research and development to explore advanced material formulations that cater to a broad spectrum of application requirements, including those demanding high thermal resistance, enhanced adhesion, and robust chemical stability. Integrating state-of-the-art curing processes-whether through heat, room temperature, or UV-based methods-can significantly reduce production times while enhancing product reliability.

Strategic partnerships and collaborations, particularly those that bridge technological innovation with manufacturing expertise, are essential. To fully harness the potential of novel encapsulation solutions, companies need to focus on digital integration, leveraging advanced analytics and process automation to optimize production workflows. Embracing predictive maintenance techniques and real-time monitoring can offer insights into process efficiencies, thereby curbing production downtimes and minimizing inefficiencies.

Furthermore, diversification across key market segments is highly recommended. By tailoring offerings to specific industries such as aerospace and defense, automotive, consumer electronics, healthcare, industrial equipment, and telecommunications, industry players can address targeted needs and drive specialized growth. Given the layered nature of segmentation-from product types to curing techniques and viscosity profiles-it is imperative that companies adopt a multi-dimensional strategy that connects technical advancements with end-user requirements.

Investment in sustainable practices, especially in regions with strict regulatory frameworks, should also be prioritized. Leaders must balance profitability with environmental responsibility by implementing eco-friendly packaging solutions and minimizing waste throughout the production cycle. Such initiatives not only bolster a company's reputation but also open avenues for compliance with evolving international standards. Overall, a forward-thinking, agile approach underpinned by technological innovation and market diversification will enable industry leaders to navigate competitive pressures while capitalizing on emerging opportunities.

Conclusion - Summarizing the Strategic Landscape

In conclusion, the PCB encapsulation market is at a pivotal juncture characterized by rapid advancements and evolving industry demands. The comprehensive exploration provided herein outlines the multifaceted nature of market segmentation, spanning a diverse array of product types, material compositions, curing processes, viscosity specifications, and application areas. Each of these dimensions offers vital insights into how encapsulation technologies are adapting to meet both current and future challenges.

The dynamic shifts across regional markets emphasize the global nature of innovation and quality control within the encapsulation domain. Whether in the mature infrastructures of the Americas, the regulated environments of Europe, the diverse markets of the Middle East and Africa, or the expansive production capabilities in the Asia-Pacific, the interplay of local and global factors continues to reshape the encapsulation landscape. Meanwhile, the leadership demonstrated by key companies in the market serves as a testament to the relentless pursuit of excellence, driving innovations that support the growth and resilience of the electronics manufacturing sector.

This report underlines that the fusion of technology, strategic market participation, and operational excellence forms the backbone of future market growth. It is a clarion call for stakeholders to harness the power of data-driven decision-making, invest in cutting-edge R&D, and consolidate efforts to anticipate and adapt to an industry in constant flux. The insights provided herein not only encapsulate the current state of the market but also serve as a roadmap for sustaining long-term competitive advantage.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing adoption of automated and smart devices globally
      • 5.1.1.2. Rising trend of electric vehicles and hybrid vehicles propelling the need for enhanced PCB protection
      • 5.1.1.3. Increasing regulatory requirements regarding sustainable encapsulation solutions
    • 5.1.2. Restraints
      • 5.1.2.1. Limited scalability of customized solutions obstructs widespread application in diverse industries
    • 5.1.3. Opportunities
      • 5.1.3.1. Adopting AI and machine learning for smart diagnostics and fault detection in PCB encapsulation processes
      • 5.1.3.2. Increasing investments in research for nanotechnology-driven PCB encapsulation enhancements
    • 5.1.4. Challenges
      • 5.1.4.1. Rising recyclability and environmental disposal concerns of encapsulation materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Product: Utilization of conformal coatings for maintaining electrical conductivity
    • 5.2.2. Material: Increasing usage of acrylic coatings as it offers UV stability to prolonged sunlight
    • 5.2.3. Curing Type: Growing of UV-cure encapsulation method due to its fast curing time and high precision
    • 5.2.4. Viscosity: Rising demad of high-viscosity encapsulants due to its strong adhesive properties and superior protection
    • 5.2.5. Application: Adoption of PCB encapsulation in aerospace & defense to ensure stable operation of navigation and control systems
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. PCB Encapsulation Market, by Product

  • 6.1. Introduction
  • 6.2. Conformal Coatings
  • 6.3. Connect Bonding
  • 6.4. Dam & Fill
  • 6.5. Glob Top
  • 6.6. Underfill

7. PCB Encapsulation Market, by Material

  • 7.1. Introduction
  • 7.2. Acrylic
  • 7.3. Epoxy
  • 7.4. Polyurethanes
  • 7.5. Silicone

8. PCB Encapsulation Market, by Curing Type

  • 8.1. Introduction
  • 8.2. Heat Cure
  • 8.3. Room Temperature Cure
  • 8.4. UV-Cure

9. PCB Encapsulation Market, by Viscosity

  • 9.1. Introduction
  • 9.2. High Viscosity
  • 9.3. Low Viscosity
  • 9.4. Medium Viscosity

10. PCB Encapsulation Market, by Application

  • 10.1. Introduction
  • 10.2. Aerospace & Defense
    • 10.2.1. Avionics
    • 10.2.2. Communication Systems
    • 10.2.3. Space Exploration
    • 10.2.4. Unmanned Aerial Vehicles
    • 10.2.5. Weapon Systems
  • 10.3. Automotive
    • 10.3.1. Advanced Driver-Assistance Systems
    • 10.3.2. Electric Vehicle Components
    • 10.3.3. Engine Control Units
    • 10.3.4. Infotainment Systems
    • 10.3.5. Lighting Systems
  • 10.4. Consumer Electronics
    • 10.4.1. Smart Home Devices
    • 10.4.2. Smartphones & Tablets
    • 10.4.3. Wearable Devices
  • 10.5. Healthcare
  • 10.6. Industrial Equipment
  • 10.7. Telecommunications

11. Americas PCB Encapsulation Market

  • 11.1. Introduction
  • 11.2. Argentina
  • 11.3. Brazil
  • 11.4. Canada
  • 11.5. Mexico
  • 11.6. United States

12. Asia-Pacific PCB Encapsulation Market

  • 12.1. Introduction
  • 12.2. Australia
  • 12.3. China
  • 12.4. India
  • 12.5. Indonesia
  • 12.6. Japan
  • 12.7. Malaysia
  • 12.8. Philippines
  • 12.9. Singapore
  • 12.10. South Korea
  • 12.11. Taiwan
  • 12.12. Thailand
  • 12.13. Vietnam

13. Europe, Middle East & Africa PCB Encapsulation Market

  • 13.1. Introduction
  • 13.2. Denmark
  • 13.3. Egypt
  • 13.4. Finland
  • 13.5. France
  • 13.6. Germany
  • 13.7. Israel
  • 13.8. Italy
  • 13.9. Netherlands
  • 13.10. Nigeria
  • 13.11. Norway
  • 13.12. Poland
  • 13.13. Qatar
  • 13.14. Russia
  • 13.15. Saudi Arabia
  • 13.16. South Africa
  • 13.17. Spain
  • 13.18. Sweden
  • 13.19. Switzerland
  • 13.20. Turkey
  • 13.21. United Arab Emirates
  • 13.22. United Kingdom

14. Competitive Landscape

  • 14.1. Market Share Analysis, 2023
  • 14.2. FPNV Positioning Matrix, 2023
  • 14.3. Competitive Scenario Analysis
    • 14.3.1. Amber Enterprises partners with Korea Circuit to enhance PCB manufacturing in india
    • 14.3.2. Henkel expanded in India by scaling up its operations by providing advanced adhesives and packaging solutions
    • 14.3.3. Astute Group has launched Astute PCB solutions to provide specialized sourcing services
    • 14.3.4. Dow unveiled the DOWSIL CC-8000 series dual-curable silicone conformal coatings
    • 14.3.5. QMS expands manufacturing capabilities to enhance PCB encapsulation processes
    • 14.3.6. Henkel unveils advanced potting solutions to enhance durability and energy efficiency in automotive electronics
    • 14.3.7. Panacol launched the Vitralit BL UC series epoxy adhesives
    • 14.3.8. Henkel unveiled a solvent-free and UV-curable conformal coating
    • 14.3.9. Swancor enhanced PCB recyclability with eco-friendly epoxy hardener utilizing waste plastics
    • 14.3.10. Robnor ResinLab launched bio-based epoxy resin with sustainability and high thermal conductivity
  • 14.4. Strategy Analysis & Recommendation
    • 14.4.1. Sika AG
    • 14.4.2. Dow Inc.
    • 14.4.3. Chase Corporation
    • 14.4.4. Henkel AG & Co. KGaA

Companies Mentioned

  • 1. 3M Company
  • 2. AI Technology, Inc.
  • 3. Chase Corporation
  • 4. Compagnie de Saint-Gobain S.A.
  • 5. Dow Inc
  • 6. Dymax Corporation
  • 7. Elantas GmbH by Altana AG
  • 8. Exxon Mobil Corporation
  • 9. H.B. Fuller Company
  • 10. Henkel AG & Co. KGaA
  • 11. Huntsman International LLC
  • 12. Illinois Tool Works Inc.
  • 13. MacDermid Alpha Electronics Solutions
  • 14. Master Bond Inc.
  • 15. Momentive Performance Materials Inc. by KCC CORPORATION
  • 16. Nagase & Co., Ltd
  • 17. Nordson Corporation
  • 18. Panacol-Elosol GmbH by Hoenle Group
  • 19. Parker Hannifin Corporation
  • 20. Robnor ResinLab Ltd
  • 21. Saudi Basic Industries Corporation
  • 22. Scheugenpflug GmbH
  • 23. Sika AG
  • 24. Wacker Chemie AG
  • 25. Wurth Elektronik eiSos GmbH & Co. KG by Kisling AG

LIST OF FIGURES

  • FIGURE 1. PCB ENCAPSULATION MARKET MULTI-CURRENCY
  • FIGURE 2. PCB ENCAPSULATION MARKET MULTI-LANGUAGE
  • FIGURE 3. PCB ENCAPSULATION MARKET RESEARCH PROCESS
  • FIGURE 4. PCB ENCAPSULATION MARKET SIZE, 2023 VS 2030
  • FIGURE 5. GLOBAL PCB ENCAPSULATION MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 6. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 7. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2023 VS 2030 (%)
  • FIGURE 13. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2023 VS 2030 (%)
  • FIGURE 15. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 17. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 21. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 22. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 23. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 24. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 25. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 26. PCB ENCAPSULATION MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 27. PCB ENCAPSULATION MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. PCB ENCAPSULATION MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL PCB ENCAPSULATION MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. PCB ENCAPSULATION MARKET DYNAMICS
  • TABLE 7. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONFORMAL COATINGS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONNECT BONDING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY DAM & FILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY GLOB TOP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ACRYLIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY EPOXY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY POLYURETHANES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SILICONE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HEAT CURE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ROOM TEMPERATURE CURE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UV-CURE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 23. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HIGH VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY LOW VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY MEDIUM VISCOSITY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 26. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 28. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AVIONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 29. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY COMMUNICATION SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 30. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SPACE EXPLORATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 31. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY UNMANNED AERIAL VEHICLES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 32. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY WEAPON SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 33. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 34. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 35. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ADVANCED DRIVER-ASSISTANCE SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 36. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ELECTRIC VEHICLE COMPONENTS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 37. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY ENGINE CONTROL UNITS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 38. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 39. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 40. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 41. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 42. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SMART HOME DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 43. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY SMARTPHONES & TABLETS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 44. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY WEARABLE DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 45. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 46. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 47. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY INDUSTRIAL EQUIPMENT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 48. GLOBAL PCB ENCAPSULATION MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 49. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 50. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 51. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 53. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 55. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 56. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 57. AMERICAS PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 58. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 59. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 60. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 61. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 62. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 64. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 65. ARGENTINA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 66. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 67. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 68. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 70. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 71. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 72. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 73. BRAZIL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 74. CANADA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 75. CANADA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. CANADA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. CANADA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 78. CANADA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. CANADA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 80. CANADA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 81. CANADA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 82. MEXICO PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 83. MEXICO PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 84. MEXICO PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. MEXICO PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 86. MEXICO PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. MEXICO PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 88. MEXICO PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 89. MEXICO PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 90. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 91. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 94. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 96. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED STATES PCB ENCAPSULATION MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 99. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 100. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 101. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 103. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 104. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 105. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 106. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 107. ASIA-PACIFIC PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 108. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 109. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 110. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 111. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 112. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 113. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 114. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 115. AUSTRALIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 116. CHINA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 117. CHINA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 118. CHINA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 119. CHINA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 120. CHINA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 121. CHINA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 122. CHINA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 123. CHINA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 124. INDIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 125. INDIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 126. INDIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. INDIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 128. INDIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 129. INDIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 130. INDIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 131. INDIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 132. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 133. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 134. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 136. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 137. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 138. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 139. INDONESIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 140. JAPAN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 141. JAPAN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 142. JAPAN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 143. JAPAN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 144. JAPAN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 145. JAPAN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 146. JAPAN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 147. JAPAN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 148. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 149. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 150. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 151. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 152. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 153. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 154. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 155. MALAYSIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 156. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 157. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 158. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 159. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 160. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 161. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 162. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 163. PHILIPPINES PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 164. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 165. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 166. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 167. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 168. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 169. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 170. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 171. SINGAPORE PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 172. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 173. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 174. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 175. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 176. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 177. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 178. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 179. SOUTH KOREA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 180. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 181. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 182. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 183. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 184. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 185. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 186. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 187. TAIWAN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 188. THAILAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 189. THAILAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 190. THAILAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 191. THAILAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 192. THAILAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 193. THAILAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 194. THAILAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 195. THAILAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 196. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 197. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 198. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 199. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 200. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 201. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 202. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 203. VIETNAM PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 204. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 205. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 206. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 207. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 208. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 209. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 210. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 211. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 212. EUROPE, MIDDLE EAST & AFRICA PCB ENCAPSULATION MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 213. DENMARK PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 214. DENMARK PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 215. DENMARK PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 216. DENMARK PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 217. DENMARK PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 218. DENMARK PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 219. DENMARK PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 220. DENMARK PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 221. EGYPT PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 222. EGYPT PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 223. EGYPT PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 224. EGYPT PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 225. EGYPT PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 226. EGYPT PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 227. EGYPT PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 228. EGYPT PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 229. FINLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 230. FINLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 231. FINLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 232. FINLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 233. FINLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 234. FINLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 235. FINLAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 236. FINLAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 237. FRANCE PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 238. FRANCE PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 239. FRANCE PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 240. FRANCE PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 241. FRANCE PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 242. FRANCE PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 243. FRANCE PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 244. FRANCE PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 245. GERMANY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 246. GERMANY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 247. GERMANY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 248. GERMANY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 249. GERMANY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 250. GERMANY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 251. GERMANY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 252. GERMANY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 253. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 254. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 255. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 256. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 257. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 258. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 259. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 260. ISRAEL PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 261. ITALY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 262. ITALY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 263. ITALY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 264. ITALY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 265. ITALY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 266. ITALY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 267. ITALY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 268. ITALY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 269. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 270. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 271. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 272. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 273. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 274. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 275. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 276. NETHERLANDS PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 277. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 278. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 279. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 280. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 281. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 282. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 283. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 284. NIGERIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 285. NORWAY PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 286. NORWAY PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 287. NORWAY PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 288. NORWAY PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 289. NORWAY PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 290. NORWAY PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 291. NORWAY PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 292. NORWAY PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 293. POLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 294. POLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 295. POLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 296. POLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 297. POLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 298. POLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 299. POLAND PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 300. POLAND PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 301. QATAR PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 302. QATAR PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 303. QATAR PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 304. QATAR PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 305. QATAR PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 306. QATAR PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 307. QATAR PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 308. QATAR PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 309. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 310. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 311. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 312. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 313. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 314. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 315. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 316. RUSSIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 317. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 318. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 319. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 320. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 321. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 322. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 323. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 324. SAUDI ARABIA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 325. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 326. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 327. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 328. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 329. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 330. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 331. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 332. SOUTH AFRICA PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 333. SPAIN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 334. SPAIN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 335. SPAIN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 336. SPAIN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 337. SPAIN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 338. SPAIN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 339. SPAIN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 340. SPAIN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 341. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 342. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 343. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 344. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 345. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 346. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 347. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY AUTOMOTIVE, 2018-2030 (USD MILLION)
  • TABLE 348. SWEDEN PCB ENCAPSULATION MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2030 (USD MILLION)
  • TABLE 349. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY PRODUCT, 2018-2030 (USD MILLION)
  • TABLE 350. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 351. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY CURING TYPE, 2018-2030 (USD MILLION)
  • TABLE 352. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY VISCOSITY, 2018-2030 (USD MILLION)
  • TABLE 353. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 354. SWITZERLAND PCB ENCAPSULATION MARKET SIZE, BY AEROSPACE & DEFENSE, 2018-2030 (USD MILLION)
  • TABLE 355. SWITZERLAND PCB ENCAPS