查看購物車
  • Simplified Chinese
  • English
  • Japanese
封面
市場調查報告書
商品編碼
1775336

半導體封裝材料市場－2025年至2030年的預測

Semiconductor Packaging Material Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 141 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

半導體封裝材料市場預計將從 2025 年的 224.76 億美元成長到 2030 年的 289.53 億美元，複合年成長率為 5.20%。

半導體封裝材料對於保護積體電路 (IC) 和半導體免受腐蝕和環境損害，以及確保晶片連接穩定至關重要。這些材料在汽車、航太、電子、製造和醫療保健等行業中至關重要，是生產流程中的關鍵組成部分。本摘要專為行業專業人士量身定做，重點關注基於 2024 年以後市場發展的半導體封裝材料市場趨勢、促進因素和限制因素。

市場趨勢

半導體封裝材料市場與全球半導體產業緊密相連。製造業、汽車業及相關產業的大量投資推動了快速工業化進程，這是市場成長的主要驅動力。物聯網 (IoT)、機器學習和人工智慧 (AI) 等技術的日益普及預計將對市場發展產生重大影響。智慧型手機、筆記型電腦和電動車 (EV) 等電子產品的需求不斷成長，與半導體市場的擴張直接相關，這對封裝材料產業產生了積極影響。

亞太地區預計將憑藉其主要產業集中、低廉的人事費用、不斷成長的電子設備需求以及持續的技術進步，佔據市場主導地位。然而，該地區也面臨全球半導體晶片短缺和原料成本上漲等挑戰，這些挑戰可能會阻礙未來的成長。

關鍵市場促進因素

1. 自動化程度和工業投資增加

由於物聯網、自動化、人工智慧和雲端基礎軟體的蓬勃發展，全球工業投資正在飆升。這些技術高度依賴半導體晶片，而半導體晶片對汽車、航太和電子等產業至關重要。對耐用、高性能晶片的需求需要先進的封裝材料來確保可靠性和使用壽命。

這一趨勢的關鍵指標是全球機器人密度的上升，其定義為每10,000名產業工人擁有的運作機器人數量。根據國際機器人聯合會的數據，製造業的平均機器人密度達到了創紀錄的水平，每10,000名員工擁有126台機器人。機器人依靠半導體來處理外部數據，隨著自動化程度的提高，預計半導體封裝材料的需求將大幅成長。這一趨勢凸顯了市場樂觀的前景，因為封裝材料對於支援機器人系統中使用的晶片的耐用性和功能性至關重要。

2. 電子設備的廣泛使用

經濟成長正在提高全球可支配收入，從而推動對智慧型手機、筆記型電腦和其他消費性電子產品等電子設備的需求。這些設備嚴重依賴半導體晶片，而半導體晶片需要堅固的封裝材料來保護其免受環境損害。電動車和混合動力汽車的廣泛普及就是這一趨勢的一個顯著例子。電動車需要半導體來管理電池、軟體系統以及實現各種功能，而所有這些功能都必須防腐蝕且可靠。隨著電動車普及率的提高，半導體封裝材料市場可望大幅擴張。

市場限制

1. 全球半導體晶片短缺

持續的全球半導體晶片短缺仍然是封裝材料市場的重大挑戰。高需求與有限供應之間的失衡，加上疫情造成的干擾，對電子和自動化產業帶來了巨大壓力。晶片產量下降直接影響了封裝材料的需求，成為市場成長的瓶頸。儘管市場正在努力恢復，但晶片短缺仍將暫時對半導體封裝材料市場構成風險。

2. 原料成本上漲

原料成本上漲也是主要限制因素。銅價上漲、運輸成本上漲、半導體短缺加劇等因素，導致封裝材料生產成本上升。這些成本壓力可能會降低利潤率，增加製造商的財務負擔，從而限制市場成長。應對這些挑戰需要策略性供應鏈管理和成本最佳化。

本報告的主要優點

  • 深刻分析：獲得涵蓋主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場。
  • 競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
  • 市場趨勢和促進因素：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
  • 可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
  • 適用範圍廣：對於新興企業、科學研究機構、顧問公司、中小企業、大型企業都有利且划算。

它有什麼用途？

產業和市場考量、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

研究範圍

  • 2022 年至 2024 年的歷史數據和 2025 年至 2030 年的預測數據
  • 成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 各細分市場和地區（包括國家）的收益成長和預測分析

公司簡介（策略、產品、財務資訊、主要發展等）

目錄

第1章 引言

  • 市場定義
  • 市場區隔

第2章調查方法

  • 調查數據
  • 先決條件

第3章執行摘要

  • 調查重點

第4章 市場動態

  • 市場促進因素
  • 市場限制
  • 波特五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 業內競爭對手之間的競爭
  • 產業價值鏈分析

第5章半導體封裝材料市場：依類型分析

  • 介紹
  • 有機基材
  • 鍵合線
  • 導線架
  • 陶瓷封裝
  • 晶片黏接材料
  • 其他

第6章半導體封裝材料市場：產業分析

  • 介紹
  • 家電
  • 車
  • 衛生保健
  • 資訊科技/通訊
  • 航太和國防
  • 其他

7. 半導體封裝材料市場技術分析

  • 介紹
  • 網格陣列
  • 小型封裝
  • 四方扁平封裝
  • 雙扁平無引線
  • 單列直插式封裝
  • 雙列直插式封裝
  • 其他

8. 半導體封裝材料市場：區域分析

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 其他
  • 中東和非洲
    • 阿拉伯聯合大公國
    • 南非
    • 以色列
    • 沙烏地阿拉伯
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 澳洲
    • 台灣
    • 韓國
    • 其他

第9章競爭格局及分析

  • 主要企業和策略分析
  • 新興企業和市場盈利
  • 合併、收購、協議和合作
  • 供應商競爭力矩陣

第10章 公司簡介

  • Dow Inc.
  • Henkel AG & Co. KGaA
  • Sumitomo Chemical Co., Ltd.
  • BASF SE
  • Hitachi Chemical Co., Ltd.
  • DuPont de Nemours, Inc.
  • Samsung Electro-Mechanics Co., Ltd.
  • Shin-Etsu Chemical Co., Ltd.
  • LG Chem Ltd.
  • Jiangsu ChangJian Technology Co., Ltd.
簡介目錄
Product Code: KSI061612986

The semiconductor packaging material market is expected to grow from USD 22.476 billion in 2025 to USD 28.953 billion in 2030, at a CAGR of 5.20%.

Semiconductor packaging materials are critical for protecting integrated circuits (ICs) and semiconductors from corrosion and environmental damage, ensuring stable chip connections. These materials are essential across industries such as automotive, aerospace, electronics, manufacturing, and healthcare, forming a vital component of the production process. This summary focuses on market trends, driving factors, and restraints for the semiconductor packaging material market, based on developments from 2024 onward, tailored for industry experts.

Market Trends

The semiconductor packaging material market is closely tied to the global semiconductor industry. Rapid industrialization, fueled by significant investments in manufacturing, automotive, and related sectors, is a primary driver of market growth. The increasing penetration of technologies such as the Internet of Things (IoT), machine learning, and artificial intelligence (AI) is expected to significantly influence market development. The growing demand for electronic gadgets, including smartphones, laptops, and electric vehicles (EVs), directly correlates with the semiconductor market's expansion, positively impacting the packaging material sector.

The Asia-Pacific region is projected to dominate the market due to its concentration of key industries, low labor costs, rising demand for electronics, and ongoing technological advancements. However, the market faces challenges, including a global shortage of semiconductor chips and rising raw material costs, which could hinder growth in the coming years.

Key Market Drivers

1. Rising Automation and Industrial Investment

Global industrial investment is surging, driven by widespread adoption of IoT, automation, AI, and cloud-based software. These technologies rely heavily on semiconductor chips, which are integral to industries like automotive, aerospace, and electronics. The demand for durable, high-performance chips necessitates advanced packaging materials to ensure reliability and longevity.

A key indicator of this trend is the global rise in robot density, defined as the number of operational robots per 10,000 industrial workers. According to the International Federation of Robotics, the average robot density in manufacturing reached a record 126 units per 10,000 employees. Robots depend on semiconductors for processing external data, and as automation continues to grow, the demand for semiconductor packaging materials is expected to increase significantly. This trend underscores the market's positive outlook, as packaging materials are critical for supporting the durability and functionality of chips used in robotic systems.

2. Growing Adoption of Electronic Gadgets

Economic growth has boosted disposable incomes worldwide, leading to higher demand for electronic gadgets such as smartphones, laptops, and other consumer electronics. These devices rely heavily on semiconductor chips, driving the need for robust packaging materials to protect them from environmental damage. The rise in electric and hybrid vehicle adoption is a notable example of this trend. EVs require semiconductors for battery management, software systems, and various functionalities, all of which must be corrosion-free and reliable. As EV adoption grows, the semiconductor packaging material market is well-positioned for significant expansion.

Market Restraints

1. Global Semiconductor Chip Shortage

The ongoing global shortage of semiconductor chips remains a significant challenge for the packaging material market. The imbalance between high demand and limited supply, exacerbated by disruptions from the pandemic, has strained the electronics and automation industries. Reduced chip production directly impacts the demand for packaging materials, creating a bottleneck for market growth. Although recovery efforts are underway, the chip shortage continues to pose a risk to the semiconductor packaging material market in the near term.

2. Rising Raw Material Costs

The increasing cost of raw materials presents another major restraint. Factors such as rising copper prices, elevated shipping costs, and the ongoing semiconductor shortage contribute to higher production costs for packaging materials. These cost pressures could limit market growth by reducing profit margins and increasing the financial burden on manufacturers. Addressing these challenges will require strategic supply chain management and cost-optimization efforts.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries

Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

By Type

  • Organic Substrates
  • Bonding Wires
  • Lead-frames
  • Ceramic Package
  • Die Attach Material
  • Others

By Industry Vertical

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecommunication
  • Aerospace and Defense
  • Others

By Technology

  • Grid Array
  • Small Outline Package
  • Quad Flat Package
  • Dual-flat no-leads
  • Single In-Line Package
  • Dual In-Line Package
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • U.K.
  • Germany
  • France
  • Others
  • Middle East and Africa
  • UAE
  • South Africa
  • Israel
  • Saudi Arabia
  • Others
  • Asia-Pacific
  • China
  • Japan
  • India
  • Australia
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Definition
  • 1.2. Market Segmentation

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Assumptions

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porters Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY TYPE

  • 5.1. Introduction
  • 5.2. Organic Substrates
  • 5.3. Bonding Wires
  • 5.4. Lead-frames
  • 5.5. Ceramic Package
  • 5.6. Die Attach Material
  • 5.7. Others

6. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY INDUSTRY VERTICAL

  • 6.1. Introduction
  • 6.2. Consumer Electronics
  • 6.3. Automotive
  • 6.4. Healthcare
  • 6.5. IT & Telecommunication
  • 6.6. Aerospace and Defense
  • 6.7. Others

7. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY TECHNOLOGY

  • 7.1. Introduction
  • 7.2. Grid Array
  • 7.3. Small Outline Package
  • 7.4. Quad Flat Package
  • 7.5. Dual-flat no-leads
  • 7.6. Single In-Line Package
  • 7.7. Dual In-Line Package
  • 7.8. Others

8. SEMICONDUCTOR PACKAGING MATERIAL MARKET ANALYSIS, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. U.K.
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Others
  • 8.5. Middle East and Africa
    • 8.5.1. UAE
    • 8.5.2. South Africa
    • 8.5.3. Israel
    • 8.5.4. Saudi Arabia
    • 8.5.5. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. Japan
    • 8.6.3. India
    • 8.6.4. Australia
    • 8.6.5. Taiwan
    • 8.6.6. South Korea
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Emerging Players and Market Lucrativeness
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

  • 10.1. Dow Inc.
  • 10.2. Henkel AG & Co. KGaA
  • 10.3. Sumitomo Chemical Co., Ltd.
  • 10.4. BASF SE
  • 10.5. Hitachi Chemical Co., Ltd.
  • 10.6. DuPont de Nemours, Inc.
  • 10.7. Samsung Electro-Mechanics Co., Ltd.
  • 10.8. Shin-Etsu Chemical Co., Ltd.
  • 10.9. LG Chem Ltd.
  • 10.10. Jiangsu ChangJian Technology Co., Ltd.