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半導體封裝材料市場：按類型、封裝技術、功能和應用 - 2025-2030 年全球預測

Semiconductor Packaging Materials Market by Type, Packaging Technology, Functionality, Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 187 Pages | 商品交期: 最快1-2個工作天內

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2024年半導體封裝材料市值為421.8億美元，預計2025年將成長至464.4億美元，複合年成長率為10.38%，預計2030年將達763億美元。

主要市場統計數據
基準年2024年 421.8億美元
預計2025年 464.4億美元
預測年份 2030 763億美元
複合年成長率（%） 10.38%

半導體封裝材料是現代電子設備性能、可靠性和使用壽命的基石。隨著晶片尺寸不斷縮小，對功率密度和數據吞吐量的要求越來越高，先進的鍵合線、封裝、基板和熱感界面材料變得比以往任何時候都更加重要。這些材料不僅可以保護精密的晶粒結構免受機械和環境應力的影響，還可以促進關鍵的電氣互連和散熱路徑。

近年來，封裝微型化、異質整合和先進節點微縮的進步，迫使材料科學家和封裝工程師比以往任何時候都更加緊密地合作。從高導電性銅鍵合線取代傳統金線，到低應力晶粒間黏合劑的開發，材料化學和製程的每一次創新都為裝置可靠性和產量比率帶來了顯著的提升。此外，製造商被迫在性能改進與環保合規之間取得平衡，引發了對環保樹脂和無鹵素基板的研究熱潮。

本介紹將為深入探討變革性轉變、監管影響、細分市場細微差別、區域促進因素以及競爭策略奠定基礎，這些因素共同決定了半導體封裝材料市場的動態格局。了解這些基本要素有助於相關人員預測市場需求並做出明智的決策，從而在技術快速進步的時代保持組織持續成長。

解讀由先進封裝材料、整合趨勢和永續實踐推動的半導體封裝格局變化

在新型整合架構和下一代元件需求的推動下，半導體封裝材料領域正在經歷重大變革時期。扇出型晶圓級封裝和2.5D/3D整合等先進封裝方法正在重新定義基板、底部填充材料和熱感界面化合物的作用。隨著系統級封裝解決方案的日益普及，材料供應商面臨著設計出能夠適應更緊密間距互連、更高動作溫度和更大機械應力且同時不影響訊號完整性的配方的挑戰。

評估美國關稅對2025年後半導體封裝材料供應鏈、成本結構和創新策略的深遠影響

隨著2025年新關稅的實施，美國正在重塑全球半導體供應鏈，對封裝材料的進出口流動造成巨大壓力。這些關稅的累積影響迫使製造商重新評估籌資策略，優先考慮在地採購，並調整成本結構以維持淨利率。例如，先前依賴跨境運輸貴金屬合金的接合線製造商正在加速北美地區的產能擴張，以減輕關稅的影響。

對材料類型、包裝技術、功能和最終用途應用的詳細洞察揭示了核心市場動態

要了解半導體封裝材料市場，需要全面了解驅動需求和塑造創新的多個交叉細分領域。從材料類型的角度檢驗市場，可以發現鍵合線、晶片黏接材料、封裝、導線架、封裝、焊球、基板和熱感界面材料在確保裝置性能方面各自發揮獨特的作用。在封裝類別中，陶瓷、玻璃、金屬和塑膠封裝的專用變體可滿足從高溫穩定性到成本最佳化的家用電子電器等各種獨特的應用需求。

全面的區域分析，重點介紹美洲、歐洲、中東和非洲地區以及亞太市場的獨特成長動力和材料創新

由於產業政策、終端市場需求以及特定區域供應鏈生態系統的變化，區域動態對半導體封裝材料的發展有重大動態。在美洲，對國內半導體製造產能的強勁投資正在刺激用於先進邏輯和記憶體產品的基板、焊球和熱感界面材料的成長。為體現國家的戰略重點，北美市場特別重視近淨導線架和阻燃封裝，以支援汽車電氣化以及航太和國防合約。

領先的半導體封裝材料供應商推動創新：競爭策略和永續解決方案

半導體封裝材料領域的領先公司展現出多樣化的策略方針，從積極的創新管道到與OSAT供應商和半導體製造商的有針對性的合作。一些公司憑藉在高可靠性晶片黏接材料和專為汽車和航太應用設計的底部填充化合物方面的開創性工作而脫穎而出。對品質系統和嚴格認證流程的深度投資，使他們能夠與頂級目標商標產品製造商達成長期供應協議。

為行業領導者提供策略建議，以利用先進的封裝技術、供應鏈彈性和永續材料的採用

為了因應不斷變化的半導體封裝材料格局，產業領導者必須採取多管齊下的策略，平衡創新與營運韌性。首先，在從原料供應商到最終用戶的價值鏈上建立合作夥伴關係，可以加速下一代化合物和加工方法的共同創造。共同開發契約可以簡化資格確認週期，並確保材料性能與新興封裝架構精確匹配。

我們嚴謹的調查方法結合了初步研究、二手資料分析和專家檢驗，以提供強大的市場洞察。

本次市場分析所採用的調查方法融合了原始資料和二手資料，並採用嚴格的檢驗流程和三角測量技術，以確保研究的準確性和深度。原始資料研究包括對領先半導體和OSAT公司的材料科學家、封裝工程師、採購負責人和高級負責人的深入訪談。這些討論提供了新興材料挑戰、合格障礙和最佳化重點的第一手見解。

半導體封裝材料市場趨勢的整合策略議程和相關人員藍圖預示著未來機會

半導體封裝材料領域正處於關鍵的十字路口，受技術創新和地緣政治格局調整的雙重影響。從扇出型晶圓級封裝到3D異質整合，先進的封裝架構正在推動對特種樹脂、高性能基板和下一代熱感界面材料前所未有的需求。同時，不斷變化的貿易政策和關稅制度迫使企業重新評估其供應鏈策略，優先考慮區域多元化，並加速本地產能擴張。

目錄

第1章：前言

第2章調查方法

第3章執行摘要

第4章 市場概述

第5章市場動態

  • 人工智慧和機器學習的進步推動半導體封裝材料的創新
  • 採用扇出型晶圓級封裝，實現超高密度互連
  • 先進功率元件封裝對高導熱基板的需求不斷增加
  • 增加對下一代半導體封裝材料的研發投入
  • 異質材料整合支援下一代3D晶片堆疊
  • 消費性電子產品擴張增加半導體封裝材料需求
  • 日益嚴格的環境法規推動半導體封裝材料變革
  • 旋塗低k介電材料的出現，降低了高速晶片的層間電容
  • 超細間距晶片互連微凸塊製造技術的進展
  • 更重視導熱材料創新，以管理人工智慧加速器的功率密度

第6章 市場洞察

  • 波特五力分析
  • PESTEL分析

第7章 2025年美國關稅的累積影響

8. 半導體封裝材料市場（依類型）

  • 鍵合線
  • 晶片黏接材料
  • 封裝樹脂
  • 導線架
  • 包裹
    • 陶瓷
    • 玻璃
    • 金屬
    • 塑膠
  • 焊球
  • 基材
  • 導熱材料

9.半導體封裝材料市場封裝技術

  • 3D/2.5D封裝
  • 球柵陣列（BGA）
  • 板載晶片(CoB)
  • 扇出型晶圓級封裝 (FOWLP)
  • 覆晶構裝
  • 系統級封裝(SiP)
  • 引線鍵合封裝

第 10 章半導體封裝材料市場（依功能）

  • 電氣互連
  • 機械保護
  • 防潮環保
  • 溫度控管

第11章半導體封裝材料市場（依應用）

  • 航太和國防
  • 車
  • 家電
  • 醫療保健和醫療設備
  • 工業自動化
  • 資訊科技/通訊

12.美洲半導體封裝材料市場

  • 美國
  • 加拿大
  • 墨西哥
  • 巴西
  • 阿根廷

13.歐洲、中東和非洲半導體封裝材料市場

  • 英國
  • 德國
  • 法國
  • 俄羅斯
  • 義大利
  • 西班牙
  • 阿拉伯聯合大公國
  • 沙烏地阿拉伯
  • 南非
  • 丹麥
  • 荷蘭
  • 卡達
  • 芬蘭
  • 瑞典
  • 奈及利亞
  • 埃及
  • 土耳其
  • 以色列
  • 挪威
  • 波蘭
  • 瑞士

14.亞太半導體封裝材料市場

  • 中國
  • 印度
  • 日本
  • 澳洲
  • 韓國
  • 印尼
  • 泰國
  • 菲律賓
  • 馬來西亞
  • 新加坡
  • 越南
  • 台灣

第15章競爭格局

  • 2024年市場佔有率分析
  • 2024年FPNV定位矩陣
  • 競爭分析
    • 3M Company
    • Amkor Technology, Inc.
    • DuPont de Nemours, Inc.
    • FUJIFILM Holdings Corporation
    • Henkel AG & Co. KGaA
    • Heraeus Group
    • Honeywell International Inc.
    • Indium Corporation
    • JSR Corporation
    • LG Chem Ltd.
    • Merck KGaA
    • Nan Ya PCB Co. Ltd.
    • Shin Etsu Chemical Co., Ltd.
    • Sumitomo Chemical Co., Ltd.
    • Parker-Hannifin Corporation
    • Tokyo Ohka Kogyo Co., Ltd.
    • The Dow Chemical Company
    • Toray Industries, Inc.
    • KCC Corporation
    • TANAKA PRECIOUS METAL GROUP Co., Ltd.
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • KYOCERA Corporation
    • AGC Inc.
    • Unimicron Technology Corp.
    • IBIDEN Co., Ltd.
    • KOA Corporation

第16章 研究人工智慧

第17章 研究統計

第18章 研究聯絡人

第19章 研究報導

第20章 附錄

Product Code: MRR-957C47F929D9

The Semiconductor Packaging Materials Market was valued at USD 42.18 billion in 2024 and is projected to grow to USD 46.44 billion in 2025, with a CAGR of 10.38%, reaching USD 76.30 billion by 2030.

KEY MARKET STATISTICS
Base Year [2024] USD 42.18 billion
Estimated Year [2025] USD 46.44 billion
Forecast Year [2030] USD 76.30 billion
CAGR (%) 10.38%

Semiconductor packaging materials form the invisible bedrock upon which modern electronic devices deliver performance, reliability, and longevity. As chips continue to shrink in geometry while simultaneously demanding higher power densities and faster data throughput, the importance of advanced bonding wires, encapsulation resins, substrates, and thermal interface materials has never been greater. These materials not only protect delicate die structures from mechanical and environmental stresses but also facilitate crucial electrical interconnections and heat dissipation pathways.

In recent years, the evolution of package miniaturization, heterogeneous integration, and advanced node scaling has driven material scientists and packaging engineers to collaborate more closely than ever before. From the emergence of high-conductivity copper bond wires replacing traditional gold to the development of low-stress die attach adhesives, each incremental innovation in materials chemistry and processing delivers outsized benefits in device reliability and yield. Moreover, manufacturers are under increasing pressure to balance performance gains with environmental compliance, leading to a surge in research on eco-friendly resins and halogen-free substrates.

This introduction sets the stage for a deeper exploration of transformative shifts, regulatory impacts, segmentation nuances, regional drivers, and competitive strategies that collectively define the dynamic landscape of semiconductor packaging materials. By understanding these foundational elements, stakeholders can make informed decisions that anticipate market needs and position their organizations for sustained growth in an era defined by rapid technological advancement.

Decoding the Transformative Shifts in Semiconductor Packaging Landscape Fueled by Advanced Materials, Integration Trends, and Sustainable Practices

The semiconductor packaging materials landscape is undergoing a profound transformation driven by emerging integration architectures and next-generation device requirements. Advanced packaging approaches, such as fan-out wafer-level packaging and 2.5D/3D integration, are redefining the role of substrates, underfill materials, and thermal interface compounds. As system-in-package solutions gain traction, material suppliers are challenged to engineer formulations that accommodate tighter pitch interconnects, higher operating temperatures, and increased mechanical stresses without compromising signal integrity.

Simultaneously, the convergence of consumer electronics, automotive electrification, and industrial automation is broadening the application spectrum. Thermal management materials, once confined to high-end computing, are now critical in electric vehicle power modules and 5G telecommunications infrastructure. This shift has accelerated demand for thermal interface materials with enhanced thermal conductivity and reduced thermal resistance, prompting vendors to explore novel additives like graphene and liquid metals.

Furthermore, sustainability imperatives are reshaping material selection and processing workflows. Regulatory initiatives banning certain flame retardants and heavy metals have catalyzed the development of halogen-free encapsulation resins and lead-free solder alloys. In response, packaging material manufacturers are investing heavily in green chemistry and circular economy principles to ensure compliance and minimize environmental footprints. Taken together, these transformative shifts underscore the growing complexity and opportunity inherent in the semiconductor packaging materials market.

Assessing the Far-reaching Effects of U.S. Tariffs on Semiconductor Packaging Materials Supply Chains, Cost Structures, and Innovation Strategies Post-2025

With the introduction of new tariff measures in 2025, the United States has reshaped the global semiconductor supply chain, placing significant pressures on packaging materials import and export flows. The cumulative impact of these duties has compelled manufacturers to reevaluate sourcing strategies, prioritize local procurement, and adapt cost structures to maintain margins. For instance, bonding wire producers that previously relied on cross-border shipments of precious metal alloys have accelerated capacity expansions within North America to mitigate tariff exposure.

In parallel, companies are forging partnerships with domestic substrate and laminate suppliers to safeguard against border delays and escalating input costs. While short-term adjustments have included passing incremental price increases downstream, longer-term strategies emphasize vertical integration, co-development agreements, and regional manufacturing hubs. These adaptations not only address immediate cost implications but also align with broader national objectives to fortify critical semiconductor infrastructure.

Moreover, the tariff-driven realignment has triggered second-order effects on research and development. Packaging material formulators are now prioritizing the use of more readily available base resins and flame retardants to reduce reliance on restricted components. This shift has ignited greater collaboration between material science teams and procurement departments to ensure innovation roadmaps remain insulated from geopolitical volatility. As the industry navigates this new landscape, resilience and agility will remain paramount to balancing competitive positioning with regulatory compliance.

In-depth Insights Across Material Types Packaging Technologies Functionalities and End-Use Applications Revealing Core Market Dynamics

Understanding the semiconductor packaging materials market requires a holistic view of multiple intersecting segments that drive demand and shape innovation. When examining the market through the lens of material type, it becomes clear that bonding wires, die attach materials, encapsulation resins, leadframes, packages, solder balls, substrates, and thermal interface materials each play distinct roles in ensuring device performance. Within the package category, specialized variants such as ceramics, glass, metal, and plastic packages address unique application requirements ranging from high-temperature stability to cost-optimized consumer electronics.

Turning to packaging technology, the landscape encompasses 3D and 2.5D integration architectures as well as established formats like ball grid array, chip-on-board, fan-out wafer-level packaging, flip chip packaging, system-in-package, and wire bond packaging. Each of these technologies imposes specific material demands, whether it be underfill chemistries to bridge micro-bumps or solder formulations engineered for fine pitch connections.

From a functionality standpoint, materials are purpose-built for electrical interconnection, mechanical protection, moisture and environmental resistance, or thermal management. The interplay between these functional requirements often dictates multi-layered solutions where a single compound must deliver several performance attributes in tandem. Finally, the application dimension spans aerospace and defense, automotive, consumer electronics, healthcare and medical devices, industrial automation, and information technology and telecommunications. As end markets evolve, packaging materials suppliers continually refine their portfolios to address the stringent qualification standards and lifecycle demands of each use case.

By synthesizing insights across type, technology, functionality, and application, stakeholders can identify high-impact areas for innovation, optimize product roadmaps, and tailor go-to-market approaches that resonate with specific customer requirements and regulatory frameworks.

Comprehensive Regional Analysis Highlighting Unique Growth Drivers and Material Innovations Across Americas EMEA and Asia-Pacific Markets

Regional dynamics exert a powerful influence on semiconductor packaging materials development, driven by variations in industrial policy, end-market demand, and localized supply chain ecosystems. In the Americas, robust investments in domestic semiconductor fabrication capacities have stimulated growth in substrates, solder balls, and thermal interface materials tailored for advanced logic and memory products. The North American market has placed particular emphasis on near-net-shape leadframes and flame-retardant encapsulation resins to support automotive electrification and aerospace defense contracts, reflecting strategic national priorities.

Meanwhile, the Europe, Middle East, and Africa region has demonstrated a balanced approach, combining stringent environmental regulations with targeted industrial incentives. This confluence has fostered demand for halogen-free encapsulants and mechanically robust packages, especially in applications related to renewable energy infrastructure and telecommunications networks. Suppliers in this region often leverage close proximity to key automotive and industrial automation customers to co-develop specialized materials that meet exacting reliability standards.

Across Asia-Pacific, manufacturing scale and cost competitiveness continue to drive the adoption of advanced packaging formats like fan-out wafer-level packaging and flip chip solutions. Countries such as Taiwan, South Korea, Japan, and China collectively host a dense network of OSAT facilities, substrate manufacturers, and material formulators collaborating to accelerate time-to-market for emerging technologies. In response, material suppliers have established regional R&D centers and strategic partnerships to ensure rapid iteration cycles and efficient logistical support for high-volume production.

Highlighting Leading Suppliers of Semiconductor Packaging Materials Driving Innovation Competitive Strategies and Sustainable Solutions

Leading players in the semiconductor packaging materials arena demonstrate diverse strategic approaches, from aggressive innovation pipelines to targeted collaborations with OSAT providers and semiconductor manufacturers. Some firms have distinguished themselves through pioneering work in high-reliability die attach materials and underfill compounds specifically engineered for automotive and aerospace applications. Their deep investment in quality systems and rigorous qualification processes has enabled them to secure long-term supply agreements with tier-one original equipment manufacturers.

Other organizations have focused on broadening their material portfolios to include both substrate laminates and advanced thermal interface solutions, effectively offering end-to-end packaging packages. By integrating vertical capabilities, these companies can deliver cost-efficient, high-performance solutions that address the dual imperatives of miniaturization and heat dissipation. Strategic acquisitions and joint ventures have been instrumental for many of these leaders, allowing them to rapidly incorporate niche technologies-such as nano-enhanced fillers and low-k dielectric formulations-into their standard offerings.

A third cohort of firms has built their competitive edge on sustainability credentials, prioritizing the development of halogen-free, lead-free, and low-VOC chemistries that anticipate tightening global regulations. These companies often engage in consortium-based research initiatives with academic institutions and government agencies to validate new materials and processing techniques. By positioning themselves at the forefront of green packaging solutions, they not only meet customer expectations but also unlock preferential access to regulated markets and public-sector contracts.

Strategic Recommendations for Industry Leaders to Capitalize on Advanced Packaging Technologies, Supply Chain Resilience, and Sustainable Materials Adoption

To navigate the evolving semiconductor packaging materials landscape, industry leaders must adopt a multifaceted strategy that balances innovation with operational resilience. First, forging collaborative partnerships across the value chain-from raw material providers to end-use customers-will accelerate the co-creation of next-generation compounds and processing methods. Joint development agreements can streamline qualification cycles and ensure that material performance aligns precisely with emerging packaging architectures.

Second, investing in regional manufacturing and R&D hubs will mitigate geopolitical risk and tariff-driven cost fluctuations. By diversifying production footprints across North America, EMEA, and Asia-Pacific, companies can maintain continuity of supply while capitalizing on local incentives and logistical efficiencies. This geographic agility will also facilitate faster market entry for novel materials designed to meet region-specific regulatory requirements.

Third, sustainability must be elevated from compliance exercise to competitive differentiator. Leaders should set ambitious targets for halogen-free content, carbon footprint reduction, and circularity in packaging materials. Transparent reporting and third-party certifications will not only enhance brand reputation but also resonate with environmentally conscious OEMs and governmental bodies.

Finally, embedding advanced digital tools-such as predictive analytics, digital twins of production lines, and AI-driven quality monitoring-will enhance process control and reduce time-to-market. These technologies enable real-time insights into material performance, yield optimization, and supply chain disruptions, empowering decision-makers to respond swiftly to evolving demands.

Rigorous Research Methodology Combining Primary Interviews Secondary Data Analysis and Expert Validation to Deliver Robust Market Insights

The research methodology underpinning this market analysis combines primary and secondary data sources, rigorous validation processes, and triangulation techniques to ensure accuracy and depth. Primary research included in-depth interviews with material scientists, packaging engineers, procurement executives, and senior strategists at leading semiconductor and OSAT companies. These discussions provided firsthand perspectives on emerging material challenges, qualification hurdles, and optimization priorities.

Secondary research involved a comprehensive review of industry journals, technical white papers, regulatory filings, and patent databases to map trends in material formulations, process innovations, and environmental compliance measures. In addition, conference proceedings and standards committee reports offered valuable insights into evolving best practices and future roadmap projections.

Data from these primary and secondary channels were synthesized through triangulation, cross-referencing quantitative input with qualitative feedback to resolve discrepancies and reinforce findings. An expert validation step engaged a panel of packaging technologists and market analysts to critique draft conclusions, ensuring that the final narrative reflects both technical feasibility and commercial viability.

This multi-layered approach delivers a robust framework that captures the complexities of semiconductor packaging materials, from raw material sourcing through to end-user applications. By adhering to stringent methodological standards, the report equips stakeholders with reliable, actionable intelligence.

Synthesis of Semiconductor Packaging Materials Market Trends Underscoring Future Opportunities Strategic Imperatives and Stakeholder Roadmaps

The semiconductor packaging materials domain stands at a pivotal crossroads, shaped by the dual forces of technological innovation and geopolitical realignment. Advanced integration architectures-spanning from fan-out wafer-level packaging to 3D heterogeneous integration-are driving unprecedented demands for specialized resins, high-performance substrates, and next-generation thermal interface materials. Meanwhile, evolving trade policies and tariff regimes have prompted organizations to rethink supply chain strategies, emphasize regional diversification, and accelerate local capacity expansions.

Segmentation analysis reveals that demand patterns vary significantly across type, technology, functionality, and application, underscoring the necessity for tailored product roadmaps. Regional dynamics further complicate the landscape, with North America focusing on automotive and aerospace demands, EMEA prioritizing environmental compliance, and Asia-Pacific leveraging scale to optimize cost structures.

In this dynamic environment, companies that combine deep technical expertise with agile manufacturing footprints and sustainability credentials will be best positioned to capture growth opportunities. Through strategic collaborations, digitalization, and rigorous material qualification processes, stakeholders can navigate uncertainty and meet the stringent performance requirements of tomorrow's electronic systems.

As the industry continues to evolve, this report serves as a comprehensive guide, distilling critical insights and offering a strategic blueprint for firms seeking to strengthen their competitive edge in semiconductor packaging materials.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. Market Sizing & Forecasting

5. Market Dynamics

  • 5.1. AI and machine learning advancements fueling innovation in semiconductor packaging materials
  • 5.2. Adoption of fan-out wafer level packaging to enable ultra high density interconnects
  • 5.3. Rising demand for high thermal conductivity substrates in advanced power device packaging
  • 5.4. Increasing R&D investments in next-generation semiconductor packaging materials
  • 5.5. Integration of heterogeneous materials to support next generation 3D chip stacking
  • 5.6. Increasing demand for semiconductor packaging materials due to the expansion of consumer electronics
  • 5.7. Increasing environmental regulations reshape semiconductor packaging materials
  • 5.8. Emergence of spin-on low-k dielectric materials for reduced interlayer capacitance in high speed chips
  • 5.9. Advancements in microbump fabrication techniques for ultra fine pitch chiplet interconnections
  • 5.10. Growing focus on thermal interface material innovations to manage power density in AI accelerators

6. Market Insights

  • 6.1. Porter's Five Forces Analysis
  • 6.2. PESTLE Analysis

7. Cumulative Impact of United States Tariffs 2025

8. Semiconductor Packaging Materials Market, by Type

  • 8.1. Introduction
  • 8.2. Bonding Wires
  • 8.3. Die Attach Materials
  • 8.4. Encapsulation Resins
  • 8.5. Leadframes
  • 8.6. Packages
    • 8.6.1. Ceramics
    • 8.6.2. Glass
    • 8.6.3. Metal
    • 8.6.4. Plastic
  • 8.7. Solder Balls
  • 8.8. Substrates
  • 8.9. Thermal Interface Materials

9. Semiconductor Packaging Materials Market, by Packaging Technology

  • 9.1. Introduction
  • 9.2. 3D/2.5D Packaging
  • 9.3. Ball Grid Array (BGA)
  • 9.4. Chip-on-Board (CoB)
  • 9.5. Fan-Out Wafer-Level Packaging (FOWLP)
  • 9.6. Flip Chip Packaging
  • 9.7. System-in-Package (SiP)
  • 9.8. Wire Bond Packaging

10. Semiconductor Packaging Materials Market, by Functionality

  • 10.1. Introduction
  • 10.2. Electrical Interconnection
  • 10.3. Mechanical Protection
  • 10.4. Moisture & Environmental Protection
  • 10.5. Thermal Management

11. Semiconductor Packaging Materials Market, by Application

  • 11.1. Introduction
  • 11.2. Aerospace & Defence
  • 11.3. Automotive
  • 11.4. Consumer Electronics
  • 11.5. Healthcare & Medical Devices
  • 11.6. Industrial Automation
  • 11.7. IT & Telecommunications

12. Americas Semiconductor Packaging Materials Market

  • 12.1. Introduction
  • 12.2. United States
  • 12.3. Canada
  • 12.4. Mexico
  • 12.5. Brazil
  • 12.6. Argentina

13. Europe, Middle East & Africa Semiconductor Packaging Materials Market

  • 13.1. Introduction
  • 13.2. United Kingdom
  • 13.3. Germany
  • 13.4. France
  • 13.5. Russia
  • 13.6. Italy
  • 13.7. Spain
  • 13.8. United Arab Emirates
  • 13.9. Saudi Arabia
  • 13.10. South Africa
  • 13.11. Denmark
  • 13.12. Netherlands
  • 13.13. Qatar
  • 13.14. Finland
  • 13.15. Sweden
  • 13.16. Nigeria
  • 13.17. Egypt
  • 13.18. Turkey
  • 13.19. Israel
  • 13.20. Norway
  • 13.21. Poland
  • 13.22. Switzerland

14. Asia-Pacific Semiconductor Packaging Materials Market

  • 14.1. Introduction
  • 14.2. China
  • 14.3. India
  • 14.4. Japan
  • 14.5. Australia
  • 14.6. South Korea
  • 14.7. Indonesia
  • 14.8. Thailand
  • 14.9. Philippines
  • 14.10. Malaysia
  • 14.11. Singapore
  • 14.12. Vietnam
  • 14.13. Taiwan

15. Competitive Landscape

  • 15.1. Market Share Analysis, 2024
  • 15.2. FPNV Positioning Matrix, 2024
  • 15.3. Competitive Analysis
    • 15.3.1. 3M Company
    • 15.3.2. Amkor Technology, Inc.
    • 15.3.3. DuPont de Nemours, Inc.
    • 15.3.4. FUJIFILM Holdings Corporation
    • 15.3.5. Henkel AG & Co. KGaA
    • 15.3.6. Heraeus Group
    • 15.3.7. Honeywell International Inc.
    • 15.3.8. Indium Corporation
    • 15.3.9. JSR Corporation
    • 15.3.10. LG Chem Ltd.
    • 15.3.11. Merck KGaA
    • 15.3.12. Nan Ya PCB Co. Ltd.
    • 15.3.13. Shin Etsu Chemical Co., Ltd.
    • 15.3.14. Sumitomo Chemical Co., Ltd.
    • 15.3.15. Parker-Hannifin Corporation
    • 15.3.16. Tokyo Ohka Kogyo Co., Ltd.
    • 15.3.17. The Dow Chemical Company
    • 15.3.18. Toray Industries, Inc.
    • 15.3.19. KCC Corporation
    • 15.3.20. TANAKA PRECIOUS METAL GROUP Co., Ltd.
    • 15.3.21. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 15.3.22. KYOCERA Corporation
    • 15.3.23. AGC Inc.
    • 15.3.24. Unimicron Technology Corp.
    • 15.3.25. IBIDEN Co., Ltd.
    • 15.3.26. KOA Corporation

16. ResearchAI

17. ResearchStatistics

18. ResearchContacts

19. ResearchArticles

20. Appendix

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024 VS 2030 (%)
  • FIGURE 6. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2030 (%)
  • FIGURE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2024 VS 2030 (%)
  • FIGURE 10. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 11. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2030 (%)
  • FIGURE 12. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 14. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2024 VS 2030 (%)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 19. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 20. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 21. SEMICONDUCTOR PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2024
  • FIGURE 22. SEMICONDUCTOR PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2024
  • FIGURE 23. SEMICONDUCTOR PACKAGING MATERIALS MARKET: RESEARCHAI
  • FIGURE 24. SEMICONDUCTOR PACKAGING MATERIALS MARKET: RESEARCHSTATISTICS
  • FIGURE 25. SEMICONDUCTOR PACKAGING MATERIALS MARKET: RESEARCHCONTACTS
  • FIGURE 26. SEMICONDUCTOR PACKAGING MATERIALS MARKET: RESEARCHARTICLES

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
  • TABLE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2024 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2025-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CERAMICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CERAMICS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY GLASS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY GLASS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY METAL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY METAL, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PLASTIC, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PLASTIC, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SUBSTRATES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SUBSTRATES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY 3D/2.5D PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY 3D/2.5D PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BALL GRID ARRAY (BGA), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BALL GRID ARRAY (BGA), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CHIP-ON-BOARD (COB), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CHIP-ON-BOARD (COB), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FAN-OUT WAFER-LEVEL PACKAGING (FOWLP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FAN-OUT WAFER-LEVEL PACKAGING (FOWLP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FLIP CHIP PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FLIP CHIP PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SYSTEM-IN-PACKAGE (SIP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SYSTEM-IN-PACKAGE (SIP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 51. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY WIRE BOND PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 52. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY WIRE BOND PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 53. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 54. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 55. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ELECTRICAL INTERCONNECTION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 56. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ELECTRICAL INTERCONNECTION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 57. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY MECHANICAL PROTECTION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 58. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY MECHANICAL PROTECTION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 59. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY MOISTURE & ENVIRONMENTAL PROTECTION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 60. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY MOISTURE & ENVIRONMENTAL PROTECTION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 61. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL MANAGEMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 62. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL MANAGEMENT, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 63. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 64. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 65. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENCE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 66. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENCE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 67. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 68. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 69. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 70. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 71. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE & MEDICAL DEVICES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 72. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE & MEDICAL DEVICES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 73. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL AUTOMATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 74. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL AUTOMATION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 75. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATIONS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 76. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATIONS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 77. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 78. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 79. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 80. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 81. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 82. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 83. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 84. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 85. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 86. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 87. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 88. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
  • TABLE 89. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 90. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 91. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 92. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 93. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 94. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 95. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 96. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 97. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 98. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 99. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2024 (USD MILLION)
  • TABLE 100. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2025-2030 (USD MILLION)
  • TABLE 101. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 102. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 103. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 104. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 105. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 106. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 107. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 108. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 109. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 110. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 111. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 112. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 113. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 114. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 115. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 116. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 117. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 118. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 119. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 120. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 121. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 122. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 123. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 124. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 125. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 126. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 127. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 128. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 129. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 130. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 131. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 132. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 133. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 134. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 135. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 136. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 137. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 138. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 139. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 140. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 141. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 142. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 143. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 144. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 145. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 146. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 147. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 148. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 149. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 150. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 151. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 152. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
  • TABLE 153. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 154. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 155. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 156. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 157. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 158. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 159. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 160. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 161. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 162. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 163. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 164. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 165. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 166. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 167. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 168. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 169. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 170. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 171. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 172. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 173. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 174. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 175. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 176. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 177. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 178. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 179. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 180. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 181. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 182. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 183. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 184. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 185. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 186. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 187. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 188. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 189. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 190. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 191. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 192. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 193. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 194. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 195. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 196. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 197. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 198. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 199. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 200. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 201. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 202. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 203. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 204. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 205. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 206. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 207. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 208. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 209. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 210. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 211. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 212. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 213. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 214. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 215. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 216. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 217. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 218. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 219. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 220. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 221. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 222. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 223. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 224. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 225. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 226. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 227. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 228. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 229. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 230. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 231. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 232. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 233. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 234. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 235. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 236. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 237. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 238. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 239. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 240. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 241. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 242. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 243. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 244. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 245. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 246. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 247. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 248. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 249. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 250. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 251. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 252. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 253. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 254. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 255. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 256. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 257. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 258. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 259. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 260. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 261. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 262. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 263. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 264. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 265. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 266. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 267. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 268. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 269. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 270. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 271. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 272. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 273. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 274. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 275. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 276. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 277. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 278. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 279. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 280. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 281. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 282. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 283. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 284. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 285. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 286. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 287. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2024 (USD MILLION)
  • TABLE 288. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2025-2030 (USD MILLION)
  • TABLE 289. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2018-2024 (USD MILLION)
  • TABLE 290. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY FUNCTIONALITY, 2025-2030 (USD MILLION)
  • TABLE 291. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 292. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2030 (USD MILLION)
  • TABLE 293. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2024 (USD MILLION)
  • TABLE 294. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2025-2030 (USD MILLION)
  • TABLE 295. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2018-2024 (USD MILLION)
  • TABLE 296. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGES, 2025-2030 (USD MILLION)
  • TABLE 297. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOL