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1864624

半導體和IC封裝材料市場：依銷售管道、應用、材料類型和封裝類型分類－2025-2032年全球預測

Semiconductor & IC Packaging Materials Market by Sales Channel, Application, Material Type, Packaging Type - Global Forecast 2025-2032
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2個工作天內

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預計到 2032 年，半導體和IC封裝材料市場將成長至 955 億美元，複合年成長率為 10.75%。

關鍵市場統計數據
基準年 2024 421.6億美元
預計年份：2025年 468億美元
預測年份 2032 955億美元
複合年成長率 (%) 10.75%

本文簡要概述了影響現代半導體和IC封裝的材料性能演變、供應鏈趨勢和整合挑戰。

在計算密度不斷提高、異質整合日益普及以及跨產業終端市場需求的推動下，半導體和積體電路（IC）封裝材料生態系統正經歷技術革新和商業性轉型的時期。晶圓層次電子構裝、扇出型封裝和先進的覆晶組裝等封裝結構的創新，對材料的黏著性、溫度控管和電氣完整性等方面的性能提出了更高的要求。同時，供應鏈的韌性、原料的可追溯性以及永續性等因素，在採購和設計規範的選擇中也變得至關重要。

因此，價值鏈上的各個相關人員（材料配方商、基板和晶圓級封裝製造商、原始設備製造商以及測試機構）都在調整其發展藍圖，以平衡可靠性、可製造性和擁有成本。汽車安全電子、高效能運算和小型消費性電子設備等領域新應用的興起，推動了在日益嚴苛的外形尺寸下仍能維持穩定機械和熱性能的材料的需求。因此，材料科學與封裝程式工程之間的合作已成為決定產品差異化和上市時間的關鍵因素。

本報告重點在於先進包裝結構及其支撐材料的交匯點。報告探討了技術促進因素、監管阻力以及客戶需求如何相互作用，從而重塑供應商策略和研發重點。報告旨在為決策者提供需求模式結構性變化、下一代材料所需性能標準以及採購、認證和規模化生產等方面的實際影響的簡明概述。

異質整合如何重塑包裝材料策略

半導體封裝材料領域正經歷技術、監管和商業性變革的交匯融合，這些變革正在重新定義競爭優勢。首先，異質整合（即將邏輯、儲存和類比功能整合到緊湊的多晶粒組件中）的技術發展趨勢，提高了對晶片黏接膠、底部填充膠和環氧樹脂封裝材料的性能要求。這些材料必須滿足更嚴格的散熱預算、更小的互連間距和更嚴苛的電遷移限制，同時還要能實現大規模生產。

其次，汽車、通訊和醫療等行業對特定應用性能要求的日益多樣化，正在推動材料組合的碎片化。汽車電子產品需要為高級駕駛輔助系統和動力傳動系統電子設備提供高溫穩定性和長期可靠性，而通訊基礎設施則強調基地台和網路設備的低損耗基板和高頻相容性。在家用電子電器，智慧型手機、平板電腦和穿戴式裝置仍然優先考慮小型化和成本效益，這迫使供應商提供差異化的化學成分和製程解決方案。

第三，永續性和監管壓力正在加速傳統合金和有害元素的替代，並重塑供應鏈和認證時間表。循環經濟的考量以及對某些含鉛和鹵化材料的限制，迫使製造商在不影響可靠性的前提下檢驗替代成分。最後，諸如近岸外包、策略性庫存緩衝以及合作研發夥伴關係等商業性趨勢正在改變供應商關係和供應商選擇標準。這些變化正在培育一個更協作的生態系統，在這個系統中，材料性能、可製造性、環境相容性和全球供應連續性都得到全面評估。

評估2025年關稅調整和貿易限制引發的供應鏈重組和籌資策略

2025年前後實施的政策和貿易措施增加了全球半導體封裝材料供應鏈的複雜性。關稅調整和有針對性的出口限制影響了某些前驅物化學品、特殊金屬和中間組件的流通，迫使採購部門重新評估採購區域和合約保障措施。因此，各公司更重視供應商多元化、庫存最佳化以及二級供應商資格認證，以降低關鍵材料供應受限的風險。

為因應這些貿易趨勢，製造商正加快與國內及夥伴國家供應商在策略性產品上的合作，並調整採購計畫以適應特種材料更長的前置作業時間。這也影響了產品認證的速度。更長的前置作業時間要求更早進行材料選擇並延長檢驗週期，以確保生產的連續性。同時，一些公司正利用垂直整合和長期供應協議，以確保優先獲得先進封裝、底部填充材料、焊料合金等產品的產能。

此外，關稅和貿易限制正在影響區域製造業產能的投資決策。企業正在評估將包裝業務遷至更靠近主要需求中心的成本效益，以減少跨境摩擦，並縮短研發與生產之間的反饋週期。這種策略轉變也促使供應商提高原產地、認證和合規文件的透明度，從而加快海關清關速度並方便客戶認證。最終，2025年關稅調整的累積影響提高了供應鏈可視性、供應商冗餘和早期材料風險評估的策略性溢價。

針對銷售管道、應用、材料類別和先進包裝結構，繪製出細緻的材料需求圖，以實現策略協同。

了解細分市場的細微差別至關重要，這有助於使材料開發和商業性推廣活動與最終用戶的期望和實際工藝流程相契合。策略客戶管理和分銷策略會因銷售管道的不同而有所差異。直銷模式適用於與大型原始設備製造商 (OEM) 達成的複雜、高價值交易，而分銷商銷售和線上通路則更適合區域包裝企業和契約製造銷售標準化、高週轉率的耗材。因此，供應商的通路策略應在技術支援需求和規模經濟之間取得平衡。

目錄

第1章：序言

第2章調查方法

第3章執行摘要

第4章 市場概覽

第5章 市場洞察

  • 5G無線模組對先進高導熱基板的需求日益成長
  • 採用扇出型晶圓層次電子構裝促進行動裝置小型化
  • 開發環保無鉛焊料以提高汽車電子設備的可靠性
  • 面向人工智慧和機器學習加速器的異構多晶片封裝整合
  • 為滿足資料中心日益成長的頻寬需求，銅柱電纜的出現應運而生
  • 為了降低高速積體電路中的寄生電容，人們開始轉向使用低介電常數材料。
  • 引入穿透矽通孔技術以支援 3D 堆疊式儲存模組
  • 穿戴式電子產品和物聯網感測器中軟性聚合物封裝的採用率不斷提高
  • 底部填充材料的進步改善了高功率LED應用的溫度控管
  • 晶圓級晶片封裝技術拓展，縮小家用電子電器的外形規格。

第6章：美國關稅的累積影響，2025年

第7章：人工智慧的累積影響，2025年

8. 半導體和IC封裝材料市場（依銷售管道分類）

  • 直銷
  • 透過分銷商銷售
  • 線上管道

9. 按應用分類的半導體和IC封裝材料市場

  • 車
    • ADAS
    • 資訊娛樂系統
    • 動力傳動系統
  • 家用電子電器
    • 筆記型電腦
    • 智慧型手機
      • 安卓智慧型手機
      • iOS智慧型手機
    • 藥片
      • 安卓平板電腦
      • iOS平板電腦
    • 穿戴式裝置
  • 衛生保健
    • 診斷設備
    • 診斷影像設備
    • 穿戴式醫療設備
  • 工業的
    • 自動化設備
    • 電動工具
    • 機器人技術
  • 電訊
    • 基地台
    • 網路裝置
    • 路由器

第10章 半導體和IC封裝材料市場（依材料類型分類）

  • 模具黏合劑
    • 銀環氧樹脂
    • 燒結漿
  • 封裝
    • 液態封裝
    • 固態封裝
  • 環氧模塑膠
    • 填充類型
    • 無需填充
  • 焊球
    • 無鉛
    • 鉛
  • 底部填充
    • 毛細管底部填充
    • 模壓底部填充物

11. 半導體和IC封裝材料市場（依封裝類型分類）

  • 球柵陣列
    • CBGA
    • MBGA
    • PBGA
  • 晶片級封裝
    • PoP
    • WLCSP
  • 覆晶
    • 覆晶BGA
    • 覆晶CSP
  • 四方平面無引腳
    • DFN
    • LGA
  • 晶圓層次電子構裝
    • 扇入式 WLP
    • 扇出WLP

12. 半導體和IC封裝材料市場（按地區分類）

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 歐洲、中東和非洲
    • 歐洲
    • 中東
    • 非洲
  • 亞太地區

第13章 半導體和IC封裝材料市場（依組別分類）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

第14章 各國半導體和IC封裝材料市場

  • 美國
  • 加拿大
  • 墨西哥
  • 巴西
  • 英國
  • 德國
  • 法國
  • 俄羅斯
  • 義大利
  • 西班牙
  • 中國
  • 印度
  • 日本
  • 澳洲
  • 韓國

第15章 競爭格局

  • 2024年市佔率分析
  • FPNV定位矩陣，2024
  • 競爭分析
    • Henkel AG & Co. KGaA
    • Sumitomo Bakelite Co., Ltd.
    • Showa Denko Materials Co., Ltd.
    • 3M Company
    • JSR Corporation
    • Dow Inc.
    • DuPont de Nemours, Inc.
    • Element Solutions Inc.
    • MKS Instruments, Inc.
    • KCC Corporation
Product Code: MRR-7A22CB0E5917

The Semiconductor & IC Packaging Materials Market is projected to grow by USD 95.50 billion at a CAGR of 10.75% by 2032.

KEY MARKET STATISTICS
Base Year [2024] USD 42.16 billion
Estimated Year [2025] USD 46.80 billion
Forecast Year [2032] USD 95.50 billion
CAGR (%) 10.75%

A concise orientation to the evolving material performance, supply chain dynamics, and integration challenges shaping modern semiconductor and IC packaging

The semiconductor and integrated circuit packaging materials ecosystem is undergoing a period of concentrated technical refinement and commercial reorientation driven by rising compute density, heterogeneous integration, and cross-industry end-market demands. Innovations in package architectures such as wafer-level packaging, fan-out approaches, and advanced flip chip assemblies are pushing material performance requirements for adhesion, thermal management, and electrical integrity. At the same time, supply chain resilience, raw material traceability, and sustainability considerations are becoming integral to procurement and design specification choices.

Consequently, stakeholders across the value chain-material formulators, substrate and wafer-level packagers, original equipment manufacturers, and testing houses-are aligning roadmaps to balance reliability, manufacturability, and cost of ownership. Emerging end uses in automotive safety electronics, high-performance computing, and compact consumer devices have intensified the need for materials that deliver consistent mechanical and thermal properties under increasingly aggressive form factor constraints. As a result, collaboration between materials science and packaging process engineering is now a core determinant of product differentiation and time-to-market success.

This introduction frames the report's core focus on the intersection of advanced packaging architectures and the materials enabling them. It highlights the interplay of technical drivers, regulatory headwinds, and customer requirements that are reshaping supplier strategies and R&D priorities. The objective is to equip decision-makers with a concise synthesis of structural shifts in demand patterns, the performance thresholds required of next-generation materials, and the practical implications for procurement, qualification, and manufacturing scale-up.

How heterogenous integration, application-specific performance demands, regulatory pressures, and supply continuity are reshaping packaging materials strategies

The landscape for semiconductor packaging materials is being transformed by a convergence of technological, regulatory, and commercial shifts that are redefining competitive advantage. First, the technical imperative for heterogeneous integration-combining logic, memory, and analog functions within compact, multi-die assemblies-has elevated performance expectations for die attach adhesives, underfills, and epoxy molding compounds. These materials must now satisfy tighter thermal budgets, finer pitch interconnects, and more stringent electromigration constraints while also enabling high-volume manufacturability.

Second, the proliferation of application-specific performance requirements in automotive, telecommunications, and healthcare has driven segmentation of material portfolios. Automotive electronics demand high-temperature stability and long-term reliability for advanced driver assistance systems and powertrain electronics, while telecommunications infrastructure emphasizes low-loss substrates and high-frequency compatibility for base stations and network equipment. Consumer electronics continue to prioritize miniaturization and cost-effectiveness for smartphones, tablets, and wearables, prompting suppliers to offer differentiated chemistries and process-ready solutions.

Third, sustainability and regulatory pressures are accelerating the substitution of legacy alloys and hazardous constituents, which is reshaping supply chains and qualification timelines. Circularity considerations and restrictions on certain leaded or halogenated materials require manufacturers to validate alternative compositions without compromising reliability. Finally, commercial dynamics such as nearshoring, strategic inventory buffering, and collaborative R&D partnerships are altering supplier relationships and vendor selection criteria. Taken together, these shifts are fostering a more collaborative ecosystem where materials performance, manufacturability, environmental compliance, and global supply continuity are evaluated in an integrated fashion.

Evaluating the systemic supply chain realignments and procurement strategies triggered by tariff adjustments and trade constraints in 2025

Policy and trade measures enacted in and around 2025 have introduced a layer of complexity to global supply chains for semiconductor packaging inputs. Tariff adjustments and targeted export controls have affected the movement of certain precursor chemicals, specialty metals, and intermediate components, prompting procurement teams to reassess sourcing geographies and contractual safeguards. As a consequence, organizations are placing greater emphasis on supplier diversification, inventory optimization, and qualifying secondary suppliers to mitigate the risk of constrained access to critical materials.

In response to these trade dynamics, manufacturers are accelerating engagement with domestic and friendly-country suppliers for strategic items, and they are redesigning procurement timelines to accommodate extended lead times for specialized materials. This has implications for product qualification cadence: longer lead windows necessitate earlier material selection and extended validation cycles to ensure production continuity. At the same time, some firms are leveraging vertical integration or long-term supply agreements to secure priority access to capacity for advanced encapsulants, underfills, and solder alloys.

Further, tariffs and trade restrictions are influencing investment decisions in regional manufacturing capacity. Firms are evaluating the cost-benefit of relocating packaging operations closer to key demand centers to reduce exposure to cross-border frictions and to shorten feedback loops between R&D and production. These strategic shifts are also prompting suppliers to strengthen transparency around origin, certification, and compliance documentation, enabling faster customs processing and smoother qualification by customers. Ultimately, the cumulative impact of tariff changes in 2025 has been to increase the strategic premium on supply chain visibility, supplier redundancy, and early material risk assessments.

Mapping nuanced material requirements across sales channels, application domains, material classes, and advanced packaging architectures for strategic alignment

A nuanced understanding of segmentation is essential for aligning materials development and commercial go-to-market actions with end-user expectations and process realities. Based on sales channel, strategic account management and distribution strategies diverge; direct sales are optimal for complex, qualification-heavy engagements with large OEMs, whereas distributor sales and online channels are more suited to standardized, high-turn consumables that support regional packaging houses and contract manufacturers. Consequently, supplier channel strategy should reflect the balance between technical support requirements and scale economics.

Based on application, materials must meet distinct performance matrices across automotive, consumer electronics, healthcare, industrial, and telecommunication segments. Automotive applications impose stringent qualification and extended lifetime expectations for ADAS, infotainment systems, and powertrain modules. Consumer electronics prioritize thin profiles and thermal dissipation across laptops, smartphones, tablets, and wearables, with smartphone form factors further differentiating requirements between Android and iOS OEM specifications, and tablets invoking separate considerations for Android and iOS ecosystems. Healthcare use cases such as diagnostic equipment, imaging systems, and wearable medical devices demand biocompatibility, electrical safety, and rigorous traceability. Industrial automation equipment, power tools, and robotics require materials with mechanical robustness and long-term thermal stability, while telecommunication infrastructure including base stations, network equipment, and routers emphasizes signal integrity and environmental endurance.

Based on material type, suppliers must tailor formulations to the unique functional role of each class. Die attach adhesives require both silver epoxy and sintered paste options to accommodate thermal conductivity and mechanical stress profiles. Encapsulants are chosen from liquid and solid chemistries depending on processing constraints and stress mitigation needs. Epoxy molding compounds are engineered as filled or unfilled variants to balance mechanical reinforcement and warpage control. Solder balls continue to be offered in lead-free and leaded compositions to serve legacy and new-production assemblies, while underfill strategies span capillary underfill for established flip-chip processes and molded underfill for higher throughput or more complex geometries.

Based on packaging type, material selection must accommodate architecture-specific demands across ball grid array, chip scale package, flip chip, quad flat no-lead, and wafer-level packaging options. Ball grid array families, including CBGA, MBGA, and PBGA, impose distinct thermal cycling and coplanarity constraints. Chip scale packages such as PoP and WLCSP demand minimal standoff heights and precise adhesion control. Flip chip variants-flip chip BGA and flip chip CSP-require adhesive and underfill chemistries capable of maintaining micro-bump integrity. Quad flat no-lead formats, including DFN and LGA, necessitate low-extrusion molding and precise bond line control, while wafer-level packaging solutions like fan-in WLP and fan-out WLP drive material innovation aimed at scalability, warpage management, and fine-pitch interconnect reliability.

Together, these segmentation vectors form a matrix of technical and commercial requirements. Suppliers that can map differentiated material roadmaps to the intersection of channel, application, material type, and packaging architecture are best positioned to reduce qualification friction, accelerate adoption, and capture value across multiple end markets.

How regional regulatory regimes, manufacturing scale, and customer priorities in the Americas, EMEA, and Asia-Pacific influence materials selection and deployment

Regional dynamics continue to play a central role in shaping the operational choices of materials suppliers and packagers. In the Americas, demand is driven by advanced computing, defense, and a resurgent manufacturing base that prioritizes secure supply chains, high-reliability components, and shorter lead times. This region also emphasizes collaboration between materials suppliers and local OEMs to shorten development cycles and to meet stringent quality assurance protocols.

In Europe, Middle East & Africa, regulatory compliance and environmental stewardship are significant determinants of material selection and process design. Manufacturers in this region stress environmental documentation, lifecycle impact reduction, and adherence to tight reliability standards for automotive and industrial applications. The region's mix of established automotive clusters and evolving telecom infrastructure creates a diversified demand profile that favors adaptable material solutions.

In Asia-Pacific, the scale and concentration of semiconductor packaging capacity, together with a dense supplier ecosystem, drive rapid iteration and adoption of novel materials. Proximity to large OEMs and contract manufacturers accelerates qualification and scaling; however, it also intensifies competition and compresses time-to-adoption windows. Regional policy incentives and localized investments in packaging capacity further influence where suppliers prioritize technical support and inventory allocation. Across all regions, regional nuances in regulatory regimes, logistics infrastructure, and customer expectation influence supplier strategy and the pace at which new material chemistries are validated and commercialized.

Competitive moves driving value capture include technical differentiation, integrated service models, and strategic partnerships to accelerate qualification and adoption

Competitive dynamics among material suppliers and packaging service providers are characterized by three parallel strategies: deepening technical differentiation, expanding integrated service offerings, and pursuing selective capacity investment. Leading suppliers are investing in formulation science to improve thermal conductivity, lower coefficient of thermal expansion mismatch, and minimize ionic contamination, while also developing process-support capabilities such as dispensing optimization, curing profiles, and warpage mitigation protocols.

Strategic partnerships between materials firms and advanced packaging houses are increasingly common, enabling co-development programs that shorten qualification cycles. Such collaborations often take the form of joint pilot lines, shared reliability testing, and in-field failure analysis partnerships that accelerate problem resolution. In addition, some suppliers are augmenting their commercial propositions with value-added services such as application engineering, turnkey qualification packages, and documentation support to reduce the barrier for adoption by contract manufacturers and OEMs.

Mergers, acquisitions, and minority investments remain tools for rapidly acquiring niche chemistries or process expertise, particularly in areas like underfill innovations and high-reliability encapsulants. At the same time, intellectual property-formulation libraries, curing kinetics models, and testing protocols-constitutes a critical asset that differentiates market leaders. For incumbent suppliers and new entrants alike, building demonstrable process compatibility, a robust qualification dossier, and responsive technical support is essential to securing long-term contracts with tier-one packagers and OEMs.

Actionable strategies for balancing supply continuity, accelerated co-development, sustainability commitments, and channel optimization to secure competitive advantage

Industry leaders should adopt a dual-track strategy that balances near-term supply continuity with sustained investment in differentiated material capabilities. In the near term, companies must prioritize supplier redundancy, certification of alternate chemistries, and hardened inventory management protocols to insulate production from geopolitical and logistical disruptions. Concurrently, prioritizing transparent origin documentation and compliance records will reduce customs friction and support faster qualification acceptance by major OEMs.

On the product and innovation side, companies should accelerate co-development programs with packaging houses and OEMs that align material performance targets with assembly process constraints. Investing in modular qualification packages-predefined test matrices, environmental stress screening protocols, and application notes-can substantially lower adoption friction for customers and shorten time-to-production for new material introductions. Further, pursuing greener chemistries and materials with lower lifecycle impacts will not only align with regulatory trajectories but also open opportunities with customers that have aggressive sustainability mandates.

Commercially, organizations should refine channel strategies to match engagement intensity with customer needs, deploying direct sales for strategic accounts while leveraging distributor and online channels for high-volume consumables. Finally, strengthening field application engineering capabilities and creating rapid-response failure analysis teams will enhance customer confidence and protect long-term relationships, thereby converting technical competence into durable commercial advantage.

A rigorous synthesis of primary interviews, secondary technical literature, and analytical triangulation to validate insights and identify resilience measures

The research approach combines structured primary engagement, comprehensive secondary intelligence, and rigorous analytical triangulation to ensure robust, actionable findings. Primary research included in-depth interviews with packaging engineers, materials scientists, procurement leaders, and reliability test specialists, providing firsthand insight into qualification pain points, performance requirements, and supplier selection criteria. These engagements informed scenario analysis and helped surface nuanced differences across application segments and packaging architectures.

Secondary intelligence was gathered from technical literature, standards bodies, patent filings, and publicly available regulatory documentation to corroborate trends identified during primary interviews. Where possible, lifecycle and material safety data sheets were reviewed to validate claims regarding thermal stability, curing behavior, and contaminant profiles. The synthesis of these inputs enabled an evidence-based mapping of material classes to application demands and process constraints.

Analytically, findings were validated through triangulation-comparing supplier disclosures, customer feedback, and independent technical references-to reduce bias and to identify persistent performance gaps. The methodology also incorporated sensitivity analysis around supply chain disruptions and regulatory changes to frame resilience recommendations. Limitations include the proprietary nature of some supplier formulations and the continuous evolution of packaging process capabilities, which means ongoing monitoring is recommended to capture emergent innovations in chemistries and process integration.

Synthesis of technical, commercial, and regulatory imperatives that will determine supplier success in the evolving semiconductor packaging materials ecosystem

In conclusion, the semiconductor and IC packaging materials landscape is at an inflection point where technical performance, supply chain resilience, and regulatory compliance converge to define competitive differentiation. Materials that can deliver on thermal management, mechanical reliability, and process compatibility while meeting environmental and traceability expectations will increasingly command preference across automotive, telecommunications, healthcare, industrial, and consumer applications. Suppliers that align R&D priorities with packaging architecture trends, and that offer robust application support, will accelerate adoption and reinforce customer loyalty.

Moreover, the strategic effects of 2025 tariff adjustments have underscored the value of supplier diversification, early material qualification, and regional capacity planning. Companies that proactively address these risk vectors by securing alternate supply sources and by designing qualification pathways that anticipate longer lead times will be better positioned to maintain production continuity. Equally important is the move toward greener chemistries and transparent origin documentation, which are becoming baseline requirements for many tier-one customers.

Taken together, the insights in this report provide a pragmatic framework for manufacturers, material suppliers, and packaging service providers to prioritize investments, adapt commercial models, and accelerate collaborative innovation. Executing on these priorities will determine who captures value as packaging technologies and application demands continue to evolve.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Growing demand for advanced high thermal conductivity substrates in 5G radio modules
  • 5.2. Adoption of fan-out wafer-level packaging to enhance miniaturization in mobile devices
  • 5.3. Development of eco-friendly lead-free solder materials for automotive electronics reliability
  • 5.4. Integration of heterogeneous multi-die packaging for AI and machine learning accelerators
  • 5.5. Emergence of copper pillar interconnects to meet rising bandwidth requirements in datacenters
  • 5.6. Shift towards low-k dielectric materials to reduce parasitic capacitance in high-speed ICs
  • 5.7. Implementation of through silicon via technology to support 3D stacked memory modules
  • 5.8. Increased use of flexible polymer encapsulants in wearable electronics and IoT sensors
  • 5.9. Advances in underfill materials improving thermal management for high-power LED applications
  • 5.10. Expansion of wafer-level chip scale packages to reduce form factor in consumer electronics

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Semiconductor & IC Packaging Materials Market, by Sales Channel

  • 8.1. Direct Sales
  • 8.2. Distributor Sales
  • 8.3. Online Channels

9. Semiconductor & IC Packaging Materials Market, by Application

  • 9.1. Automotive
    • 9.1.1. ADAS
    • 9.1.2. Infotainment Systems
    • 9.1.3. Powertrain
  • 9.2. Consumer Electronics
    • 9.2.1. Laptops
    • 9.2.2. Smartphones
      • 9.2.2.1. Android Smartphones
      • 9.2.2.2. iOS Smartphones
    • 9.2.3. Tablets
      • 9.2.3.1. Android Tablets
      • 9.2.3.2. iOS Tablets
    • 9.2.4. Wearables
  • 9.3. Healthcare
    • 9.3.1. Diagnostic Equipment
    • 9.3.2. Imaging Equipment
    • 9.3.3. Wearable Medical Devices
  • 9.4. Industrial
    • 9.4.1. Automation Equipment
    • 9.4.2. Power Tools
    • 9.4.3. Robotics
  • 9.5. Telecommunication
    • 9.5.1. Base Stations
    • 9.5.2. Network Equipment
    • 9.5.3. Routers

10. Semiconductor & IC Packaging Materials Market, by Material Type

  • 10.1. Die Attach Adhesive
    • 10.1.1. Silver Epoxy
    • 10.1.2. Sintered Paste
  • 10.2. Encapsulant
    • 10.2.1. Liquid Encapsulant
    • 10.2.2. Solid Encapsulant
  • 10.3. Epoxy Molding Compound
    • 10.3.1. Filled
    • 10.3.2. Unfilled
  • 10.4. Solder Ball
    • 10.4.1. Lead-Free
    • 10.4.2. Leaded
  • 10.5. Underfill
    • 10.5.1. Capillary Underfill
    • 10.5.2. Molded Underfill

11. Semiconductor & IC Packaging Materials Market, by Packaging Type

  • 11.1. Ball Grid Array
    • 11.1.1. CBGA
    • 11.1.2. MBGA
    • 11.1.3. PBGA
  • 11.2. Chip Scale Package
    • 11.2.1. PoP
    • 11.2.2. WLCSP
  • 11.3. Flip Chip
    • 11.3.1. Flip Chip BGA
    • 11.3.2. Flip Chip CSP
  • 11.4. Quad Flat No-Lead
    • 11.4.1. DFN
    • 11.4.2. LGA
  • 11.5. Wafer-Level Packaging
    • 11.5.1. Fan-In WLP
    • 11.5.2. Fan-Out WLP

12. Semiconductor & IC Packaging Materials Market, by Region

  • 12.1. Americas
    • 12.1.1. North America
    • 12.1.2. Latin America
  • 12.2. Europe, Middle East & Africa
    • 12.2.1. Europe
    • 12.2.2. Middle East
    • 12.2.3. Africa
  • 12.3. Asia-Pacific

13. Semiconductor & IC Packaging Materials Market, by Group

  • 13.1. ASEAN
  • 13.2. GCC
  • 13.3. European Union
  • 13.4. BRICS
  • 13.5. G7
  • 13.6. NATO

14. Semiconductor & IC Packaging Materials Market, by Country

  • 14.1. United States
  • 14.2. Canada
  • 14.3. Mexico
  • 14.4. Brazil
  • 14.5. United Kingdom
  • 14.6. Germany
  • 14.7. France
  • 14.8. Russia
  • 14.9. Italy
  • 14.10. Spain
  • 14.11. China
  • 14.12. India
  • 14.13. Japan
  • 14.14. Australia
  • 14.15. South Korea

15. Competitive Landscape

  • 15.1. Market Share Analysis, 2024
  • 15.2. FPNV Positioning Matrix, 2024
  • 15.3. Competitive Analysis
    • 15.3.1. Henkel AG & Co. KGaA
    • 15.3.2. Sumitomo Bakelite Co., Ltd.
    • 15.3.3. Showa Denko Materials Co., Ltd.
    • 15.3.4. 3M Company
    • 15.3.5. JSR Corporation
    • 15.3.6. Dow Inc.
    • 15.3.7. DuPont de Nemours, Inc.
    • 15.3.8. Element Solutions Inc.
    • 15.3.9. MKS Instruments, Inc.
    • 15.3.10. KCC Corporation

LIST OF FIGURES

  • FIGURE 1. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2024 VS 2032 (%)
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2032 (%)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2032 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2032 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TYPE, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 11. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 12. NORTH AMERICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 13. LATIN AMERICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 14. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SUBREGION, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 15. EUROPE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 16. MIDDLE EAST SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 17. AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GROUP, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 20. ASEAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 21. GCC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 22. EUROPEAN UNION SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 23. BRICS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 24. G7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 25. NATO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2032 (USD MILLION)
  • FIGURE 27. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2024
  • FIGURE 28. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2024

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2024 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2025-2032 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2018-2024 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SALES CHANNEL, 2025-2032 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIRECT SALES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DISTRIBUTOR SALES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ONLINE CHANNELS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2024 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2025-2032 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, 2018-2024 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, 2025-2032 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ADAS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INFOTAINMENT SYSTEMS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 51. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 52. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWERTRAIN, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 53. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, 2018-2024 (USD MILLION)
  • TABLE 54. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, 2025-2032 (USD MILLION)
  • TABLE 55. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 56. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 57. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 58. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 59. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 60. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 61. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 62. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 63. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 64. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 65. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 66. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LAPTOPS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 67. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, 2018-2024 (USD MILLION)
  • TABLE 68. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, 2025-2032 (USD MILLION)
  • TABLE 69. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 70. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 71. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 72. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 73. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 74. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 75. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 76. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 77. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 78. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 79. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 80. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 81. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 82. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 83. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 84. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 85. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 86. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS SMARTPHONES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 87. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, 2018-2024 (USD MILLION)
  • TABLE 88. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, 2025-2032 (USD MILLION)
  • TABLE 89. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 90. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 91. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 92. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 93. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 94. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 95. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 96. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 97. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 98. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 99. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 100. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ANDROID TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 101. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 102. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 103. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 104. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 105. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 106. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IOS TABLETS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 107. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 108. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 109. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 110. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 111. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 112. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 113. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, 2018-2024 (USD MILLION)
  • TABLE 114. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, 2025-2032 (USD MILLION)
  • TABLE 115. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 116. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 117. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 118. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 119. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 120. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 121. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 122. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 123. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 124. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 125. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 126. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIAGNOSTIC EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 127. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 128. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 129. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 130. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 131. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 132. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IMAGING EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 133. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 134. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 135. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 136. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 137. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 138. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WEARABLE MEDICAL DEVICES, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 139. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, 2018-2024 (USD MILLION)
  • TABLE 140. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, 2025-2032 (USD MILLION)
  • TABLE 141. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 142. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 143. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 144. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 145. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 146. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 147. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 148. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 149. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 150. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 151. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 152. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMATION EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 153. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 154. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 155. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 156. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 157. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 158. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY POWER TOOLS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 159. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 160. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 161. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 162. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 163. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 164. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROBOTICS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 165. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, 2018-2024 (USD MILLION)
  • TABLE 166. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, 2025-2032 (USD MILLION)
  • TABLE 167. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 168. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 169. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 170. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 171. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 172. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATION, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 173. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 174. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 175. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 176. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 177. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 178. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BASE STATIONS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 179. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 180. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 181. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 182. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 183. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 184. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY NETWORK EQUIPMENT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 185. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 186. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 187. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 188. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 189. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 190. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ROUTERS, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 191. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2018-2024 (USD MILLION)
  • TABLE 192. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY MATERIAL TYPE, 2025-2032 (USD MILLION)
  • TABLE 193. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, 2018-2024 (USD MILLION)
  • TABLE 194. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, 2025-2032 (USD MILLION)
  • TABLE 195. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 196. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 197. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 198. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 199. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 200. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH ADHESIVE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 201. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 202. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 203. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 204. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 205. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 206. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SILVER EPOXY, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 207. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 208. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 209. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 210. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 211. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 212. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SINTERED PASTE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 213. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, 2018-2024 (USD MILLION)
  • TABLE 214. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, 2025-2032 (USD MILLION)
  • TABLE 215. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 216. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 217. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 218. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 219. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 220. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 221. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 222. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 223. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 224. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 225. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 226. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LIQUID ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 227. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 228. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 229. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 230. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 231. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 232. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLID ENCAPSULANT, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 233. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, 2018-2024 (USD MILLION)
  • TABLE 234. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, 2025-2032 (USD MILLION)
  • TABLE 235. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 236. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 237. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 238. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 239. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 240. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY EPOXY MOLDING COMPOUND, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 241. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 242. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 243. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 244. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 245. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 246. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FILLED, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 247. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 248. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 249. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 250. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 251. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 252. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY UNFILLED, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 253. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, 2018-2024 (USD MILLION)
  • TABLE 254. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, 2025-2032 (USD MILLION)
  • TABLE 255. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 256. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 257. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 258. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 259. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 260. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALL, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 261. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 262. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 263. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 264. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 265. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 266. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEAD-FREE, BY COUNTRY, 2025-2032 (USD MILLION)
  • TABLE 267. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 268. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY REGION, 2025-2032 (USD MILLION)
  • TABLE 269. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY GROUP, 2018-2024 (USD MILLION)
  • TABLE 270. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADED, BY GROUP, 2025-2032 (USD MILLION)
  • TABLE 271. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET S