射頻氮化鎵技術專利趨勢分析（2026 年）

了解整個射頻氮化鎵生態系統中的創新、智慧財產權領先地位和策略機會。

主要特點

報告

包含超過270張投影片的PDF文件

• 全球專利趨勢，包括專利出版物隨時間的變化以及專利申請提交的國家。
• 按國家和細分市場分類的主要專利持有者和智慧財產權領域的新參與企業
• 主要公司在智慧財產權領域的定位及其專利組合的相對優勢。
• 我們專注於大型企業的智慧財產權組合。
• 15 家領導參與企業的智慧財產權概況（包括其專利組合、技術覆蓋範圍、地理覆蓋範圍和近期顯著創新的概述）。
• 專利依供應鏈/技術領域分類（晶圓和磊晶片、元件、模組和封裝、電路、電流崩壞、矽基氮化鎵、單晶片整合、溫度控管等）。內容包括各領域的智慧財產權趨勢、主要專利持有人排名、智慧財產權領域的新參與企業、主要智慧財產權參與企業、近期創新成果。

本報告採用多用戶授權協議，可在採購組織內部員工之間共用。子公司和合資企業不在本授權協議的涵蓋範圍內。

資料庫

這是一個包含本報告中所列5,300多項專利的Excel資料庫。它包括專利分類以及指向最新線上資料庫的超連結。

儀表板

互動式儀表板（授權用戶可無限次訪問，有效期一年）

• 我們將分析結果轉化為真正的決策支援工具。
• 您可以按申請人、技術、國家/地區、公開期和法律狀態自由、動態地探索專利的整體情況。
• 使用者可以立即深入了解關鍵見解，並客製化分析以滿足每個部門（研發、智慧財產權、策略、業務發展）的具體需求。

互動式儀表板的進入許可權有效期限為一年（12個月），採購組織內部的已通過核准使用者數量不限。此儀表板不得用於產生分析結果或報告，也不得轉售、再授權或提供給採購組織以外的外部使用者或實體。

RF GaN 正在進入一個新的成長和策略競爭階段。

受通訊基礎設施以及國防、電子戰、反無人機系統和衛星通訊等領域需求成長的推動，射頻氮化鎵（RF GaN）市場正進入新的成長週期。預計到2031年，該裝置市場規模將達到24億美元，其中僅國防相關的射頻氮化鎵銷售額就預計將從2025年的5.92億美元成長到2031年的10.6億美元。

從技術角度來看，由於其功率密度高、散熱性能優異且擁有完善的認證記錄，GaN-on-SiC 仍然是高功率通訊、雷達和電子戰應用領域的標竿平台。同時，在 8 吋製造技術、低功率無線架構以及未來 FR3 和 6G 應用領域的新機會的推動下，GaN-on-Si 正在朝著產業化方向發展。

此外，創新正在整個射頻氮化鎵價值鏈中不斷擴展，涵蓋從半絕緣基板和外延生長到電晶體架構、溫度控管、先進封裝、異質整合和射頻電路等各個方面。諸如金剛石上氮化鎵和氮化鋁上氮化鎵等新興平台有望在長期內進一步突破性能極限。

同時，產業結構調整、授權授權、產品組合重組以及地緣政治緊張局勢正在改變競爭格局。製造自主性、關鍵基板的取得、製程智慧財產權的控制以及技術轉移限制，其戰略重要性與裝置性能本身不相上下。

隨著射頻氮化鎵（RF GaN）進入市場成長的新階段，競爭格局依然動盪。哪些技術平台吸引了最強勁的創新力量？哪些公司正在新興領域（例如矽基氮化鎵、先進外延、溫度控管和封裝）建立防禦地位？隨著供應鏈日益在地化，關鍵技術的取得變得更加戰略性，美國、中國、日本和歐洲的公司將如何調整其智慧財產權策略？

專利分析為解答這些問題提供了一個獨特的觀點。它不僅揭示了創新發生在哪裡，還揭示了誰在投資、尋求保護的領域、競爭格局如何變化，以及哪些技術領域未來可能成為差異化、依賴或衝突的根源。

專利格局揭示了什麼

射頻氮化鎵專利格局正朝著兩個方向同時改變。隨著技術的成熟，整體專利申請活動正在放緩，而特定技術領域和地區的競爭正在加劇。

分析結果凸顯了當前競爭格局：美國和中國對全球智慧財產權平衡的影響力日益增強，歐洲正成為更具戰略意義的專利管轄區，而日本企業則在拓展其國際保護策略。同時，射頻氮化鎵晶圓和外延晶圓技術等關鍵領域的競爭格局也持續顯著變化。

射頻氮化鎵（RF GaN）整個價值鏈的智慧財產權競爭日益激烈

儘管整個射頻氮化鎵供應鏈的智慧財產權競爭優勢仍集中在少數幾家領先企業手中，但格局正在改變。在晶圓和外延片領域，日本企業持續保持強大的智慧財產權優勢，其中住友電工和NGK絕緣體是公認的產業領導者，而信越化學則崛起成為強而有力的挑戰者。在裝置和下游技術領域，美國企業則保持著特別強大的地位。在收購Wolfspeed的射頻業務及相關專利資產後，MACOM目前擁有涵蓋射頻氮化鎵裝置、封裝和電路的廣泛智慧財產權組合，使其成為整個價值鏈中最全面的智慧財產權組合之一。

此外，競爭格局正呈現日益鮮明的區域特徵。中國主要的射頻氮化鎵（RF GaN）專利組合仍主要由中國電子科技集團公司（CETC）和西迪安大學等國有機構主導，後者正迅速崛起為射頻氮化鎵裝置領域的國內主要參與企業。同時，華為、恩科瑞斯和韓華半導體等工業企業的影響力也不斷增強，這顯示中國的創新基礎正逐步擴展到機構申請人之外。

同時，智慧財產權戰略正日益國際化。美國公司正大力拓展其在歐洲以及擴大在中國的專利保護範圍，而日本公司自2022年以來也一直在擴大其在美國和中國的專利申請。因此，射頻氮化鎵（RF GaN）智慧財產權環境正朝著更直接的競爭方向發展，無論是在技術層面還是在司法管轄層面，專利組合的廣度和國際專利覆蓋範圍都成為智慧財產權領先地位的關鍵要素。

有用的專利資料庫

本報告包含大規模Excel資料庫，其中包含本研究中分析的所有專利，並包含以下資訊：

• 關鍵專利資訊（專利號、日期、權利人、摘要整理、摘要等）
• 指向最新線上資料庫（原始文件、法律地位等）的超鏈接
• 依供應鏈/技術領域進行系統分類（晶圓和外延晶圓、裝置、模組和封裝、電路、電流崩壞、矽上氮化鎵、單晶片整合、溫度控管等）

互動式儀表板（可選）

可選附加功能：您可以在一年內使用互動式儀表板，組織內已通過核准的使用者數量沒有限制。

此解決方案將專利格局分析轉化為真正的決策支援工具。

主要特點：

• 您可以根據優先動態探索專利格局。
• 清晰且互動的視覺化效果可提供即時洞察。
• 您可以按參與企業、技術、國家/地區、日期和法律狀態篩選和分析資料。
• 您可以立即從整體趨勢深入了解參與企業、技術和專利。
• 我們可以根據每個團隊（研發、智慧財產權、策略、業務發展）的需求來客製化見解。

優點：

• 您可以立即獲得重要問題的解答。
• 它可以節省時間，加快決策速度。
• 您可以專注於最重要的見解。

本報告中提及的公司（部分名單）

製造 - CETC, Sumitomo Electric, Macom, Mitsubishi Electric, Toshiba, Fujitsu, Wolfspeed, Intel, Qorvo, Panasonic, NXP, NTT, RTX Corporation, HiWAFER, San’an, HRL, Dynax Semiconductor, Samsung, Northrop Grumman, Hatchip, Huawei, Murata, NEC, RFHIC, NGK Insulators, Shin Etsu, Akoustis, Ampleon, Hanhua Semiconductor, Qualcomm, ZTE, Sony, SpaceX, WIN Semiconductors, Broadcom, BAE Systems, Infineon, Skyworks, Sumitomo Chemical, Analog Devices, OnMicro Electronics, Thales, Lockheed Martin, Enkris, IQE, Nuvoton等。

研究與發展機構：Xidian University, SCUT, IMECAS, UESTC, Institute of Semiconductors (CAS), ETRI, SINANO (CAS), University of California, KETI, KNU – Kyungpook National University, SUSTech, Fraunhofer, MIT, Shanghai Institute of Microsystem & Information Technology (CAS), imec, Cornell University, Shandong University, Sun Yat-sen University, Suzhou University of Science and Technology, AIST, CEA等。

目錄

介紹

摘要整理

射頻氮化鎵專利趨勢

• 專利情勢概述
  • 誰在主導專利收購活動？
  • 從專利角度看全球供應鏈
  • 最活躍的智慧財產權參與企業和新進入者
  • 關鍵技術挑戰（動態導通電阻、增強型、GaN-on-Si、產業專用元件、單晶片整合、溫度控管等）
• 按國家/地區分類的專利狀況分析
  • 美國專利趨勢
  • 日本專利狀況
  • 歐洲專利趨勢
  • 中國專利情勢
  • 台灣專利趨勢
  • 韓國專利趨勢

每個國家都關注專利活動的時間軸、從專利角度看的供應鏈、參與企業的智慧財產權活動狀況、主要專利持有人、最活躍的智慧財產權參與企業、新進入者、智慧財產權參與企業面臨的主要技術挑戰、參與企業的智慧財產權活動狀況、專利的當前法律狀態（待審、已授權、受參與企業智慧財產權、最近的智慧財產權申請

• 依供應鏈環節分類的專利狀況分析
  • 用於射頻應用的晶圓和外延晶圓
  • 氮化鎵射頻元件
  • 射頻模組和封裝
  • 射頻電路及應用

針對每個細分市場：我們分析美國公司、日本公司、歐洲公司等的專利出版物時間序列趨勢、主要專利持有人、最活躍的知識產權公司、新參與企業、專利的當前法律狀態（待核准、已授權）、知識產權公司正在應對的技術挑戰、主要專利持有人和新參與企業按技術挑戰分類的情況。

附件文件

知識製造演示

Mapping innovation, IP leadership and strategic opportunities across the RF GaN ecosystem

Key Features

REPORT

PDF file with 270+ slides

• Global patenting trends, including time evolution of patent publications, countries of patent filings, etc.
• Main patent assignees and IP newcomers by countries and segments.
• Key players’ IP position and the relative strength of their patent portfolio.
• Focus on key players’ IP portfolios.
• IP profile of 15 key players (patent portfolio overview, technical coverage, geographical coverage, recent notable innovations, etc.).
• Patents categorized by supply chain/technical segments (wafers & epiwafers, devices, modules & packaging, circuits, current collapse, GaN-on-Silicon, monolithic integration, thermal management, etc.). For each segment: IP dynamics, ranking of main patent assignees, IP newcomers, key IP players, recent innovations.

The report is provided under a multi-user license and can be shared internally among employees of the purchasing organization. Subsidiaries and joint ventures are excluded from this license.

DATABASE

Excel database containing the 5,300+ patents of the report, including patent segmentations and hyperlinks to an updated online database.

DASHBOARD

Interactive dashboard (one-year access for unlimited authorized users)

• Transforming the analysis into a true decision-support tool.
• Enabling free and dynamic exploration of the patent landscape by applicant, technology, country/geographical area, publication period, and legal status.
• Allowing users to instantly drill down into key insights and tailor the analysis to the specific needs of each function (R&D, IP, strategy, business development).

Access to the interactive dashboard is granted for one year (12 months) to an unlimited number of authorized users within the purchasing organization. The dashboard must not be used to produce analyses or reports that are resold, sublicensed, or otherwise made available to any external user or entity outside the purchasing organization.

RF GaN Enters a New Phase of Growth and Strategic Competition

The RF GaN market is entering a new growth cycle, driven not only by telecom infrastructure but increasingly by defense, electronic warfare, counter-drone systems and satellite communications. The device market is projected to reach $2.4 billion by 2031, while defense-related RF GaN revenues alone are expected to rise from $592 million in 2025 to $1.06 billion in 2031.

At the technology level, GaN-on-SiC remains the reference platform for high-power telecom, radar and electronic-warfare applications thanks to its power density, thermal performance and established qualification track record. At the same time, GaN-on-Si is progressing toward industrialization, supported by 8-inch manufacturing and emerging opportunities in lower-power radio architectures and future FR3 and 6G applications.

Innovation is also expanding across the entire RF GaN value chain from semi-insulating substrates and epitaxy to transistor architectures, thermal management, advanced packaging, heterogeneous integration and RF circuits. Emerging platforms such as GaN-on-diamond and GaN-on-AlN could further reshape performance limits over the longer term.

Meanwhile, consolidation, licensing, portfolio repositioning and geopolitical tensions are transforming the competitive landscape. Manufacturing sovereignty, access to critical substrates, control of process IP and technology-transfer restrictions are becoming as strategically important as device performance itself.

As RF GaN moves into this new phase of market growth, the competitive implications remain far from settled. Which technology platforms are attracting the strongest innovation efforts? Which players are building defensible positions in emerging areas such as GaN-on-Si, advanced epitaxy, thermal management and packaging? How are US, Chinese, Japanese and European companies adapting their IP strategies as supply chains become more regionalized and access to critical technologies more strategic?

Patent analysis provides a unique lens through which to address these questions, revealing not only where innovation is taking place, but also who is investing, where they are seeking protection, how competitive positions are evolving, and which technology areas may become future sources of differentiation, dependency or confrontation.

What the Patent Landscape Shows

The RF GaN patent landscape is evolving in two directions at once: overall patenting activity is slowing as the technology matures, while competition is intensifying in selected technologic and geographic areas.

The analysis highlights a competitive landscape in which the US and China increasingly shape the global IP balance, Europe is becoming a more strategic patent jurisdiction, and Japanese companies are broadening their international protection strategies. At the same time, focused areas such as RF GaN wafer and epiwafer technologies continue to generate meaningful shifts in competitive positioning.

RF GaN IP Competition Intensifies Across the Value Chain

Across the RF GaN supply chain, competitive IP positions remain concentrated around a limited number of established players, but the balance is shifting. Japanese companies continue to hold strong IPpositions in wafers and epiwafers, with Sumitomo Electric and NGK Insulators among the established leaders and Shin-Etsu emerging as a significant challenger. In devices and downstream technologies, US players retain a particularly strong position. Following the transfer of Wolfspeed’s RF business and related patent assets, MACOM now stands out through the breadth of its IP position across RF GaN devices, packaging and circuits, giving it one of the most comprehensive portfolios across the value chain.

Competition is also taking increasingly distinct regional forms. China’s leading RF GaN patent positions remain largely driven by state-backed organizations, notably CETC and Xidian University, with Xidian University emerging as the leading domestic player in RF GaN devices. At the same time, industrial companies such as Huawei, Enkris and Hanhua Semiconductor are becoming more visible, suggesting a gradual broadening of China’s innovation base beyond institutional applicants.

Meanwhile, IP strategies are becoming increasingly international. US companies are extending their patent protection more strongly into Europe and, increasingly, China, while Japanese players have expanded their filings in the United States and China since 2022. The RF GaN IP landscape is therefore moving toward more direct competition across both technology segments and jurisdictions, with portfolio breadth and international patent coverage becoming increasingly important dimensions of IP leadership.

Useful patent database

This report includes an extensive Excel database with all patents analyzed in this study, including:

• Key patent information (numbers, dates, assignees, titles, abstracts, etc.)
• Hyperlinks to an up-to-date online database (original documents, legal status, etc.)
• Structured classification by supply chain/technical segments (wafers & epiwafers, devices, modules & packaging, circuits, current collapse, GaN-on-Silicon, monolithic integration, thermal management, etc.)

Interactive dashboard (optional)

Optional add-on: One-year access to the interactive dashboard for unlimited authorized users within your organization.

This solution transforms the patent landscape analysis into a true decision-support tool.

Key features:

• Dynamically explore the patent landscape based on your priorities
• Access clear, interactive visualizations for immediate insights
• Filter and analyze data by players, technologies, countries, dates, and legal status
• Drill down instantly from high-level trends to specific players, technologies, and patents
• Tailor insights to the needs of each team (R&D, IP, strategy, business development)

Benefits:

• Get immediate answers to your key questions
• Save time and accelerate decision-making
• Focus on the insights that matter most

Companies mentioned in the report (non-exhaustive)

INDUSTRIALS: CETC, Sumitomo Electric, Macom, Mitsubishi Electric, Toshiba, Fujitsu, Wolfspeed, Intel, Qorvo, Panasonic, NXP, NTT, RTX Corporation, HiWAFER, San’an, HRL, Dynax Semiconductor, Samsung, Northrop Grumman, Hatchip, Huawei, Murata, NEC, RFHIC, NGK Insulators, Shin Etsu, Akoustis, Ampleon, Hanhua Semiconductor, Qualcomm, ZTE, Sony, SpaceX, WIN Semiconductors, Broadcom, BAE Systems, Infineon, Skyworks, Sumitomo Chemical, Analog Devices, OnMicro Electronics, Thales, Lockheed Martin, Enkris, IQE, Nuvoton, and more.

R&D LABORATORIES: Xidian University, SCUT, IMECAS, UESTC, Institute of Semiconductors (CAS), ETRI, SINANO (CAS), University of California, KETI, KNU – Kyungpook National University, SUSTech, Fraunhofer, MIT, Shanghai Institute of Microsystem & Information Technology (CAS), imec, Cornell University, Shandong University, Sun Yat-sen University, Suzhou University of Science and Technology, AIST, CEA, and more..

Table of Contents

INTRODUCTION

• Context and objectives of the report
• Patent search strategy and methodology

EXECUTIVE SUMMARY

• Take away messages
• IP activities in the different ecosystems (Japan, China, US, Europe, etc.)
• IP activities across the supply Chain

RF GaN PATENT LANDSCAPE

• Patent landscape overview
  • Who is driving the patenting activity?
  • The global supply chain from a patent perspective
  • Most active IP players and new entrants
  • Main technical challenges (dynamic on-resistance, e-mode, GaN-on-Si, vertical devices, monolithic integration, thermal management, etc.)
• Patent landscape analysis by country/geographical area
  • US patent landscape
  • Japanese patent landscape
  • European patent landscape
  • Chinese patent landscape
  • Taiwanese patent landscape
  • South Korean patent landscape

For each country: time evolution of patenting activity, supply chain from a patent perspective, status of players’ IP activity, main patent assignees, most active IP players, new entrants, main technical challenges addressed by IP players, IP strategies of players, current legal status of their patents (pending, granted, protected countries, etc.), recent IP collaborations (patent co-filings) and IP transfers (change in ownership), focus on key players’ patent portfolio.

• Patent landscape analysis by supply chain segments
  • Wafers & epiwafers for RF applications
  • GaN RF devices
  • RF modules & packaging
  • RF circuits & applications

For each segment: Time evolution of patent publications from US players, Japanese players, European players, etc., main patent assignees, most active IP players, new entrants, current legal status of their patents (pending, granted), technical challenges addressed by IP players, main patent assignees and new entrant by technical challenge.

ANNEX

• Terminology

KNOWMADE PRESENTATION