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市場調查報告書
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1746839

日本熱界面材料市場報告(按產品類型、應用和地區)2025-2033

Japan Thermal Interface Material Market Report by Product Type, Application, and Region 2025-2033

出版日期: | 出版商: IMARC | 英文 120 Pages | 商品交期: 5-7個工作天內

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簡介目錄

2024年,日本熱界面材料市場規模達2.33億美元。展望未來, IMARC Group預計到2033年,該市場規模將達到5.152億美元,2025-2033年期間的複合年成長率(CAGR)為9.2%。市場成長主要源自於幾個關鍵促進因素,包括對有效熱管理解決方案的需求日益成長、熱界面材料(TIM)配方和技術的持續進步,以及對電子設備的需求日益成長。

熱界面材料 (TIM) 在各種電子設備內兩個表面之間有效傳導熱量方面發揮著至關重要的作用。其主要作用是填充縫隙,消除微處理器、功率電晶體、LED 模組以及散熱器或擴散器等組件之間可能存在的氣穴,從而確保最高效的散熱。這些材料經過特殊設計,具有高導熱性和低熱阻,從而促進熱量的無縫傳遞。透過促進高效散熱,TIM 有助於維持最佳工作溫度,防止熱節流,並提升整個系統的整體效能。

日本熱界面材料市場趨勢:

日本熱界面材料市場正經歷強勁成長,這得益於電子設備格局和工業需求不斷發展變化相契合的一系列因素。一個重要的促進因素是電子設備使用量的不斷成長,包括智慧型手機、筆記型電腦和汽車電子設備。這些設備正成為現代生活不可或缺的一部分,對高效能的熱管理解決方案的需求也日益成長。此外,以更高的功率密度和更高的組件整合度為標誌的半導體技術的快速發展,對市場產生了重大影響。這一趨勢推動了對先進熱界面材料 (TIM) 解決方案的需求,以有效散發這些複雜電子元件產生的熱量。向電動車 (EV) 的轉變是另一個驅動力。電動車的生產需要有效的熱管理解決方案來解決電池、電力電子設備和電動馬達產生的熱量。資料中心基礎設施的擴張,以及資料儲存和處理需求的不斷成長,進一步催化了市場的成長。此外,提高電子設備能源效率的需求也推動了熱界面材料 (TIM) 的採用。此外,持續的研發工作已促成新型TIM配方的開發,其導熱性、可靠性和易用性均有所提升。這些創新為市場創造了巨大的成長機會。此外,汽車和航太等各行業的監管標準和指南都要求有效的熱管理,以確保安全性和可靠性,預計這將在未來幾年推動區域市場的發展。

日本熱界面材料市場細分:

產品類型洞察:

  • 膠帶和薄膜
  • 彈性墊
  • 油脂和黏合劑
  • 相變材料
  • 金屬基材料
  • 其他

應用程式洞察:

  • 電信
  • 電腦
  • 醫療器材
  • 工業機械
  • 耐久性消費品
  • 汽車電子
  • 其他

競爭格局:

市場研究報告也對市場競爭格局進行了全面分析。報告涵蓋了市場結構、關鍵參與者定位、最佳制勝策略、競爭儀錶板和公司評估象限等競爭分析。此外,報告還提供了所有主要公司的詳細資料。一些關鍵參與者包括:

  • 富士聚合物工業株式會社
  • 漢高日本有限公司(Henkel AG & Co. KGaA)
  • 稔株式會社
  • 信越化學工業株式會社

本報告回答的關鍵問題:

  • 日本熱界面材料市場迄今表現如何?未來幾年將如何表現?
  • COVID-19 對日本熱界面材料市場有何影響?
  • 日本熱界面材料市場按產品類型分類的狀況如何?
  • 日本熱界面材料市場按應用分類的分佈如何?
  • 日本熱界面材料市場的價值鏈分為哪些階段?
  • 日本熱界面材料的關鍵促進因素和挑戰是什麼?
  • 日本熱界面材料市場的結構是怎麼樣的?主要參與者有哪些?
  • 日本熱界面材料市場的競爭程度如何?

本報告回答的關鍵問題:

  • 日本熱界面材料市場迄今表現如何?未來幾年將如何表現?
  • COVID-19 對日本熱界面材料市場有何影響?
  • 日本熱界面材料市場按產品類型分類的狀況如何?
  • 日本熱界面材料市場按應用分類的分佈如何?
  • 日本熱界面材料市場的價值鏈分為哪些階段?
  • 日本熱界面材料的關鍵促進因素和挑戰是什麼?
  • 日本熱界面材料市場的結構是怎麼樣的?主要參與者有哪些?
  • 日本熱界面材料市場的競爭程度如何?

目錄

第1章:前言

第2章:範圍與方法

  • 研究目標
  • 利害關係人
  • 資料來源
    • 主要來源
    • 次要來源
  • 市場評估
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第3章:執行摘要

第4章:日本熱界面材料市場-簡介

  • 概述
  • 市場動態
  • 產業趨勢
  • 競爭情報

第5章:日本熱界面材料市場格局

  • 歷史與當前市場趨勢(2019-2024)
  • 市場預測(2025-2033)

第6章:日本熱界面材料市場-細分:依產品類型

  • 膠帶和薄膜
    • 概述
  • 彈性墊
    • 概述
  • 油脂和黏合劑
    • 概述
  • 相變材料
    • 概述
  • 金屬基材料
    • 概述
  • 其他

第7章:日本熱界面材料市場-細分:依應用

  • 電信
    • 概述
  • 電腦
    • 概述
  • 醫療器材
    • 概述
  • 工業機械
    • 概述
  • 耐久性消費品
    • 概述
  • 汽車電子
    • 概述
  • 其他

第8章:日本熱界面材料市場-競爭格局

  • 概述
  • 市場結構
  • 市場參與者定位
  • 最佳獲勝策略
  • 競爭儀錶板
  • 公司評估象限

第9章:關鍵參與者簡介

  • Fuji Polymer Industries Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Henkel Japan Ltd. (Henkel AG & Co. KGaA)
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Minoru Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events
  • Shin-Etsu Chemical Co. Ltd.
    • Business Overview
    • Product Portfolio
    • Business Strategies
    • SWOT Analysis
    • Major News and Events

第10章:日本熱界面材料市場-產業分析

  • 促進因素、限制因素和機遇
    • 概述
    • 驅動程式
    • 限制
    • 機會
  • 波特五力分析
    • 概述
    • 買家的議價能力
    • 供應商的議價能力
    • 競爭程度
    • 新進入者的威脅
    • 替代品的威脅
  • 價值鏈分析

第 11 章:附錄

簡介目錄
Product Code: SR112025A19284

Japan thermal interface material market size reached USD 233.0 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 515.2 Million by 2033, exhibiting a growth rate (CAGR) of 9.2% during 2025-2033. The market is experiencing growth due to several key drivers, including a growing need for effective thermal management solutions, ongoing advancements in thermal interface material (TIM) formulations and technologies, and the increasing demand for electronic devices.

Thermal interface material (TIMs) play a crucial role in effectively conducting heat between two surfaces within various electronic devices. Their primary function involves filling gaps and eliminating air pockets that may exist between components, such as microprocessors, power transistors, LED modules, and heat sinks or spreaders, to ensure the most efficient dissipation of heat. These materials are specifically engineered to possess high thermal conductivity and low thermal resistance, facilitating the seamless transfer of heat. By promoting efficient heat dissipation, TIMs aid in maintaining optimal operational temperatures, preventing thermal throttling, and enhancing the overall performance of the entire system.

Japan Thermal Interface Material Market Trends:

The Japan thermal interface material market is experiencing robust growth, driven by a convergence of factors that align with the evolving landscape of electronic devices and industrial requirements. A significant driver is the increasing use of electronic devices, encompassing smartphones, laptops, and automotive electronics. These devices are becoming integral to modern life, necessitating efficient thermal management solutions. Furthermore, the rapid advancements in semiconductor technology, marked by higher power densities and increased component integration, have a substantial impact on the market. This trend drives the demand for advanced TIM solutions to effectively dissipate the heat generated by these sophisticated electronic components. The shift toward electric vehicles (EVs) is another driving force. The production of EVs requires effective thermal management solutions to address the heat generated by batteries, power electronics, and electric motors. The expansion of data center infrastructure, driven by the increasing demand for data storage and processing, further catalyzes the market's growth. Additionally, the need to improve energy efficiency in electronic devices is promoting the adoption of TIMs. Moreover, ongoing research and development efforts have led to the development of new TIM formulations with improved thermal conductivity, reliability, and ease of application. These innovations create numerous growth opportunities for the market. Furthermore, regulatory standards and guidelines in various industries, such as automotive and aerospace, mandate effective thermal management to ensure safety and reliability, which is expected to fuel the regional market in the coming years.

Japan Thermal Interface Material Market Segmentation:

Product Type Insights:

  • Tapes and Films
  • Elastomeric Pads
  • Greases and Adhesives
  • Phase Change Materials
  • Metal Based Materials
  • Others

Application Insights:

  • Telecom
  • Computer
  • Medical Devices
  • Industrial Machinery
  • Consumer Durables
  • Automotive Electronics
  • Others

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the key players include:

  • Fuji Polymer Industries Co. Ltd.
  • Henkel Japan Ltd. (Henkel AG & Co. KGaA)
  • Minoru Co. Ltd.
  • Shin-Etsu Chemical Co. Ltd.

Key Questions Answered in This Report:

  • How has the Japan thermal interface material market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the Japan thermal interface material market?
  • What is the breakup of the Japan thermal interface material market on the basis of product type?
  • What is the breakup of the Japan thermal interface material market on the basis of application?
  • What are the various stages in the value chain of the Japan thermal interface material market?
  • What are the key driving factors and challenges in the Japan thermal interface material?
  • What is the structure of the Japan thermal interface material market and who are the key players?
  • What is the degree of competition in the Japan thermal interface material market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Thermal Interface Material Market - Introduction

  • 4.1 Overview
  • 4.2 Market Dynamics
  • 4.3 Industry Trends
  • 4.4 Competitive Intelligence

5 Japan Thermal Interface Material Market Landscape

  • 5.1 Historical and Current Market Trends (2019-2024)
  • 5.2 Market Forecast (2025-2033)

6 Japan Thermal Interface Material Market - Breakup by Product Type

  • 6.1 Tapes and Films
    • 6.1.1 Overview
    • 6.1.2 Historical and Current Market Trends (2019-2024)
    • 6.1.3 Market Forecast (2025-2033)
  • 6.2 Elastomeric Pads
    • 6.2.1 Overview
    • 6.2.2 Historical and Current Market Trends (2019-2024)
    • 6.2.3 Market Forecast (2025-2033)
  • 6.3 Greases and Adhesives
    • 6.3.1 Overview
    • 6.3.2 Historical and Current Market Trends (2019-2024)
    • 6.3.3 Market Forecast (2025-2033)
  • 6.4 Phase Change Materials
    • 6.4.1 Overview
    • 6.4.2 Historical and Current Market Trends (2019-2024)
    • 6.4.3 Market Forecast (2025-2033)
  • 6.5 Metal Based Materials
    • 6.5.1 Overview
    • 6.5.2 Historical and Current Market Trends (2019-2024)
    • 6.5.3 Market Forecast (2025-2033)
  • 6.6 Others
    • 6.6.1 Historical and Current Market Trends (2019-2024)
    • 6.6.2 Market Forecast (2025-2033)

7 Japan Thermal Interface Material Market - Breakup by Application

  • 7.1 Telecom
    • 7.1.1 Overview
    • 7.1.2 Historical and Current Market Trends (2019-2024)
    • 7.1.3 Market Forecast (2025-2033)
  • 7.2 Computer
    • 7.2.1 Overview
    • 7.2.2 Historical and Current Market Trends (2019-2024)
    • 7.2.3 Market Forecast (2025-2033)
  • 7.3 Medical Devices
    • 7.3.1 Overview
    • 7.3.2 Historical and Current Market Trends (2019-2024)
    • 7.3.3 Market Forecast (2025-2033)
  • 7.4 Industrial Machinery
    • 7.4.1 Overview
    • 7.4.2 Historical and Current Market Trends (2019-2024)
    • 7.4.3 Market Forecast (2025-2033)
  • 7.5 Consumer Durables
    • 7.5.1 Overview
    • 7.5.2 Historical and Current Market Trends (2019-2024)
    • 7.5.3 Market Forecast (2025-2033)
  • 7.6 Automotive Electronics
    • 7.6.1 Overview
    • 7.6.2 Historical and Current Market Trends (2019-2024)
    • 7.6.3 Market Forecast (2025-2033)
  • 7.7 Others
    • 7.7.1 Historical and Current Market Trends (2019-2024)
    • 7.7.2 Market Forecast (2025-2033)

8 Japan Thermal Interface Material Market - Competitive Landscape

  • 8.1 Overview
  • 8.2 Market Structure
  • 8.3 Market Player Positioning
  • 8.4 Top Winning Strategies
  • 8.5 Competitive Dashboard
  • 8.6 Company Evaluation Quadrant

9 Profiles of Key Players

  • 9.1 Fuji Polymer Industries Co. Ltd.
    • 9.1.1 Business Overview
    • 9.1.2 Product Portfolio
    • 9.1.3 Business Strategies
    • 9.1.4 SWOT Analysis
    • 9.1.5 Major News and Events
  • 9.2 Henkel Japan Ltd. (Henkel AG & Co. KGaA)
    • 9.2.1 Business Overview
    • 9.2.2 Product Portfolio
    • 9.2.3 Business Strategies
    • 9.2.4 SWOT Analysis
    • 9.2.5 Major News and Events
  • 9.3 Minoru Co. Ltd.
    • 9.3.1 Business Overview
    • 9.3.2 Product Portfolio
    • 9.3.3 Business Strategies
    • 9.3.4 SWOT Analysis
    • 9.3.5 Major News and Events
  • 9.4 Shin-Etsu Chemical Co. Ltd.
    • 9.4.1 Business Overview
    • 9.4.2 Product Portfolio
    • 9.4.3 Business Strategies
    • 9.4.4 SWOT Analysis
    • 9.4.5 Major News and Events

10 Japan Thermal Interface Material Market - Industry Analysis

  • 10.1 Drivers, Restraints, and Opportunities
    • 10.1.1 Overview
    • 10.1.2 Drivers
    • 10.1.3 Restraints
    • 10.1.4 Opportunities
  • 10.2 Porters Five Forces Analysis
    • 10.2.1 Overview
    • 10.2.2 Bargaining Power of Buyers
    • 10.2.3 Bargaining Power of Suppliers
    • 10.2.4 Degree of Competition
    • 10.2.5 Threat of New Entrants
    • 10.2.6 Threat of Substitutes
  • 10.3 Value Chain Analysis

11 Appendix