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1225410

高密度互連 (HDI) PCB 市場：2023-2028 年全球行業趨勢、份額、規模、增長、機遇和預測

High-Density Interconnect (HDI) PCB Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日期: | 出版商: IMARC | 英文 142 Pages | 商品交期: 2-3個工作天內

價格

市場概覽

  • 到 2022 年，高密度互連 (HDI) PCB 的全球市場規模將達到 82 億美元。 展望未來，IMARC Group 預測到 2028 年將達到 115 億美元，顯示 2023 年至 2028 年的增長率 (CAGR) 為 5.5%。
  • 高密度佈線板 (HDI) 是單位佈線密度高於傳統佈線板的佈線板。 盲孔和埋孔具有比傳統電路板更高的電路密度，但包含直徑更小的微孔，並且具有比傳統電路板相對更高的焊盤密度。 高密度 PCB 技術為工程師提供了更大的設計自由度和靈活性，使他們能夠將組件放置得更小、更緊密，從而減少信號損失和交叉延遲。 高密度互連 PCB 可以增加設計人員可以使用的表面積。 因此，高密度互連 PCB 可以實現更好的信號質量和更快的信號傳輸。

高密度互連 (HDI) PCB 市場趨勢

  • 全球市場的主要驅動力是電信、消費電子和汽車等許多最終用途行業不斷增長的產品需求。 這是由於它們在各種電子設備（如觸摸屏設備、移動電話、筆記本電腦和數碼相機）中的使用迅速擴大。 此外，電子設備小型化的趨勢和對高性能小工具的需求不斷增加也正在振興市場。 此外，隨著醫療費用的擴大，醫療器械和器械的普及也在為市場帶來利好跡象。 此外，飛機電子零部件產量的增加也是推動市場增長的關鍵因素。 其他市場發展因素包括先進安全系統的普及、自動駕駛的增長趨勢、智能設備和遊戲機銷量的擴大、可支配收入水平的提高以及大規模的研發活動。

主要市場細分

  • IMARC Group 對全球高密度互連 (HDI) PCB 市場報告的每個子部分的主要趨勢進行了分析，並預測了 2023 年至 2028 年在全球、區域和國家層面的增長。 該報告根據 HDI 層數和最終用途行業對市場進行分類。

按 HDI 層數細分

  • 4-6層HDI印刷電路板
  • 8-10 層 HDI PCB
  • 10 層或更多 HDI PCB

按最終用途行業細分

  • 智能手機、平板電腦
  • 計算機
  • 電信/數據通信
  • 消費類電子產品
  • 車載
  • 其他

按地區劃分

  • 北美
  • 美國
  • 加拿大
  • 亞太地區
  • 中國
  • 日本
  • 印度
  • 韓國
  • 澳大利亞
  • 印度尼西亞
  • 其他
  • 歐洲
  • 德國
  • 法國
  • 英國
  • 意大利
  • 西班牙
  • 俄羅斯
  • 其他
  • 拉丁美洲
  • 巴西
  • 墨西哥
  • 其他
  • 中東和非洲

本報告中回答的關鍵問題

  • 全球高密度互連 (HDI) PCB 市場迄今進展如何，未來將如何發展？
  • COVID-19 對全球高密度互連 (HDI) PCB 市場有何影響？
  • 主要的區域市場是什麼？
  • HDI 市場按層數細分的情況如何？
  • 按最終用途行業劃分的市場細分情況如何？
  • 行業價值鏈中有哪些不同階段？
  • 該行業的主要驅動因素和挑戰是什麼？
  • 全球高密度互連 (HDI) PCB 市場的結構如何，主要參與者有哪些？
  • 您所在行業的競爭力如何？

內容

第一章前言

第 2 章研究方法和範圍

  • 調查的目的
  • 利益相關者
  • 數據源
    • 主要信息
    • 次要信息
  • 市場評估
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章執行摘要

第四章介紹

  • 概覽
  • 主要行業趨勢

第 5 章全球高密度互連 (HDI) PCB 市場

  • 市場概覽
  • 市場結果
  • COVID-19 的影響
  • 市場展望

第 6 章按 HDI 層數劃分的市場細分

  • 4-6層HDI印刷電路板
    • 市場趨勢
    • 市場展望
  • 8-10層HDI印刷電路板
    • 市場趨勢
    • 市場展望
  • 10層以上的HDI印刷電路板
    • 市場趨勢
    • 市場展望

第 7 章最終用戶行業的市場細分

  • 智能手機、平板電腦
    • 市場趨勢
    • 市場預測
  • 計算機
    • 市場趨勢
    • 市場預測
  • 電信/數據通信
    • 市場趨勢
    • 市場預測
  • 消費類電子產品
    • 市場趨勢
    • 市場預測
  • 汽車
    • 市場趨勢
    • 市場預測
  • 其他
    • 市場趨勢
    • 市場預測

第 8 章按區域劃分的市場細分

  • 北美
    • 美國
      • 市場趨勢
      • 市場預測
    • 加拿大
      • 市場趨勢
      • 市場展望
  • 亞太地區
    • 中國
      • 市場趨勢
      • 市場展望
    • 日本
      • 市場趨勢
      • 市場預測
    • 印度
      • 市場趨勢
      • 市場展望
    • 韓國市場
      • 市場趨勢
      • 市場展望
    • 澳大利亞
      • 市場趨勢
      • 市場展望
    • 印度尼西亞
      • 市場趨勢
      • 市場展望
    • 其他
      • 市場趨勢
      • 市場預測
  • 歐洲
    • 德國
      • 市場趨勢
      • 市場展望
    • 法國
      • 市場趨勢
      • 市場預測
    • 英國
      • 市場趨勢
      • 市場預測
    • 意大利
      • 市場趨勢
      • 市場展望
    • 西班牙
      • 市場趨勢
      • 市場展望
    • 俄羅斯
      • 市場趨勢
      • 市場展望
    • 其他
      • 市場趨勢
      • 市場預測
  • 拉丁美洲
    • 巴西
      • 市場趨勢
      • 市場展望
    • 墨西哥
      • 市場趨勢
      • 市場展望
    • 其他
      • 市場趨勢
      • 市場預測
  • 中東和非洲
    • 市場趨勢
    • 按國家/地區劃分的市場細分
    • 市場展望

第9章SWOT分析

  • 概覽
  • 強度
  • 弱點
  • 機會
  • 威脅

第 10 章價值鏈分析

第11章波特五力分析

  • 概覽
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 12 章：價格分析

第13章競爭格局

  • 市場結構
  • 主要公司
  • 主要公司簡介
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Bittele Electronics Inc.
    • Fineline Ltd.
    • Meiko Electronics Co. Ltd.
    • Millennium Circuits Limited
    • Mistral Solutions Pvt. Ltd.
    • Shenzhen Kinwong Electronic Co. Ltd.
    • Sierra Circuits
    • TTM Technologies Inc.
    • Unimicron Technology Corporation（United Microelectronics Corporation）
    • Unitech Printed Circuit Board Corp.
    • Wurth Elektronik GmbH & Co. KG
Product Code: SR1423A251_Report

Market Overview:

  • The global high-density interconnect (HDI) PCB market size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
  • Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

High-Density Interconnect (HDI) PCB Market Trends:

  • The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.

Key Market Segmentation:

  • IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.

Breakup by Number of HDI Layer:

  • 4-6 Layers HDI PCBs
  • 8-10 Layer HDI PCBs
  • 10+ Layer HDI PCBs

Breakup by End Use Industry:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:

  • The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Wurth Elektronik GmbH & Co. KG.

Key Questions Answered in This Report:

  • How has the global high-density interconnect (HDI) PCB market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global high-density interconnect (HDI) PCB market?
  • What are the key regional markets?
  • What is the breakup of the market based on the number of HDI layer?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global high-density interconnect (HDI) PCB market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global High-Density Interconnect (HDI) PCB Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Number of HDI Layer

  • 6.1 4-6 Layers HDI PCBs
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 8-10 Layer HDI PCBs
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 10+ Layer HDI PCBs
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Smartphones and Tablets
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Computers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Telecom/Datacom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Consumer Electronics
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 Bittele Electronics Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
    • 13.3.3 Fineline Ltd.
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 Meiko Electronics Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
    • 13.3.5 Millennium Circuits Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
    • 13.3.6 Mistral Solutions Pvt. Ltd.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Shenzhen Kinwong Electronic Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 Sierra Circuits
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 TTM Technologies Inc.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 Unitech Printed Circuit Board Corp.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Wurth Elektronik GmbH & Co. KG
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio

List of Figures

  • Figure 1: Global: High-Density Interconnect PCB Market: Major Drivers and Challenges
  • Figure 2: Global: High-Density Interconnect PCB Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: High-Density Interconnect PCB Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: High-Density Interconnect PCB Market: Breakup by Number of HDI Layer (in %), 2022
  • Figure 5: Global: High-Density Interconnect PCB Market: Breakup by End Use Industry (in %), 2022
  • Figure 6: Global: High-Density Interconnect PCB Market: Breakup by Region (in %), 2022
  • Figure 7: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 8: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 9: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: High-Density Interconnect PCB (Computers) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: High-Density Interconnect PCB (Computers) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: High-Density Interconnect PCB (Telecom/Datacom) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: High-Density Interconnect PCB (Telecom/Datacom) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: High-Density Interconnect PCB (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: High-Density Interconnect PCB (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: High-Density Interconnect PCB (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: High-Density Interconnect PCB (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: High-Density Interconnect PCB (Other End Use Industries) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: High-Density Interconnect PCB (Other End Use Industries) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: North America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: North America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: United States: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: United States: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: Canada: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: Canada: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 31: Asia-Pacific: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 32: Asia-Pacific: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 33: China: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 34: China: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Japan: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: Japan: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 37: India: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 38: India: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 39: South Korea: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 40: South Korea: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 41: Australia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 42: Australia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 43: Indonesia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 44: Indonesia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 45: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 46: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 47: Europe: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 48: Europe: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 49: Germany: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 50: Germany: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: France: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: France: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 53: United Kingdom: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 54: United Kingdom: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 55: Italy: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 56: Italy: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 57: Spain: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 58: Spain: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 59: Russia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 60: Russia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 61: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 62: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 63: Latin America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 64: Latin America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 65: Brazil: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 66: Brazil: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Mexico: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Mexico: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 69: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 70: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 71: Middle East and Africa: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 72: Middle East and Africa: High-Density Interconnect PCB Market: Breakup by Country (in %), 2022
  • Figure 73: Middle East and Africa: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 74: Global: High-Density Interconnect PCB Industry: SWOT Analysis
  • Figure 75: Global: High-Density Interconnect PCB Industry: Value Chain Analysis
  • Figure 76: Global: High-Density Interconnect PCB Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: High-Density Interconnect PCB Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: High-Density Interconnect PCB Market Forecast: Breakup by Number of HDI Layer (in Million US$), 2023-2028
  • Table 3: Global: High-Density Interconnect PCB Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
  • Table 4: Global: High-Density Interconnect PCB Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 5: Global: High-Density Interconnect PCB Market: Competitive Structure
  • Table 6: Global: High-Density Interconnect PCB Market: Key Players