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1881561

高密度互連PCB市場－全球產業規模、佔有率、趨勢、機會和預測，以互連層數（單層HDI、雙層或多層HDI和全層HDI）、應用、區域和競爭格局分類，2020-2030年預測

High Density Interconnect PCB Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Interconnection Layers (1 Layer HDI, 2 or more layers HDI, and All Layers HDI), By Application, By Region and Competition, 2020-2030F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年全球高密度互連PCB市場規模為78.2億美元，預計2030年將以17.92%的複合年成長率成長至210.2億美元。高密度互連（HDI）PCB是一種印刷電路板，其單位面積佈線密度高於傳統電路板，並採用微孔、更精細的線路和間距以及盲孔或埋孔等技術，以實現更高的電氣性能和更小的尺寸。市場成長的主要促進因素包括：對小型輕量電子設備的需求不斷成長、先進消費性電子產品的普及以及汽車行業中用於自動駕駛和高級駕駛輔助系統的複雜系統的日益整合。

市場概覽
預測期 2026-2030
2024年市場規模 78.2億美元
2030年市場規模 210.2億美元
2025-2030年複合年成長率 17.92%
成長最快的細分市場 消費性電子產品
最大的市場 亞太地區

主要市場促進因素

主要市場挑戰

主要市場趨勢

目錄

第1章：產品概述

第2章：研究方法

第3章：執行概要

第4章：顧客之聲

第5章：全球高密度互連PCB市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 以互連層數分類（1 層 (1+N+1) HDI、2 層或更多層 (2+N+2) HDI、所有層均為 HD）
    • 按應用領域（消費性電子、汽車、軍事和國防、醫療保健、工業/製造、其他）
    • 按地區
    • 按公司（2024 年）
  • 市場地圖

第6章：北美高密度互連PCB市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲高密度互連PCB市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區高密度互連PCB市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲高密度互連PCB市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美高密度互連PCB市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章：市場動態

  • 促進要素
  • 挑戰

第12章：市場趨勢與發展

  • 併購（如有）
  • 產品發布（如有）
  • 最新進展

第13章：全球高密度互連PCB市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商議價能力
  • 顧客的力量
  • 替代產品的威脅

第15章：競爭格局

  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • Applied Materials, Inc.
  • Cadence Design Systems, Inc..
  • Synopsys, Inc.
  • Advanced Micro Devices Inc.
  • Lam Research Corporation

第16章：策略建議

第17章調查會社について,免責事項

簡介目錄
Product Code: 21821

The Global High Density Interconnect PCB Market, valued at USD 7.82 Billion in 2024, is projected to experience a CAGR of 17.92% to reach USD 21.02 Billion by 2030. High Density Interconnect (HDI) PCBs are printed circuit boards characterized by a higher wiring density per unit area than conventional boards, incorporating features such as microvias, finer lines and spaces, and blind or buried vias to achieve enhanced electrical performance and miniaturization. The market's growth is primarily driven by the escalating demand for compact and lightweight electronic devices, the proliferation of advanced consumer electronics, and the expanding integration of sophisticated systems in the automotive sector for autonomous driving and advanced driver-assistance systems.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 7.82 Billion
Market Size 2030USD 21.02 Billion
CAGR 2025-203017.92%
Fastest Growing SegmentConsumer Electronics
Largest MarketAsia Pacific

Key Market Drivers

The global High Density Interconnect PCB Market experiences significant expansion driven by the continuous miniaturization of electronic devices. Demand for compact, lighter, and higher-performing electronics necessitates advanced printed circuit board solutions. HDI technology directly facilitates this trend by enabling finer lines, smaller vias, and greater connection densities, crucial for integrating advanced functionalities within reduced device dimensions. For example, according to Apple's announcement, in June 2023, the company planned to introduce resin-coated copper materials in its iPhone models in 2024, replacing some copper-clad laminates, a strategic shift underscoring commitment to space-efficient designs.

Key Market Challenges

The inherent manufacturing complexity and elevated production costs associated with High Density Interconnect (HDI) PCBs present a significant impediment to the growth of the global market. The intricate design requirements for HDI PCBs, including microvias and fine line technology, necessitate specialized equipment and highly precise processes. This directly contributes to higher unit costs, which can constrain broader adoption in various cost-sensitive applications. For instance, establishing a single high-end HDI PCB production line requires an investment exceeding $7 million, according to Revista Espanola de Electronica in 2025.

Key Market Trends

The Global High Density Interconnect PCB Market is significantly influenced by the proliferation of flexible and rigid-flex HDI form factors. This trend addresses the evolving demand for compact, lightweight, and highly adaptable electronic devices by integrating rigid and flexible substrates into a single, interconnected structure. Such designs minimize the need for traditional connectors, consequently reducing overall assembly size, weight, and potential points of failure, while simultaneously enhancing signal integrity. These advantages are crucial for modern applications such as wearables, medical devices, and advanced automotive systems that require complex circuitry in constrained spaces.

Key Market Players

  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • Applied Materials, Inc.
  • Cadence Design Systems, Inc..
  • Synopsys, Inc.
  • Advanced Micro Devices Inc.
  • Lam Research Corporation

Report Scope:

In this report, the Global High Density Interconnect PCB Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

High Density Interconnect PCB Market, By Interconnection Layers:

  • 1 Layer (1+N+1) HDI
  • 2 or more layers (2+N+2) HDI
  • All Layers HD

High Density Interconnect PCB Market, By Application:

  • Consumer Electronics
  • Automotive
  • Military and Defense
  • Healthcare
  • Industrial/ Manufacturing
  • Others

High Density Interconnect PCB Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global High Density Interconnect PCB Market.

Available Customizations:

Global High Density Interconnect PCB Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global High Density Interconnect PCB Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Interconnection Layers (1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, All Layers HD)
    • 5.2.2. By Application (Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2024)
  • 5.3. Market Map

6. North America High Density Interconnect PCB Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Interconnection Layers
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States High Density Interconnect PCB Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Interconnection Layers
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada High Density Interconnect PCB Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Interconnection Layers
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico High Density Interconnect PCB Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Interconnection Layers
        • 6.3.3.2.2. By Application

7. Europe High Density Interconnect PCB Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Interconnection Layers
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany High Density Interconnect PCB Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Interconnection Layers
        • 7.3.1.2.2. By Application
    • 7.3.2. France High Density Interconnect PCB Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Interconnection Layers
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom High Density Interconnect PCB Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Interconnection Layers
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy High Density Interconnect PCB Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Interconnection Layers
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain High Density Interconnect PCB Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Interconnection Layers
        • 7.3.5.2.2. By Application

8. Asia Pacific High Density Interconnect PCB Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Interconnection Layers
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China High Density Interconnect PCB Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Interconnection Layers
        • 8.3.1.2.2. By Application
    • 8.3.2. India High Density Interconnect PCB Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Interconnection Layers
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan High Density Interconnect PCB Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Interconnection Layers
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea High Density Interconnect PCB Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Interconnection Layers
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia High Density Interconnect PCB Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Interconnection Layers
        • 8.3.5.2.2. By Application

9. Middle East & Africa High Density Interconnect PCB Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Interconnection Layers
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia High Density Interconnect PCB Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Interconnection Layers
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE High Density Interconnect PCB Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Interconnection Layers
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa High Density Interconnect PCB Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Interconnection Layers
        • 9.3.3.2.2. By Application

10. South America High Density Interconnect PCB Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Interconnection Layers
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil High Density Interconnect PCB Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Interconnection Layers
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia High Density Interconnect PCB Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Interconnection Layers
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina High Density Interconnect PCB Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Interconnection Layers
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global High Density Interconnect PCB Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Taiwan Semiconductor Manufacturing Company Limited
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Intel Corporation
  • 15.3. Samsung Electronics Co., Ltd.
  • 15.4. GlobalFoundries Inc.
  • 15.5. United Microelectronics Corporation
  • 15.6. Applied Materials, Inc.
  • 15.7. Cadence Design Systems, Inc..
  • 15.8. Synopsys, Inc.
  • 15.9. Advanced Micro Devices Inc.
  • 15.10. Lam Research Corporation

16. Strategic Recommendations

17. About Us & Disclaimer