查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1662211

全球 3D 晶片 (3D IC) 市場

3D Chips (3D IC)
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 276 Pages | 商品交期: 最快1-2個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

預計到 2030 年全球 3D 晶片 (3D IC) 市場規模將達到 452 億美元

2024 年全球 3D 晶片（3D IC）市場規模估計為 168 億美元，預計到 2030 年將達到 452 億美元，2024 年至 2030 年的複合年成長率為 18.0%。記憶體是報告中分析的細分市場之一，預計複合年成長率為 19.2%，到分析期結束時將達到 222 億美元。在分析期間內，LED 部分的複合年成長率預計為 18.2%。

美國市場規模估計為 46 億美元，中國市場預估年複合成長率為 16.6%

預計2024年美國3D晶片（3D IC）市場規模將達46億美元。中國是世界第二大經濟體，預計到 2030 年市場規模將達到 67 億美元，2024-2030 年分析期間的複合年成長率為 16.6%。其他值得注意的區域市場包括日本和加拿大，預計在分析期間的複合年成長率分別為 16.5% 和 15.2%。在歐洲，預計德國的複合年成長率約為 12.6%。

3D 晶片 (3D IC) - 主要趨勢和促進因素

3D 晶片，也稱為 3D 積體電路 (3D IC)，是半導體技術的一項革命性進步，解決了傳統 2D IC 的限制。這些晶片是透過堆疊多層矽晶片或晶粒並使用穿透矽通孔(TSV) 垂直連接它們製成的。這種架構設計透過提高整合密度、降低功耗，顯著提高了晶片效能。垂直堆疊減少了層間互連長度，從而提高訊號傳輸速度並減少延遲。這使得多種類型的電路（包括邏輯、記憶體和類比）可以整合到單一封裝中，以緊湊的尺寸提供增強的功能和性能。 3D IC 對各種應用都有重大影響，包括高效能運算、行動裝置、資料中心和物聯網 (IoT) 設備，它為克服傳統半導體擴展的物理和經濟障礙提供了途徑。

3D IC 市場最突出的趨勢之一是對高效能和節能運算解決方案的需求不斷增加。資料中心和雲端處理服務的快速擴張迫切需要能夠以最小的能耗處理大量資料的處理器。 3D IC 因其卓越的性能和能源效率而特別適合這些需求。此外，人工智慧（AI）和機器學習（ML）應用的普及需要能夠快速執行複雜運算的晶片。 3D IC 尺寸更小、性能更佳，非常適合這些應用。此外，智慧型手機和穿戴式裝置等消費性電子產品的小型化趨勢正在推動 3D IC 的採用。這些晶片在更小的封裝內提供更多的功能，滿足了消費者對更強大但更緊湊的設備的需求。異質整合的發展將不同類型的電路結合到一個3D封裝中，進一步擴展了3D積體電路的潛在應用，為不同行業的特定需求提供客製化的解決方案。

3D IC 市場的成長受到多種因素的推動。其中一個主要促進因素是電子設備的複雜性日益增加以及對更高整合度的需求。隨著設備變得越來越複雜，對於能夠在單一封裝中整合更多功能的晶片的需求也越來越大，而 3D IC 可以實現這一點。另一個關鍵促進因素是提高資料密集型應用的能源效率和效能。提高處理速度並降低功耗的能力使得 3D IC 在資料中心和高效能運算環境中具有吸引力。此外，製造技術的進步正在降低生產 3D IC 的成本，使其更適用於更廣泛的應用。此外，物聯網設備的普及和邊緣運算日益成長的重要性也促進了市場的成長。這些應用需要小型、高效、高性能的晶片。此外，領先半導體公司的策略聯盟和研發投資正在加速 3D IC 技術的創新和應用。新材料的整合和先進封裝技術的發展也正在擴大3D IC的功能和應用。總而言之，技術進步、市場需求和策略投資的整合正在推動 3D IC 市場向前發展，預計將在運算效能、能源效率和設備功能方面取得重大進展。

部分

產品（記憶體、LED、感測器、MEMS）；類型（加法 3D、單片 3D）；最終用戶（消費性電子、通訊、汽車、軍事和航太、醫療設備、工業、其他最終用戶）

受訪公司範例（26家值得關注的公司）

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Toshiba Corporation

目錄

第1章調查方法

第 2 章執行摘要

  • 市場概況
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章 市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他地區

第4章 競賽

簡介目錄
Product Code: MCP-6575

Global 3D Chips (3D IC) Market to Reach US$45.2 Billion by 2030

The global market for 3D Chips (3D IC) estimated at US$16.8 Billion in the year 2024, is expected to reach US$45.2 Billion by 2030, growing at a CAGR of 18.0% over the analysis period 2024-2030. Memory, one of the segments analyzed in the report, is expected to record a 19.2% CAGR and reach US$22.2 Billion by the end of the analysis period. Growth in the LEDs segment is estimated at 18.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$4.6 Billion While China is Forecast to Grow at 16.6% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$4.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.5% and 15.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.6% CAGR.

3D Chips (3D IC) - Key Trends and Drivers

3D chips, also known as 3D integrated circuits (3D ICs), represent a transformative advancement in semiconductor technology, addressing the limitations of traditional 2D ICs. These chips are created by stacking multiple layers of silicon wafers or dies and connecting them vertically using through-silicon vias (TSVs). This architectural design significantly enhances chip performance by increasing density and reducing power consumption. The vertical stacking shortens the interconnect lengths between layers, which improves signal transmission speed and reduces latency. This allows for integrating various types of circuits, such as logic, memory, and analog, within a single package, enhancing functionality and performance in a compact form factor. The impact of 3D ICs is profound across various applications, including high-performance computing, mobile devices, data centers, and Internet of Things (IoT) devices, offering a path to overcoming the physical and economic barriers of traditional semiconductor scaling.

One of the most prominent trends in the 3D IC market is the escalating demand for high-performance and energy-efficient computing solutions. As data centers and cloud computing services expand rapidly, there is a pressing need for processors capable of handling vast amounts of data with minimal energy consumption. 3D ICs are particularly well-suited for these demands due to their superior performance and energy efficiency. Additionally, the surge in artificial intelligence (AI) and machine learning (ML) applications necessitates chips that can execute complex computations swiftly. The compactness and enhanced performance of 3D ICs make them ideal for these applications. Moreover, the ongoing trend of miniaturization in consumer electronics, such as smartphones and wearable devices, is propelling the adoption of 3D ICs. These chips enable more functionality within smaller packages, addressing consumer demand for more powerful yet compact devices. The development of heterogeneous integration, where different types of circuits are combined in a single 3D package, further expands the potential applications of 3D ICs, offering solutions tailored to specific needs across various sectors.

The growth in the 3D IC market is driven by several factors. One major driver is the increasing complexity of electronic devices and the need for higher integration levels. As devices become more sophisticated, there is a greater demand for chips that can integrate more functions within a single package, which 3D ICs can provide. Another key driver is the push for improved energy efficiency and performance in data-intensive applications. The ability of 3D ICs to reduce power consumption while enhancing processing speed makes them attractive for use in data centers and high-performance computing environments. Additionally, advancements in fabrication and manufacturing technologies have reduced the costs associated with 3D IC production, making them more accessible to a broader range of applications. The proliferation of IoT devices and the increasing importance of edge computing also contribute to the market growth, as these applications require compact, efficient, and high-performance chips. Moreover, strategic collaborations and investments in research and development by major semiconductor companies are accelerating the innovation and adoption of 3D IC technologies. The integration of new materials and the development of advanced packaging techniques are also expanding the capabilities and applications of 3D ICs. In summary, the convergence of technological advancements, market demands, and strategic investments is propelling the 3D IC market forward, promising significant advancements in computing performance, energy efficiency, and device functionality.

SCOPE OF STUDY:

The report analyzes the 3D Chips (3D IC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product (Memory, LEDs, Sensors, MEMS); Type (Stacked 3D, Monolithic 3D); End-Use (Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 26 Featured) -

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Toshiba Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • 3D Chips (3D IC) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increasing Demand for High-Performance Computing Drives Adoption
    • Advances in Through-Silicon Via (TSV) Technology Propel Growth
    • Expansion of Data Centers Spurs Demand for Energy-Efficient 3D ICs
    • Rise of AI and Machine Learning Applications Expands Addressable Market Opportunity
    • Miniaturization Trends in Consumer Electronics Strengthen Business Case for 3D ICs
    • Growing Complexity of Electronic Devices Generates Demand for Higher Integration
    • Innovations in Heterogeneous Integration Techniques Accelerate Adoption
    • Shift Towards Edge Computing Sustains Growth in 3D IC Market
    • Consumer Demand for Compact and Powerful Devices Propels Market Growth
    • Development of Advanced Packaging Solutions Expands Market Opportunities
    • Emergence of Smart Devices Accelerates Demand for 3D ICs
    • Integration of New Materials in 3D ICs Generates Opportunities for Enhanced Functionality
    • Evolving Cloud Computing Requirements Propel Need for High-Density 3D ICs
    • Focus on Reducing Latency in Data Processing: Here's the Story of 3D IC Impact
    • Adoption of Biometric and Security Technologies Drives Market Growth for 3D ICs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D Chips (3D IC) Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for LEDs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for LEDs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Stacked 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Stacked 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Monolithic 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Monolithic 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Medical Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Medical Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Industrial Sector by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World 6-Year Perspective for Industrial Sector by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 29: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 30: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: USA 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 32: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: USA 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 34: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 35: USA 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 36: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Canada 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Canada 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 40: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: Canada 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 42: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: Japan 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Japan 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 46: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Japan 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 48: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: China 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 50: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: China 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 52: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: China 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 55: Europe 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 58: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 60: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 62: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 64: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: France 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 66: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: France 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 68: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 70: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Germany 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 72: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Germany 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 74: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 76: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 77: Italy 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 78: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Italy 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 80: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 82: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 83: UK 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 84: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 85: UK 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 88: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 89: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 90: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 91: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 94: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 96: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF WORLD
    • TABLE 98: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 100: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 102: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Rest of World 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION