靜態隨機存取記憶體（SRAM）市場機會、成長要素、產業趨勢分析及2026年至2035年預測

全球靜態隨機存取記憶體 (SRAM) 市場預計到 2025 年將達到 7.18 億美元，到 2035 年將達到 11.6 億美元，年複合成長率為 4.9%。

由於先進電子系統對高速、低延遲和高可靠性的儲存解決方案的需求不斷成長，市場正在擴張。 SRAM 在下一代半導體設計中的整合度不斷提高，以及其在運算、網路和汽車電子領域的應用日益廣泛，正在推動其長期成長。半導體製造技術的不斷進步，也為 SRAM 產品更高的密度和效率提供了支援。對數據密集型數位基礎設施的投資不斷成長，也加速了 SRAM 的應用，因為 SRAM 在確保快速數據存取和處理方面發揮關鍵作用。隨著現代應用不斷產生和處理大量數據，快速穩定的片上記憶體變得日益重要。靜態隨機存取記憶體 (SRAM) 是一種揮發性半導體記憶體，僅在通電時才保存數據，與其他類型的記憶體相比，其存取速度更快。這些效能優勢滿足了系統設計人員對速度、可靠性和低功耗的需求。

預計到2025年，非同步SRAM市場規模將達到3.018億美元。該市場憑藉其穩定的運作、簡化的介面設計以及與多種電子架構的兼容性，保持著強勁的市場地位。其久經考驗的可靠性和易於整合性也使其在多種系統設計中廣泛應用。

預計到 2035 年，16Mb 及以上 SRAM 市場將以 6.3% 的複合年成長率成長，達到 1.947 億美元。該市場的成長是由對片上儲存容量日益成長的需求所驅動的，以實現更快的數據處理並減少對外部儲存組件的依賴。

預計到 2025 年，北美靜態隨機存取記憶體 (SRAM) 市佔率將達到 31.2%。該地區的成長得益於強大的半導體製造能力、先進的技術基礎設施以及對專注於記憶體技術創新的研發活動的持續投資。

目錄

第1章調查方法和範圍

第2章執行摘要

第3章業界考察

• 生態系分析
  • 供應商情況
  • 利潤率
  • 成本結構
  • 每個階段的附加價值
  • 影響價值鏈的因素
  • 中斷
• 產業影響因素
  • 促進要素
    • 擴展人工智慧和機器學習應用
    • 邊緣運算和物聯網設備的激增
    • 處理器對高效能快取的需求不斷成長
    • 半導體技術和節點小型化的進步
    • 汽車和5G基礎設施電子產業的成長
  • 產業潛在風險與挑戰
    • 高昂的製造成本和規模限制
    • 半導體供應鏈波動性和原料供應情況
  • 市場機遇
    • SRAM在人工智慧加速器和高效能運算中的應用日益廣泛
    • 在先進的SoC設計中擴展嵌入式SRAM整合
• 成長潛力分析
• 監管環境
• 波特分析
• PESTEL 分析
• 科技與創新趨勢
  • 當前技術趨勢
  • 新興技術
• 價格趨勢
  • 按地區
  • 依產品
• 定價策略
• 新興經營模式
• 合規要求
• 永續性措施
• 消費者心理分析
• 專利和智慧財產權分析
• 地緣政治和貿易趨勢

第4章 競爭情勢

• 介紹
• 公司市佔率分析
  • 按地區
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東和非洲
  • 市場集中度分析
• 主要企業的競爭標竿分析
  • 財務績效比較
    • 收入
    • 利潤率
    • 研究與開發
  • 產品系列比較
    • 產品線豐富
    • 科技
    • 創新
  • 按地區分類的企業發展比較
    • 全球擴張分析
    • 服務網路覆蓋範圍
    • 按地區分類的市場滲透率
  • 競爭定位矩陣
    • 領導企業
    • 受讓人
    • 追蹤者
    • 小眾玩家
  • 戰略展望矩陣
• 2021-2024 年主要發展動態
  • 併購
  • 夥伴關係與合作
  • 技術進步
  • 擴張與投資策略
  • 永續發展計劃
  • 數位轉型計劃
• 新興/Start-Ups競賽的趨勢

第5章 按類型分類的市場估算與預測，2022-2035年

• 異步SRAM
• 同步SRAM
• 其他

第6章 依記憶容量分類的市場估算與預測，2022-2035年

• 1MB 或更少
• 1Mb～4Mb
• 4Mb～16Mb
• 16Mb 或以上

7. 2022-2035年按最終用途產業分類的市場估算與預測

• 資訊科技/通訊
• 家用電子電器
• 車
• 航太/國防
• 工業的
• 衛生保健
• 其他

第8章 2022-2035年各地區市場估算與預測

• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 英國
  • 法國
  • 義大利
  • 西班牙
  • 荷蘭
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 澳洲
  • 韓國
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 阿根廷
• 中東和非洲
  • 南非
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國

第9章：公司簡介

• Alliance Memory, Inc.
• Analog Devices, Inc.
• GSI Technology Inc.
• Infineon Technologies
• Integrated Silicon Solution Inc.（ISSI）
• Microchip Technology Inc.
• NXP Semiconductors
• ON Semiconductor
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• STMicroelectronics NV
• Texas Instruments
• Toshiba Corporation
• Winbond Electronics Corporation

The Global Static Random-Access Memory Market was valued at USD 718 million in 2025 and is estimated to grow at a CAGR of 4.9% to reach USD 1.16 billion by 2035.

Market expansion is driven by rising demand for memory solutions that deliver high speed, minimal latency, and reliable performance across advanced electronic systems. Increasing integration of SRAM in next-generation semiconductor designs and the broadening scope of applications across computing, networking, and automotive electronics are reinforcing long-term growth. Ongoing improvements in semiconductor fabrication technologies are supporting higher density and improved efficiency in SRAM products. Growing investment in data-intensive digital infrastructure is also accelerating adoption, as SRAM plays a critical role in ensuring fast data access and processing. As modern applications continue to generate and process larger volumes of data, the importance of fast and stable on-chip memory is increasing. Static random-access memory is defined as a volatile semiconductor memory that retains stored data as long as power is supplied and enables faster access speeds compared to alternative memory types. These performance advantages are sustaining demand as system designers prioritize speed, reliability, and low power consumption.

The asynchronous SRAM segment generated USD 301.8 million in 2025. This segment maintains a strong position due to its stable operation, simplified interface design, and compatibility with a wide range of electronic architectures. Its proven reliability and ease of integration continue to support widespread use across multiple system designs.

The above 16Mb SRAM segment is projected to grow at a CAGR of 6.3% and is expected to reach USD 194.7 million by 2035. Growth in this segment is being supported by increasing requirements for higher on-chip memory capacity to enable faster data handling and reduced dependence on external memory components.

North America Static Random-Access Memory (SRAM) Market accounted for 31.2% share in 2025. Regional growth is supported by strong semiconductor manufacturing capabilities, advanced technological infrastructure, and sustained investment in research and development activities focused on memory innovation.

Key companies operating in the Global Static Random-Access Memory Market include Samsung Electronics Co., Ltd., Texas Instruments, Renesas Electronics Corporation, Microchip Technology Inc., Infineon Technologies, NXP Semiconductors, STMicroelectronics NV, Toshiba Corporation, Winbond Electronics Corporation, Alliance Memory, Inc., GSI Technology Inc., ON Semiconductor, Integrated Silicon Solution Inc., and Analog Devices, Inc. Companies in the Static Random-Access Memory (SRAM) Market are strengthening their position through continuous innovation, capacity expansion, and technology optimization. Many players are investing in advanced process nodes to improve speed, reduce power consumption, and increase memory density. Expanding product portfolios to address diverse performance and capacity requirements is a key strategy. Firms are also focusing on long-term supply agreements with system manufacturers to secure consistent demand.

Table of Contents

Chapter 1 Methodology and Scope

• 1.1 Market scope and definition
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Data mining sources
  • 1.3.1 Global
  • 1.3.2 Regional/Country
• 1.4 Base estimates and calculations
  • 1.4.1 Base year calculation
  • 1.4.2 Key trends for market estimation
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
• 1.6 Forecast model
• 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

• 2.1 Industry 360° synopsis
• 2.2 Key market trends
  • 2.2.1 Business trends
  • 2.2.2 Type Trends
  • 2.2.3 Memory Size Trends
  • 2.2.4 End Use Industry Trends
  • 2.2.5 Regional Trends
• 2.3 CXO perspectives: Strategic imperatives
  • 2.3.1 Key decision points for industry executives
  • 2.3.2 Critical success factors for market players
• 2.4 Future outlook and strategic recommendations

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Supplier Landscape
  • 3.1.2 Profit Margin
  • 3.1.3 Cost structure
  • 3.1.4 Value addition at each stage
  • 3.1.5 Factor affecting the value chain
  • 3.1.6 Disruptions
• 3.2 Industry impact forces
  • 3.2.1 Growth drivers
    • 3.2.1.1 Expansion of AI and Machine Learning Applications
    • 3.2.1.2 Proliferation of Edge Computing and IoT Devices
    • 3.2.1.3 Increasing Demand for High-Performance Cache Memory in Processors
    • 3.2.1.4 Advancements in Semiconductor Technology and Node Scaling
    • 3.2.1.5 Growth in Automotive and 5G Infrastructure Electronics
  • 3.2.2 Industry pitfalls and challenges
    • 3.2.2.1 High Manufacturing Costs and Scaling Limitations
    • 3.2.2.2 Volatility in Semiconductor Supply Chain and Raw Material Availability
  • 3.2.3 Market opportunities
    • 3.2.3.1 Rising Adoption of SRAM in AI Accelerators and High-Performance Computing
    • 3.2.3.2 Growing Integration of Embedded SRAM in Advanced SoC Designs
• 3.3 Growth potential analysis
• 3.4 Regulatory landscape
  • 3.4.1 North America
  • 3.4.2 Europe
  • 3.4.3 Asia Pacific
  • 3.4.4 Latin America
  • 3.4.5 Middle East and Africa
• 3.5 Porter';s analysis
• 3.6 PESTEL analysis
• 3.7 Technology and Innovation landscape
  • 3.7.1 Current technological trends
  • 3.7.2 Emerging technologies
• 3.8 Price trends
  • 3.8.1 By region
  • 3.8.2 By product
• 3.9 Pricing Strategies
• 3.10 Emerging Business Models
• 3.11 Compliance Requirements
• 3.12 Sustainability Measures
• 3.13 Consumer Sentiment Analysis
• 3.14 Patent and IP analysis
• 3.15 Geopolitical and trade dynamics

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
  • 4.2.1 By region
    • 4.2.1.1 North America
    • 4.2.1.2 Europe
    • 4.2.1.3 Asia Pacific
    • 4.2.1.4 Latin America
    • 4.2.1.5 Middle East & Africa
  • 4.2.2 Market Concentration Analysis
• 4.3 Competitive Benchmarking of key Players
  • 4.3.1 Financial Performance Comparison
    • 4.3.1.1 Revenue
    • 4.3.1.2 Profit Margin
    • 4.3.1.3 R&D
  • 4.3.2 Product Portfolio Comparison
    • 4.3.2.1 Product Range Breadth
    • 4.3.2.2 Technology
    • 4.3.2.3 Innovation
  • 4.3.3 Geographic Presence Comparison
    • 4.3.3.1 Global Footprint Analysis
    • 4.3.3.2 Service Network Coverage
    • 4.3.3.3 Market Penetration by Region
  • 4.3.4 Competitive Positioning Matrix
    • 4.3.4.1 Leaders
    • 4.3.4.2 Challengers
    • 4.3.4.3 Followers
    • 4.3.4.4 Niche Players
  • 1.1.1 Strategic outlook matrix
• 4.4 Key developments, 2021-2024
  • 4.4.1 Mergers and Acquisitions
  • 4.4.2 Partnerships and Collaborations
  • 4.4.3 Technological Advancements
  • 4.4.4 Expansion and Investment Strategies
  • 4.4.5 Sustainability Initiatives
  • 4.4.6 Digital Transformation Initiatives
• 4.5 Emerging/ Startup Competitors Landscape

Chapter 5 Market Estimates and Forecast, By Type, 2022 - 2035 ($ Bn)

• 5.1 Key trends
• 5.2 Asynchronous SRAM
• 5.3 Synchronous SRAM
• 5.4 Others

Chapter 6 Market Estimates and Forecast, By Memory Size, 2022 - 2035 ($ Bn)

• 6.1 Key trends
• 6.2 Up to 1Mb
• 6.3 1Mb to 4Mb
• 6.4 4Mb to 16Mb
• 6.5 Above 16 Mb

Chapter 7 Market Estimates and Forecast, By End Use Industry, 2022 - 2035 ($ Bn)

• 7.1 Key trends
• 7.2 IT & telecom
• 7.3 Consumer electronics
• 7.4 Automotive
• 7.5 Aerospace & defense
• 7.6 Industrial
• 7.7 Healthcare
• 7.8 Others

Chapter 8 Market Estimates and Forecast, By Region, 2022 - 2035 ($ Bn)

• 8.1 Key trends
• 8.2 North America
  • 8.2.1 U.S.
  • 8.2.2 Canada
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 France
  • 8.3.4 Italy
  • 8.3.5 Spain
  • 8.3.6 Netherlands
• 8.4 Asia Pacific
  • 8.4.1 China
  • 8.4.2 India
  • 8.4.3 Japan
  • 8.4.4 Australia
  • 8.4.5 South Korea
• 8.5 Latin America
  • 8.5.1 Brazil
  • 8.5.2 Mexico
  • 8.5.3 Argentina
• 8.6 Middle East and Africa
  • 8.6.1 South Africa
  • 8.6.2 Saudi Arabia
  • 8.6.3 UAE

Chapter 9 Company Profiles

• 9.1 Alliance Memory, Inc.
• 9.2 Analog Devices, Inc.
• 9.3 GSI Technology Inc.
• 9.4 Infineon Technologies
• 9.5 Integrated Silicon Solution Inc. (ISSI)
• 9.6 Microchip Technology Inc.
• 9.7 NXP Semiconductors
• 9.8 ON Semiconductor
• 9.9 Renesas Electronics Corporation
• 9.10 Samsung Electronics Co., Ltd.
• 9.11 STMicroelectronics NV
• 9.12 Texas Instruments
• 9.13 Toshiba Corporation
• 9.14 Winbond Electronics Corporation