SRAM 和 ROM 設計 IP 市場規模、佔有率和成長分析(按應用、產品、技術、最終用途和地區分類)—產業預測(2026-2033 年)
市場調查報告書
商品編碼
1913991

SRAM 和 ROM 設計 IP 市場規模、佔有率和成長分析(按應用、產品、技術、最終用途和地區分類)—產業預測(2026-2033 年)

SRAM and ROM Design IP Market Size, Share, and Growth Analysis, By Application (Consumer Electronics, Automotive), By Product (Standard SRAM, Embedded SRAM), By Technology, By End use, By Region - Industry Forecast 2026-2033.

出版日期: | 出版商: SkyQuest | 英文 192 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

全球 SRAM 和 ROM 設計 IP 市場規模預計到 2024 年將達到 25.5 億美元,到 2025 年將達到 27.1 億美元,到 2033 年將達到 44.2 億美元,預測期(2026-2033 年)的複合年成長率為 6.3%。

全球SRAM和ROM設計IP市場的發展動力源自於各領域對節能、高密度片上記憶體的需求,這些領域包括家用電子電器、汽車系統晶片(SoC)和邊緣AI應用。隨著設計人員專注於更小的晶片尺寸和更節能的架構,對嵌入式記憶體IP模組的需求正在飆升。這些IP模組使設計人員能夠在支援多種代工廠製程的同時,實現更高的性能和更低的延遲。 SRAM IP在AI加速器中發揮關鍵作用,用於高效資料處理,而ROM IP則用於安全地儲存韌體和設備資訊。隨著SoC設計人員越來越需要針對汽車、穿戴式裝置和工業自動化等特定應用進行客製化,各種節點尺寸的記憶體效能的提升正在為IP供應商和Start-Ups創造盈利的環境。

推動全球SRAM和ROM設計IP市場發展的因素

人工智慧驅動的應用在家用電子電器、汽車和工業等領域的廣泛應用,顯著提升了對片上儲存解決方案的需求。嵌入式SRAM在邊緣AI晶片中扮演關鍵角色,提供即時資料處理所需的低延遲、高速儲存。同時,ROM IP在儲存超小型物聯網設備的韌體和靜態配置方面發揮著至關重要的作用。這些IP在提升效能的同時還能有效控制功耗,其獨特的優勢正推動著它們在智慧穿戴裝置、無人機、自主系統和先進神經網路處理器等多個市場中廣泛應用。

限制全球SRAM和ROM設計IP市場的因素

全球SRAM和ROM設計IP市場面臨嚴峻挑戰,尤其是對於中小型晶片開發商和Start-Ups而言,高性能IP模組的授權成本高。除了授權本身的經濟負擔外,將這些IP元件整合到現有的系統晶片(SoC)框架中也需要付出巨大的努力。這個過程通常需要代工廠進行嚴格的檢驗、調優和確認,這會進一步增加開發成本和產品上市時間。因此,許多小規模企業無法獲得這些高階IP產品,這限制了它們在市場上的創新和有效競爭力。

全球SRAM和ROM設計IP市場趨勢

全球SRAM和ROM設計IP市場正經歷著向可自訂、專用記憶體IP解決方案的顯著轉變。隨著半導體應用的不斷發展,對能夠根據特定需求量身定做的記憶體組件的需求日益成長,尤其是在人工智慧、汽車系統和穿戴式裝置等領域。半導體製造商越來越傾向於尋求能夠提高能源效率、性能和安全性,同時又能最大限度縮小物理尺寸的IP。這種不斷變化的市場格局正促使IP供應商開發可配置的記憶體編譯器和專用記憶體選項,以確保能夠在競爭激烈的市場中滿足客戶提出的各種效能和技術標準。

目錄

介紹

  • 調查目標
  • 調查範圍
  • 定義

調查方法

  • 資訊收集
  • 二手資料和一手資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 細分市場機會分析

市場動態與展望

  • 市場規模
  • 市場動態
    • 促進因素和機遇
    • 限制與挑戰
  • 波特分析

關鍵市場考察

  • 關鍵成功因素
  • 競爭程度
  • 關鍵投資機會
  • 市場生態系統
  • 市場吸引力指數(2025)
  • PESTEL 分析
  • 總體經濟指標
  • 價值鏈分析
  • 定價分析
  • 技術分析
  • 案例研究
  • 顧客購買行為分析

全球SRAM及ROM設計IP市場規模(依應用及複合年成長率分類)(2026-2033年)

  • 家用電子電器
  • 電訊
  • 工業自動化
  • 航太

全球SRAM和ROM設計IP市場規模(按產品和複合年成長率分類)(2026-2033年)

  • 標準SRAM
  • 嵌入式SRAM
  • 異步SRAM
  • 同步SRAM
  • ROM

全球SRAM及ROM設計IP市場規模(依技術及複合年成長率分類)(2026-2033年)

  • CMOS
  • BiCMOS
  • SOI
  • FinFET

全球SRAM和ROM設計IP市場規模(按最終用途和複合年成長率分類)(2026-2033年)

  • 行動裝置
  • 電腦
  • 網路裝置
  • 物聯網設備

全球SRAM及ROM設計IP市場規模及複合年成長率(2026-2033年)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 亞太其他地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地區
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東和非洲地區

競爭資訊

  • 前五大公司對比
  • 主要企業的市場定位(2025 年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市佔率分析(2025 年)
  • 主要企業公司簡介
    • 公司詳情
    • 產品系列分析
    • 依業務板塊進行公司股票分析
    • 2023-2025年營收年比比較

主要企業簡介

  • Qualcomm
  • Cadence Design Systems
  • Broadcom
  • Analogue Devices
  • Texas Instruments
  • Infineon Technologies
  • Synopsys
  • ON Semiconductor
  • STMicroelectronics
  • Microchip Technology
  • Intel

結論與建議

簡介目錄
Product Code: SQMIG45N2129

Global SRAM and ROM Design IP Market size was valued at USD 2.55 Billion in 2024 and is poised to grow from USD 2.71 Billion in 2025 to USD 4.42 Billion by 2033, growing at a CAGR of 6.3% during the forecast period (2026-2033).

The global SRAM and ROM design IP market is propelled by the necessity for energy-efficient and high-density on-chip memory across various sectors, including consumer electronics, automotive systems-on-chip (SoCs), and edge AI applications. As designers focus on smaller footprints and power-efficient architectures, the demand for embedded memory IP blocks has surged. These IP blocks empower designers to achieve enhanced performance and reduced latency, compatible with multiple foundry processes. SRAM IP plays a crucial role in AI accelerators for efficient data handling, while ROM IP securely stores firmware and device information. The evolution of memory performance across diverse node sizes creates a profitable landscape for IP vendors and startups, driven by the increasing customization needs of SoC designers for specific applications in automotive, wearables, and industrial automation.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global SRAM and ROM Design IP market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global SRAM and ROM Design IP Market Segments Analysis

Global SRAM and ROM Design IP Market is segmented by Application, Product, Technology, End use and region. Based on Application, the market is segmented into Consumer Electronics, Automotive, Telecommunications, Industrial Automation and Aerospace. Based on Product, the market is segmented into Standard SRAM, Embedded SRAM, Asynchronous SRAM, Synchronous SRAM and ROM. Based on Technology, the market is segmented into CMOS, BiCMOS, SOI and FinFET. Based on End use, the market is segmented into Mobile Devices, Computers, Networking Equipment and IoT Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global SRAM and ROM Design IP Market

The expansion of AI-driven applications across consumer electronics, automotive sectors, and industrial use cases has resulted in a substantial increase in demand for on-chip memory solutions. Embedded SRAM plays a vital role in edge AI chips, providing the low-latency and high-speed memory necessary for real-time data processing. Meanwhile, ROM IP serves a critical purpose by storing firmware and static configurations for ultra-compact IoT devices. The distinct ability of these intellectual properties to enhance performance while managing power consumption significantly influences their acceptance in diverse markets, including smart wearables, drones, autonomous systems, and advanced neural processors.

Restraints in the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market faces significant challenges due to the prohibitively high costs associated with licensing high-performance IP blocks, particularly for smaller chip developers and start-ups. In addition to the financial burden of licensing itself, integrating these IP components into existing System-on-Chip (SoC) frameworks requires extensive effort. This process often entails rigorous verification, tuning, and validation by foundries, which can further escalate both development costs and timelines. As a result, many smaller organizations find themselves unable to access these premium IP offerings, thereby limiting their ability to innovate and compete effectively in the market.

Market Trends of the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market is witnessing a pronounced shift towards customizable and application-specific memory IP solutions. As semiconductor applications evolve, particularly in fields such as artificial intelligence, automotive systems, and wearable devices, there is a growing demand for memory components that can be tailored to specific requirements. Chipmakers are increasingly seeking IP that enhances power efficiency, performance, security, and minimizes physical footprint. This evolving landscape is encouraging IP providers to develop configurable memory compilers and specialized memory options, ensuring that they meet the diverse performance criteria and technology standards set by their clients in this competitive market.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2025
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Case Studies
  • Customer Buying Behavior Analysis

Global SRAM and ROM Design IP Market Size by Application & CAGR (2026-2033)

  • Market Overview
  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Industrial Automation
  • Aerospace

Global SRAM and ROM Design IP Market Size by Product & CAGR (2026-2033)

  • Market Overview
  • Standard SRAM
  • Embedded SRAM
  • Asynchronous SRAM
  • Synchronous SRAM
  • ROM

Global SRAM and ROM Design IP Market Size by Technology & CAGR (2026-2033)

  • Market Overview
  • CMOS
  • BiCMOS
  • SOI
  • FinFET

Global SRAM and ROM Design IP Market Size by End use & CAGR (2026-2033)

  • Market Overview
  • Mobile Devices
  • Computers
  • Networking Equipment
  • IoT Devices

Global SRAM and ROM Design IP Market Size & CAGR (2026-2033)

  • North America (Application, Product, Technology, End use)
    • US
    • Canada
  • Europe (Application, Product, Technology, End use)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Application, Product, Technology, End use)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Application, Product, Technology, End use)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Application, Product, Technology, End use)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2025
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2025
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

  • Qualcomm
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cadence Design Systems
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Broadcom
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Analogue Devices
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Synopsys
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ON Semiconductor
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Microchip Technology
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations