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1858838

氮化鎵(GaN)功率晶片在電動車領域的市場機會、成長促進因素、產業趨勢分析及預測(2025-2034年)

Gallium Nitride (GaN) Power Chips for EVs Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034

出版日期: | 出版商: Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024 年全球電動車用氮化鎵 (GaN) 功率晶片市場價值為 2.97 億美元,預計到 2034 年將以 15.5% 的複合年成長率成長至 15 億美元。

電動車用氮化鎵 (GaN) 功率晶片市場 - IMG1

這一強勁成長與汽車製造商日益大規模地整合高頻、高密度轉換架構的趨勢相符。隨著電動車的普及和充電基礎設施的不斷完善,車輛及其配套系統對高效能電力電子產品的整體需求正在加速成長。 2024年,全球電動車銷量達1,700萬輛,佔新車總銷量的20%以上。全球電動車保有量已成長至近5,800萬輛,持續推動對更有效率電力轉換解決方案的需求。基於氮化鎵(GaN)的車載充電器因其在效率和尺寸縮小方面的顯著優勢而備受青睞。它們能夠提高功率密度並減輕重量,從而提升電動車的續航里程和系統整合度。氮化鎵技術的最新進展也支援高密度雙向運行,這對於未來的車網互動(V2G)應用至關重要。從分立元件到整合式驅動器、開關和保護電路的氮化鎵模組的轉變,進一步提升了系統性能,降低了電磁干擾,並改善了散熱管理。公私合作在加速這些寬禁帶解決方案的商業化過程中發揮了關鍵作用。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 2.97億美元
預測值 15億美元
複合年成長率 15.5%

2024年,橫向GaN元件市場佔有率達到70%,預計2034年將以16.1%的複合年成長率成長。由於這些裝置適用於車用充電器、輔助系統和工作電壓高達650V的DC-DC轉換器,因此已成為電動車電力電子設備的核心。得益於矽基AlGaN/GaN HEMT架構,這些元件具有高電子遷移率和高擊穿場強,與傳統的矽基元件相比,在高電壓下導通電阻顯著降低。

2024年,電壓範圍在100V至650V的中壓氮化鎵(GaN)裝置佔據了67%的市場佔有率,預計2025年至2034年間將以16%的複合年成長率成長。此電壓等級涵蓋了眾多電動車應用,包括車載充電器和直流-直流轉換器,適用於目前的400V電池平台和未來的800V架構。在此電壓範圍內,氮化鎵裝置具有卓越的開關速度和效率,能夠實現緊湊輕巧的電源轉換系統,這對於高密度電動車應用至關重要。

2024年,中國用於電動車的氮化鎵(GaN)功率晶片市場規模預計將達到7,340萬美元。作為全球最大的電動車市場,中國約佔全球電動車銷量的三分之二,光是2023年就交付了超過800萬輛。如此龐大的市場規模為GaN組件創造了巨大的潛在市場,因為每輛電動車和充電站都需要高性能的功率電子裝置。此外,政府對新能源汽車的大力支持、國內半導體研發的蓬勃發展以及電動車基礎設施的廣泛部署,都進一步鞏固了中國在電動車領域的領先地位,使其超越了印度、韓國和日本等其他區域競爭對手。

積極引領電動車氮化鎵 (GaN) 功率晶片市場的關鍵企業包括 Transphorm、GaN Systems、英飛凌科技、羅姆半導體、Navitas、EPC、Power Integrations、Innoscience、意法半導體和德州儀器。為了鞏固自身市場地位,GaN 功率晶片領域的領導企業正大力投資研發,以開發高性能、符合汽車級標準的 GaN 解決方案,從而支援更高的功率密度和更佳的熱效率。許多廠商正從分立產品轉向整合解決方案,例如採用共封裝半橋模組,將驅動器、開關和保護功能整合於一體,以簡化設計、最大限度地降低電磁干擾 (EMI) 並提高可靠性。此外,這些企業也積極尋求與汽車製造商和一級供應商建立策略合作夥伴關係,以加速在電動車平台的設計中勝出。

目錄

第1章:方法論與範圍

第2章:執行概要

第3章:行業洞察

  • 產業生態系分析
    • 供應商格局
      • 原料
      • 外延生長和晶圓製造
      • 製造商
      • 模組和系統整合商
      • 原始設備製造商
      • 充電基礎設施和能源營運商
    • 成本結構
    • 利潤率
    • 每個階段的價值增加
    • 影響供應鏈的因素
    • 顛覆者
  • 對力的影響
    • 成長促進因素
      • 政府電動車推廣強制令及政策支持
      • 對高效電力電子產品的需求不斷成長
      • 汽車產業力求輕量化和緊湊化解決方案
      • 快速充電基礎設施建設的成長
    • 產業陷阱與挑戰
      • 高昂的初始設備和製造成本
      • 高壓氮化鎵裝置供應有限
      • 汽車資格認證和可靠性挑戰
    • 市場機遇
      • 新興的48V輕度混合動力汽車細分市場
      • 兆瓦級充電基礎設施建設
      • 垂直氮化鎵技術商業化
      • 區域製造本地化舉措
  • 成長潛力分析
  • 監管環境
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • 中東和非洲
  • 波特的分析
  • PESTEL 分析
  • 技術趨勢與創新生態系統
    • 目前技術
      • 增強型架構與耗盡型架構
      • 矽基板、碳化矽基板和原生氮化鎵基板
      • 閘極驅動技術及整合
      • 熱管理解決方案
    • 新興技術
      • 垂直氮化鎵裝置開發
      • 氮化鎵鑽石冷卻技術
      • 整體式整合與系統級封裝
      • 人工智慧驅動的裝置最佳化
  • 價格趨勢分析
    • 按地區
    • 依產品
  • 生產統計
    • 生產中心
    • 消費中心
    • 進出口
  • 成本細分分析
  • 專利分析
  • 永續性和環境方面
    • 永續實踐
    • 減少廢棄物策略
    • 生產中的能源效率
    • 環保舉措
    • 碳足跡考量
  • 最佳情況
  • 包裝創新與先進技術
    • 目前包裝技術
    • 先進包裝創新
    • 熱管理創新
    • 互連技術
  • 氮化鎵與碳化矽競爭分析
    • 比較矩陣
    • 總擁有成本 (TCO)
  • OEM採納路線圖及策略
  • 設計導入流程及驗證
  • 柵極驅動器技術及整合
  • 快速充電基礎設施的影響

第4章:競爭格局

  • 介紹
  • 公司市佔率分析
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • MEA
  • 主要市場參與者的競爭分析
  • 競爭定位矩陣
  • 戰略展望矩陣
  • 關鍵進展
    • 併購
    • 合作夥伴關係與合作
    • 新產品發布
    • 擴張計劃和資金

第5章:市場估算與預測:依設備架構分類,2021-2034年

  • 主要趨勢
  • 橫向氮化鎵裝置
  • 垂直氮化鎵裝置

第6章:市場估算與預測:依電壓等級分類,2021-2034年

  • 主要趨勢
  • 低電壓(≤100V)
  • 中壓(100V-650V)
  • 高壓(>650V)

第7章:市場估價與預測:依包裝類型分類,2021-2034年

  • 主要趨勢
  • 獨立包裝
  • 電源模組
  • 整合功率級

第8章:市場估算與預測:依應用領域分類,2021-2034年

  • 主要趨勢
  • 牽引逆變器
  • 車用充電器(OBC)
  • 直流-直流轉換器
  • 充電基礎設施
  • 輔助電源系統

第9章:市場估算與預測:以推進方式分類,2021-2034年

  • 主要趨勢
  • 電池電動車(BEV)
  • 插電式混合動力車(PHEV)
  • 輕度混合動力電動車(MHEV)
  • 燃料電池電動車(FCEV)

第10章:市場估價與預測:依車輛類型分類,2021-2034年

  • 主要趨勢
  • 搭乘用車
    • 掀背車
    • 轎車
    • SUV
  • 商用車輛
    • 低容量性狀
    • MCV
    • C型肝炎
  • 兩輪和三輪車

第11章:市場估價與預測:依銷售管道分類,2021-2034年

  • 主要趨勢
  • OEM
  • 售後市場

第12章:市場估計與預測:依地區分類,2021-2034年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 北歐
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 菲律賓
    • 印尼
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • MEA
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國

第13章:公司簡介

  • Global Leaders
    • EPC
    • Transphorm
    • GaN Systems
    • Navitas
    • Infineon Technologies
    • STMicroelectronics
    • Rohm
    • Texas Instruments
    • Nexperia
    • Vishay
  • Regional Champions
    • Innoscience
    • NexGen Power Systems
    • Cambridge GaN Devices
    • Fuji Electric
    • Littelfuse
    • Toshiba
    • Renesas
    • Semikron
  • 新興參與者
    • VisIC Technologies
    • Qorvo
    • Macom
    • Integra Technologies
    • Akash Systems
    • Kyma Technologies
    • Power Integrations
    • Panasonic
    • SweGaN
    • GeneSiC
    • Fujitsu
簡介目錄
Product Code: 14914

The Global Gallium Nitride (GaN) Power Chips for EVs Market was valued at USD 297 million in 2024 and is estimated to grow at a CAGR of 15.5% to reach USD 1.5 billion by 2034.

Gallium Nitride (GaN) Power Chips for EVs Market - IMG1

The robust expansion aligns with automakers increasingly integrating high-frequency, high-density conversion architectures at scale. As EV adoption grows alongside expanding charging infrastructure, the overall demand for efficient power electronics in both vehicles and supporting systems is accelerating. In 2024, global EV sales reached 17 million and accounted for over 20% of all new car sales. The global EV fleet has grown to nearly 58 million, fueling consistent demand for more efficient power conversion solutions. GaN-based onboard chargers are gaining traction due to their significant advantages in efficiency and size reduction. They enable increased power density and lower weight, improving EV range and system integration. Recent advancements in GaN technology also support high-density, bidirectional operations, a key feature for future vehicle-to-grid applications. The transition from discrete components to integrated GaN modules combining drivers, switches, and protection circuits has further enhanced system performance, reduced electromagnetic interference, and improved thermal management. Public-private efforts have been instrumental in accelerating the commercialization of these wide-bandgap solutions.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$297 Million
Forecast Value$1.5 Billion
CAGR15.5%

In 2024, the lateral GaN devices segment held a 70% share and is projected to grow at a CAGR of 16.1% through 2034. These devices have become the backbone of EV power electronics due to their suitability for onboard chargers, auxiliary systems, and DC-DC converters operating up to 650 V. Their high electron mobility and elevated breakdown field strength, enabled by AlGaN/GaN HEMT architecture on silicon, allow for significantly lower on-resistance at higher voltages when compared to traditional silicon-based components.

The medium-voltage GaN devices, ranging from 100 V to 650 V, held a 67% share in 2024 and are forecasted to grow at a CAGR of 16% between 2025 and 2034. This voltage class covers many EV applications, including onboard chargers and DC-DC converters in both current 400 V battery platforms and future 800 V architectures. Within this range, GaN devices deliver superior switching speeds and efficiency, enabling compact and lightweight power conversion systems critical for high-density EV applications.

China Gallium Nitride (GaN) Power Chips for EVs Market generated USD 73.4 million in 2024. As the largest EV market globally, China accounted for roughly two-thirds of global EV sales, delivering over 8 million units in 2023 alone. This massive scale has created a vast addressable market for GaN components, as every vehicle and charging site requires high-performance power electronics. Additionally, strong government support for NEVs, domestic semiconductor development, and widespread deployment of EV infrastructure continue to solidify China's leadership over other regional players such as India, South Korea, and Japan.

Key companies actively shaping the Gallium Nitride (GaN) Power Chips for EVs Market include Transphorm, GaN Systems, Infineon Technologies, ROHM Semiconductor, Navitas, EPC, Power Integrations, Innoscience, STMicroelectronics, and Texas Instruments. To enhance their positioning, leading companies in the GaN power chip sector are heavily investing in R&D to develop high-performance, automotive-qualified GaN solutions that support higher power densities and better thermal efficiency. Many players are shifting from discrete products to integrated solutions such as co-packaged half-bridge modules combining drivers, switches, and protection features to simplify design, minimize EMI, and improve reliability. Strategic partnerships with automakers and Tier 1 suppliers are also being pursued to accelerate design wins in EV platforms.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/Country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis
  • 2.2 Key market trends
    • 2.2.1 Regional
    • 2.2.2 Device architecture
    • 2.2.3 Voltage
    • 2.2.4 Application
    • 2.2.5 Propulsion
    • 2.2.6 Package
    • 2.2.7 Vehicle
    • 2.2.8 Sales Channel
  • 2.3 TAM Analysis, 2025-2034
  • 2.4 CXO perspectives: Strategic imperatives
    • 2.4.1 Key decision points for industry executives
    • 2.4.2 Critical success factors for market players
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier landscape
      • 3.1.1.1 Raw material
      • 3.1.1.2 Epitaxy & wafer fabrication
      • 3.1.1.3 Manufacturers
      • 3.1.1.4 Module & system integrators
      • 3.1.1.5 OEMs
      • 3.1.1.6 Charging infrastructure & energy operators
    • 3.1.2 Cost structure
    • 3.1.3 Profit margin
    • 3.1.4 Value addition at each stage
    • 3.1.5 Factors impacting the supply chain
    • 3.1.6 Disruptors
  • 3.2 Impact on forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Government EV adoption mandates and policy support
      • 3.2.1.2 Rising demand for high-efficiency power electronics
      • 3.2.1.3 Automotive industry push for lightweight and compact solutions
      • 3.2.1.4 Growth in fast-charging infrastructure development
    • 3.2.2 Industry pitfalls & challenges
      • 3.2.2.1 High initial device and manufacturing costs
      • 3.2.2.2 Limited availability of high-voltage GaN devices
      • 3.2.2.3 Automotive qualification and reliability challenges
    • 3.2.3 Market opportunities
      • 3.2.3.1 Emerging 48V mild hybrid vehicle segment
      • 3.2.3.2 Megawatt charging infrastructure development
      • 3.2.3.3 Vertical GaN technology commercialization
      • 3.2.3.4 Regional manufacturing localization initiatives
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
    • 3.4.1 North America
    • 3.4.2 Europe
    • 3.4.3 Asia Pacific
    • 3.4.4 Latin America
    • 3.4.5 Middle East & Africa
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis
  • 3.7 Technology trends & innovation ecosystem
    • 3.7.1 Current technologies
      • 3.7.1.1 Enhancement-mode vs depletion-mode architectures
      • 3.7.1.2 Silicon vs SiC vs native GaN substrates
      • 3.7.1.3 Gate drive technology and integration
      • 3.7.1.4 Thermal management solutions
    • 3.7.2 Emerging technologies
      • 3.7.2.1 Vertical GaN device development
      • 3.7.2.2 GaN-on-diamond cooling technology
      • 3.7.2.3 Monolithic integration and system-in-package
      • 3.7.2.4 AI-driven device optimization
  • 3.8 Price trend analysis
    • 3.8.1 By region
    • 3.8.2 By Products
  • 3.9 Production statistics
    • 3.9.1 Production hubs
    • 3.9.2 Consumption hubs
    • 3.9.3 Export and import
  • 3.10 Cost breakdown analysis
  • 3.11 Patent analysis
  • 3.12 Sustainability and environmental aspects
    • 3.12.1 Sustainable practices
    • 3.12.2 Waste reduction strategies
    • 3.12.3 Energy efficiency in production
    • 3.12.4 Eco-friendly initiatives
    • 3.12.5 Carbon footprint considerations
  • 3.13 Best case scenario
  • 3.14 Packaging Innovation & Advanced Technologies
    • 3.14.1 Current Packaging Technologies
    • 3.14.2 Advanced Packaging Innovations
    • 3.14.3 Thermal Management Innovations
    • 3.14.4 Interconnect Technologies
  • 3.15 GaN vs SiC Competitive Analysis
    • 3.15.1 Comparison Matrix
    • 3.15.2 Total Cost of Ownership (TCO)
  • 3.16 OEM Adoption Roadmap & Strategy
  • 3.17 Design-In Process & Qualification
  • 3.18 Gate Driver Technology & Integration
  • 3.19 Fast-Charging Infrastructure Impact

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 North America
    • 4.2.2 Europe
    • 4.2.3 Asia Pacific
    • 4.2.4 LATAM
    • 4.2.5 MEA
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategic outlook matrix
  • 4.6 Key developments
    • 4.6.1 Mergers & acquisitions
    • 4.6.2 Partnerships & collaborations
    • 4.6.3 New product launches
    • 4.6.4 Expansion plans and funding

Chapter 5 Market Estimates & Forecast, By Device Architecture, 2021 - 2034 ($Bn, Units)

  • 5.1 Key trends
  • 5.2 Lateral GaN devices
  • 5.3 Vertical GaN devices

Chapter 6 Market Estimates & Forecast, By Voltage, 2021 - 2034 ($Bn, Units)

  • 6.1 Key trends
  • 6.2 Low voltage (≤100V)
  • 6.3 Medium voltage (100V-650V)
  • 6.4 High voltage (>650V)

Chapter 7 Market Estimates & Forecast, By Package, 2021 - 2034 ($Bn, Units)

  • 7.1 Key trends
  • 7.2 Discrete packages
  • 7.3 Power modules
  • 7.4 Integrated power stages

Chapter 8 Market Estimates & Forecast, By Application, 2021 - 2034 ($Bn, Units)

  • 8.1 Key trends
  • 8.2 Traction inverters
  • 8.3 On-board chargers (OBC)
  • 8.4 DC-DC converters
  • 8.5 Charging infrastructure
  • 8.6 Auxiliary power systems

Chapter 9 Market Estimates & Forecast, By Propulsion, 2021 - 2034 ($Bn, Units)

  • 9.1 Key trends
  • 9.2 Battery electric vehicles (BEV)
  • 9.3 Plug-in hybrid electric vehicles (PHEV)
  • 9.4 Mild hybrid electric vehicles (MHEV)
  • 9.5 Fuel cell electric vehicles (FCEV)

Chapter 10 Market Estimates & Forecast, By Vehicle, 2021 - 2034 ($Bn, Units)

  • 10.1 Key trends
  • 10.2 Passenger cars
    • 10.2.1 Hatchback
    • 10.2.2 Sedan
    • 10.2.3 SUV
  • 10.3 Commercial vehicles
    • 10.3.1 LCV
    • 10.3.2 MCV
    • 10.3.3 HCV
  • 10.4 Two & three wheelers

Chapter 11 Market Estimates & Forecast, By Sales Channel, 2021 - 2034 ($Bn, Units)

  • 11.1 Key trends
  • 11.2 OEM
  • 11.3 Aftermarket

Chapter 12 Market Estimates & Forecast, By Region, 2021 - 2034 ($Bn, Units)

  • 12.1 Key trends
  • 12.2 North America
    • 12.2.1 US
    • 12.2.2 Canada
  • 12.3 Europe
    • 12.3.1 Germany
    • 12.3.2 UK
    • 12.3.3 France
    • 12.3.4 Italy
    • 12.3.5 Spain
    • 12.3.6 Russia
    • 12.3.7 Nordics
  • 12.4 Asia Pacific
    • 12.4.1 China
    • 12.4.2 India
    • 12.4.3 Japan
    • 12.4.4 Australia
    • 12.4.5 South Korea
    • 12.4.6 Philippines
    • 12.4.7 Indonesia
  • 12.5 Latin America
    • 12.5.1 Brazil
    • 12.5.2 Mexico
    • 12.5.3 Argentina
  • 12.6 MEA
    • 12.6.1 South Africa
    • 12.6.2 Saudi Arabia
    • 12.6.3 UAE

Chapter 13 Company Profiles

  • 13.1 Global Leaders
    • 13.1.1 EPC
    • 13.1.2 Transphorm
    • 13.1.3 GaN Systems
    • 13.1.4 Navitas
    • 13.1.5 Infineon Technologies
    • 13.1.6 STMicroelectronics
    • 13.1.7 Rohm
    • 13.1.8 Texas Instruments
    • 13.1.9 Nexperia
    • 13.1.10 Vishay
  • 13.2 Regional Champions
    • 13.2.1 Innoscience
    • 13.2.2 NexGen Power Systems
    • 13.2.3 Cambridge GaN Devices
    • 13.2.4 Fuji Electric
    • 13.2.5 Littelfuse
    • 13.2.6 Toshiba
    • 13.2.7 Renesas
    • 13.2.8 Semikron
  • 13.3 Emerging Players
    • 13.3.1 VisIC Technologies
    • 13.3.2 Qorvo
    • 13.3.3 Macom
    • 13.3.4 Integra Technologies
    • 13.3.5 Akash Systems
    • 13.3.6 Kyma Technologies
    • 13.3.7 Power Integrations
    • 13.3.8 Panasonic
    • 13.3.9 SweGaN
    • 13.3.10 GeneSiC
    • 13.3.11 Fujitsu