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市場調查報告書
商品編碼
2069667

全球先進半導體封裝市場（2027-2037 年）

The Global Market for Advanced Semiconductor Packaging 2027-2037
出版日期: | 出版商: Future Markets, Inc. | 英文 339 Pages, 79 Tables, 28 Figures | 訂單完成後即時交付

價格

先進半導體封裝已成為整個電子產業最具戰略意義的領域之一。隨著電晶體小型化帶來的效能、功耗和經濟效益在最尖端科技中趨於穩定，封裝本身已成為提升系統效能的主要手段。過去，運算能力主要取決於裝置小型化，而現在，晶片間的互連方式、儲存單元和運算單元的間距以及單一封裝中可整合的異質組件數量，都越來越成為決定運算能力的關鍵因素。這種轉變使得封裝從一個成本驅動的後端工藝，躍升為半導體設計和製造中決定價值的關鍵環節。

推動這項變革的主要動力是人工智慧 (AI)。 AI 的訓練和推理需要巨大的記憶體頻寬、高密度的晶片互連以及高效的供電，這促使 2.5D 和 3D 架構、高頻寬記憶體以及越來越大的封裝尺寸佔主導地位。這些需求使得先進的封裝技術既是關鍵的推動因素，也是最嚴苛計算系統面臨的重大瓶頸。技術格局由幾個相互融合的要素構成：銅-銅混合鍵合技術實現了超細間距的垂直互連；基於晶片的異構整合將邏輯、存儲、模擬以及來自不同工藝節點的日益密集的光電在一起；玻璃基板和中介層作為新型高階平台；面板級製造技術實現了更大、更經濟高效的封裝；以及將光介面直接整合到光學介面中的共裝件。

這些趨勢得益於一個涵蓋整合設備製造商、晶圓代工廠、外包組裝和測試服務商、記憶體製造商、設備和材料供應商以及快速成長的光連接模組領域的龐大且競爭日益激烈的生態系統。該產業也正在經歷重大的結構性變革，包括一些尖端封裝能力回歸國內市場、超大規模資料中心業者的客製化晶片興起，以及隨著整合化程度的加深，整個價值鏈上的合作也在不斷深化。材料創新、溫度控管以及設計階段的協同最佳化不再是次要問題，而是至關重要的領域。

同時，該領域也面臨著許多挑戰，包括大尺寸封裝的良率和成本、玻璃和麵板加工的製造成熟度、高度整合堆疊結構的散熱密度、共封裝光學元件的光學對準和測試、晶片間介面的標準化以及集中式、資本密集型的​​供應鏈。儘管有這些挑戰，先進封裝技術已成為下一代運算、通訊、汽車和消費性電子系統的基礎技術，其戰略重要性預計將在未來十年進一步提升。

「全球先進半導體封裝市場（2027-2037）」報告對先進半導體封裝產業進行了全面分析，檢驗了到2037年將塑造該產業的技術、材料、應用、市場趨勢、競爭格局和前景。隨著電晶體小型化帶來的效能提昇在最尖端科技中逐漸減弱，先進封裝正成為提昇系統效能的主要驅動力。本報告涵蓋了推動人工智慧、高效能運算、汽車、行動和消費性電子市場這一轉變的技術和主要參與者。報告將技術深度與市場分析相結合，並輔以詳細的預測和豐富的公司簡介。

本報告的主要內容如下：

  • 摘要整理- 技術概述、包裝演變、供應鏈、關鍵技術趨勢、成長要素、競爭格局、市場挑戰和未來展望。
  • 半導體封裝技術－電晶體元件的小型化和 2nm 以下的悖論、晶圓級和扇出封裝、晶片和解耦、互連方法、中介層技術（包括矽、有機、矽橋和玻璃）、2.5D 和 3D 封裝、銅對銅室溫鍵合（包括低溫和低層製程）以及晶片間 I/O。
  • 晶圓級封裝 - WLCSP、扇出型、扇入型、面板級封裝、製造流程、趨勢與應用。
  • 系統級封裝和異構整合－整合方法、製造方法、促進因素、應用、積體電路基板和共封裝光學元件。
  • 單晶片式 3D IC 架構、2D 材料、優勢與挑戰。
  • 市場與應用：移動、高效能運算、人工智慧、汽車（包括高級駕駛輔助系統和電動汽車電力電子）、物聯網、醫療、消費性電子、航太與國防、積層製造、矽光電。
  • 玻璃基板和中介層 - 優勢、材料特性、TGV 形成和金屬化、面板加工、供應商藍圖和技術挑戰。
  • 共封裝光元件 - 共封裝方法、EIC/PIC 整合、耦合器、優勢和局限性、上市時間以及各公司的技術。
  • 熱界面材料－候選材料、藍圖和應用。
  • 全球市場預測—按封裝類型、單元和晶圓、最終用途市場、地區以及 3D SoC、3D 堆疊記憶體、UHD FO/RDL 中介層、2.5D 中介層和嵌入式矽橋進行預測。
  • 市場趨勢與藍圖－資料中心、人工智慧和圖形、CPU、自動駕駛汽車、互連和節點的藍圖，以及GPU、AI ASIC、CPU和CPO交換器的商業化產品路線圖。
  • 市場參與企業、挑戰和公司簡介—涵蓋IDM、晶圓代工廠、OSAT、OEM、設備、材料和基板供應商。參展公司包括：AaltoSemi、Absolics、ACCRETECH、Adeia、Advanced Micro Devices (AMD)、味之素、Alphawave Semi、Amkor Technology、Analog Devices、AMQ Intelligent、Apple、Applied Materials、Ardentec System、ARM、ASE、ASMPT、AMQ Intelbs、Ayar、Aelmo、Bedent、 Science、Broadcom、BroadPak、Cadence、Cambricon、Capcon、CAS Microelectronics、CD Micro-Technology、CEA-Leti、Celestial AI、Cerebras、China Wafer Level CSP、Chipbond、Chipletz、ChipMOS、Coherent、Corning、Dai N系統Automation、Disco、DuPont、Ebara、Eliyan、EMC Semiconductor、EPS Technology、Entegris、EV Group、GlobalFoundries、Global Unichip、Gloway、Goldenscope、Gona、Graphcore、Greatek。航科半導體、韓美半導體、HD Microsystems、海思半導體、HLMC、華天半導體、華為、Ibiden、IBM、ICLeague、im​​ec、銦泰、英飛凌、Integra、Inari Amertron、英特爾、江電電子、江蘇積體電路技術有限公司、京都半導體、科陽半導體、金源半導體、鎧人半導體、KyLitho、京瓷、Lam Research、Lapis、LB Semicon、Leading Interconnect、LG Innotek、Lam Research、Lapis、LB Semicon、Leading Interconnect、LG Innotek、Lidrotec、Lightm、Lumentum Semiconductors、馬來西亞太平洋工業公司、Marvell、美光半導體、聯發科、Meta、Micross、三菱半導體、NCAP中國、NEC、日本電氣硝子株式會社 (NEG)、Nepes、輝達、安森美半導體、東方半導體、松下、Plan Optik、Powertech、Pragmatic、Qorvo、瑞薩電子、RMT、羅姆、榮、三星電子、Samtec、蕭特半導體、夏普半導體、新光半導體、昭和半導體Denko/Resonac、Sigurd、Silicon Box、SPIL、S​​J Semicondumas、STM HMIC、Sony、Star、Stark、Star、Star、Star、Starsctor、H東西、SkyS、Sun​​k Microtec、Synopsys、SZLQ、台積電 (TSMC)、Techsense、Tezzaron、東京電子 (TEL)、Tongfu、德州儀器 (Texas Instruments)、東京精密 (Tokyo Seimitsu)、通興 (Tong Hsing)、凸版印刷 (Toppan)、東麗 (Toray)、東麗 (TorayBductor (UMC)、Unimicron、Unisem、UTAC、Walton、Winstek、新和 (Xinhe)、義步 (Yibu)、岳河 (Yueha) 等。

目錄

第1章摘要整理

  • 半導體封裝技術概述
  • 半導體供應鏈
  • 先進包裝供應鏈
  • 先進封裝的關鍵技術趨勢
  • 市場成長促進因素
  • 競爭格局
  • 市場挑戰
  • 前景

第2章 半導體封裝技術

  • 電晶體裝置的尺寸縮放
  • 晶圓級封裝
  • 扇出型晶圓級封裝
  • 晶片組
  • 半導體封裝中的互連
  • 2.5D 和 3D 包裝

第3章 晶圓級封裝

  • 介紹
  • 優勢
  • 晶圓級封裝的類型
  • WLP製造程序
  • 晶圓級封裝的發展趨勢
  • 晶圓級封裝的應用
  • 晶圓級封裝展望

第4章：系統級封裝與異質整合

  • 介紹
  • 異質整合方法
  • SyP製造方法
  • SiP組件整合
  • 驅動異質性整合的因素
  • 推動系統整合（SiP）引入的趨勢
  • SiP應用
  • SiP產業現狀
  • 異構融合的未來前景
  • CPO（共封裝光學元件）
  • IC基板

第5章 單片3D積體電路

  • 概述
  • 優勢
  • 任務
  • 前景

第6章 市場與應用

  • 市場價值鏈
  • 按市場分類的包裝趨勢
  • 設計要求
  • 人工智慧（AI）
  • 行動裝置
  • 高效能運算（HPC）
  • 汽車電子
  • 物聯網 (IoT) 設備
  • 5G和6G通訊基礎設施
  • 航太與國防電子
  • 醫療用電子設備
  • 家用電器
  • 用於先進包裝的積層製造
  • 矽光電

第7章：全球市場預測

  • 按類型
  • 按單元和按晶圓
  • 按最終用途市場分類
  • 按地區
  • 3D SoC
  • 3D堆疊內存
  • UHD FO/RDL 中介層
  • 2.5D 中介層
  • 嵌入式矽膠橋

第8章 市場趨勢

  • 資料中心
  • 人工智慧與圖形
  • CPU
  • 自動駕駛汽車
  • 藍圖
  • 市售產品

第9章 市場參與企業

  • 整合裝置製造商
  • 半導體組裝和測試（OSAT）外包公司
  • 鑄造廠
  • 電子設備OEM
  • 包裝設備和材料公司

第10章 市場挑戰

第11章：公司簡介

  • AaltoSemi
  • Absolic, Inc.
  • ACCRETECH (Europe) GmbH
  • Adeia, Inc.
  • Advanced Micro Devices, Inc. (AMD)
  • Ajinomoto
  • Analog Devices, Inc. (ADI)
  • Amkor Technology
  • Anmuquan Intelligent Technology (AMQ Intelligent)
  • Apple
  • Applied Materials
  • Ardentec Corporation
  • Arieca
  • ARM
  • ASE
  • ASMPT Ltd
  • Ayar Labs
  • Besi
  • Biren Technology
  • Blue Ocean Smart System
  • Brewer Science
  • Broadcom
  • BroadPak
  • Cadence Design Systems
  • Cambricon Technologies Co.
  • Capcon Semiconductor
  • CAS Microelectronics Integration
  • CD Micro-Technology
  • CEA-Leti
  • Cerebras
  • China Wafer Level CSP Co
  • Chipbond Technology Corporation
  • Chipletz
  • ChipMOS Technologies, Inc.
  • Coherent
  • Corning
  • Dai Nippon Printing (DNP)
  • Dewo Advanced Automation (DAA)
  • Disco
  • Dupont
  • Ebara
  • Eliyan
  • EMC Semi-Conductor Technology
  • EPS Technology
  • Entegris
  • EV Group
  • GlobalFoundries
  • Global Unichip
  • Gloway
  • Goldenscope Tech
  • Gona Semiconductor Technology
  • Graphcore
  • Greatek Electronics Inc
  • Hangke Chuangxing (Aero Inno-Star)
  • Hanmi Semiconductor
  • HD Microsystems
  • HiSilicon
  • HLMC (Shanghai Huali Microelectronics Corporation)
  • Huatian Huichuang Technology (Xi'an) Co., Ltd.
  • Huawei
  • Ibiden
  • IBM
  • ICLeague Technology Co Ltd
  • IMEC
  • Indium Corporation
  • Infineon Technologies AG
  • Integra
  • Inari Amertron Berhad
  • Intel Corporation
  • JCET Group
  • Jiangsu IC Assembly & Test (ICAT)
  • Jingdu Semiconductor
  • Keyang Semiconductor (KYS)
  • King Yuan Electronics Co., Ltd.
  • Kioxia
  • KyLitho
  • Kyocera
  • Lam Research
  • Lapis Technology
  • LB Semicon Co Ltd
  • Leading Interconnect Semiconductor Technology
  • LG Innotek
  • Lidrotec GmbH
  • Lux Semiconductors
  • Malaysian Pacific Industries Berhad
  • Micron Technology, Inc.
  • Mediatek
  • Micross Components
  • Mitsubishi
  • National Center For Advanced Packaging China (NCAP China)
  • NEC
  • Nvidia Corporation
  • Nepes Corporation
  • Nippon Electric Glass (NEG)
  • Onsemi
  • Orient Semiconductor Electronics Ltd.
  • Panasonic
  • Plan Optik AG
  • Powertech Technology Inc.
  • Pragmatic Semiconductor
  • Qorvo
  • Renesas
  • Rigger Micro Technologies (RMT)
  • Rohm
  • Rong Semiconductor
  • Samsung Electronics
  • Samtec, Inc.
  • Schott AG
  • Sharp
  • Shinko Electric Industries
  • Showa Denko (Resonac)
  • Sigurd Microelectronics Corporation
  • Silicon Box
  • Siliconware Precision Industries (SPIL)
  • SJ Semiconductor
  • SK Hynix
  • Skywater
  • Sony Corporation
  • Starmask
  • STMicroelectronics
  • Suss Microtec
  • Synopsys
  • SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • Techsense International
  • Tezzaron Semiconductor
  • Tokyo Electron (TEL)
  • Tongfu Microelectronics Co., Ltd.
  • Toppan
  • Toray
  • Texas Instruments
  • Tokyo Electron
  • Tokyo Seimitsu Co., Ltd.
  • Tong Hsing Electronic Industries, Ltd.
  • Toshiba
  • Tower Semiconductor
  • Unimicron
  • Unisem
  • UTAC Group
  • Walton Advanced Engineering Inc.
  • Winstek Semiconductor Technology Co., Ltd.
  • Xinhe Semiconductor
  • Yibu Semiconductor
  • Yuehai Integrated

第12章調查方法

第13章參考文獻

Advanced semiconductor packaging has become one of the most strategically important domains in the entire electronics industry. As the performance, power, and economic returns from transistor scaling diminish at the leading edge, the package itself has emerged as the primary lever for improving system performance. Where computing capability once came chiefly from shrinking devices, it now comes increasingly from how dies are interconnected, how closely memory is placed to compute, and how many heterogeneous components can be integrated into a single package. This shift has elevated packaging from a back-end, cost-driven step to a value-defining stage of semiconductor design and manufacture.

The principal driver of this transformation is artificial intelligence. AI training and inference demand enormous memory bandwidth, dense die-to-die connectivity, and efficient power delivery, pushing 2.5D and 3D architectures, high-bandwidth memory, and ever-larger package formats into the mainstream. These requirements have made advanced packaging both a key enabler of, and a critical bottleneck for, the most demanding computing systems. The technology landscape is defined by several converging vectors: copper-to-copper hybrid bonding, which enables extraordinarily fine-pitch vertical interconnects; chiplet-based, heterogeneous integration that combines logic, memory, analog, and increasingly photonics from different process nodes; glass substrates and interposers as a new high-end platform; panel-level processing for larger and more cost-effective packages; and co-packaged optics, which brings the optical interface directly into the package.

Underpinning these trends is a deep and increasingly contested ecosystem spanning integrated device manufacturers, foundries, outsourced assembly and test providers, memory makers, equipment and materials suppliers, and a fast-growing optical-interconnect sector. The industry is also experiencing significant structural change, including the partial reshoring of leading-edge packaging capacity, the rise of hyperscaler custom silicon, and growing collaboration across the value chain as the complexity of integration intensifies. Materials innovation, thermal management, and design-stage co-optimisation have become essential disciplines rather than peripheral concerns.

At the same time, the field faces substantial challenges: yield and cost at large package formats, manufacturing maturity for glass and panel processing, thermal density in tightly integrated stacks, optical alignment and test for co-packaged optics, standardisation of die-to-die interfaces, and a concentrated, capital-intensive supply chain. Despite these hurdles, advanced packaging is firmly established as a foundational technology for next-generation computing, communications, automotive, and consumer systems, and its strategic significance is expected to deepen throughout the coming decade.

The Global Market for Advanced Semiconductor Packaging 2027–2037 provides a comprehensive analysis of the advanced semiconductor packaging industry, examining the technologies, materials, applications, market trends, competitive landscape, and outlook that will shape the sector through 2037. As gains from transistor scaling diminish at the leading edge, advanced packaging has become the primary lever for system performance, and this report maps the technologies and players driving that shift across AI, high-performance computing, automotive, mobile, and consumer markets. It combines technical depth with market analysis, supported by detailed forecasts and an extensive directory of company profiles.

The report covers:

  • Executive summary - technology overview, evolution of packaging, supply chains, key technology trends, growth drivers, competitive landscape, market challenges, and future outlook.
  • Semiconductor packaging technologies - transistor device scaling and the sub-2nm paradox; wafer-level and fan-out packaging; chiplets and disaggregation; interconnection methods; interposer technologies including silicon, organic, silicon bridge, and glass; 2.5D and 3D packaging; copper-to-copper hybrid bonding, including low- and room-temperature processes; and die-to-die I/O.
  • Wafer-level packaging - WLCSP, fan-out, fan-in, panel-level packaging, manufacturing processes, trends, and applications.
  • System-in-package and heterogeneous integration - integration approaches, manufacturing methods, drivers, applications, IC substrates, and co-packaged optics.
  • Monolithic 3D ICs - architectures, 2D materials, benefits, and challenges.
  • Markets and applications - mobile, HPC, AI, automotive (including ADAS and EV power electronics), IoT, medical, consumer, aerospace and defense, additive manufacturing, and silicon photonics.
  • Glass substrates and interposers - benefits, material properties, TGV formation and metallisation, panel processing, supplier roadmaps, and technical challenges.
  • Co-packaged optics - co-packaging approaches, EIC/PIC integration, couplers, advantages and limitations, time to market, and company technologies.
  • Thermal interface materials - candidates, roadmaps, and applications.
  • Global market forecasts - by packaging type, units and wafers, end-use market, region, and by 3D SoC, 3D stacked memory, UHD FO/RDL interposer, 2.5D interposers, and embedded silicon bridge.
  • Market trends and roadmaps - data center, AI and graphics, CPU, autonomous vehicles, interconnect and node roadmaps, and commercialized products across GPUs, AI ASICs, CPUs, and CPO switches.
  • Market players, challenges, and company profiles - covering IDMs, foundries, OSATs, OEMs, equipment, materials, and substrate suppliers. Companies profiled include AaltoSemi, Absolics, ACCRETECH, Adeia, Advanced Micro Devices (AMD), Ajinomoto, Alphawave Semi, Amkor Technology, Analog Devices, AMQ Intelligent, Apple, Applied Materials, Ardentec, ARM, ASE, ASMPT, Astera Labs, Ayar Labs, Besi, Biren Technology, Blue Ocean Smart System, Brewer Science, Broadcom, BroadPak, Cadence, Cambricon, Capcon, CAS Microelectronics, CD Micro-Technology, CEA-Leti, Celestial AI, Cerebras, China Wafer Level CSP, Chipbond, Chipletz, ChipMOS, Coherent, Corning, Dai Nippon Printing (DNP), Dewo Advanced Automation, Disco, DuPont, Ebara, Eliyan, EMC Semiconductor, EPS Technology, Entegris, EV Group, GlobalFoundries, Global Unichip, Gloway, Goldenscope, Gona, Graphcore, Greatek, Hangke, Hanmi Semiconductor, HD Microsystems, HiSilicon, HLMC, Huatian, Huawei, Ibiden, IBM, ICLeague, imec, Indium Corporation, Infineon, Integra, Inari Amertron, Intel, JCET, Jiangsu ICAT, Jingdu, Keyang, King Yuan, Kioxia, KyLitho, Kyocera, Lam Research, Lapis, LB Semicon, Leading Interconnect, LG Innotek, Lidrotec, Lightmatter, Lumentum, Lux Semiconductors, Malaysian Pacific Industries, Marvell, Micron, MediaTek, Meta, Micross, Mitsubishi, NCAP China, NEC, Nippon Electric Glass (NEG), Nepes, Nvidia, Onsemi, Orient Semiconductor, Panasonic, Plan Optik, Powertech, Pragmatic, Qorvo, Renesas, RMT, Rohm, Rong, Samsung Electronics, Samtec, Schott, Sharp, Shinko, Showa Denko/Resonac, Sigurd, Silicon Box, SPIL, SJ Semiconductor, SK Hynix, Skywater, SMIC, Sony, Starmask, STMicroelectronics, Suss Microtec, Synopsys, SZLQ, Taiwan Semiconductor Manufacturing Company (TSMC), Techsense, Tezzaron, Tokyo Electron (TEL), Tongfu, Texas Instruments, Tokyo Seimitsu, Tong Hsing, Toppan, Toray, Toshiba, Tower Semiconductor, UMC, Unimicron, Unisem, UTAC, Walton, Winstek, Xinhe, Yibu, and Yuehai.

Table of Contents

1 EXECUTIVE SUMMARY

  • 1.1 Semiconductor Packaging Technology Overview
    • 1.1.1 Key challenges
    • 1.1.2 Evolution of semiconductor packaging
      • 1.1.2.1 From 1D to 3D
    • 1.1.3 Conventional packaging approaches
    • 1.1.4 Advanced packaging approaches
  • 1.2 Semiconductor Supply Chain
  • 1.3 Advanced Packaging Supply Chain
  • 1.4 Key Technology Trends in Advanced Packaging
  • 1.5 Market Growth Drivers
  • 1.6 Competitive Landscape
  • 1.7 Market Challenges
  • 1.8 Future outlook
    • 1.8.1 Heterogeneous Integration
    • 1.8.2 Chiplets and Die Disaggregation
    • 1.8.3 Advanced Interconnects
    • 1.8.4 Scaling and Miniaturization
    • 1.8.5 Thermal Management
    • 1.8.6 Materials Innovation
    • 1.8.7 Supply Chain Developments
    • 1.8.8 Role of Simulation and Data Analytics

2 SEMICONDUCTOR PACKAGING TECHNOLOGIES

  • 2.1 Transistor Device Scaling
    • 2.1.1 Overview
    • 2.1.2 Heterogeneous Architecture Transition
    • 2.1.3 Co-Design Focus Areas
  • 2.2 Wafer Level Packaging
  • 2.3 Fan-Out Wafer Level Packaging
  • 2.4 Chiplets
    • 2.4.1 AMD EPYC and Ryzen processor families
    • 2.4.2 Disaggregation Needs
  • 2.5 Interconnection in Semiconductor Packaging
    • 2.5.1 Overview
    • 2.5.2 Wire Bonding
    • 2.5.3 Flip-chip bonding
    • 2.5.4 Interposer
      • 2.5.4.1 Interposer technology comparison
      • 2.5.4.2 Glass interposer
        • 2.5.4.2.1 Technical challenge of glass interposer
        • 2.5.4.2.2 Different Interposer material comparison
    • 2.5.5 Through-silicon via (TSV) bonding
    • 2.5.6 Hybrid bonding with chiplets
    • 2.5.7 Re-architecting die-to-die I/O
  • 2.6 2.5D and 3D Packaging
    • 2.6.1 2.5D packaging
      • 2.6.1.1 Overview
        • 2.6.1.1.1 Silicon Interposer 2.5D
          • 2.6.1.1.1.1 Through Si Via (TSV)
          • 2.6.1.1.1.2 (SiO2) based redistribution layers (RDLs)
        • 2.6.1.1.2 2.5D Organic-based packaging
          • 2.6.1.1.2.1 Chip-first and chip-last fan-out packaging
          • 2.6.1.1.2.2 Organic substrates
          • 2.6.1.1.2.3 Organic RDL
        • 2.6.1.1.3 2.5D glass-based packaging
          • 2.6.1.1.3.1 Benefits
          • 2.6.1.1.3.2 Glass Si interposers in advanced packaging
          • 2.6.1.1.3.3 Glass material properties
          • 2.6.1.1.3.4 2/2 μm line/space metal pitch on glass substrates
          • 2.6.1.1.3.5 3D Glass Panel Embedding (GPE) packaging
          • 2.6.1.1.3.6 Thermal management
          • 2.6.1.1.3.7 Polymer dielectric films
          • 2.6.1.1.3.8 Challenges
          • 2.6.1.1.3.9 Comparison with other substrates
          • 2.6.1.1.3.10 TGV formation and metallisation
        • 2.6.1.1.4 2.5D vs. 3D Packaging
      • 2.6.1.2 Benefits
      • 2.6.1.3 Challenges
      • 2.6.1.4 Trends
      • 2.6.1.5 Market players
    • 2.6.2 3D packaging
      • 2.6.2.1 Conventional 3D packaging
      • 2.6.2.2 Advanced 3D Packaging with through-silicon vias (TSVs)
      • 2.6.2.3 W2W vs D2W vs Collective D2W
      • 2.6.2.4 Direct Molecular Bonding
      • 2.6.2.5 3D Interconnect Trends
      • 2.6.2.6 Hybrid Bonding
        • 2.6.2.6.1 Devices using hybrid bonding
        • 2.6.2.6.2 Fusion Bond
        • 2.6.2.6.3 Low- and room-temperature Cu-Cu bonding
        • 2.6.2.6.4 Devices using hybrid bonding
      • 2.6.2.7 3D stacking supply chain
      • 2.6.2.8 3D Microbump technology
        • 2.6.2.8.1 Technologies
        • 2.6.2.8.2 Challenges
        • 2.6.2.8.3 Bumpless copper-to-copper (Cu-Cu) hybrid bonding
      • 2.6.2.9 Trends
        • 2.6.2.9.1 Memory drives the next wave
        • 2.6.2.9.2 Low- and room-temperature Cu-Cu bonding

3 WAFER-LEVEL PACKAGING

  • 3.1 Introduction
    • 3.1.1 WLP to PLP
  • 3.2 Benefits
  • 3.3 Types of Wafer Level Packaging
    • 3.3.1 Wafer Level Chip Scale Packaging
      • 3.3.1.1 Overview
      • 3.3.1.2 Advantages
      • 3.3.1.3 Applications
    • 3.3.2 Wafer Level Fan-Out Packaging
      • 3.3.2.1 Overview
      • 3.3.2.2 Advantages
      • 3.3.2.3 Applications
    • 3.3.3 Wafer Level Fan-In Packaging
      • 3.3.3.1 Overview
      • 3.3.3.2 Advantages
      • 3.3.3.3 Applications
    • 3.3.4 Other Types of WLP
      • 3.3.4.1 Cu-Pillar Flip Chip
      • 3.3.4.2 Advantages
        • 3.3.4.2.1 Applications
      • 3.3.4.3 Embedded Wafer Level BGA (eWLB)
      • 3.3.4.4 Advantages
        • 3.3.4.4.1 Applications
      • 3.3.4.5 Chip-last FO-WLP
        • 3.3.4.5.1 Advantages
        • 3.3.4.5.2 Applications
      • 3.3.4.6 Wafer-on-Wafer (WoW)
        • 3.3.4.6.1 Applications
  • 3.4 WLP Manufacturing Processes
    • 3.4.1 Wafer Preparation
    • 3.4.2 RDL Buildup
    • 3.4.3 Bumping
    • 3.4.4 Encapsulation
    • 3.4.5 Integration
    • 3.4.6 Test and Singulation
  • 3.5 Wafer Level Packaging Trends
  • 3.6 Applications of Wafer Level Packaging
    • 3.6.1 Mobile and Consumer Electronics
    • 3.6.2 Automotive Electronics
    • 3.6.3 IoT and Industrial
    • 3.6.4 High Performance Computing
    • 3.6.5 Aerospace and Defense
  • 3.7 Wafer Level Packaging Outlook

4 SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION

  • 4.1 Introduction
  • 4.2 Approaches for heterogenous integration
    • 4.2.1 Technology Building Blocks
  • 4.3 SiP Manufacturing Approaches
    • 4.3.1 2.5D Integrated Interposers
    • 4.3.2 Multi-Chip Modules
    • 4.3.3 3D Stacked packages
    • 4.3.4 Fan-Out Wafer Level Packaging
    • 4.3.5 Flip Chip Package-on-Package
  • 4.4 SiP Component Integration
  • 4.5 Heterogeneous Integration Drivers
  • 4.6 Trends Driving SiP Adoption
  • 4.7 SiP Applications
  • 4.8 SiP Industry Landscape
  • 4.9 Future Outlook on Heterogeneous Integration
  • 4.10 CPO (Co-Packaged Optics)
    • 4.10.1 Co-packaging approaches
    • 4.10.2 Heterogeneous integration of EIC and PIC
    • 4.10.3 Interconnect Technology (in CPO)
    • 4.10.4 Type of couplers
    • 4.10.5 Advantages and limitations
    • 4.10.6 CPO technologies, by company
  • 4.11 IC Substrates

5 MONOLITHIC 3D IC

  • 5.1 Overview
    • 5.1.1 Transitioning from 2D Systems
    • 5.1.2 Motivation for developing monolithic 3D manufacturing
    • 5.1.3 Improved M3D Interconnect Density
    • 5.1.4 Heterogenous 3D vs Monolithic 3D
    • 5.1.5 2D Materials
  • 5.2 Benefits
  • 5.3 Challenges
  • 5.4 Future outlook

6 MARKETS AND APPLICATIONS

  • 6.1 Market value chain
    • 6.1.1 SiP OEM/Designers
    • 6.1.2 Chiplet OEM/Designer and Chiplet Foundry
    • 6.1.3 Chiplet Integrator
      • 6.1.3.1 Integrated Device Manufacturers (IDMs)
      • 6.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) Providers
    • 6.1.4 Material Suppliers
    • 6.1.5 Equipment Suppliers
    • 6.1.6 Substrate and PCB suppliers
    • 6.1.7 EDA Tools Suppliers
    • 6.1.8 Interposer Foundry
  • 6.2 Packaging trends by market
    • 6.2.1 Mobile Devices
    • 6.2.2 High-Performance Computing (HPC)
    • 6.2.3 Automotive
    • 6.2.4 Internet of Things (IoT)
    • 6.2.5 Consumer Electronics
    • 6.2.6 Aerospace and Defense
    • 6.2.7 Medical Devices
  • 6.3 Design requirements
  • 6.4 Artificial Intelligence (AI)
    • 6.4.1 Challenges in AI
    • 6.4.2 Advanced Packaging Solutions
      • 6.4.2.1 2.5D and 3D Integration
      • 6.4.2.2 Chiplet-based Packaging
      • 6.4.2.3 Wafer-Level Packaging (WLP)
    • 6.4.3 Addressing AI Challenges through Advanced Packaging
      • 6.4.3.1 Processing Power
      • 6.4.3.2 Memory Bandwidth
      • 6.4.3.3 Energy Efficiency
      • 6.4.3.4 Scalability
    • 6.4.4 Applications
      • 6.4.4.1 Data Center and Cloud Computing
      • 6.4.4.2 Edge Devices and IoT
      • 6.4.4.3 Healthcare and Medical Devices
      • 6.4.4.4 Autonomous Vehicles
  • 6.5 Mobile Devices
    • 6.5.1 Challenges
    • 6.5.2 Advanced Packaging Solutions
      • 6.5.2.1 System-in-Package (SiP)
      • 6.5.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
      • 6.5.2.3 3D IC Packaging
      • 6.5.2.4 Wafer-Level Chip-Scale Packaging (WLCSP)
    • 6.5.3 Addressing Challenges through Advanced Packaging
      • 6.5.3.1 Power Consumption and Thermal Management
      • 6.5.3.2 Size Constraints
      • 6.5.3.3 Cost
    • 6.5.4 Applications
      • 6.5.4.1 Smartphones
      • 6.5.4.2 Tablets
      • 6.5.4.3 Wearables
      • 6.5.4.4 AR/VR Devices
    • 6.5.5 Future trends
  • 6.6 High Performance Computing (HPC)
    • 6.6.1 Challenges
    • 6.6.2 Advanced Packaging Solutions for HPC
      • 6.6.2.1 2.5D and 3D Integration
      • 6.6.2.2 Hybrid bonding
      • 6.6.2.3 Multi-Chip Modules (MCMs)
      • 6.6.2.4 Chiplet-based Architectures
      • 6.6.2.5 Advanced Interconnect Technologies
    • 6.6.3 Addressing HPC Challenges through Advanced Packaging
      • 6.6.3.1 Performance Scaling
      • 6.6.3.2 Power Consumption
      • 6.6.3.3 Interconnect Bandwidth
      • 6.6.3.4 Reliability
    • 6.6.4 Applications
      • 6.6.4.1 Supercomputers
      • 6.6.4.2 Data Center and Cloud Computing
      • 6.6.4.3 Artificial Intelligence and Machine Learning
      • 6.6.4.4 Scientific Computing and Simulation
      • 6.6.4.5 Co-Packaged Optics
        • 6.6.4.5.1 Network Switch
        • 6.6.4.5.2 Optical communication in data centers
        • 6.6.4.5.3 Thermal Management
        • 6.6.4.5.4 Challenges in CPO
        • 6.6.4.5.5 Package Structure
        • 6.6.4.5.6 Fan-Out Embedded Bridge (FOEB) structure
        • 6.6.4.5.7 Advancing Switching and AI Networks
        • 6.6.4.5.8 Making on-chip photonics manufacturable
    • 6.6.5 Thermal Interface Materials
    • 6.6.6 Future Trends
  • 6.7 Automotive Electronics
    • 6.7.1 Challenges
    • 6.7.2 Advanced Packaging Solutions for Automotive Electronics
      • 6.7.2.1 System-in-Package (SiP)
      • 6.7.2.2 Flip-Chip and Wafer-Level Packaging (WLP)
      • 6.7.2.3 3D Integration and Through-Silicon Vias (TSVs)
    • 6.7.3 Addressing Automotive Electronics Challenges through Advanced Packaging
      • 6.7.3.1 ADAS/Autonomous driving systems
      • 6.7.3.2 Harsh Environment Reliability
      • 6.7.3.3 Safety and Reliability
      • 6.7.3.4 Miniaturization and Integration
      • 6.7.3.5 High-Speed Communication
      • 6.7.3.6 Thermal Management
    • 6.7.4 Applications
      • 6.7.4.1 Advanced Driver Assistance Systems (ADAS) and Autonomous Driving
        • 6.7.4.1.1 Radar packaging
      • 6.7.4.2 Electric Vehicle (EV) Power Electronics
      • 6.7.4.3 Infotainment and Telematics
      • 6.7.4.4 Sensors and Actuators
    • 6.7.5 Future Trends
  • 6.8 Internet of Things (IoT) Devices
    • 6.8.1 Challenges
    • 6.8.2 Advanced Packaging Solutions for IoT Devices
      • 6.8.2.1 Wafer-Level Packaging (WLP)
      • 6.8.2.2 System-in-Package (SiP)
      • 6.8.2.3 Fan-Out Wafer-Level Packaging (FOWLP)
      • 6.8.2.4 3D Packaging and Through-Silicon Vias (TSVs)
    • 6.8.3 Addressing IoT Device Challenges through Advanced Packaging
      • 6.8.3.1 Size Constraints
      • 6.8.3.2 Power Consumption
      • 6.8.3.3 Cost Pressures
      • 6.8.3.4 Integration and Functionality
      • 6.8.3.5 Reliability and Robustness
    • 6.8.4 Applications
      • 6.8.4.1 Wearable Devices
      • 6.8.4.2 Smart Home Devices
      • 6.8.4.3 Industrial IoT Devices
      • 6.8.4.4 Medical IoT Devices
    • 6.8.5 Future Trends
  • 6.9 5G & 6G Communications Infrastructure
    • 6.9.1 Challenges
    • 6.9.2 Trends in 5G and 6G packaging
    • 6.9.3 Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
      • 6.9.3.1 Antenna-in-Package (AiP)
      • 6.9.3.2 System-in-Package (SiP)
      • 6.9.3.3 3D Packaging and Through-Silicon Vias (TSVs)
      • 6.9.3.4 Fan-Out Wafer-Level Packaging (FOWLP)
    • 6.9.4 Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
      • 6.9.4.1 High-Frequency Operation
      • 6.9.4.2 Massive MIMO and Beamforming
      • 6.9.4.3 Energy Efficiency
      • 6.9.4.4 Cost and Scalability
      • 6.9.4.5 Thermal Management
    • 6.9.5 Applications
      • 6.9.5.1 Base Stations and Small Cells
      • 6.9.5.2 Backhaul and Fronthaul Networks
      • 6.9.5.3 Edge Computing and Network Slicing
      • 6.9.5.4 Satellite and Non-Terrestrial Networks
    • 6.9.6 Future Trends
  • 6.10 Aerospace and Defense Electronics
    • 6.10.1 Challenges
    • 6.10.2 Advanced Packaging Solutions for Aerospace and Defense Electronics
      • 6.10.2.1 3D Packaging and Through-Silicon Vias (TSVs)
      • 6.10.2.2 Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)
      • 6.10.2.3 Flip-Chip and Ball Grid Array (BGA) Packaging
      • 6.10.2.4 Hermetic Packaging and Sealing
    • 6.10.3 Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
      • 6.10.3.1 Size, Weight, and Power (SWaP) Optimization
      • 6.10.3.2 Harsh Environment Reliability
      • 6.10.3.3 High Performance and Speed
      • 6.10.3.4 Long-Term Reliability and Maintainability
      • 6.10.3.5 Security and Anti-Tamper Features
    • 6.10.4 Applications
      • 6.10.4.1 Avionics and Flight Control Systems
      • 6.10.4.2 Radar and Electronic Warfare Systems
      • 6.10.4.3 Satellite Communications and Payload Electronics
      • 6.10.4.4 Missile Guidance and Control Electronics
    • 6.10.5 Future Trends
  • 6.11 Medical Electronics
    • 6.11.1 Challenges
    • 6.11.2 Advanced Packaging Solutions for Medical Electronics
      • 6.11.2.1 3D Packaging and Through-Silicon Vias (TSVs)
      • 6.11.2.2 Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)
      • 6.11.2.3 Flexible and Stretchable Packaging
      • 6.11.2.4 Microfluidic Packaging
    • 6.11.3 Addressing Medical Electronics Challenges through Advanced Packaging
      • 6.11.3.1 Miniaturization
      • 6.11.3.2 Biocompatibility
      • 6.11.3.3 Reliability
      • 6.11.3.4 Power Efficiency
      • 6.11.3.5 High Performance
    • 6.11.4 Applications
      • 6.11.4.1 Implantable Devices
      • 6.11.4.2 Wearable Health Monitors
      • 6.11.4.3 Diagnostic Imaging Equipment
      • 6.11.4.4 Surgical Robotics and Instruments
    • 6.11.5 Future Trends
  • 6.12 Consumer Electronics
    • 6.12.1 Challenges
    • 6.12.2 Advanced Packaging Solutions for Consumer Electronics
      • 6.12.2.1 System-in-Package (SiP)
      • 6.12.2.2 Fan-Out Wafer-Level Packaging (FOWLP)
      • 6.12.2.3 3D Packaging and Through-Silicon Vias (TSVs)
      • 6.12.2.4 Embedded Die Packaging
    • 6.12.3 Addressing Consumer Electronics Challenges through Advanced Packaging
      • 6.12.3.1 Miniaturization
      • 6.12.3.2 Power Efficiency
      • 6.12.3.3 High Performance
      • 6.12.3.4 Cost Reduction
      • 6.12.3.5 Time-to-Market
    • 6.12.4 Applications
      • 6.12.4.1 Smartphones and Tablets
      • 6.12.4.2 Wearables and IoT Devices
      • 6.12.4.3 Gaming Consoles and VR/AR Devices
      • 6.12.4.4 Smart Home Devices
    • 6.12.5 Future Trends
  • 6.13 Additive manufacturing for advanced packaging
  • 6.14 Silicon photonics

7 GLOBAL MARKET FORECASTS

  • 7.1 By type
  • 7.2 By Units & Wafers
  • 7.3 By end-use market
  • 7.4 By region
  • 7.5 3D SoC
  • 7.6 3D Stacked memory
  • 7.7 UHD FO / RDL Interposer
  • 7.8 2.5D Interposers
  • 7.9 Embedded Si bridge

8 MARKET TRENDS

  • 8.1 Data center
  • 8.2 AI and Graphics
  • 8.3 CPU
  • 8.4 Autonomous vehicles
  • 8.5 Roadmap
    • 8.5.1 Interconnect technology trend
    • 8.5.2 By interconnect density and technology node
    • 8.5.3 By reticle size
    • 8.5.4 By front-end vs back-end
    • 8.5.5 By 2.5D and 3D Technology Trends
    • 8.5.6 By I/O density, I/O pitch and package size
  • 8.6 Commercialized Products
    • 8.6.1 3D Memory
    • 8.6.2 GPU
      • 8.6.2.1 Nvidia
      • 8.6.2.2 AMD
      • 8.6.2.3 Intel
    • 8.6.3 AI ASICs
      • 8.6.3.1 Intel
      • 8.6.3.2 Google
      • 8.6.3.3 Amazon
      • 8.6.3.4 Microsoft
      • 8.6.3.5 Huawei
      • 8.6.3.6 Meta
    • 8.6.4 CPU
      • 8.6.4.1 AMD
      • 8.6.4.2 Amazon
      • 8.6.4.3 Intel
      • 8.6.4.4 Nvidia
    • 8.6.5 Networking and CPO switches
      • 8.6.5.1 Nvidia Quantum-X and Spectrum-X Photonics
      • 8.6.5.2 Broadcom Tomahawk CPO (Bailly / Davisson)

9 MARKET PLAYERS

  • 9.1 Integrated Device Manufacturers
  • 9.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies
  • 9.3 Foundries
  • 9.4 Electronics OEMs
  • 9.5 Packaging Equipment and Materials Companies

10 MARKET CHALLENGES

11 COMPANY PROFILES

  • 11.1 AaltoSemi
  • 11.2 Absolic, Inc.
  • 11.3 ACCRETECH (Europe) GmbH
  • 11.4 Adeia, Inc.
  • 11.5 Advanced Micro Devices, Inc. (AMD)
  • 11.6 Ajinomoto
  • 11.7 Analog Devices, Inc. (ADI)
  • 11.8 Amkor Technology
  • 11.9 Anmuquan Intelligent Technology (AMQ Intelligent)
  • 11.10 Apple
  • 11.11 Applied Materials
  • 11.12 Ardentec Corporation
  • 11.13 Arieca
  • 11.14 ARM
  • 11.15 ASE
  • 11.16 ASMPT Ltd
  • 11.17 Ayar Labs
  • 11.18 Besi
  • 11.19 Biren Technology
  • 11.20 Blue Ocean Smart System
  • 11.21 Brewer Science
  • 11.22 Broadcom
  • 11.23 BroadPak
  • 11.24 Cadence Design Systems
  • 11.25 Cambricon Technologies Co.
  • 11.26 Capcon Semiconductor
  • 11.27 CAS Microelectronics Integration
  • 11.28 CD Micro-Technology
  • 11.29 CEA-Leti
  • 11.30 Cerebras
  • 11.31 China Wafer Level CSP Co
  • 11.32 Chipbond Technology Corporation
  • 11.33 Chipletz
  • 11.34 ChipMOS Technologies, Inc.
  • 11.35 Coherent
  • 11.36 Corning
  • 11.37 Dai Nippon Printing (DNP)
  • 11.38 Dewo Advanced Automation (DAA)
  • 11.39 Disco
  • 11.40 Dupont
  • 11.41 Ebara
  • 11.42 Eliyan
  • 11.43 EMC Semi-Conductor Technology
  • 11.44 EPS Technology
  • 11.45 Entegris
  • 11.46 EV Group
  • 11.47 GlobalFoundries
  • 11.48 Global Unichip
  • 11.49 Gloway
  • 11.50 Goldenscope Tech
  • 11.51 Gona Semiconductor Technology
  • 11.52 Graphcore
  • 11.53 Greatek Electronics Inc
  • 11.54 Hangke Chuangxing (Aero Inno-Star)
  • 11.55 Hanmi Semiconductor
  • 11.56 HD Microsystems
  • 11.57 HiSilicon
  • 11.58 HLMC (Shanghai Huali Microelectronics Corporation)
  • 11.59 Huatian Huichuang Technology (Xi'an) Co., Ltd.
  • 11.60 Huawei
  • 11.61 Ibiden
  • 11.62 IBM
  • 11.63 ICLeague Technology Co Ltd
  • 11.64 IMEC
  • 11.65 Indium Corporation
  • 11.66 Infineon Technologies AG
  • 11.67 Integra
  • 11.68 Inari Amertron Berhad
  • 11.69 Intel Corporation
  • 11.70 JCET Group
  • 11.71 Jiangsu IC Assembly & Test (ICAT)
  • 11.72 Jingdu Semiconductor
  • 11.73 Keyang Semiconductor (KYS)
  • 11.74 King Yuan Electronics Co., Ltd.
  • 11.75 Kioxia
  • 11.76 KyLitho
  • 11.77 Kyocera
  • 11.78 Lam Research
  • 11.79 Lapis Technology
  • 11.80 LB Semicon Co Ltd
  • 11.81 Leading Interconnect Semiconductor Technology
  • 11.82 LG Innotek
  • 11.83 Lidrotec GmbH
  • 11.84 Lux Semiconductors
  • 11.85 Malaysian Pacific Industries Berhad
  • 11.86 Micron Technology, Inc.
  • 11.87 Mediatek
  • 11.88 Micross Components
  • 11.89 Mitsubishi
  • 11.90 National Center For Advanced Packaging China (NCAP China)
  • 11.91 NEC
  • 11.92 Nvidia Corporation
  • 11.93 Nepes Corporation
  • 11.94 Nippon Electric Glass (NEG)
  • 11.95 Onsemi
  • 11.96 Orient Semiconductor Electronics Ltd.
  • 11.97 Panasonic
  • 11.98 Plan Optik AG
  • 11.99 Powertech Technology Inc.
  • 11.100 Pragmatic Semiconductor
  • 11.101 Qorvo
  • 11.102 Renesas
  • 11.103 Rigger Micro Technologies (RMT)
  • 11.104 Rohm
  • 11.105 Rong Semiconductor
  • 11.106 Samsung Electronics
  • 11.107 Samtec, Inc.
  • 11.108 Schott AG
  • 11.109 Sharp
  • 11.110 Shinko Electric Industries
  • 11.111 Showa Denko (Resonac)
  • 11.112 Sigurd Microelectronics Corporation
  • 11.113 Silicon Box
  • 11.114 Siliconware Precision Industries (SPIL)
  • 11.115 SJ Semiconductor
  • 11.116 SK Hynix
  • 11.117 Skywater
  • 11.118 Sony Corporation
  • 11.119 Starmask
  • 11.120 STMicroelectronics
  • 11.121 Suss Microtec
  • 11.122 Synopsys
  • 11.123 SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
  • 11.124 Taiwan Semiconductor Manufacturing Company (TSMC)
  • 11.125 Techsense International
  • 11.126 Tezzaron Semiconductor
  • 11.127 Tokyo Electron (TEL)
  • 11.128 Tongfu Microelectronics Co., Ltd.
  • 11.129 Toppan
  • 11.130 Toray
  • 11.131 Texas Instruments
  • 11.132 Tokyo Electron
  • 11.133 Tokyo Seimitsu Co., Ltd.
  • 11.134 Tong Hsing Electronic Industries, Ltd.
  • 11.135 Toshiba
  • 11.136 Tower Semiconductor
  • 11.137 Unimicron
  • 11.138 Unisem
  • 11.139 UTAC Group
  • 11.140 Walton Advanced Engineering Inc.
  • 11.141 Winstek Semiconductor Technology Co., Ltd.
  • 11.142 Xinhe Semiconductor
  • 11.143 Yibu Semiconductor
  • 11.144 Yuehai Integrated

12 RESEARCH METHODOLOGY

13 REFERENCES

List of Tables

  • Table 1. Evolution of semiconductor packaging.
  • Table 2. Summary of key advanced semiconductor packaging approaches.
  • Table 3. Key Technology Trends in Advanced Semiconductor Packaging.
  • Table 4. Market Growth Drivers for advanced semiconductor packaging.
  • Table 5. Challenges Facing Advanced Packaging Adoption.
  • Table 6. Challenges in transistor scaling.
  • Table 7. Leading-edge logic node roadmap, 2026–2030.
  • Table 8. Use cases and benefits of using chiplets in semiconductor design.
  • Table 9. Specifications of interconnection methods.
  • Table 10. Interconnection technique in semiconductor packaging
  • Table 11. Passive vs active interposer.
  • Table 12. Interposer technology comparison
  • Table 13. Technical challenges of glass interposer
  • Table 14. Different Interposer material comparison
  • Table 15. Comparative benchmark overview table of key semiconductor interconnection technologies
  • Table 16. Die-to-die I/O approaches compared
  • Table 17. Fan-out packaging process overview.
  • Table 18. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.
  • Table 19. Benefits of glass in 2.5D glass-based packaging.
  • Table 20. Through-glass-via (TGV) formation methods compared.
  • Table 21. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.
  • Table 22. Challenges of glass semiconductor packaging.
  • Table 23. Comparison between silicon, organic laminates and glass as packaging substrates.
  • Table 24. Through-glass-via (TGV) formation methods compared (insert after Table 16)
  • Table 25. 2.5D vs. 3D packaging.
  • Table 26. 2.5D packaging challenges.
  • Table 27. Market players in 2.5D packaging.
  • Table 28. Glass substrate/packaging supplier landscape (2026).
  • Table 29. Advantages and disadvantages of 3D packaging.
  • Table 30. W2W vs D2W vs Collective D2W – Process and Comparison.
  • Table 31. 3D Stacking Trends - Direct Molecular Bonding Technologies.
  • Table 32. 3D interconnect trends
  • Table 33. Hybrid bonding Advantages and Challenges.
  • Table 34. Hybrid Bond Timeline for Chip Makers and Equipment Makers.
  • Table 35. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.
  • Table 36. Challenges in scaling bumps.
  • Table 37. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
  • Table 38. Micro bumps vs Cu-Cu bumpless hybrid bonding.
  • Table 39. Panel-level packaging format scaling.
  • Table 40. Benefits of Wafer-Level Packaging.
  • Table 41. Types of wafer level packaging.
  • Table 42. Key trends shaping wafer level packaging.
  • Table 43. Packaging approaches utilized for assembling System-in-Package modules.
  • Table 44. Considerations for integrating key component categories into system-in-package (SiP) modules/
  • Table 45. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.
  • Table 46. Key trends influencing adoption of System-in-Package modules.
  • Table 47. System-in-package (SiP) module applications.
  • Table 48. Co-packaging approaches
  • Table 49. Type of couplers
  • Table 50. CPO advantages and limitations
  • Table 51. Technologies offered by companies
  • Table 52. Comparison between heterogeneous 3D integration and monolithic 3D integration.
  • Table 53. Key 2D materials in monolithic 3D integrated circuits.
  • Table 54. Benefits of monolithic 3D ICs.
  • Table 55. Challenges of monolithic 3D ICs.
  • Table 56. Advanced semiconductor packaging trends by market.
  • Table 57. Design requirements in advanced packaging, by market.
  • Table 58. TIM candidate benchmark
  • Table 59. Wide-bandgap power semiconductors compared.
  • Table 60. Global market for Advanced semiconductor packaging, 2027-2037, by packaging type, (billions USD).
  • Table 61. Global market for Advanced semiconductor packaging, 2020-2035, by Units & Wafers, (billions USD).
  • Table 62. Global market for Advanced semiconductor packaging, 2027-2035, by end use market (billions USD).
  • Table 63. Global market for advanced semiconductor packaging, 2027–2037, by region (billions USD)
  • Table 64. 3D SoC market, 2027–2037 (billions USD)
  • Table 65. 3D stacked memory (HBM) packaging market, 2027–2037 (billions USD)
  • Table 66. UHD FO / RDL interposer market, 2027–2037 (billions USD)
  • Table 67. 2.5D interposer market, 2027–2037 (billions USD)
  • Table 68. Large-format 2.5D / CoWoS roadmap.
  • Table 69. Embedded Si bridge market, 2027–2037 (billions USD)
  • Table 70. Interconnect technology trend
  • Table 71. Roadmap By interconnect density and technology node
  • Table 72. Roadmap By reticle size
  • Table 73. Roadmap front-end vs back-end
  • Table 74. Roadmap By 2.5D and 3D Technology Trends
  • Table 75. Roadmap By I/O density, I/O pitch and package size
  • Table 76. Main Global Wafer Foundry Companies 2023.
  • Table 77. Market challenges for advanced semiconductor packaging.
  • Table 78. AMD AI chip range.
  • Table 79. Intel's products that adopt 3D FOVEROS.

List of Figures

  • Figure 1. Timeline of different packaging technologies.
  • Figure 2. Evolution roadmap for semiconductor packaging.
  • Figure 3. Semiconductor Supply Chain.
  • Figure 4. Advanced packaging supply chain.
  • Figure 5. Scaling technology roadmap.
  • Figure 6. Wafer-level chip scale packaging (WLCSP)
  • Figure 7. Embedded wafer-level ball grid array (eWLB).
  • Figure 8. Fan-out wafer-level packaging (FOWLP).
  • Figure 9. Chiplet design.
  • Figure 10. Chiplet SoC.
  • Figure 11. 2D chip packaging.
  • Figure 12. Typical structure of 2.5D IC package utilizing interposer.
  • Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow.
  • Figure 14. Manufacturing process for glass interposers.
  • Figure 15. 3D Glass Panel Embedding (GPE) package.
  • Figure 16. 3D stacking supply chain.
  • Figure 17. Typical FOWLP structure.
  • Figure 18. System-in-Package (SiP) for HI.
  • Figure 19. 2.5D chiplet integration.
  • Figure 20. Advanced packaging supply chain.
  • Figure 21. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving.
  • Figure 22. Absolic glass substrate.
  • Figure 23. AMD Radeon Instinct.
  • Figure 24. AMD Ryzen 7040.
  • Figure 25. Alveo V70.
  • Figure 26. Versal Adaptive SOC.
  • Figure 27. AMD’s MI300 chip.
  • Figure 28. 12-layer HBM3.