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市場調查報告書
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2066262

全球量子材料市場（2027-2047 年）

The Global Quantum Materials Market 2027-2047
出版日期: | 出版商: Future Markets, Inc. | 英文 152 Pages, 82 Tables, 12 Figures | 訂單完成後即時交付

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量子材料市場涵蓋了支撐所有量子技術的特殊材料和基礎組件——量子計算、感測和通訊的物理基礎。與量子位元和演算法等以媒體為中心的元素不同，該市場位於價值鏈的下游，供應超導性、光子平台、鑽石、奈米材料、低溫系統、雷射、真空設備和互連組件。沒有這些組件，任何量子系統都無法運作。該市場的特點是，材料的質量，而非系統結構，正日益決定哪些平台能夠實現規模化並最終實現商業性化。

材料是量子硬體的阻礙因素。量子位元的相干性、閘保真度和誤碼率直接取決於構成處理器的材料的純度、缺陷密度和介面品質。基板表面氧化物和雙能階系統中的缺陷仍然是超導性元件退相干的主要原因。不同模式對材料的要求差異很大。超導性處理器依賴鈮、鉭和鋁，基板為低損耗的藍寶石或矽。矽自旋量子位元需要同位素富集的矽-28。鑽石基板依賴包含特定氮空位中心的量子級化學氣相沉積（CVD）材料。光子系統和原子系統也利用氮化矽和薄膜鈮酸鋰積體電路、專用雷射和單光子檢測器。然而，所有這些系統的通用在於它們都依賴低溫基礎設施、超高純度原料以及日益受限的資源，例如氦-3。

這個市場受供應鏈高度集中的影響。稀釋製冷機、氦-3分銷、量子級鑽石、高濃度矽以及低溫CMOS晶圓代工廠都處於戰略瓶頸，少數供應商（通常是單一的壟斷供應商）控制著供應。這些瓶頸正日益影響量子硬體的擴張速度，而與市場需求無關。供應鏈也是地緣政治競爭的焦點，歐洲、美國及其盟友的供應商控制著許多最關鍵的瓶頸，而其他地區則在大力投資國內產能和材料研發。

隨著量子技術從實驗室走向商業部署，構成量子系統的材料和組件正成為限制產業發展速度的阻礙因素。量子位元的相干性、量子閘的保真度和誤碼率直接取決於構成系統的材料的純度和品質。同時，氦-3、稀釋冷凍機、量子級鑽石、高濃度矽、特殊雷射以及低溫CMOS晶圓代工廠產能等關鍵投入品的供應集中在少數供應商手中，且地緣政治因素加劇了競爭。對於材料製造商、組件供應商、投資者和系統開發人員而言，供應鏈如今已成為整個量子價值鏈中最具戰略意義、最脆弱的環節之一。

「全球量子材料市場（2027-2047）」報告對未來20年該市場進行了全面的技術和商業性分析。報告按材料類別、物理平台和地區對市場進行了量化，並基於量子位元部署預測和材料強度建模，提出了精細的自下而上的預測。此外，報告還評估了所有材料類別的技術成熟度，對最有可能限制硬體擴展的供應鏈瓶頸進行了排名，並揭示了該領域供應商的競爭格局。

本報告解答了決定您在該市場定位的關鍵問題：到 2047 年，哪些材料和組件將帶來最大的商機？供應瓶頸將在何時何地出現？哪些平台和地區將推動需求？中美之間的競爭將如何重塑材料供應鏈？哪些供應商在各個細分市場佔有優勢？

本報告的主要內容如下：

  • 2027-2047 年按材料類別、平台和地區分類的市場預測（包括保守、基準和樂觀情境）
  • 超導性和超導性量子電路
  • 光電、矽光電和光學元件
  • 奈米材料和人造鑽石
  • 低溫基礎設施和氦-3供應鏈
  • 低溫控制電子設備和低溫CMOS
  • 雷射、光電元件和單光子偵測
  • 超高真空系統
  • 微波和光連接模組
  • 供應鏈瓶頸評估，考慮嚴重性、發生機率和解決時間。
  • 透過材料分類評估技術成熟度
  • 量子技術領域的投資趨勢與主要資金籌措趨勢
  • 量子材料競爭的地緣政治層面
  • 量子材料價值鏈中 67 家公司的簡介：Aegiq、Aeluma、Archer Materials、Arctic Instruments、BlueFors、C12 Quantum Electronics、CavilinQ、Chiral Nano、Covesion、Delft Circuits、Diatope、Diraq、Element Six、Chiral Nano、Covesion、Delft Circuits、Diatope、Diraq、Element Six、Ephos、Exaili​​yc​​a –iak 它、Liaconn、Ephos、Zir323053 月Industries、memQ、Menlo Systems、Monarch Quantum、Montana Instruments、Munich Quantum Instruments、NeoCrystech、nOhm Devices、Novocene Photonics、Nu Quantum 以及其他 67 家公司。
  • 20 年銷售預測及相關數據表

對於希望了解和受益於支撐量子經濟的材料的材料和組件供應商、量子硬體開發人員、投資者、政府機構和供應鏈負責人而言，這份報告是必讀之作。

購買者將獲得以下物品：

  • 下載 PDF 報告 / 透過電子郵件發送
  • 包含所有資料的完整Excel表格。
  • 過渡時期更新

目錄

第1章：摘要整理

第2章 材料分析

  • 超導性
    • 概述
    • 技術準備
    • 類型和屬性
    • 臨界溫度和材料選擇
    • 超導性量子電路
    • 缺陷和噪音源
    • 超導性奈米線單光子檢測器（SNSPD）－材料與製造
    • 機會
  • 光電、矽光電、光學元件
    • 概述
    • 類型和屬性
    • 技術準備
    • 用於量子技術的光子積體電路
    • 用於量子感測的PIC
    • 機會
  • 奈米材料
    • 概述
    • 類型和屬性
    • 技術準備
    • 機會
  • 用於量子技術的人造鑽石
    • 概述
    • 技術準備
    • 基於鑽石的量子電腦供應鏈和材料
    • 量子級鑽石
    • 鑽石量子記憶體中的矽空位
  • 低溫基礎設施
    • 低溫技術在量子計算中的作用
    • 技術準備
    • 按運轉模式動作溫度要求
    • 稀釋冷藏庫
    • 脈衝管和低溫冷凍機
    • 替代冷卻技術
    • 稀釋冷藏庫供應商情況
    • 夥伴關係模式
    • 低溫系統的前置作業時間和產能限制
    • 預測－待安裝的稀釋冷凍裝置數量
  • 氦-3供應鏈
    • 為什麼氦-3在量子計算中如此重要
    • 3. 氚崩壞產生氦
    • 氦-3的來源與年度產量預測
    • 技術準備
    • 氦-3供應鏈
    • 2026-2046年供需差距分析模型
    • 月壤採集（插曲）
    • 氦-4的工業供應風險
    • 戰略儲備和緩解措施
  • 低溫控制電子元件和低溫CMOS
    • 線路危機－為什麼室溫控制系統無法擴展
    • 建築設計方法
    • 技術準備
    • NVQLink與量子/經典資料中心的融合
    • 低溫CMOS元件和製程技術
    • 供應商情況
    • 低溫放大器——TWPA、HEMT、參量放大器
    • 熱負荷預算和功耗限制
    • 預測－低溫CMOS市場及滲透率
  • 雷射和光子元件（按類型）
    • 量子系統中的雷射材料清單
    • 原子和固體模式所需的波長
    • 雷射技術平台
    • 技術準備
    • 線寬、穩定性和相位雜訊要求
    • 光子元件供應商
    • 雷射折彎機能力矩陣
    • 單光子偵測
    • 取得光子積體電路和晶圓代工廠的途徑
  • 超高真空（UGV）系統
    • 處理方法對真空壓力的要求
    • 超高真空腔的設計與材料
    • 技術準備
    • 真空幫浦及相關設備
    • 真空饋通和氣密密封
    • 蒸氣池技術和原子能源
    • 超高真空彎曲能力矩陣
  • 微波和光連接模組
    • 技術準備
    • 低溫微波電纜
    • 高密度低溫連接器
    • 低溫衰減器和濾波器
    • 循環系統、斷路器、開關
    • 用於光子和模組化量子系統的光連接模組
    • 微波光轉換器
    • 供應商情況
  • 供應鏈瓶頸評估
    • 調查方法—嚴重性、發生機率和解決時間框架
    • 主要瓶頸
    • 嚴重的瓶頸
    • 按模式分割的瓶頸熱圖
    • 緩解措施
  • 材料市場預測
    • 超導性晶片和基板
    • 光子積體電路和光學元件
    • 低溫基礎設施
    • 氦-3和氦-4的供應
    • 低溫控制電子元件和低溫CMOS
    • 雷射和單光子檢測器
    • 超高真空系統
    • 微波和光連接模組
    • 鑽石和量子材料
    • 用於量子應用的奈米材料

第3章：公司簡介（65家公司簡介）

第4章參考文獻

The quantum materials market encompasses the specialised materials and enabling components on which all quantum technologies depend - the physical substrate of quantum computing, sensing, and communications. Unlike the headline-grabbing layers of qubits and algorithms, this market sits deeper in the value chain, supplying the superconductors, photonic platforms, diamond, nanomaterials, cryogenic systems, lasers, vacuum hardware, and interconnects without which no quantum system can operate. Its defining characteristic is that materials quality, not system architecture, increasingly determines which platforms can scale toward commercial viability.

Materials are the binding constraint on quantum hardware. Qubit coherence, gate fidelity, and error rates are governed directly by the purity, defect density, and interface quality of the materials a processor is built from - two-level-system defects in surface oxides and substrates remain the leading source of decoherence in superconducting devices. Requirements are highly modality-specific: superconducting processors depend on niobium, tantalum, and aluminium on low-loss sapphire or silicon substrates; silicon spin qubits require isotopically enriched silicon-28; diamond platforms rely on quantum-grade CVD material hosting engineered nitrogen-vacancy centres; and photonic and atomic systems draw on silicon-nitride and thin-film-lithium-niobate integrated circuits, specialty lasers, and single-photon detectors. Yet all share a dependence on cryogenic infrastructure, ultra-pure inputs, and increasingly constrained resources such as helium-3.

The market is shaped by acute supply-chain concentration. Dilution-refrigerator manufacturing, helium-3 allocation, quantum-grade diamond, enriched silicon, and cryo-CMOS foundry access each represent strategic chokepoints where a small number of suppliers - often a single dominant vendor - control availability. These bottlenecks increasingly govern the rate at which quantum hardware can scale, independent of demand. The supply chain has also become a distinct axis of geopolitical competition, with Western and allied suppliers controlling most critical chokepoints while other regions invest heavily in indigenous capacity and materials research.

Quantum technology is moving from the laboratory to commercial deployment, and the materials and components that make quantum systems work have become the decisive constraint on how fast the industry can scale. Qubit coherence, gate fidelity, and error rates are set directly by the purity and quality of the materials a system is built from, while supply of critical inputs - helium-3, dilution refrigerators, quantum-grade diamond, enriched silicon, specialty lasers, and cryo-CMOS foundry capacity - is concentrated among a small number of suppliers and increasingly contested along geopolitical lines. For materials producers, component suppliers, investors, and system developers, the supply layer is now one of the most strategically significant and defensible positions in the entire quantum value chain.

The Global Quantum Materials Market 2027-2047 provides a comprehensive technical and commercial analysis of this market across a twenty-year horizon. It quantifies the market by materials category, by physical platform, and by region, with granular bottom-up forecasts built from qubit installed-base projections and material-intensity modelling. It assesses technology readiness across every materials class, ranks the supply-chain bottlenecks most likely to constrain hardware scaling, and maps the competitive landscape of the companies supplying the sector.

The report answers the questions that determine positioning in this market: which materials and components represent the largest revenue opportunities through 2047; where supply chokepoints will bind and when; which platforms and regions will drive demand; how the US–China competition is reshaping the materials supply chain; and which suppliers hold defensible positions in each segment.

Coverage includes:

  • Market forecasts 2027-2047 by materials category, platform, and region, with conservative, base, and optimistic scenarios
  • Superconductors and superconducting quantum circuits
  • Photonics, silicon photonics, and optical components
  • Nanomaterials and artificial diamond
  • Cryogenic infrastructure and the helium-3 supply chain
  • Cryogenic control electronics and cryo-CMOS
  • Lasers, photonic components, and single-photon detection
  • Ultra-high-vacuum systems
  • Microwave and optical interconnects
  • Supply-chain bottleneck assessment with severity, probability, and time-to-resolution analysis
  • Technology readiness assessment by material class
  • Quantum technology investment landscape and key funding trends
  • The geopolitical dimension of quantum materials competition
  • Profiles of 67 companies across the quantum materials value chain including Aegiq, Aeluma, Archer Materials, Arctic Instruments, BlueFors, C12 Quantum Electronics, CavilinQ, Chiral Nano, Covesion, Delft Circuits, Diatope, Diraq, Element Six, Ephos, Exail, g2-Zero, Ki3 Photonics, Kiutra, Ligentec, Maybell Quantum Industries, memQ, Menlo Systems, Monarch Quantum, Montana Instruments, Munich Quantum Instruments, NeoCrystech, nOhm Devices, Novocene Photonics, Nu Quantum and more...
  • Twenty-year revenue forecasts and supporting data tables

The report is essential reading for materials and component suppliers, quantum hardware developers, investors, government agencies, and supply-chain strategists seeking to understand and capitalise on the materials foundation of the quantum economy.

Purchasers will receive the following:

  • PDF report download/by email.
  • Comprehensive Excel spreadsheet of all data.
  • Mid-year Update

Table of Contents

1 EXECUTIVE SUMMARY

  • 1.1 The Quantum Technology Market in
    • 1.1.1 Q1 2025: The Surge That Set the Tone
    • 1.1.2 Q2 2025: Momentum Builds Across the Stack
    • 1.1.3 Q3 2025: Mega-Rounds and a New Valuation Era
    • 1.1.4 Q4 2025: Going Public and Consolidation Accelerates
    • 1.1.5 Into 2026: The Public Market Era Begins
    • 1.1.6 The Strategic Picture: What $10 Billion Means
    • 1.1.7 2025 as Quantum Technology's Commercial Watershed
  • 1.2 First and second quantum revolutions
  • 1.3 Current quantum technology market landscape
    • 1.3.1 Key developments
  • 1.4 Quantum Technologies Investment Landscape
    • 1.4.1 Total market investments 2012-2026
    • 1.4.2 By Technology
    • 1.4.3 By Company
    • 1.4.4 By Application
    • 1.4.5 By Region
      • 1.4.5.1 The Quantum Market in North America
      • 1.4.5.2 The Quantum Market in Asia
      • 1.4.5.3 The Quantum Market in Europe
    • 1.4.6 Key Investment Trends 2025–2026
  • 1.5 Enabling Technologies and Infrastructure
  • 1.6 Material Platforms
    • 1.6.1 Materials in Quantum Computing
      • 1.6.1.1 Materials Opportunities in Quantum Computing
      • 1.6.1.2 Roadmap for Components in Quantum Computing
    • 1.6.2 Materials for Quantum Sensing
      • 1.6.2.1 Materials Opportunities in Quantum Sensing
      • 1.6.2.2 Roadmap for Components in Quantum Sensing
    • 1.6.3 Materials for Quantum Networking and Communications
      • 1.6.3.1 Materials Opportunities in Quantum Networking and Communications
      • 1.6.3.2 Roadmap for Quantum Networking and Communications
  • 1.7 Quantum Materials Technology Readiness Overview
  • 1.8 Investment Opportunities in Quantum Materials
  • 1.9 Critical Supply Chain Bottlenecks
  • 1.10 The Geopolitical Dimension
  • 1.11 Materials Market Forecasts

2 MATERIALS ANALYSIS

  • 2.1 Superconductors
    • 2.1.1 Overview
    • 2.1.2 Technology Readiness
    • 2.1.3 Types and Properties
    • 2.1.4 Critical Temperature and Material Selection
      • 2.1.4.1 Critical Material Supply Chain Considerations
    • 2.1.5 Superconducting Quantum Circuits
      • 2.1.5.1 Introduction
      • 2.1.5.2 Fabricating Superconducting Qubits
    • 2.1.6 Defects and Sources of Noise
    • 2.1.7 Superconducting Nanowire Single-Photon Detectors (SNSPDs) - Materials and Fabrication
    • 2.1.8 Opportunities
  • 2.2 Photonics, Silicon Photonics and Optical Components
    • 2.2.1 Overview
    • 2.2.2 Types and Properties
    • 2.2.3 Technology Readiness
    • 2.2.4 Photonic Integrated Circuits for Quantum Technology
      • 2.2.4.1 Overview
    • 2.2.5 PICs for Quantum Sensing
    • 2.2.6 Opportunities
  • 2.3 Nanomaterials
    • 2.3.1 Overview
    • 2.3.2 Types and Properties
      • 2.3.2.1 Quantum Dots
      • 2.3.2.2 Carbon Nanotubes
      • 2.3.2.3 Graphene
      • 2.3.2.4 Nanowires
      • 2.3.2.5 Nanodiamonds
      • 2.3.2.6 2D Materials
      • 2.3.2.7 Silicon Carbide Colour Centres
      • 2.3.2.8 Rare-Earth-Doped Nanoparticles
      • 2.3.2.9 Hexagonal Boron Nitride (hBN) Single-Photon Emitters
      • 2.3.2.10 Topological Insulator Nanostructures
      • 2.3.2.11 Perovskite Nanocrystals
      • 2.3.2.12 Molecular Qubits and Endohedral Fullerenes
    • 2.3.3 Technology Readiness
    • 2.3.4 Opportunities
  • 2.4 Artificial Diamond for Quantum Technology
    • 2.4.1 Overview
    • 2.4.2 Technology Readiness
    • 2.4.3 Supply Chain and Materials for Diamond-Based Quantum Computers
    • 2.4.4 Quantum Grade Diamond
    • 2.4.5 Silicon-Vacancy in Diamond Quantum Memory
  • 2.5 Cryogenic Infrastructure
    • 2.5.1 The Role of Cryogenics in Quantum Computing
    • 2.5.2 Technology Readiness
    • 2.5.3 Operating Temperature Requirements by Modality
    • 2.5.4 Dilution Refrigerators
      • 2.5.4.1 Cryogen-Free vs. Wet Systems
    • 2.5.5 Pulse Tube and Cryocoolers
    • 2.5.6 Alternative Cooling Technologies
    • 2.5.7 Dilution Refrigerator Vendor Landscape
    • 2.5.8 Partnership Models
    • 2.5.9 Cryogenic System Lead Times and Capacity Constraints
    • 2.5.10 Forecast - Installed Base of Dilution Refrigerators
  • 2.6 Helium-3 Supply Chain
    • 2.6.1 Why Helium-3 Matters for Quantum Computing
    • 2.6.2 ³He Production from Tritium Decay
    • 2.6.3 ³He Supply Sources and Annual Production Estimates
    • 2.6.4 Technology Readiness
    • 2.6.5 Helium-3 Supply Chain
    • 2.6.6 Demand-Supply Gap Modelling, 2026–2046
    • 2.6.7 Lunar Regolith Harvesting (Interlune)
    • 2.6.8 Helium-4 Industrial Supply Risk
    • 2.6.9 Strategic Stockpiling and Mitigation
  • 2.7 Cryogenic Control Electronics and Cryo-CMOS
    • 2.7.1 The Wiring Crisis - Why Room-Temperature Control Cannot Scale
    • 2.7.2 Architectural Approaches
    • 2.7.3 Technology Readiness
    • 2.7.4 NVQLink and the Quantum-Classical Data Centre Convergence
    • 2.7.5 Cryo-CMOS Devices and Process Technology
    • 2.7.6 Vendor Landscape
    • 2.7.7 Cryogenic Amplifiers - TWPAs, HEMT and Parametric
    • 2.7.8 Heat Load Budgets and Power Dissipation Constraints
    • 2.7.9 Forecast - Cryo-CMOS Market and Penetration
  • 2.8 Lasers and Photonic Components by Modality
    • 2.8.1 The Laser Bill of Materials in a Quantum System
    • 2.8.2 Wavelengths Required by Atomic and Solid-State Modalities
    • 2.8.3 Laser Technology Platforms
    • 2.8.4 Technology Readiness
    • 2.8.5 Linewidth, Stability and Phase Noise Requirements
    • 2.8.6 Photonic Component Suppliers
    • 2.8.7 Laser Vendor Capability Matrix
    • 2.8.8 Single-Photon Detection
    • 2.8.9 Photonic Integrated Circuits and Foundry Access
  • 2.9 Ultra-High Vacuum (UGV) Systems
    • 2.9.1 Vacuum Pressure Requirements by Modality
    • 2.9.2 UHV Chamber Design and Materials
    • 2.9.3 Technology Readiness
    • 2.9.4 Vacuum Pumps and Hardware
    • 2.9.5 Vacuum Feedthroughs and Hermetic Seals
    • 2.9.6 Vapour Cell Technology and Atomic Sources
    • 2.9.7 UHV Vendor Capability Matrix
  • 2.10 Microwave and Optical Interconnects
    • 2.10.1 Technology Readiness
    • 2.10.2 Cryogenic Microwave Cabling
    • 2.10.3 High-Density Cryogenic Connectors
    • 2.10.4 Cryogenic Attenuators and Filters
    • 2.10.5 Circulators, Isolators and Switches
    • 2.10.6 Optical Interconnects for Photonic and Modular Quantum Systems
    • 2.10.7 Microwave-to-Optical Transducers
    • 2.10.8 Vendor Landscape
  • 2.11 Supply Chain Bottleneck Assessment
    • 2.11.1 Methodology - Severity, Probability and Time-to-Resolution Framework
    • 2.11.2 Critical Bottlenecks
    • 2.11.3 High-Severity Bottlenecks
    • 2.11.4 Bottleneck Heat-Map by Modality
    • 2.11.5 Mitigation Strategies
  • 2.12 Materials Market Forecasts
    • 2.12.1 Superconducting Chips and Substrates
    • 2.12.2 Photonic Integrated Circuits and Optical Components
    • 2.12.3 Cryogenic Infrastructure
    • 2.12.4 Helium-3 and Helium-4 Supply
    • 2.12.5 Cryogenic Control Electronics and Cryo-CMOS
    • 2.12.6 Lasers and Single-Photon Detectors
    • 2.12.7 Ultra-High Vacuum Systems
    • 2.12.8 Microwave and Optical Interconnects
    • 2.12.9 Diamond and Quantum Materials
    • 2.12.10 Nanomaterials for Quantum Applications

3 COMPANY PROFILES (65 company profiles)

4 REFERENCES

List of Tables

  • Table 1. Materials in Quantum Technology.
  • Table 2. 2025–2026 Quantum Technology Investment
  • Table 3. First and second quantum revolutions.
  • Table 4. Quantum Technology Total Investments 2012–2026 (millions USD)
  • Table 5. Major Quantum Technologies Investments 2024–2026
  • Table 6. Quantum Technology Investments 2012–2026 by Technology Subsector (millions USD)
  • Table 7. Quantum Technology Funding 2022–2026 by Company (USD)
  • Table 8. Quantum Technology Investment by Application 2012–2026 (millions USD)
  • Table 9. Quantum Technology Investments 2012–2026 by Region (millions USD)
  • Table 10. Key Quantum Investment Trends 2025–2026
  • Table 11. Material platforms mapped to market verticals
  • Table 12. The Role of Key Materials Across Quantum Computing Modalities
  • Table 13. Materials Opportunities in Quantum Computing by Impact, Maturity and Horizon
  • Table 14. Materials and Components for Quantum Sensing by Sensor Type
  • Table 15. Materials Opportunities in Quantum Sensing by Impact and Maturity
  • Table 16. Summary Technology Readiness Level Assessment by Material Class
  • Table 17. Investment Opportunities by Materials Segment
  • Table 18. Top Ten Most Severe Supply Chain Bottlenecks, 2026
  • Table 19. Materials market by platform, 2027–2047 (US$M)
  • Table 20. Technology Readiness Assessment — Superconducting Materials and Devices
  • Table 21. Superconductors in quantum technology.
  • Table 22. Critical temperature of superconducting materials for quantum technology
  • Table 23. Transmon superconducting qubit structure and materials
  • Table 24. Summary of manufacturing processes for superconducting quantum chips
  • Table 25. Defects and sources of noise for superconducting quantum circuits
  • Table 26. Fabrication methods for SNSPDs
  • Table 27. Photonics, silicon photonics and optics in quantum technology.
  • Table 28. Technology Readiness Assessment — Photonic Platforms and Components
  • Table 29. Quantum PIC material platforms benchmarked
  • Table 30. PIC materials used by quantum technology companies
  • Table 31. Nanomaterials in quantum technology.
  • Table 32.Technology Readiness Assessment — All Nanomaterial Types for Quantum Technology
  • Table 33. Material advantages and disadvantages of diamond for quantum applications
  • Table 34. Technology Readiness Assessment — Diamond Materials and Applications
  • Table 35. Synthetic diamond value chain for quantum technology
  • Table 36. Technology Readiness Assessment — Cryogenic Infrastructure
  • Table 37. Cryogenic Operating Temperature Requirements by Quantum Computing Modality
  • Table 38. Dilution Refrigerator Pricing Bands by Configuration, 2026
  • Table 39. Dilution Refrigerator Vendor Comparison, 2026
  • Table 40. Dilution Refrigerator Lead Times, 2022 vs. 2026
  • Table 41. Installed Base Forecast — Dilution Refrigerators by Region (units, cumulative)
  • Table 42. Helium-3 Annual Production by Source, 2026
  • Table 43. Technology Readiness Assessment — Helium Supply and Mitigation
  • Table 44. Helium-3 supply–demand balance (litres STP/year)
  • Table 45. Helium-3 Demand Forecast for Quantum Computing, 2027–2047
  • Table 46. Wiring Density Requirements vs. Cryogenic Cooling Budget
  • Table 47.Technology Readiness Assessment — Cryogenic Control Electronics
  • Table 48. NVQLink Ecosystem Participation, 2026
  • Table 49. Cryo-CMOS and Cryogenic Control Vendor Capabilities, 2026
  • Table 50. Cryogenic Amplifier Performance Benchmarks
  • Table 51. OS Market Forecast, 2026–2047 (millions USD)
  • Table 52. Required Laser Wavelengths by Quantum Computing Modality
  • Table 53. Technology Readiness Assessment — Lasers and Photonic Components
  • Table 54. Laser Linewidth Requirements by Application
  • Table 55. Laser Vendor Capability Matrix, 2026
  • Table 56. Single-Photon Detector Technology Comparison, 2026
  • Table 57. PIC Material Platform Comparison for Quantum Applications
  • Table 58. Vacuum Pressure Requirements by Modality
  • Table 59. Optical Viewport Specifications and Suppliers
  • Table 60. Technology Readiness Assessment — Ultra-High Vacuum Systems
  • Table 61. UHV Pump Type Selection Matrix
  • Table 62. Vapour Cell and Atomic Source Suppliers
  • Table 63. UHV Vendor Capability Matrix, 2026
  • Table 64. Technology Readiness Assessment — Microwave and Optical Interconnects
  • Table 65. Cryogenic Cable Type Comparison
  • Table 66. High-Density Cryogenic Connector Comparison
  • Table 67. Cryogenic Attenuator Pricing and Specifications
  • Table 68. Cryogenic Interconnect Vendor Comparison, 2026
  • Table 69. Bottleneck Heat-Map by Quantum Computing Modality
  • Table 70. Bottleneck Mitigation Pathways
  • Table 71. Market by category (Millions USD)
  • Table 72. Superconducting Chip and Substrate Market Forecast, 2027–2047 (millions USD)
  • Table 73. PIC and Optical Component Market Forecast, 2027–2047 (millions USD)
  • Table 74. Cryogenic Infrastructure Market Forecast, 2027–2047 (millions USD)
  • Table 75. Helium-3 and Helium-4 Market Forecast, 2027–2047 (millions USD, quantum applications only)
  • Table 76. Cryogenic Control Electronics Market Forecast, 2027–2047 (millions USD)
  • Table 77. Cryo-CMOS Market Forecast, 2027–2047 (millions USD)
  • Table 78. Lasers and Single-Photon Detectors Market Forecast, 2027–2047 (millions USD)
  • Table 79. UHV Systems Market Forecast, 2027–2047 (millions USD)
  • Table 80. Cryogenic and Optical Interconnect Market Forecast, 2027–2047 (millions USD)
  • Table 81. Diamond and Specialty Materials Market Forecast, 2027–2047 (millions USD)
  • Table 82. Nanomaterials Market Forecast, 2027–2047 (millions USD)

List of Figures

  • Figure 1. Quantum computing development timeline.
  • Figure 2. Material platform relevance across the three quantum technology verticals.
  • Figure 3. Component Roadmap for Quantum Computing, 2027–2047
  • Figure 4. Component Roadmap for Quantum Sensing, 2027–2047
  • Figure 5. Materials Opportunities in Quantum Networking and Communications
  • Figure 6. Component Roadmap for Quantum Networking and Communications, 2027–2047
  • Figure 7. Quantum materials and components market by platform, 2027–2047 (US$ millions).
  • Figure 8. Helium-3 supply–demand balance (litres STP/year)
  • Figure 9. Archer-EPFL spin-resonance circuit.
  • Figure 10. Maybell Big Fridge.
  • Figure 11. Quantum Brilliance device
  • Figure 12. SemiQ first chip prototype.