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市場調查報告書
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1891768

全球電力電子市場（2026-2036）

The Global Power Electronics Market 2026-2036
出版日期: | 出版商: Future Markets, Inc. | 英文 430 Pages, 352 Tables, 29 Figures | 訂單完成後即時交付

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電力電子技術不再侷限於特定應用領域。如今，其影響已擴展至電動車、再生能源系統、工業自動化、資料中心基礎設施以及高端消費性電子產品。這些領域共同的共同點在於對更高效、更高功率密度的能源傳輸的需求。在交通電氣化、再生能源擴張以及資料中心基礎設施需求激增的推動下，全球電力電子市場正經歷前所未有的成長和轉型。這個充滿活力的產業涵蓋了幾乎所有現代應用中負責功率轉換和控制的關鍵組件，從電動車動力系統到電網級儲能系統，無所不包。推動市場發展的核心在於從傳統矽基元件向寬禁帶（WBG）半導體（特別是碳化矽（SiC）和氮化鎵（GaN））的根本性技術轉型。這項典範轉移代表了自1980年代IGBT問世以來電力電子領域最重大的進步。與矽IGBT相比，SiC MOSFET具有顯著優勢，包括高溫工作、優異的導熱性、高達五倍的開關速度，以及將電動車續航里程延長約7%的潛力。這些特性使得功率轉換系統更緊湊高效，所需的被動元件更小，散熱需求更低。

電動車產業是電力電子需求的主要驅動力。關鍵組件包括牽引逆變器、車載充電器（OBC）和DC-DC轉換器，市場正擴大採用800V架構以實現更快的充電速度和更高的效率。 SiC MOSFET在電動車逆變器市場迅速佔市場佔有率，預計到2035年將成為主流技術。同時，GaN元件在車載充電器和DC-DC轉換器等低功率應用領域取得了顯著進展，其高頻開關能力可顯著降低元件的尺寸和重量。

電力電子供應鏈正在經歷重大重組，垂直整合已成為關鍵策略趨勢。 主要汽車製造商和半導體供應商正透過收購、合作和自主研發碳化矽（SiC）技術來確保供應。從150毫米到200毫米SiC晶圓的過渡是一個重要的里程碑，帶來了產能的顯著提升和成本的大幅降低，全球多家供應商正在擴大200毫米晶圓的生產規模。中國製造商正積極進軍市場，目前已有四家公司躋身全球前20大功率裝置供應商。

由於人工智慧工作負載對功率的需求空前高漲，資料中心是另一個快速成長的應用領域。電源單元正在不斷發展以滿足嚴格的效率標準，80 PLUS Ruby認證要求效率高達96.5%。寬禁帶裝置在該領域的應用正在加速，結合矽、SiC和GaN的混合設計正成為在不同功率轉換階段最大化效率的首選方案。

該產業也正從分離式轉換器設計朝向整合系統級方法發展。 這種 "電力電子2.0" 範式強調超越簡單功率轉換的能量管理，融合了智慧電網整合、分散式控制架構和任務導向的效率指標。多單元轉換器架構正日益普及，其優勢包括開關頻率翻倍、冗餘度提高以及標準化優勢。

儘管寬禁帶（WBG）技術發展迅速，但由於矽元件的成熟性、完善的供應鍊和成本優勢，它們仍然佔著相當大的市場佔有率。市場面臨巨大的成本壓力，尤其是在太陽能逆變器和電池儲能系統（BESS）等價格敏感型領域。 展望未來，電動車的持續普及、可再生能源的部署以及對數位基礎設施日益增長的需求預計將推動全球電力電子市場以超過 8% 的複合年增長率增長，到 2030 年市場規模將超過 150 億美元。

本報告分析了全球電力電子市場，並探討了從矽基元件到寬禁帶 (WBG) 技術（包括碳化矽 (SiC) MOSFET 和氮化鎵 (GaN) HEMT）的變革性轉變。

目錄

第一章：摘要整理

  • 報告概述及範圍
  • 分析範圍
  • 研究方法
  • 主要發現及市場亮點
  • 全球電力電子市場概況（2026-2036）
  • 技術演進：從矽到寬禁帶
  • 市場規模及成長預測概要
  • 區域市場分析概述
  • 主要市場驅動因素及挑戰

第二章：市場概述與定義

  • 電力電子基礎知識
  • 市場區隔
  • 性能指標及衡量標準

第三章：技術分析

  • 電力電子技術演進
  • 矽基功率元件
  • 碳化矽 (SiC) 技術
  • 氮化鎵 (GaN) 技術
  • 轉換器拓撲分析
  • 封裝與熱管理

第四章：應用市場分析

  • 電動車 (EV)
  • 再生能源
  • 資料中心計算
  • 電網基礎設施
  • 工業應用
  • 消費性電子產品

第五章：區域市場分析

  • 中國
  • 歐洲
  • 美國
  • 日本和韓國
  • 世界其他地區

第六章：供應鏈分析

  • 價值鏈結構
  • SiC 供應供應鏈
  • 氮化鎵供應鏈
  • 矽供應鏈
  • 被動元件供應
  • 封裝和模組組裝
  • 熱管理供應鏈
  • 供應鏈韌性與策略考量

第七章 市場預測

  • 關鍵預測假設
  • 整體市場預測
  • 電動車電力電子預測
  • 資料中心電力電子預測
  • 再生能源預測
  • 工業及其他應用預測
  • 半導體技術預測
  • 區域市場預測
  • 情境分析
  • 預測總結

第八章 競爭格局

  • 市佔率分析
  • 競爭策略
  • 產能擴張計劃

第九章未來科技趨勢

  • 電力電子 2.0 願景
  • 裝置技術路線圖
  • 系統級創新
  • 被動元件與電磁幹擾挑戰
  • 新興科技概述

第十章：公司簡介

  • 半導體裝置製造商（20 家公司簡介）
  • 氮化鎵 (GaN) 專業廠商（7 家公司簡介）
  • 碳化矽 (SiC) 晶圓和材料供應商（10 家公司簡介）
  • 一級汽車供應商（8 家公司簡介）
  • 本土汽車 OEM 廠商（9 家公司簡介）
  • 中國電力電子公司（9 家公司簡介）
  • 模組和系統整合商（6 家公司簡介）
  • 資料中心與工業電源（7 家公司簡介）
  • 其他公司（8 家公司簡介）

章節11：參考文獻

Power electronics is no longer confined to specialist applications. Its influence now spans electric vehicles, renewable energy systems, industrial automation, data-centre infrastructure and advanced consumer equipment. What links these sectors is the need to move energy more efficiently and at higher power densities. The global power electronics market is experiencing unprecedented growth and transformation, driven by the electrification of transportation, renewable energy expansion, and surging demand for data center infrastructure. This dynamic sector encompasses the critical components that convert and control electrical power across virtually every modern application, from electric vehicle powertrains to grid-scale energy storage systems. At the heart of this market evolution is a fundamental technology transition from traditional silicon-based devices to wide bandgap (WBG) semiconductors, specifically silicon carbide (SiC) and gallium nitride (GaN). This paradigm shift represents the most significant advancement in power electronics since the introduction of IGBTs in the 1980s. SiC MOSFETs offer compelling advantages over silicon IGBTs, including higher temperature operation, superior thermal conductivity, switching speeds up to five times faster, and the potential to increase electric vehicle range by approximately 7%. These characteristics enable more compact, efficient power conversion systems with smaller passive components and reduced cooling requirements.

The electric vehicle sector stands as the primary growth driver for power electronics demand. Key components include traction inverters, onboard chargers (OBCs), and DC-DC converters, with the market increasingly adopting 800V architectures to enable faster charging and improved efficiency. SiC MOSFETs are rapidly gaining market share in EV inverters, with projections indicating they will become the majority technology by 2035. Meanwhile, GaN devices are making significant inroads in lower-power applications such as onboard chargers and DC-DC converters, where their high-frequency switching capabilities enable dramatic reductions in size and weight.

The supply chain for power electronics is undergoing significant restructuring, with vertical integration emerging as a key strategic trend. Major automotive OEMs and semiconductor suppliers are securing supply through acquisitions, partnerships, and in-house development of SiC capabilities. The transition from 150mm to 200mm SiC wafers represents a critical milestone that will substantially increase production capacity and reduce costs, with multiple suppliers worldwide scaling up 200mm wafer production. Chinese manufacturers have entered the market aggressively, with four Chinese companies now ranking among the top 20 global power device suppliers.

Data centers represent another rapidly expanding application, driven by artificial intelligence workloads that demand unprecedented power levels. Power supply units are evolving to meet stringent efficiency standards, with the 80 PLUS Ruby certification requiring up to 96.5% efficiency. Wide bandgap adoption is accelerating in this sector, with hybrid designs combining silicon, SiC, and GaN emerging as the preferred approach for maximizing efficiency across different power conversion stages.

The industry is also witnessing a conceptual evolution from discrete converter design toward integrated system-level approaches. This "Power Electronics 2.0" paradigm emphasizes energy management over simple power conversion, incorporating smart grid integration, distributed control architectures, and mission-oriented efficiency metrics. Multi-cell converter architectures are gaining traction, offering advantages including switching frequency multiplication, improved redundancy, and standardization benefits.

Despite the rapid advancement of WBG technologies, silicon devices continue to hold significant market share due to their maturity, established supply chains, and cost advantages. The market is characterized by intense cost pressure, particularly in price-sensitive segments like solar inverters and battery energy storage systems. Looking forward, the global power electronics market is projected to grow with a compound annual growth rate exceeding 8%, adding more than $15 billion in market value by 2030, driven by the continued expansion of electric mobility, renewable energy deployment, and digital infrastructure requirements.

The Global Power Electronics Market 2026-2036 provides comprehensive analysis of the rapidly evolving power semiconductor industry, examining the transformative shift from silicon-based devices to wide bandgap (WBG) technologies including silicon carbide (SiC) MOSFETs and gallium nitride (GaN) HEMTs. This in-depth market intelligence report delivers granular 10-year forecasts covering market size in US dollars and gigawatts across key segments including electric vehicle inverters, onboard chargers, DC-DC converters, data center power supply units, renewable energy systems, and industrial applications.

The report analyzes critical technology trends driving market growth, including the transition from 400V to 800V EV architectures, the evolution from 150mm to 200mm SiC wafer production, and the emergence of integrated power electronics modules. Detailed supply chain analysis covers the complete value chain from raw materials and wafer production through device manufacturing, packaging, and system integration, with particular focus on vertical integration strategies and the rising influence of Chinese manufacturers in the global market.

Regional market analysis examines growth dynamics across China, Europe, North America, Japan, South Korea, and emerging markets, while competitive landscape assessment provides market share rankings, M&A activity tracking, and strategic partnership analysis. The report includes over 90 detailed company profiles spanning semiconductor device manufacturers, GaN specialists, SiC wafer suppliers, tier-1 automotive suppliers, automotive OEMs, and system integrators.

Report Contents include:

  • Market Analysis & Forecasts
    • Global power electronics market size and 10-year growth projections (2026-2036)
    • Device-level forecasts for Si IGBTs, SiC MOSFETs, and GaN devices by voltage class
    • Application-level forecasts for EV inverters, onboard chargers, and DC-DC converters in units, GW, and US$
    • Regional market forecasts for China, Europe, North America, and Asia-Pacific
    • Price trend analysis and cost reduction projections for WBG semiconductors
  • Technology Analysis
    • Comprehensive comparison of Si, SiC, and GaN semiconductor properties and performance
    • Technology S-curve analysis and paradigm shift to Power Electronics 2.0
    • Multi-cell converter architectures including parallel and series interleaving
    • Packaging evolution including single-sided and double-sided cooling technologies
    • 150mm to 200mm SiC wafer transition timeline and cost advantages
  • Application Markets
    • Electric vehicle power electronics including 400V vs 800V architecture analysis
    • Traction inverter, onboard charger, and DC-DC converter technology benchmarking
    • Data center PSU market including AI server power requirements
    • Renewable energy applications covering solar PV, wind, and battery energy storage
    • Grid infrastructure including smart grid, solid-state transformers, and HVDC systems
  • Supply Chain Analysis
    • Complete Si, SiC, and GaN supply chain mapping from raw materials to end applications
    • SiC wafer supplier market share and 200mm production roadmap
    • Vertical integration trends and OEM acquisition strategies
    • Packaging and assembly supply chain including die attach technologies
    • Passive component technology roadmap for capacitors and magnetics
  • Competitive Landscape
    • Top 20 power device supplier rankings and market share analysis
    • Recent mergers, acquisitions, and strategic partnerships
    • Manufacturing capacity expansion plans by region and technology
    • OEM-supplier relationship mapping for SiC MOSFETs and Si IGBTs
  • Future Technology Trends
    • Power Electronics 2.0 vision: from converters to systems
    • SiC and GaN technology roadmaps through 2035
    • Emerging WBG materials including Ga2O3 and diamond
    • Virtual prototyping and digital twin design methodologies

Companies Profiled include ABB, Advanced Energy Industries, Alpha & Omega Semiconductor, Bimotal, BMW, BorgWarner, Bosch, BYD, Cambridge GaN Devices, China Resources Microelectronics (CR Micro), CM Materials, Coherent, CRRC Corporation, Dana Incorporated, Delta Electronics, Denso, Diodes Incorporated, Dynex Semiconductor, Dynolt Technologies, Eaton, Efficient Power Conversion (EPC), Entuple E-Mobility, Fuji Electric, General Motors, GlobalWafers, HBN Technology, Heron Power, Hitachi Astemo, Hitachi Energy, Huawei, Hyundai Motor Group, Infineon Technologies, Innoscience, Inovance Technology, Lite-On Technology, Littelfuse, Lucid Motors, Magna International, Microchip Technology, Mitsubishi Electric, Navitas Semiconductor, Nexperia, NXP Semiconductors, onsemi and more......

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

  • 1.1 Report Introduction and Scope
  • 1.2 Scope of Analysis
  • 1.3 Methodology
  • 1.4 Key Findings and Market Highlights
  • 1.5 Global Power Electronics Market Overview 2026-2036
    • 1.5.1 Market Structure
  • 1.6 Technology Evolution: From Silicon to Wide Bandgap
    • 1.6.1 The Technology S-Curve
  • 1.7 Market Size and Growth Projections Summary
    • 1.7.1 Device-Level Projections
    • 1.7.2 Application-Level Projections
  • 1.8 Regional Market Analysis Overview
    • 1.8.1 China
    • 1.8.2 Europe
    • 1.8.3 United States
    • 1.8.4 Japan and South Korea
  • 1.9 Key Market Drivers and Challenges
    • 1.9.1 Primary Market Drivers
    • 1.9.2 Key Market Challenges

2 MARKET OVERVIEW AND DEFINITIONS

  • 2.1 Power Electronics Fundamentals
    • 2.1.1 What is Power Electronics?
    • 2.1.2 Value Chain Economics and Margin Structure
    • 2.1.3 Key Applications and End Markets
    • 2.1.4 Electric Vehicle Power Electronics
    • 2.1.5 Data Center Power Demand Transformation
    • 2.1.6 Power Conversion Technologies Overview
    • 2.1.7 ETH Zurich VIENNA Rectifier Development Generations
  • 2.2 Market Segmentation
    • 2.2.1 By Product Type (Inverters, Converters, Rectifiers)
      • 2.2.1.1 Inverter Market Dynamics
      • 2.2.1.2 DC-DC Converter Market Dynamics
      • 2.2.1.3 Rectifier/Charger Market Dynamics
    • 2.2.2 By Semiconductor Material (Si, SiC, GaN)
      • 2.2.2.1 Silicon Market Dynamics
      • 2.2.2.2 Silicon Carbide Market Dynamics
      • 2.2.2.3 Gallium Nitride Market Dynamics
    • 2.2.3 By Application Sector
      • 2.2.3.1 Automotive & EV Sector Deep Dive
    • 2.2.4 By Voltage Class
  • 2.3 Performance Indices and Metrics
    • 2.3.1 Power Density (kW/dm3)
    • 2.3.2 Efficiency and Loss Analysis
    • 2.3.3 Cost per kW Trends
    • 2.3.4 Reliability and Failure Rate Metrics

3 TECHNOLOGY ANALYSIS

  • 3.1 Evolution of Power Electronics Technology
    • 3.1.1 Historical Development: SCRs to WBG
    • 3.1.2 Technology S-Curve Analysis
      • 3.1.2.1 Semiconductor S-Curves
      • 3.1.2.2 Passive Component S-Curves
    • 3.1.3 Paradigm Shift to Power Electronics 2.0
      • 3.1.3.1 From Power to Energy Metrics
      • 3.1.3.2 Multi-Objective Optimization and Pareto Fronts
      • 3.1.3.3 System-Level Integration
  • 3.2 Silicon-Based Power Devices
    • 3.2.1 Silicon IGBT Technology and Performance
    • 3.2.2 IGBT Market Segmentation
    • 3.2.3 Silicon MOSFET Applications
    • 3.2.4 Super-Junction Technology Advances
    • 3.2.5 Si Device Roadmap and Limitations
      • 3.2.5.1 Fundamental Silicon Limitations
  • 3.3 Silicon Carbide (SiC) Technology
    • 3.3.1 SiC Material Properties and Advantages
    • 3.3.2 SiC Device Figure of Merit Analysis
    • 3.3.3 SiC MOSFET Technology Development
    • 3.3.4 SiC MOSFET Manufacturer Comparison
    • 3.3.5 SiC vs Si IGBT Performance Comparison
    • 3.3.6 Efficiency Across Load Range
    • 3.3.7 SiC Device Packaging Evolution
    • 3.3.8 150mm to 200mm Wafer Transition
    • 3.3.9 200mm SiC Wafer Production Status
    • 3.3.10 SiC Cost Reduction Roadmap
  • 3.4 Gallium Nitride (GaN) Technology
    • 3.4.1 GaN Material Properties and Potential
    • 3.4.2 GaN HEMT and FET Technologies
    • 3.4.3 GaN-on-Si vs Alternative Substrates
    • 3.4.4 GaN Voltage Limitations and Solutions
    • 3.4.5 GaN Device Roadmap for Automotive
  • 3.5 Converter Topology Analysis
    • 3.5.1 Multi-Cell Converter Architectures
    • 3.5.2 Parallel and Series Interleaving
    • 3.5.3 DC-Transformer Concepts
    • 3.5.4 Three-Level Inverter Designs
  • 3.6 Packaging and Thermal Management
    • 3.6.1 Power Module Packaging Evolution
    • 3.6.2 Single-Sided vs Double-Sided Cooling
    • 3.6.3 Thermal Interface Materials (TIM)
    • 3.6.4 Advanced Packaging Technologies (P4, p2pack)

4 APPLICATION MARKETS ANALYSIS

  • 4.1 Electric Vehicles (EVs)
    • 4.1.1 EV Market Overview and Growth Trends
    • 4.1.2 Powertrain Mix Evolution
    • 4.1.3 EV Price Segment Distribution
    • 4.1.4 Traction Inverter Technologies
      • 4.1.4.1 Traction Inverter Market Size and Growth
      • 4.1.4.2 Semiconductor Technology Transition
      • 4.1.4.3 Inverter Topology Evolution
      • 4.1.4.4 Traction Inverter Competitive Landscape
      • 4.1.4.5 Inverter-Motor Integration Trends
    • 4.1.5 Onboard Charger (OBC) Systems
      • 4.1.5.1 OBC Market Size and Growth
      • 4.1.5.2 OBC Power Level Distribution
      • 4.1.5.3 OBC Semiconductor Technology Transition
      • 4.1.5.4 Bidirectional OBC Functionality
      • 4.1.5.5 OBC Competitive Landscape
    • 4.1.6 DC-DC Converter Requirements
      • 4.1.6.1 DC-DC Converter Market Size and Growth
      • 4.1.6.2 Output Voltage Architecture Evolution
      • 4.1.6.3 DC-DC Converter Semiconductor Transition
    • 4.1.7 400V vs 800V Architecture Analysis
      • 4.1.7.1 800V Architecture Benefits
      • 4.1.7.2 800V Architecture Adoption Timeline
      • 4.1.7.3 400V Charging Compatibility Solutions
    • 4.1.8 Power Electronics Integration Trends
      • 4.1.8.1 Integration Level Evolution
      • 4.1.8.2 Integrated OBC with DC-DC Converter
      • 4.1.8.3 Traction-Integrated Onboard Charger (TiOBC)
    • 4.1.9 Heavy-Duty Vehicle Applications
      • 4.1.9.1 Heavy-Duty EV Market Overview
      • 4.1.9.2 Heavy-Duty Power Electronics Requirements
      • 4.1.9.3 Heavy-Duty Power Electronics Market
  • 4.2 Renewable Energy
    • 4.2.1 Solar PV Inverter Market
      • 4.2.1.1 Solar Inverter Market Size and Growth
      • 4.2.1.2 Solar Inverter Market Segmentation
      • 4.2.1.3 Solar Inverter Semiconductor Technology
      • 4.2.1.4 Solar Inverter Competitive Landscape
    • 4.2.2 Wind Power Converters
      • 4.2.2.1 Wind Power Converter Market
    • 4.2.3 Battery Energy Storage Systems (BESS)
      • 4.2.3.1 BESS Market Size and Growth
  • 4.3 Data Centers and Computing
    • 4.3.1 Power Supply Unit (PSU) Market
      • 4.3.1.1 Data Center Power Demand Transformation
      • 4.3.1.2 PSU Market Size and Growth
      • 4.3.1.3 PSU Efficiency Standards
      • 4.3.1.4 Data Center PSU Competitive Landscape
    • 4.3.2 AI Server Power Requirements
      • 4.3.2.1 AI Server Power Architecture
      • 4.3.2.2 Power Delivery Architecture Evolution
  • 4.4 Grid Infrastructure
    • 4.4.1 Smart Grid and Energy Management
      • 4.4.1.1 Smart Grid Power Electronics Market
      • 4.4.1.2 Hierarchical Grid Architecture
    • 4.4.2 Solid-State Transformers
      • 4.4.2.1 Solid-State Transformer Characteristics
    • 4.4.3 HVDC Transmission Systems
      • 4.4.3.1 HVDC Market Overview
  • 4.5 Industrial Applications
    • 4.5.1 Motor Drives and Variable Frequency Drives
      • 4.5.1.1 VFD Market Size and Growth
      • 4.5.1.2 VFD Market Segmentation
      • 4.5.1.3 VFD Competitive Landscape
    • 4.5.2 Industrial Power Supplies
  • 4.6 Consumer Electronics
    • 4.6.1 Fast Charging Technologies
      • 4.6.1.1 Consumer Fast Charger Market
      • 4.6.1.2 Consumer Charger Competitive Landscape

5 REGIONAL MARKET ANALYSIS

  • 5.1 China
    • 5.1.1 Market Size and Growth
    • 5.1.2 China EV Market Dynamics
    • 5.1.3 Domestic Manufacturing Expansion
      • 5.1.3.1 China Power Semiconductor Production
      • 5.1.3.2 Manufacturing Capacity Expansion
    • 5.1.4 SiC Wafer Production Scale-up
      • 5.1.4.1 China SiC Wafer Production Status
      • 5.1.4.2 SiC Wafer Quality Comparison
      • 5.1.4.3 Government Support for SiC Development
  • 5.2 Europe
    • 5.2.1 Market Overview and Regulations
    • 5.2.2 European EV Market Characteristics
    • 5.2.3 EU Emissions Targets Impact
    • 5.2.4 European Semiconductor Initiatives
  • 5.3 United States
    • 5.3.1 Market Trends and Policy Drivers
    • 5.3.2 US EV Market Dynamics
    • 5.3.3 CHIPS Act and Manufacturing Incentives
    • 5.3.4 US Power Semiconductor Manufacturing Expansion
    • 5.3.5 US-Based Supply Chain Analysis
  • 5.4 Japan and South Korea
    • 5.4.1 Technology Leadership Positions
    • 5.4.2 Japanese Power Semiconductor Leadership
    • 5.4.3 Automotive OEM Strategies
      • 5.4.3.1 Hyundai E-GMP Platform Analysis
    • 5.4.4 South Korea Power Electronics Market
  • 5.5 Rest of World
    • 5.5.1 India Market Potential
    • 5.5.2 India EV Market Development
    • 5.5.3 India Manufacturing Development
    • 5.5.4 Southeast Asia Manufacturing Hub

6 SUPPLY CHAIN ANALYSIS

  • 6.1 Value Chain Structure
    • 6.1.1 Power Electronics Value Chain Overview
    • 6.1.2 Value Chain Cost Buildup
    • 6.1.3 Vertical Integration Strategies
      • 6.1.3.1 Semiconductor Supplier Forward Integration
      • 6.1.3.2 OEM Backward Integration
      • 6.1.3.3 Integration Economics
    • 6.1.4 Supply Chain Vulnerabilities
      • 6.1.4.1 Geographic Concentration Risk
      • 6.1.4.2 Single-Source Dependencies
      • 6.1.4.3 Supply Chain Disruption History
  • 6.2 SiC Supply Chain
    • 6.2.1 SiC Wafer Suppliers
      • 6.2.1.1 Global SiC Wafer Market Overview
      • 6.2.1.2 SiC Wafer Supplier Competitive Landscape
      • 6.2.1.3 Wafer Supply Agreements
    • 6.2.2 SiC Device Manufacturers
      • 6.2.2.1 SiC Device Market Overview
      • 6.2.2.2 SiC Device Technology Comparison
    • 6.2.3 SiC Device Production Capacity
    • 6.2.4 SiC Module and System Integration
      • 6.2.4.1 SiC Power Module Market
  • 6.3 GaN Supply Chain
    • 6.3.1 GaN Device Ecosystem
      • 6.3.1.1 GaN Supply Chain Structure
      • 6.3.1.2 GaN Device Supplier Landscape
      • 6.3.1.3 GaN Manufacturing Capacity
    • 6.3.2 GaN Foundry Dynamics
      • 6.3.2.1 TSMC GaN Exit Impact
      • 6.3.2.2 Alternative GaN Foundry Options
  • 6.4 Silicon Supply Chain
    • 6.4.1 Si IGBT and MOSFET Suppliers
      • 6.4.1.1 Silicon Power Device Market Overview
      • 6.4.1.2 Silicon Device Technology Roadmap
    • 6.4.2 Silicon Wafer Supply
  • 6.5 Passive Component Supply
    • 6.5.1 Capacitor Suppliers
      • 6.5.1.1 Power Electronics Capacitor Market
    • 6.5.2 Magnetic Component Suppliers
  • 6.6 Packaging and Module Assembly
    • 6.6.1 Power Module Packaging Suppliers
      • 6.6.1.1 Power Module Packaging Market
      • 6.6.1.2 Packaging Technology Evolution
    • 6.6.2 Die Attach and Interconnect Materials
      • 6.6.2.1 Die Attach Material Suppliers
  • 6.7 Thermal Management Supply Chain
    • 6.7.1 Cooling System Suppliers
    • 6.7.2 Thermal Interface Materials
  • 6.8 Supply Chain Resilience and Strategic Considerations
    • 6.8.1 Supply Chain Risk Assessment
    • 6.8.2 Multi-sourcing Strategies
    • 6.8.3 Regional Supply Chain Development

7 MARKET FORECASTS

  • 7.1 Key Forecast Assumptions
    • 7.1.1 Scenario Framework
    • 7.1.2 Market Definitions and Scope
    • 7.1.3 Geographic Scope
  • 7.2 Total Market Forecast
    • 7.2.1 Global Power Electronics Market Overview
    • 7.2.2 Market Growth Phase Analysis
    • 7.2.3 Market Forecast by Application
    • 7.2.4 Application Share Evolution
    • 7.2.5 Market Forecast by Semiconductor Technology
    • 7.2.6 Technology Share Evolution
    • 7.2.7 Market Forecast by Region
    • 7.2.8 Regional Share Evolution
  • 7.3 Electric Vehicle Power Electronics Forecast
    • 7.3.1 EV Unit Volume Projections
    • 7.3.2 Regional EV Volume Distribution
    • 7.3.3 Traction Inverter Forecast
    • 7.3.4 Inverter Technology Mix Forecast
    • 7.3.5 Inverter Value by Technology
    • 7.3.6 Onboard Charger Forecast
      • 7.3.6.1 OBC Power Level Distribution
      • 7.3.6.2 OBC Semiconductor Technology Forecast
    • 7.3.7 DC-DC Converter Forecast
      • 7.3.7.1 DC-DC Technology Mix Forecast
    • 7.3.8 Architecture Adoption Forecast
      • 7.3.8.1 EV Power Electronics Summary Forecast
    • 7.3.9 EV Power Electronics Content per Vehicle
  • 7.4 Data Center Power Electronics Forecast
    • 7.4.1 Data Center Power Demand
    • 7.4.2 PSU and Power Infrastructure Forecast
    • 7.4.3 PSU Technology Transition
  • 7.5 Renewable Energy Forecast
    • 7.5.1 Solar Inverter Forecast
    • 7.5.2 Solar Inverter Semiconductor Technology
    • 7.5.3 Wind Power Converter Forecast
    • 7.5.4 Energy Storage Inverter Forecast
  • 7.6 Industrial and Other Applications Forecast
    • 7.6.1 Industrial Motor Drive Forecast
    • 7.6.2 Consumer Fast Charger Forecast
    • 7.6.3 EV Charging Infrastructure Forecast
  • 7.7 Semiconductor Technology Forecasts
    • 7.7.1 SiC Market Detailed Forecast
    • 7.7.2 SiC Wafer Demand Forecast
    • 7.7.3 GaN Market Detailed Forecast
    • 7.7.4 Silicon Power Device Forecast
    • 7.7.5 Si IGBT Application Mix Evolution
  • 7.8 Regional Market Forecasts
    • 7.8.1 China Detailed Forecast
    • 7.8.2 Europe Detailed Forecast
    • 7.8.3 North America Detailed Forecast
  • 7.9 Scenario Analysis
    • 7.9.1 Scenario Comparison
    • 7.9.2 Scenario Assumptions Detailed
    • 7.9.3 Risk Factors and Sensitivities
  • 7.10 Forecast Summary
    • 7.10.1 Key Forecast Highlights

8 COMPETITIVE LANDSCAPE

  • 8.1 Market Share Analysis
    • 8.1.1 Top 20 Power Device Suppliers Ranking
    • 8.1.2 Market Leadership Analysis
    • 8.1.3 Financial Profile Analysis
    • 8.1.4 Market Share Trend Analysis
    • 8.1.5 Market Share by Technology Segment
      • 8.1.5.1 Silicon IGBT Market Share
      • 8.1.5.2 Silicon Carbide MOSFET Market Share
    • 8.1.6 Gallium Nitride Market Share
    • 8.1.7 Regional Market Share Distribution
      • 8.1.7.1 China Market Share
      • 8.1.7.2 Europe Market Share
      • 8.1.7.3 North America Market Share
    • 8.1.8 Regional Market Share Summary
  • 8.2 Competitive Strategies
    • 8.2.1 Vertical Integration Approaches
      • 8.2.1.1 Integration Strategy Typology
      • 8.2.1.2 Semiconductor Supplier Integration Analysis
      • 8.2.1.3 STMicroelectronics Vertical Integration Strategy
      • 8.2.1.4 OEM Backward Integration Analysis
      • 8.2.1.5 Tesla Vertical Integration Economics
      • 8.2.1.6 BYD Semiconductor: Full Integration Case Study
    • 8.2.2 OEM Partnership Models
      • 8.2.2.1 Partnership Model Taxonomy
      • 8.2.2.2 Major OEM-Supplier Partnership Overview
      • 8.2.2.3 Tesla-STMicroelectronics Partnership Analysis
      • 8.2.2.4 GM-Wolfspeed Strategic Partnership
      • 8.2.2.5 Partnership Economics and Risk Allocation
  • 8.3 Capacity Expansion Plans
    • 8.3.1 Si Fab Expansion Projects
      • 8.3.1.1 Silicon Fab Capacity Overview
      • 8.3.1.2 Silicon Fab Expansion Projects Detail
    • 8.3.2 SiC Manufacturing Investments
      • 8.3.2.1 SiC Capacity Expansion Overview
      • 8.3.2.2 Major SiC Fab Expansion Projects
      • 8.3.2.3 Chinese SiC Capacity Expansion
    • 8.3.3 GaN Production Scale-up
      • 8.3.3.1 GaN Capacity Overview
      • 8.3.3.2 GaN Capacity Expansion Projects

9 FUTURE TECHNOLOGY TRENDS

  • 9.1 Power Electronics 2.0 Vision
    • 9.1.1 From Converters to Systems
    • 9.1.2 Energy Management Paradigm
    • 9.1.3 Smart Grid Integration
  • 9.2 Device Technology Roadmap
    • 9.2.1 SiC Technology Evolution
    • 9.2.2 GaN High-Voltage Development
    • 9.2.3 Emerging Materials (Ga2O3, Diamond)
  • 9.3 System-Level Innovations
    • 9.3.1 Integrated Power Electronics Modules
    • 9.3.2 Multi-Cell and Modular Architectures
    • 9.3.3 Virtual Prototyping and Digital Twins
  • 9.4 Passives and EMI Challenges
    • 9.4.1 Advanced Magnetic Materials
    • 9.4.2 Capacitor Technology Trends
    • 9.4.3 EMI Reduction Strategies
  • 9.5 Future Technology Summary
    • 9.5.1 Technology Roadmap Synthesis
    • 9.5.2 Research and Development Priorities

10 COMPANY PROFILES

  • 10.1 Semiconductor Device Manufacturers (20 company profiles)
  • 10.2 GaN Specialists (7 company profiles)
  • 10.3 SiC Wafer and Material Suppliers (10 company profiles)
  • 10.4 Tier-1 Automotive Suppliers 330 (8 company profiles)
  • 10.5 Automotive OEMs with In-House Development (9 company profiles)
  • 10.6 Chinese Power Electronics Companies (9 company profiles)
  • 10.7 Module and System Integrators (6 company profiles)
  • 10.8 Data Centre and Industrial Power (7 company profiles)
  • 10.9 Other Companies (8 company profiles)

11 REFERENCES

List of Tables

  • Table 1. Global Power Electronics Market Summary 2026-2036 (US$ Billion).
  • Table 2. Key Market Metrics by Segment
  • Table 3. Technology Comparison: Si vs SiC vs GaN
  • Table 4. Regional Market Share Distribution
  • Table 5. Power Electronics Market Size by Component Category 2024-2036 (US$ Billion)
  • Table 6. Power Electronics Value Chain Economics
  • Table 7. Power Electronics Demand by Application Sector 2024-2036
  • Table 8. EV Power Electronics Content by Vehicle Segment
  • Table 9. Data Center Power Architecture Evolution
  • Table 10. Converter Topology Selection by Application
  • Table 11. VIENNA Rectifier Performance Evolution (10kW, 3-phase, 400V input)
  • Table 12. Power Electronics Market by Product Category 2024-2036 (US$ Billion)
  • Table 13. EV Traction Inverter Competitive Landscape 2024
  • Table 14. Automotive DC-DC Converter Evolution
  • Table 15. Onboard Charger Market Segmentation by Power Level
  • Table 16. Power Semiconductor Market by Material 2024-2036 (US$ Billion)
  • Table 17. Silicon Device Application Outlook
  • Table 18. SiC MOSFET Market by Application 2024-2036 (US$ Billion)
  • Table 19. SiC vs Si IGBT Cost and Performance Comparison (Automotive Inverter)
  • Table 20. GaN Device Market by Application 2024-2036 (US$ Million)
  • Table 21. Power Electronics Market by Application Sector 2024-2036 (US$ Billion)
  • Table 22. Automotive Power Electronics Segmentation 2024-2036 (US$ Billion)
  • Table 23. Power Semiconductor Market by Voltage Class 2024-2036 (US$ Billion)
  • Table 24. 1200V Device Market Competition
  • Table 25. Power Density Benchmarks by Application
  • Table 26. Power Converter Efficiency Benchmarks
  • Table 27. Loss Breakdown Analysis - 150kW EV Traction Inverter
  • Table 28. Power Electronics Cost Structure by Application ($/kW)
  • Table 29. SiC Cost Reduction Roadmap
  • Table 30. Reliability Requirements by Application
  • Table 31. Power Cycling Capability Comparison
  • Table 32. Si vs SiC vs GaN Material Properties
  • Table 33. Power Electronics Technology Generations
  • Table 34. Technology Adoption Timeline Patterns
  • Table 35. Silicon IGBT Generational Improvements
  • Table 36. SiC MOSFET Performance Trajectory
  • Table 37. Passive Component Improvement Rates
  • Table 38. Power Electronics 1.0 vs 2.0 Paradigm Comparison
  • Table 39. Rated-Point vs Mission Efficiency Comparison
  • Table 40. Converter Performance Trade-offs
  • Table 41. EV Powertrain Integration Levels
  • Table 42. IGBT Technology Comparison by Manufacturer (1200V, 100A class)
  • Table 43. IGBT Market by Voltage Class 2024
  • Table 44. Silicon MOSFET Market by Voltage Class 2024
  • Table 45. Super-Junction MOSFET Performance Evolution
  • Table 46. Silicon Power Device Roadmap
  • Table 47. Silicon Material Limits vs Current Devices
  • Table 48. SiC vs Silicon Material Properties
  • Table 49. Device Figure of Merit Comparison (1200V class)
  • Table 50. SiC MOSFET Technology Generations
  • Table 51. SiC MOSFET Technology Comparison by Manufacturer (1200V, 75m-Omega class)
  • Table 52. SiC MOSFET vs Si IGBT Performance Comparison (150kW EV Inverter)
  • Table 53. Efficiency vs. Switching Frequency Performance Comparison
  • Table 54. Inverter Efficiency vs Load Comparison
  • Table 55. Power Module Package Evolution
  • Table 56. Double-Sided Cooling Module Comparison
  • Table 57. 150mm vs 200mm SiC Wafer Economics
  • Table 58. 200mm SiC Wafer Production Timeline by Manufacturer
  • Table 59. SiC Cost Reduction Drivers 2024-2030
  • Table 60. SiC System Cost Parity Timeline by Application
  • Table 61. GaN Material Properties vs Si and SiC
  • Table 62. GaN Device Architecture Comparison
  • Table 63. GaN Device Comparison by Manufacturer (650V class)
  • Table 64. GaN Substrate Comparison
  • Table 65. GaN Voltage Rating Evolution
  • Table 66. GaN Automotive Application Roadmap
  • Table 67. GaN OBC Performance vs Alternatives
  • Table 68. Multi-Cell Converter Benefits and Challenges
  • Table 69. Parallel Interleaving Performance vs Cell Count
  • Table 70. Series Cell R_DS(on) Advantage vs Single High-Voltage Device
  • Table 71. DC-Transformer vs Regulated DC-DC Converter
  • Table 72. Inverter Topology Comparison
  • Table 73. Power Module Packaging Technology Generations
  • Table 74. Single-Sided vs Double-Sided Cooling Comparison
  • Table 75. Double-Sided Cooling Adoption by Application
  • Table 76. Thermal Interface Material Comparison
  • Table 77. Die Attach Technology Comparison
  • Table 78. P4 vs Conventional Module Comparison
  • Table 79. p2pack Demonstrator Specifications
  • Table 80. Global Electric Vehicle Sales by Region 2020-2036 (Million Units)
  • Table 81. Global EV Sales by Powertrain Type 2024-2036 (Million Units)
  • Table 82. Power Electronics Content by Powertrain Type
  • Table 83. Global BEV Sales by Price Segment 2024-2036 (Million Units)
  • Table 84. Global Traction Inverter Market 2024-2036
  • Table 85. Traction Inverter Semiconductor Technology Mix 2024-2036
  • Table 86. Traction Inverter Semiconductor Technology by Vehicle Segment 2024 vs 2030
  • Table 87. Traction Inverter Performance Benchmarking by OEM
  • Table 88. Traction Inverter Topology Comparison
  • Table 89. Traction Inverter Supplier Market Share 2024
  • Table 90. Traction Inverter Supplier Strategic Positioning
  • Table 91. Powertrain Integration Levels in Production Vehicles
  • Table 92. Global Onboard Charger Market 2024-2036
  • Table 93. OBC Market by Power Level 2024-2036 (Unit Share)
  • Table 94. OBC Semiconductor Technology Mix 2024-2036
  • Table 95. OBC Technology Comparison by Semiconductor
  • Table 96. Bidirectional OBC Adoption and Functionality
  • Table 97. Onboard Charger Supplier Market Share 2024
  • Table 98. Automotive DC-DC Converter Market 2024-2036
  • Table 99. Low-Voltage Architecture Evolution
  • Table 100. Automotive DC-DC Converter Semiconductor Technology Mix
  • Table 101. DC-DC Converter Performance by Semiconductor Technology
  • Table 102. 400V vs 800V Architecture Comparison
  • Table 103. 800V Architecture Adoption by Market Segment
  • Table 104. 800V Platform Vehicles in Production or Announced (as of 2024)
  • Table 105. 400V Charging Compatibility Approaches
  • Table 106. Power Electronics Integration Level Definitions and Adoption
  • Table 107. Integrated Power Electronics Examples
  • Table 108. Integrated OBC + DC-DC Converter Benefits
  • Table 109. Traction-Integrated OBC Approaches
  • Table 110. Heavy-Duty Electric Vehicle Market 2024-2036 (Thousand Units)
  • Table 111. Heavy-Duty vs Passenger Vehicle Power Electronics Requirements
  • Table 112. Heavy-Duty Power Electronics Market 2024-2036 (US$ Million)
  • Table 113. Heavy-Duty Inverter Specifications by Application
  • Table 114. Global Solar PV Inverter Market 2024-2036
  • Table 115. Solar Inverter Market by Type 2024-2036 (US$ Billion)
  • Table 116. Solar Inverter Semiconductor Technology Mix
  • Table 117. Solar Inverter Efficiency Impact of SiC Adoption
  • Table 118. Solar Inverter Supplier Market Share 2024
  • Table 119. Global Wind Power Converter Market 2024-2036
  • Table 120. Wind Turbine Converter Specifications by Rating
  • Table 121. Global Battery Energy Storage Market 2024-2036
  • Table 122. BESS Converter Technology by Application
  • Table 123. Data Center Power Consumption Evolution
  • Table 124. Data Center PSU Market 2024-2036
  • Table 125. 80 PLUS Efficiency Standards
  • Table 126. PSU Semiconductor Technology Mix
  • Table 127. PSU Power Density Evolution by Technology
  • Table 128. Data Center PSU Supplier Market Share 2024
  • Table 129. AI Server Power Breakdown (8-GPU Configuration)
  • Table 130. AI Server Power Trends by GPU Generation
  • Table 131. Power Distribution Architecture Comparison
  • Table 132. Smart Grid Power Electronics Market 2024-2036 (US$ Billion)
  • Table 133. Hierarchical Grid Structure
  • Table 134. Solid-State Transformer vs Conventional Transformer
  • Table 135. Solid-State Transformer Market Outlook
  • Table 136. Global HVDC Market 2024-2036
  • Table 137. HVDC Technology Comparison
  • Table 138. Global Variable Frequency Drive Market 2024-2036
  • Table 139. VFD Market by Power Range 2024
  • Table 140. Variable Frequency Drive Supplier Market Share 2024
  • Table 141. Industrial Power Supply Market 2024-2036 (US$ Billion)
  • Table 142. Consumer Fast Charger Market 2024-2036
  • Table 143. Consumer Fast Charger Technology Comparison
  • Table 144. Consumer GaN Charger Supplier Market Share 2024
  • Table 145. China Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 146. China EV Market Characteristics vs Global
  • Table 147. China EV Sales by Price Segment 2024
  • Table 148. China Power Semiconductor Self-Sufficiency by Technology
  • Table 149. China Power Semiconductor Manufacturers by Technology
  • Table 150. Major China Power Semiconductor Capacity Expansion Projects
  • Table 151. China SiC Wafer Manufacturers Capacity and Roadmap
  • Table 152. SiC Wafer Quality Comparison by Origin
  • Table 153. China Government Support for SiC Industry
  • Table 154. Europe Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 155. European EV Market vs China Comparison
  • Table 156. EU CO2 Emissions Targets for Passenger Vehicles
  • Table 157. EU EV Sales Trajectory Required for Compliance
  • Table 158. European Chips Act Power Semiconductor Investments
  • Table 159. United States Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 160. US EV Market Characteristics
  • Table 161. US Policy Incentives for Power Electronics
  • Table 162. Major US Power Semiconductor Capacity Projects
  • Table 163. US-Headquartered Power Semiconductor Companies
  • Table 164. Japan Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 165. Major Japanese Power Semiconductor Companies
  • Table 166. Japan/Korea Automotive OEM Electrification Strategies
  • Table 167. Hyundai E-GMP Platform Specifications
  • Table 168. South Korea Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 169. India Power Electronics Market Size 2024-2036 (US$ Billion)
  • Table 170. India EV Market Projections
  • Table 171. India Power Electronics Manufacturing Initiatives
  • Table 172. Southeast Asia Power Electronics Manufacturing Presence
  • Table 173. Regional Power Electronics Market Summary 2024-2036
  • Table 174. Power Electronics Value Chain Stage Characteristics
  • Table 175. SiC Power Module Value Chain Cost Buildup (Representative 1200V/200A Module)
  • Table 176. Semiconductor Supplier Vertical Integration Strategies
  • Table 177. OEM Vertical Integration Strategies
  • Table 178. Vertical Integration Economic Impact Analysis
  • Table 179. Power Electronics Supply Chain Geographic Concentration
  • Table 180. Critical Single/Dual Source Dependencies
  • Table 181. Major Power Electronics Supply Chain Disruptions 2020-2024
  • Table 182. Global SiC Wafer Market 2024-2030
  • Table 183. SiC Wafer Supplier Market Share and Capacity 2024
  • Table 184. Major SiC Wafer Long-Term Supply Agreements
  • Table 185. SiC Device Market by Manufacturer 2024
  • Table 186. SiC MOSFET Technology Comparison by Manufacturer
  • Table 187. SiC Device Production Capacity by Manufacturer 2024-2028
  • Table 188. SiC Power Module Market 2024-2030
  • Table 189. SiC Power Module Supplier Market Share 2024
  • Table 190. GaN Power Device Supply Chain Models
  • Table 191. GaN Power Device Supplier Analysis 2024
  • Table 192. GaN Power Device Manufacturing Capacity 2024-2028
  • Table 193. TSMC GaN Foundry Exit Analysis
  • Table 194. GaN Foundry Alternative Assessment
  • Table 195. Silicon Power Device Market by Supplier 2024
  • Table 196. Silicon Power Device Technology Evolution
  • Table 197. Silicon Power Wafer Suppliers
  • Table 198. Power Electronics Capacitor Market by Type 2024
  • Table 199. DC Link Film Capacitor Supplier Market Share 2024
  • Table 200. Power Magnetics Market Overview 2024
  • Table 201. Power Magnetics Supplier Landscape
  • Table 202. Power Module Packaging Market 2024-2030
  • Table 203. Power Module Packaging Supplier Market Share 2024
  • Table 204. Power Module Packaging Technology Generations
  • Table 205. Die Attach Technology Comparison
  • Table 206. Silver Sintering Paste Supplier Analysis
  • Table 207. Power Electronics Cooling Market 2024-2030
  • Table 208. Power Electronics Cooling Supplier Analysis
  • Table 209. Thermal Interface Material Market 2024
  • Table 210. TIM Supplier Market Analysis
  • Table 211. Power Electronics Supply Chain Risk Matrix
  • Table 212. OEM Multisourcing Adoption by Component
  • Table 213. Multisourcing Cost-Benefit Analysis
  • Table 214. Regional Supply Chain Development Status
  • Table 215. Supply Chain Localization Requirements by Region
  • Table 216. Baseline Forecast Assumptions
  • Table 217. Forecast Scenario Definitions
  • Table 218. Market Scope Definitions
  • Table 219. Regional Market Definitions
  • Table 220. Global Power Electronics Market Forecast 2024-2036 (US$ Billion)
  • Table 221. Market Growth Phase Characteristics
  • Table 222. Power Electronics Market by Application 2024-2036 (US$ Billion)
  • Table 223. Power Electronics Market Share by Application 2024-2036
  • Table 224. Power Semiconductor Market by Technology 2024-2036 (US$ Billion)
  • Table 225. Power Semiconductor Market Share by Technology 2024-2036
  • Table 226. Power Electronics Market by Region 2024-2036 (US$ Billion)
  • Table 227. Power Electronics Market Share by Region 2024-2036
  • Table 228. Global EV Sales Forecast by Powertrain 2024-2036 (Million Units)
  • Table 229. EV Sales by Region 2024-2036 (Million Units)
  • Table 230. Global Traction Inverter Market Forecast 2024-2036
  • Table 231. Traction Inverter Semiconductor Technology Mix 2024-2036 (Unit Share)
  • Table 232. Traction Inverter Market Value by Technology 2024-2036 (US$ Billion)
  • Table 233. Global Onboard Charger Market Forecast 2024-2036
  • Table 234. OBC Market by Power Level 2024-2036 (Unit Share)
  • Table 235. OBC Semiconductor Technology Mix 2024-2036 (Unit Share)
  • Table 236. Automotive DC-DC Converter Market Forecast 2024-2036
  • Table 237. Automotive DC-DC Converter Technology Mix 2024-2036 (Unit Share)
  • Table 238. 800V Architecture Adoption by Segment 2024-2036 (Unit Share)
  • Table 239. Total EV Power Electronics Market Forecast 2024-2036 (US$ Billion)
  • Table 240. Average Power Electronics Content per EV 2024-2036
  • Table 241. Global Data Center Power Demand Forecast 2024-2036
  • Table 242. Data Center Power Electronics Market Forecast 2024-2036 (US$ Billion)
  • Table 243. Data Center PSU Technology Mix 2024-2036 (Value Share)
  • Table 244. Global Solar PV Inverter Market Forecast 2024-2036
  • Table 245. Solar Inverter Semiconductor Technology Mix 2024-2036 (Value Share)
  • Table 246. Global Wind Power Converter Market Forecast 2024-2036
  • Table 247. Global Battery Energy Storage Inverter Market Forecast 2024-2036
  • Table 248. Global Variable Frequency Drive Market Forecast 2024-2036
  • Table 249. Consumer Fast Charger Market Forecast 2024-2036
  • Table 250. EV Charging Infrastructure Market Forecast 2024-2036
  • Table 251. SiC Power Semiconductor Market Forecast 2024-2036 (US$ Billion)
  • Table 252. SiC Wafer Demand Forecast 2024-2036 (Thousand Wafers)
  • Table 253. GaN Power Semiconductor Market Forecast 2024-2036 (US$ Billion)
  • Table 254. Silicon Power Device Market Forecast 2024-2036 (US$ Billion)
  • Table 255. Si IGBT Market by Application 2024-2036 (Value Share)
  • Table 256. China Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Table 257. Europe Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Table 258. North America Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Table 259. Total Market Forecast by Scenario 2024-2036 (US$ Billion)
  • Table 260. Key Scenario Assumptions
  • Table 261. Forecast Sensitivity Analysis
  • Table 262. Power Electronics Market Forecast Summary
  • Table 263. Technology Transition Milestones
  • Table 264. Top 20 Global Power Device Suppliers Ranking 2024
  • Table 265. Top 20 Power Device Supplier Financial Metrics 2024
  • Table 266. Market Share Evolution 2020-2024-2028E
  • Table 267. Si IGBT Market Share by Supplier 2024
  • Table 268. SiC MOSFET Market Share by Supplier 2024
  • Table 269. SiC MOSFET Technology Comparison by Supplier
  • Table 270. GaN Power Device Market Share by Supplier 2024
  • Table 271. China Power Semiconductor Market Share 2024
  • Table 272. Europe Power Semiconductor Market Share 2024
  • Table 273. North America Power Semiconductor Market Share 2024
  • Table 274. Regional Market Share by Supplier Headquarters 2024
  • Table 275. Vertical Integration Strategy Categories
  • Table 276. Semiconductor Supplier Vertical Integration Scope
  • Table 277. STMicroelectronics SiC Integration Economics
  • Table 278. Automotive OEM Power Electronics Integration Status
  • Table 279. Tesla Power Electronics Vertical Integration Analysis
  • Table 280. BYD Semiconductor Integration Roadmap
  • Table 281. OEM-Supplier Partnership Model Categories
  • Table 282. Significant Power Electronics Partnerships 2022-2024
  • Table 283. Tesla-STMicroelectronics Partnership Characteristics
  • Table 284. GM-Wolfspeed Partnership Structure
  • Table 285. Partnership Model Risk-Reward Analysis
  • Table 286. Major Silicon Power Semiconductor Fab Capacity 2024
  • Table 287. Announced Silicon Power Fab Expansion Projects 2024-2030
  • Table 288. Global SiC Manufacturing Capacity Expansion 2024-2030
  • Table 289. Significant SiC Manufacturing Investment Projects
  • Table 290. Major Chinese SiC Expansion Projects
  • Table 291. Global GaN Power Device Capacity 2024-2030
  • Table 292. Major GaN Capacity Expansion Projects
  • Table 293. Power Electronics 1.0 vs. 2.0 Paradigm Comparison
  • Table 294. Performance Metric Evolution
  • Table 295. Multi-Objective Pareto Optimization Parameters
  • Table 296. Power Electronics Technology S-Curve Assessment
  • Table 297. Research Priority Evolution
  • Table 298. Power vs. Energy Management Perspectives
  • Table 299. Mission Efficiency vs. Rated Efficiency Examples
  • Table 300. Energy Control Center Functional Requirements
  • Table 301. DER Integration Power Electronics Requirements
  • Table 302. Hierarchical Smart Grid Structure
  • Table 303. Solid-State Transformer vs. Conventional Transformer
  • Table 304. Solid-State Transformer Application Analysis
  • Table 305. Solid-State Transformer Market Forecast 2024-2036
  • Table 306. FREEDM System Key Elements
  • Table 307. SiC MOSFET Technology Roadmap 2024-2035
  • Table 308. SiC MOSFET Gate Structure Comparison and Roadmap
  • Table 309. SiC Wafer Technology Evolution 2024-2035
  • Table 310. Advanced SiC Manufacturing Technologies
  • Table 311. Cold Split Technology Benefits
  • Table 312. GaN Power Device Voltage Rating Roadmap
  • Table 313. High-Voltage GaN Technology Comparison
  • Table 314. Vertical GaN vs. Lateral GaN Comparison
  • Table 315. GaN HEMT Technology Roadmap 2024-2035
  • Table 316. Ultra-Wide Bandgap Material Properties
  • Table 317. Ga2O3 Technology Status and Roadmap
  • Table 318. Major Ga2O3 Technology Developers
  • Table 319. Diamond Power Semiconductor Status
  • Table 320. Emerging Material Commercialization Timeline
  • Table 321. Power Electronics Integration Levels
  • Table 322. Automotive Power Electronics Integration Evolution
  • Table 323. BYD 8-in-1 Powertrain Specifications
  • Table 324. Integrated OBC/DC-DC Market Analysis
  • Table 325. Traction-Integrated OBC Concept
  • Table 326. Multi-Cell Converter Architecture Advantages
  • Table 327. Parallel Interleaving Performance Scaling
  • Table 328. Series Interleaving R_DS(on) Advantage
  • Table 329. ETH Zurich 99.36% PFC Rectifier Specifications
  • Table 330. Modular Multilevel Converter (MMC) Applications
  • Table 331. Power Electronics Design Process Evolution
  • Table 332. Multi-Domain Simulation Integration
  • Table 333. Power Electronics Digital Twin Use Cases
  • Table 334. Digital Twin Technology Stack
  • Table 335. Power Electronics Loss Distribution Evolution
  • Table 336. Power Magnetic Core Material Comparison
  • Table 337. Emerging Magnetic Material Technologies
  • Table 338. Magnetic Component Design Evolution
  • Table 339. Power Electronics Capacitor Technology Comparison
  • Table 340. DC Link Capacitor Development Roadmap
  • Table 341. Emerging Capacitor Technologies for Power Electronics
  • Table 342. Passive Component Trade-offs at Increasing Frequency
  • Table 343. EMI Impact of WBG Semiconductor Adoption
  • Table 344. EMI Reduction Strategy Classification
  • Table 345. Active Gate Drive Technology
  • Table 346. ETH Zurich Closed-Loop Gate Drive Specifications
  • Table 347. EMI Filter Technology Roadmap
  • Table 348. Integrated EMI Mitigation Approaches
  • Table 349. Power Electronics Technology Roadmap Summary 2024-2035
  • Table 350. Power Electronics Performance Trajectory 2024-2035
  • Table 351. Power Electronics R&D Priority Matrix 2025-2035
  • Table 352. Technology Investment Recommendations by Company Type

List of Figures

  • Figure 1. Global Power Electronics Market Summary 2026-2036 (US$ Billion).
  • Figure 2. Power Electronics Market Size by Component Category 2024-2036 (US$ Billion).
  • Figure 3. SiC MOSFET Market by Application 2024-2036 (US$ Billion).
  • Figure 4. GaN Device Market by Application 2024-2036 (US$ Million).
  • Figure 5. Power Electronics Market by Application Sector 2024-2036 (US$ Billion)
  • Figure 6. Automotive Power Electronics Segmentation 2024-2036 (US$ Billion)
  • Figure 7. Super-Junction Technology Cross-Section
  • Figure 8. GaN HEMT Structure Schematic.
  • Figure 9. Single vs Double-Sided Cooling Schematic
  • Figure 10. Frame-based power module uses a metal base plate, ceramic substrate, wire bonding and copper terminals. The cavity is filled with silicone gel for insulation.
  • Figure 11. Global Electric Vehicle Sales by Region 2020-2036 (Million Units)
  • Figure 12. Global EV Sales by Powertrain Type 2024-2036 (Million Units)
  • Figure 13. EV Power Electronics System Architecture
  • Figure 14. Inverter Benchmarking: Si, SiC, GaN
  • Figure 15. Heavy-Duty Power Electronics Market 2024-2036 (US$ Million)
  • Figure 16. Solid-State Transformer Architecture
  • Figure 17. Smart Grid Power Electronics Market 2024-2036 (US$ Billion)
  • Figure 18. China Power Electronics Market Size 2024-2036 (US$ Billion)
  • Figure 19. Europe Power Electronics Market Size 2024-2036 (US$ Billion)
  • Figure 20. United States Power Electronics Market Size 2024-2036 (US$ Billion)
  • Figure 21. SiC power module packaging structure.
  • Figure 22. GaN technology in various power sectors
  • Figure 23. Power Electronics Market by Region 2024-2036 (US$ Billion)
  • Figure 24. China Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Figure 25. Europe Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Figure 26. North America Power Electronics Market Detailed Forecast 2024-2036 (US$ Billion)
  • Figure 27. Schematic of configurations for normally on AlGaN/GaN HEMTs with (a) Schottky gate; and (b) and insulated gate
  • Figure 28. Comparison of diamond properties with other materials. Diamond has the largest bandgap, breakdown electric field, thermal conductivity, and hole mobility. Besides GaAs, diamond has the highest electron mobility.
  • Figure 29. Device schematic of different diamond diodes: (a) LSBDs; (b) pVSBDs; (c) VSBDs; (d) PNDs; (e) SPNDs; and (f) SPINDs.