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市場調查報告書
商品編碼
1887068
EUV光刻市場規模、佔有率、成長及全球產業分析:依類型、應用和地區劃分的洞察,以及2024年至2032年的預測EUV Lithography Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032 |
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隨著半導體製造商加速向7nm以下先進製程節點轉型,全球EUV光刻市場正經歷快速的技術和商業擴張。據估計,2024年全球市場規模將達到111.9億美元。在半導體代工廠、整合裝置製造商和先進消費性電子產品強勁需求的推動下,預計2025年市場規模將達到121.6億美元,並在2032年進一步成長至242.3億美元,預測期內複合年增長率(CAGR)為10.35%。在強大的研發生態系統和世界領先的光刻設備製造商的支持下,歐洲在2024年以44.15%的市佔率引領全球市場。
極紫外光刻技術對於實現先進的半導體製造至關重要,尤其是在生產特徵尺寸小於7奈米的晶片方面。極紫外光(EUV)的使用能夠實現矽晶圓上更精確的圖案化,使製造商能夠提高電晶體密度並延續摩爾定律。 EUV設備在處理器、儲存晶片以及用於人工智慧系統、5G基礎設施、資料中心和高效能消費性電子設備的超高速電子元件的生產中起著至關重要的作用。
生成式人工智慧的影響
生成式人工智慧正在透過優化圖案佈局、提高模擬精度和增強缺陷檢測能力來變革半導體製造流程。 EUV光刻技術從人工智慧輔助建模中獲益匪淺,這可以降低製造變異性、縮短生產週期並提高晶圓良率。隨著半導體公司採用先進的人工智慧驅動自動化技術,將人工智慧整合到光刻圖案設計中有望進一步加速市場擴張。
市場推動因素
推動EUV微影技術普及的主要推動因素是積體電路日益增長的複雜性。先進的處理器和記憶體架構需要超精細的結構和高密度電晶體,而這只有透過EUV微影技術才能實現。對5nm、3nm以及新興的3nm以下製程的投資不斷增長,使EUV成為半導體創新的核心。
此外,資料中心、雲端運算和高效能運算的擴張正在推動對下一代儲存裝置(例如NAND快閃記憶體和DRAM)的需求。 EUV能夠提供先進儲存結構所需的精度和可擴充性。諸如台積電和ASML合作擴大EUV產能等策略合作表明,基於EUV的大規模生產轉型正在進行中。
市場限制因子
儘管EUV光刻技術具有諸多優勢,但仍面臨諸多挑戰。設備極為昂貴,成本是傳統微影設備的數倍。 EUV組件,例如光罩、薄膜和高能量光源,製造流程複雜且成本高昂。中小型代工廠在採用EUV技術時面臨資金限制,而全球範圍內專用組件的短缺也造成了瓶頸。
此外,掩模完整性、薄膜耐久性和無缺陷圖案化等挑戰仍在阻礙EUV技術的廣泛應用。然而,產業創新正在逐步解決這些問題。
市場機會
全球半導體製造投資的不斷增長以及資料中心的快速發展為EUV光刻系統帶來了巨大的機會。隨著消費性電子產品、汽車電子產品和人工智慧設備對高性能且節能的晶片的需求日益增長,EUV微影技術已成為先進節點製造的關鍵。預計對下一代高數值孔徑(NA)極紫外光刻(EUV)技術的研發投入增加,將進一步提高圖形精度,實現更精細的結構,並增強其長期市場前景。
依裝置類型
到2024年,光源細分市場將佔最大的市場佔有率,達到42.12%,這主要得益於高功率EUV光刻系統的創新。由於對高精度半導體圖形和7奈米以下結構的需求不斷增長,預計掩模細分市場將實現最快成長。
依最終使用者
到2024年,市場將由整合元件製造商(IDM)主導,他們利用EUV技術實現高密度、高性能晶片。預計到 2025 年,IDM 廠商將維持 55.77% 的市佔率。同時,在主要公司加速向 EUV 光刻技術轉型以進行商用晶片生產的推動下,晶圓代工廠預計將呈現最高的複合年增長率 (CAGR),達到 12.27%。
歐洲 - 引領市場
歐洲引領全球需求,預計到 2024 年市場規模將達到 49.4 億美元。該地區受益於強大的半導體研發生態系統和大規模投資,例如英特爾在德國和波蘭投資數十億美元的晶片製造項目。
亞太地區
亞太地區是成長最快的地區,預計到 2025 年市場規模將達到 34 億美元,這主要得益於台積電、三星和中芯國際等廠商大規模採用 EUV 技術。
北美
預計到 2025 年,北美市場規模將達到 18 億美元,這主要得益於對人工智慧晶片和先進運算技術的需求不斷增長。
The global EUV lithography market is entering a phase of rapid technological and commercial expansion as semiconductor manufacturers increasingly shift toward advanced nodes below 7nm. According to 2024 estimates, the global market was valued at USD 11.19 billion. With strong demand from semiconductor foundries, integrated device manufacturers, and advanced consumer electronics, the market is projected to reach USD 12.16 billion in 2025 and further expand to USD 24.23 billion by 2032, reflecting a CAGR of 10.35% during the forecast period. Europe led the global landscape with a 44.15% share in 2024, supported by robust R&D ecosystems and world-leading lithography equipment manufacturers.
EUV lithography is essential for enabling advanced semiconductor fabrication, particularly in producing chips with feature sizes below 7 nanometers. By using extreme ultraviolet light, the technology enables more precise patterning on silicon wafers, allowing manufacturers to increase transistor density and extend Moore's Law. EUV tools are critical in producing processors, memory chips, and ultra-fast electronics used in AI systems, 5G infrastructure, data centers, and high-performance consumer devices.
Impact of Generative AI
Generative AI is transforming semiconductor manufacturing processes by optimizing pattern layouts, enhancing simulation accuracy, and improving defect detection. EUV lithography benefits significantly from AI-assisted modeling, which reduces manufacturing variability, shortens production cycles, and increases wafer yield rates. As semiconductor companies adopt advanced AI-driven automation, the integration of AI into lithography pattern design will continue to accelerate market expansion.
Market Drivers
The primary driver of EUV lithography adoption is the increasing complexity of integrated circuits. Advanced processors and memory architectures demand ultra-fine geometries and higher transistor densities, which are only achievable through EUV lithography. Growing investment in 5nm, 3nm, and emerging sub-3nm nodes places EUV at the center of semiconductor innovation.
Furthermore, the expansion of data centers, cloud computing, and high-performance computing intensifies demand for next-generation memory devices such as NAND Flash and DRAM. EUV enables the precision and scalability required for advanced memory structures. Strategic collaborations-such as TSMC's partnership with ASML to expand EUV capacity-highlight the ongoing shift toward EUV-enabled mass production.
Market Restraints
Despite its advantages, EUV lithography faces major barriers. The equipment is extremely expensive, costing several times more than conventional lithography tools. EUV components-including masks, pellicles, and high-energy light sources-are highly complex and costly to manufacture. Smaller foundries face financial limitations in adopting EUV technology, and global shortages of specialized components have caused installation bottlenecks.
Additionally, challenges in mask integrity, pellicle durability, and achieving defect-free patterns continue to slow full-scale adoption, although industry innovations are gradually resolving these issues.
Market Opportunities
Expanding global investment in semiconductor fabrication and the rapid growth of data centers provide significant opportunities for EUV lithography systems. As consumer electronics, automotive electronics, and AI-enabled devices require powerful and energy-efficient chips, EUV lithography becomes indispensable for manufacturing advanced nodes. Increasing R&D funding for next-generation High-NA EUV technology will further enhance pattern accuracy and enable even smaller geometries, strengthening long-term market prospects.
By Equipment Type
The light source segment held the largest share in 2024 at 42.12%, driven by innovations in high-power EUV generation systems. Masks are expected to register the fastest growth due to rising demand for high-precision semiconductor patterns and sub-7nm structures.
By End-User
Integrated Device Manufacturers (IDMs) dominated the market in 2024, leveraging EUV to deliver high-density, high-performance chips. IDMs are projected to hold 55.77% of the market in 2025. Foundries will exhibit the highest CAGR of 12.27%, as leading players increasingly transition to EUV for commercial chip production.
Europe - Market Leader
Europe led global demand with a valuation of USD 4.94 billion in 2024. The region benefits from strong semiconductor R&D ecosystems and major investments such as Intel's multi-billion-dollar chip manufacturing projects in Germany and Poland.
Asia Pacific
Asia Pacific is the fastest-growing region, expected to reach USD 3.40 billion in 2025, driven by TSMC, Samsung, and SMIC's extensive EUV deployments.
North America
North America is projected to reach USD 1.80 billion in 2025, supported by rising demand for AI chips and advanced computing technologies.
Competitive Landscape
ASML remains the exclusive producer of EUV systems globally, giving it a dominant position in the market. Other major players-Samsung, Canon, KLA, Nikon, ZEISS, and Advantest-play critical roles in optics, metrology, and inspection systems. Continuous product innovations, strategic alliances, and High-NA EUV developments will define the competitive landscape through 2032.
Segmentation By Equipment
By End-user
By Region
Companies Profiled in the Report ASML (Netherlands), Samsung Electronics Co. Ltd. (South Korea), Canon Inc. (Japan), KLA Corporation (U.S.), NTT Advanced Technology Corporation (Japan), Nikon Corporation (China), ZEISS Group (Germany), ADVANTEST CORPORATION (Japan), SUSS MicroTec SE (Germany)