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直通矽晶穿孔(TSV) 技術的全球市場規模：依產品、應用、地區及預測

Global Through Silicon Via (TSV) Technology Market Size By Product (Via First TSV, Via Middle TSV), By Application (Image Sensors, 3D Package, 3D Integrated Circuits), By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

直通矽晶穿孔（TSV）技術的市場規模與預測

2024 年直通矽晶穿孔(TSV) 技術市場規模價值為 351.2 億美元，預計到 2032 年將達到 1922.9 億美元，2026 年至 2032 年的複合年成長率為 26.12%。

直通矽晶穿孔(TSV) 技術的應用也呈指數級成長。 TSV 主要用於3D積體電路 (IC) 的製造和 IC 封裝，而 IC 封裝是智慧電子製造中最關鍵的組件之一。此外，與傳統的覆晶和打線接合相比，TSV 還能提供更高密度的鍵結、更小的空間和更佳的連接性。 TSV 的效用使其廣泛應用於各種電子元件，例如微處理單元 (MPU)、可程式邏輯元件 (PLD)、動態隨機存取記憶體 (DRAM)、圖形電子晶片、CMOS 影像感測器等等。

定義全球直通矽晶穿孔(TSV) 技術市場

直通矽晶穿孔(TSV) 技術是實現3D (3D) 矽晶圓與3D積體電路 (IC) 整合的核心與最重要的技術。它能夠實現最短的晶片間互連，並具有最小的墊片尺寸和間距。使用直通矽晶穿孔(TSV) 技術進行3D晶片堆疊互連，正成為 CMOS 成像器、記憶體和 MEMS 的先進封裝技術。 TSV 技術與傳統互連技術相比具有許多優勢，包括更低的功耗、更高的電氣性能、更高的密度、由於資料頻寬更寬而帶來的更高頻寬以及更輕的重量。

直通矽晶穿孔(TSV) 是指完全貫穿矽晶圓或晶粒晶圓的垂直電氣連接。 TSV 是一種用於創建 3D 積體電路和 3D 封裝的高性能互連技術，取代了打線接合和覆晶。此技術可顯著提高裝置和互連密度，並縮短連接長度。直通矽晶穿孔(TSV) 記憶體的市場驅動應用包括：整合邏輯功能和記憶體以提高手持裝置的視訊品質；多晶片高效能 DRAM；以及用於固態硬碟的堆疊NAND快閃記憶體快閃記憶體。

直通矽晶穿孔(TSV) 技術的全球市場概覽

半導體晶片在電力、醫療、能源、汽車、電動車、電機控制應用以及航太和國防等各行各業的應用日益增多，推動了全球直通矽晶穿孔(TSV) 技術市場的成長。發光二極體)在產品中的日益普及，刺激了更高產量、更低成本和更高密度裝置的生產。與2D封裝不同，採用 TSV 技術的3D (3D) 封裝可實現更高密度的垂直佈線。

此外，由於晶片結構小型化，對電子設備小型化的需求日益成長，這推動了直通矽晶穿孔(TSV) 技術的發展。汽車、通訊、醫療保健和工業生產等各個領域都需要半導體積體電路的小型化。此外，用於 3D 晶片封裝的 TSV 技術需求日益成長，以縮短佈線長度、降低功率損耗、提高訊號速度並降低功耗，這直通矽晶穿孔(TSV) 技術市場的成長創造了巨大的機會。

然而，供應商必須投入大量資金來設計用於生產小型積體電路的設備。此外，製造過程複雜且耗時。此外，隨著半導體積體電路製造製程設計日益複雜，供應商需要增加對封裝和組裝設備的投入，以提高半導體積體電路的性能，這將對半導體晶片製造商產生一定程度的影響。

目錄

第1章直通矽晶穿孔（TSV）技術全球市場介紹

  • 市場概覽
  • 研究範圍
  • 先決條件

第2章執行摘要

第3章：已驗證的市場研究調查方法

  • 資料探勘
  • 驗證
  • 第一手資料
  • 資料來源列表

第4章直通矽晶穿孔(TSV) 技術的全球市場展望

  • 概述
  • 市場動態
    • 驅動程式
    • 限制因素
    • 機會
  • 波特五力模型
  • 價值鏈分析

第5章 全球直通矽晶穿孔(TSV) 技術市場（按產品）

  • 概述
  • 先通孔 TSV
  • VIA MiddleTSV
  • 後導孔TSV

第6章 全球直通矽晶穿孔(TSV) 技術市場（依應用）

  • 概述
  • 影像感測器
  • 3D封裝
  • 3D積體電路
  • 其他

第7章全球直通矽晶穿孔（TSV）技術市場（按地區）

  • 概述
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 阿根廷
    • 其他拉丁美洲
  • 中東和非洲
    • 阿拉伯聯合大公國
    • 沙烏地阿拉伯
    • 南非
    • 其他中東和非洲地區

第8章直通矽晶穿孔（TSV）技術全球市場競爭格局

  • 概述
  • 各公司市場排名
  • 重點發展策略

第9章 公司簡介

  • Applied Materials
  • International Business Machines Corporation
  • Amkor Micralyne, Inc.
  • Tezzaron Semiconductors
  • STATS ChipPAC Ltd
  • Xilinx.
  • Intel Corporation
  • Renesas Electronics Corporation
  • Texas Instruments
  • AMS
  • Hua Tian Technology
  • Samsung
  • TESCAN
  • Dow Inc.
  • WLCSP
  • ALLVIA

第10章 重大進展

  • 產品發布/開發
  • 合併與收購
  • 業務擴展
  • 夥伴關係與合作

第11章 附錄

相關調查

簡介目錄
Product Code: 49950

Through Silicon Via (TSV) Technology Market Size And Forecast

Through Silicon Via (TSV) Technology Market size was valued at USD 35.12 Billion in 2024 and is projected to reach USD 192.29 Billion by 2032, growing at a CAGR of 26.12% from 2026 to 2032.

The growing adoption of smart electronics products such as smartphones, laptops, tablets, and many others is leading to the exponential growth of Through Silicon Via (TSV) Technology. Since, these TSVs are majorly used in building 3D integrated circuits (ICs), and the IC packages which are one of the most vital components in smart electronics manufacturing. Besides this, the TSVs provide higher-density bonds, require minimal space, and provide the best connectivity compared to conventional flip-chips and wire bonds. The usability of TSVs and various electronic components such as microprocessing units (MPUs), PLDs, DRAMs, electronic chips for graphics and CMOS image sensors, and many others.

Global Through Silicon Via (TSV) Technology Market Definition

Through-silicon via (TSV) technology is the central and most crucial technology enabling the integration of the three-dimensional (3D) Si and 3D integrated circuit (IC). It offers the ability for the shortest chip-to-chip interconnections, and the interconnection of the smallest pad size and pitch. Stacking chips in three dimensional with through-silicon via (TSV) technology as interconnects is an emerging advanced packaging technology for CMOS imagers, memories, and MEMS. TSV technology offers several advantages as compared to traditional interconnection technology, including lower power consumption, better electrical performance, higher density, wider data width and thus bandwidth, and lighter weight.

A through-silicon via (TSV) refers to a vertical electrical connection that passes entirely through a wafer of silicone or dies. TSVs are higher-performance interconnect methods utilized to create 3D integrated circuits and 3D packages as an alternative to wire-bond and flip-chips. In this technique, the device and interconnect density is significantly higher, and the connection length becomes shorter. Market-driven application of through-silicon via (TSV) engaging memory comprises the integration of logic functions and memory for the improved video quality on handheld devices, multi-chip high-performance DRAM, and stacked NAND flash memory for solid-state drives.

Global Through Silicon Via (TSV) Technology Market Overview

The increasing use of semiconductor chips' applications in various industries such as the power, medical, energy, automobiles, electric vehicles, motor control applications, and aerospace and defense is accelerating the growth of the Global Through Silicon Via (TSV) Technology Market. The rising use of light-emitting diodes in products has stimulated the production of higher capacity, lower cost, and higher density devices. Using three-dimensional (3D) packaging in TSV technology, unlike 2D packaging, allows for a higher density of vertical interconnections.

Furthermore, the increasing demand for the miniaturization of the electronic device owing to the compact size chip architecture is driving the development of through silicon via (TSV) technology. Various sectors, such as automotive, telecommunications, healthcare, and industrial manufacturing created the requirement for miniaturized semiconductor ICs. Also, the growing demand for TSV technology for 3D chip packaging to reduce interconnection length, reduce power dissipation, increase signal speed, and reduce power consumption presents a great opportunity for the Through Silicon Via (TSV) Technology Market growth.

However, the market vendors have to capitalize a lot on designing equipment to manufacture compact ICs. In addition to this, the production process is complex and also consumes more time. Also, the designing of the semiconductor ICs manufacturing process is becoming complex, therefore it would have a moderate impact on semiconductor chip manufacturers as they need to invest a great deal in packaging and assembly equipment to improve the performance of semiconductor ICs.

Global Through Silicon Via (TSV) Technology Market: Segmentation Analysis

The Global Through Silicon Via (TSV) Technology Market is segmented on the basis of Product, Application, and Geography.

Through Silicon Via (TSV) Technology Market, By Product

  • Via First TSV
  • Via Middle TSV
  • Via Last TSV

Based on Product, the market is segmented into Via First TSV, Via Middle TSV, and Via Last TSV. The Via Middle TSV segment accounted for the largest market share in 2021. Via-middle TSV approaches typically insert the TSV module after completion of the FEOL phases, which consists of various high-temperature processes but before BEOL processing, where multi-layer metal routing is carried out. Via-middle TSVs are presently a prevalent option for advanced three-dimensional (3D) ICs and also for interposer stacks.

Through Silicon Via (TSV) Technology Market, By Application

  • Image Sensors

3D Package

3D Integrated Circuits

  • Others

Based on Application, the market is segmented into Image Sensors, 3D Package, 3D Integrated Circuits, and Others. The 3D Integrated Circuits segment accounted for the largest market share in 2021. 3-dimensional integration of integrated circuits (3DIC) using Through Silicon Vias (TSV) is one of the most promising but also challenging technology. Furthermore, increasing penetration of smartphones, feature phones & tablets, and technological advancements in consumer electronic devices are major factors driving the growth of the global 3D integrated circuit with the Through Silicon Via (TSV) Technology Market.

Through Silicon Via (TSV) Technology Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Middle East and Africa
  • Latin America
  • On the basis of Regional Analysis, the Global Through Silicon Via (TSV) Technology Market is classified into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America. Asia Pacific dominated the Global Through Silicon Via (TSV) Technology Market in 2019. Countries such as China, Korea, and Japan utilize through-silicon via (TSV) technology on a large scale. These regions are considered the hub of electronics parts manufacturing. The presence of a large number of smartphone companies along with the kinship of consumers to adopt newer technology such as 5G technology will drive the market in the telecommunication sector.
  • These parent regions are further segmented as follows; Asia Pacific (China, India, Japan, Rest of APAC), Europe (Germany, UK, France, Spain, Italy, Rest of Europe), North America (US, Canada, Mexico), Latin America (Brazil, Argentina, Rest of LATAM), and Middle East & Africa (UAE, Saudi Arabia, South Africa, Rest of MEA).

Key Players

The "Global Through Silicon Via (TSV) Technology Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are AMS, Hua Tian Technology, Samsung, Amkor Micralyne, Inc., Intel Corporation, TESCAN, Dow Inc., WLCSP, ALLVIA, Applied Materials, International Business Machines Corporation, Tezzaron Semiconductors, STATS ChipPAC Ltd, Xilinx, Renesas Electronics Corporation, Texas Instruments. Besides this, much new entrance and Through Silicon Via manufacturers from the respective economies are forming supply agreements with the Smart Electronics manufacturing companies to attain a competitive edge in the market.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

  • Key Developments:
  • Samsung Electronics Co., Ltd. announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. This new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes while maintaining the same thickness as current 8-layer chips.
  • In September 2019, Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne Digital Imaging, Inc., acquired Micralyne Inc. which is a privately-owned foundry providing Micro Electro Mechanical Systems or MEMS devices. In particular, Micralyne possesses unique microfluidic technology for biotech applications, as well as capabilities in non-silicon-based MEMS (e.g. gold, polymers) often required for human-body compatibility.
  • Ace Matrix Analysis
  • The Ace Matrix provided in the report would help to understand how the major key players involved in this industry are performing as we provide a ranking for these companies based on various factors such as service features & innovations, scalability, innovation of services, industry coverage, industry reach, and growth roadmap. Based on these factors, we rank the companies into four categories as Active, Cutting Edge, Emerging, and Innovators.
  • Market Attractiveness
  • The image of market attractiveness provided would further help to get information about the region that is majorly leading in the Global Through Silicon Via (TSV) Technology Market. We cover the major impacting factors that are responsible for driving the industry growth in the given region.
  • Porter's Five Forces
  • The image provided would further help to get information about Porter's five forces framework providing a blueprint for understanding the behavior of competitors and a player's strategic positioning in the respective industry. Porter's five forces model can be used to assess the competitive landscape in the Global Through Silicon Via (TSV) Technology Market, gauge the attractiveness of a certain sector, and assess investment possibilities.

TABLE OF CONTENTS

1 INTRODUCTION OF THE GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porter's Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY PRODUCT

  • 5.1 Overview
  • 5.2 Via First TSV
  • 5.3 Via Middle TSV
  • 5.4 Via Last TSV

6 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Image Sensors
  • 6.3 3D Package
  • 6.4 3D Integrated Circuits
  • 6.5 Others

7 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 The U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 The U.K.
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Argentina
    • 7.5.3 Rest of LATAM
  • 7.6 Middle East and Africa
    • 7.6.1 UAE
    • 7.6.2 Saudi Arabia
    • 7.6.3 South Africa
    • 7.6.4 Rest of the Middle East and Africa

8 GLOBAL THROUGH SILICON VIA (TSV) TECHNOLOGY MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 Applied Materials
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 International Business Machines Corporation
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 Amkor Micralyne, Inc.
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 Tezzaron Semiconductors
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 STATS ChipPAC Ltd
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 Xilinx.
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 Intel Corporation
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 Renesas Electronics Corporation
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 Texas Instruments
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments
  • 9.10 AMS
    • 9.10.1 Overview
    • 9.10.2 Financial Performance
    • 9.10.3 Product Outlook
    • 9.10.4 Key Developments
  • 9.11 Hua Tian Technology
    • 9.11.1 Overview
    • 9.11.2 Financial Performance
    • 9.11.3 Product Outlook
    • 9.11.4 Key Developments
  • 9.12 Samsung
    • 9.12.1 Overview
    • 9.12.2 Financial Performance
    • 9.12.3 Product Outlook
    • 9.12.4 Key Developments
  • 9.13 TESCAN
    • 9.13.1 Overview
    • 9.13.2 Financial Performance
    • 9.13.3 Product Outlook
    • 9.13.4 Key Developments
  • 9.14 Dow Inc.
    • 9.14.1 Overview
    • 9.14.2 Financial Performance
    • 9.14.3 Product Outlook
    • 9.14.4 Key Developments
  • 9.15 WLCSP
    • 9.15.1 Overview
    • 9.15.2 Financial Performance
    • 9.15.3 Product Outlook
    • 9.15.4 Key Developments
  • 9.16 ALLVIA
    • 9.16.1 Overview
    • 9.16.2 Financial Performance
    • 9.16.3 Product Outlook
    • 9.16.4 Key Developments

10 KEY DEVELOPMENTS

  • 10.1 Product Launches/Developments
  • 10.2 Mergers and Acquisitions
  • 10.3 Business Expansions
  • 10.4 Partnerships and Collaborations

11 Appendix

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