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市場調查報告書

商品編碼

1747106

日本半導體封裝市場規模、佔有率、趨勢及預測（按類型、封裝材料、技術、最終用戶和地區），2025 年至 2033 年

Japan Semiconductor Packaging Market Size, Share, Trends and Forecast by Type, Packaging Material, Technology, End User, and Region, 2025-2033

出版日期: 2025年06月02日 | 出版商:

IMARC | 英文 121 Pages | 商品交期: 5-7個工作天內

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簡介目錄

2024年，日本半導體封裝市場規模達22.1779億美元。展望未來， IMARC Group預計到2033年，市場規模將達到40.2616億美元，2025-2033年期間的複合年成長率（CAGR）為6.85%。市場驅動力包括：對緊湊型高性能消費性電子產品的需求不斷成長、汽車電子產品的進步以及人工智慧和5G技術的廣泛應用。政府對國內晶片生產的支持以及本土製造商在研發方面的大力投入也促進了市場成長，確保了技術競爭力和供應鏈的韌性。

日本半導體封裝市場趨勢：

先進汽車電子整合

日本在汽車創新領域的領先地位正顯著影響其半導體封裝格局。隨著電動車 (EV)、自動駕駛系統和車聯網技術日益複雜，對能夠承受高熱負荷和複雜功能的堅固半導體封裝的需求也日益成長。日本汽車製造商擴大採用高級駕駛輔助系統 (ADAS)、電源模組和車載資訊娛樂系統，而這些系統都需要緊湊且高可靠的半導體封裝。這種轉變促使封裝供應商開發耐熱且節省空間的解決方案，例如多晶片模組和系統級封裝 (SiP) 配置。半導體公司和汽車原始設備製造商之間的合作正在加速，重點是垂直整合和共同開發適合車輛環境的封裝技術。因此，汽車和半導體產業的融合正在重塑封裝的優先事項，重點是長壽命、高精度和小型化。例如，2024年12月，凸版印刷株式會社（TOPPAN Inc.）宣布加入由Resonac Corporation主導的美日合作聯盟US-JOINT，旨在開發下一代半導體封裝技術。凸版印刷將作為封裝基板製造商，為人工智慧和自動駕駛等應用領域2.5D和3D封裝技術的進步提供支援。

玻璃芯基板在高密度封裝中的興起

日本對高密度半導體封裝中玻璃芯基板的應用興趣日益濃厚，尤其是在資料中心、人工智慧晶片和高效能運算領域。與傳統有機材料相比，玻璃基板具有更優異的尺寸穩定性、更佳的電絕緣性和更平整的表面，從而能夠實現更精確的分層和更高的互連密度。日本企業正在投資改進玻璃基板的製造程序，以提高良率和整合度。這一趨勢與全球向晶片級架構（chiplet architecture）的轉變相契合，在這種架構中，多個較小的晶片整合在單一基板上，形成一個統一的系統。日本企業以其材料科學專業知識而聞名，在引領該領域創新方面擁有獨特的優勢，能夠滿足新興運算平台對效能、空間和能源效率的要求。例如，2024年6月，Rapidus Corporation和IBM宣布擴大合作關係，專注於開發用於2奈米半導體的晶片級封裝技術。該計畫以現有的2奈米節點合作為基礎，是日本NEDO支持的下一代半導體封裝推進計畫的一部分。目標是使日本成為先進晶片封裝領域的關鍵參與者，支援人工智慧和高效能運算應用並加強全球半導體供應鏈。

日本半導體封裝市場區隔：

類型洞察：

覆晶
嵌入式DIE
扇入晶圓級封裝
扇出型晶圓級封裝

包裝材料洞察：

有機基質
鍵合線
引線框架
陶瓷封裝
晶片黏接材料
其他

技術洞察：

網格陣列
小外形封裝
扁平無引線封裝
雙列直插式封裝
其他

最終用戶洞察：

消費性電子產品
汽車
衛生保健
資訊科技和電信
航太和國防
其他

競爭格局：

市場研究報告也對競爭格局進行了全面的分析。報告涵蓋了市場結構、關鍵參與者定位、最佳制勝策略、競爭儀錶板和公司評估象限等競爭分析。此外，報告還提供了所有主要公司的詳細資料。

本報告回答的關鍵問題：

日本半導體封裝市場目前表現如何？未來幾年將如何表現？
日本半導體封裝市場依類型分為哪些類型？
日本半導體封裝市場依封裝材料分為哪些種類？
日本半導體封裝市場依技術分類是怎樣的？
根據最終用戶，日本半導體封裝市場的分佈如何？
日本半導體封裝市場的價值鏈分為哪些階段？
日本半導體封裝市場的主要促進因素和挑戰是什麼？
日本半導體封裝市場的結構是怎麼樣的？主要參與者有哪些？
日本半導體封裝市場的競爭程度如何？

本報告回答的關鍵問題：

日本半導體封裝市場目前表現如何？未來幾年將如何表現？
日本半導體封裝市場依類型分為哪些類型？
日本半導體封裝市場依封裝材料分為哪些類型？
日本半導體封裝市場依技術分類是怎樣的？
根據最終用戶，日本半導體封裝市場的分佈如何？
日本半導體封裝市場的價值鏈分為哪些階段？
日本半導體封裝市場的主要促進因素和挑戰是什麼？
日本半導體封裝市場的結構是怎麼樣的？主要參與者有哪些？
日本半導體封裝市場的競爭程度如何？

The Japan semiconductor packaging market size reached USD 2,217.79 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 4,026.16 Million by 2033, exhibiting a growth rate (CAGR) of 6.85% during 2025-2033. The market is driven by rising demand for compact, high-performance consumer electronics, advancements in automotive electronics, and increased deployment of AI and 5G technologies. Government support for domestic chip production and strong R&D investments by local manufacturers also contribute to growth, ensuring technological competitiveness and supply chain resilience.

Japan Semiconductor Packaging Market Trends:

Integration of Advanced Automotive Electronics

Japan's prominence in automotive innovation is significantly influencing its semiconductor packaging landscape. As electric vehicles (EVs), autonomous systems, and connected car technologies become more sophisticated, demand is rising for robust semiconductor packages that can withstand high thermal loads and complex functionality. Japanese automakers are increasingly incorporating advanced driver-assistance systems (ADAS), power modules, and in-vehicle infotainment-each requiring compact and high-reliability semiconductor packaging. This shift is pushing packaging providers to develop heat-resistant and space-efficient solutions, such as multi-chip modules and system-in-package (SiP) configurations. Collaborations between semiconductor firms and automotive OEMs have accelerated, focusing on vertical integration and co-development of packaging technologies tailored to vehicular environments. The convergence of automotive and semiconductor sectors is thus reshaping packaging priorities, with emphasis on longevity, precision, and miniaturization. For instance, in December 2024, TOPPAN Inc. announced its participation in the US-JOINT consortium, a U.S.-Japan initiative led by Resonac Corporation to develop next-generation semiconductor packaging technologies. TOPPAN will contribute as a packaging substrate manufacturer, supporting advancements in 2.5D and 3D packaging for applications like AI and autonomous driving.

Rise of Glass Core Substrates in High-Density Packaging

Japan is witnessing growing interest in the adoption of glass core substrates for high-density semiconductor packaging, particularly for applications in data centers, AI chips, and high-performance computing. Glass substrates offer superior dimensional stability, better electrical insulation, and flatter surfaces compared to traditional organic materials, enabling more precise layering and interconnect density. Japanese companies are investing in refining the fabrication processes for glass-based substrates to enhance yield and integration capability. This trend aligns with global shifts toward chiplet architectures, where multiple smaller chips are integrated on a single substrate to function as a unified system. Japanese firms, known for their material science expertise, are uniquely positioned to lead innovations in this domain, helping meet performance, space, and power efficiency requirements of emerging computing platforms. For instance, in June 2024, Rapidus Corporation and IBM announced an expanded partnership focused on developing chiplet packaging technologies for 2nm-generation semiconductors. Building on an existing 2nm node collaboration, the initiative is part of a NEDO-backed Japanese project to advance next-gen semiconductor packaging. The goal is to establish Japan as a key player in advanced chiplet packaging, supporting AI and HPC applications and strengthening the global semiconductor supply chain.

Japan Semiconductor Packaging Market Segmentation:

Type Insights:

Flip Chip
Embedded DIE
Fan-In WLP
Fan-Out WLP

Packaging Material Insights:

Organic Substrate
Bonding Wire
Leadframe
Ceramic Package
Die Attach Material
Others

Technology Insights:

Grid Array
Small Outline Package
Flat no-leads Package
Dual In-Line Package
Others

End User Insights:

Consumer Electronics
Automotive
Healthcare
IT and Telecommunication
Aerospace and Defense
Others

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

How has the Japan semiconductor packaging market performed so far and how will it perform in the coming years?
What is the breakup of the Japan semiconductor packaging market on the basis of type?
What is the breakup of the Japan semiconductor packaging market on the basis of packaging material?
What is the breakup of the Japan semiconductor packaging market on the basis of technology?
What is the breakup of the Japan semiconductor packaging market on the basis of end user?
What are the various stages in the value chain of the Japan semiconductor packaging market?
What are the key driving factors and challenges in the Japan semiconductor packaging market?
What is the structure of the Japan semiconductor packaging market and who are the key players?
What is the degree of competition in the Japan semiconductor packaging market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Packaging Market - Introduction

4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Japan Semiconductor Packaging Market Landscape

5.1 Historical and Current Market Trends (2019-2024)
5.2 Market Forecast (2025-2033)

6 Japan Semiconductor Packaging Market - Breakup by Type

6.1 Flip Chip
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2019-2024)
- 6.1.3 Market Forecast (2025-2033)
6.2 Embedded DIE
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2019-2024)
- 6.2.3 Market Forecast (2025-2033)
6.3 Fan-in WLP
- 6.3.1 Overview
- 6.3.2 Historical and Current Market Trends (2019-2024)
- 6.3.3 Market Forecast (2025-2033)
6.4 Fan-out WLP
- 6.4.1 Overview
- 6.4.2 Historical and Current Market Trends (2019-2024)
- 6.4.3 Market Forecast (2025-2033)

7 Japan Semiconductor Packaging Market - Breakup by Packaging Material

7.1 Organic Substrate
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2019-2024)
- 7.1.3 Market Forecast (2025-2033)
7.2 Bonding Wire
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2019-2024)
- 7.2.3 Market Forecast (2025-2033)
7.3 Leadframe
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2019-2024)
- 7.3.3 Market Forecast (2025-2033)
7.4 Ceramic Package
- 7.4.1 Overview
- 7.4.2 Historical and Current Market Trends (2019-2024)
- 7.4.3 Market Forecast (2025-2033)
7.5 Die Attach Material
- 7.5.1 Overview
- 7.5.2 Historical and Current Market Trends (2019-2024)
- 7.5.3 Market Forecast (2025-2033)
7.6 Others
- 7.6.1 Historical and Current Market Trends (2019-2024)
- 7.6.2 Market Forecast (2025-2033)

8 Japan Semiconductor Packaging Market - Breakup by Technology

8.1 Grid Array
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2019-2024)
- 8.1.3 Market Forecast (2025-2033)
8.2 Small Outline Package
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2019-2024)
- 8.2.3 Market Forecast (2025-2033)
8.3 Flat no-leads Package
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2019-2024)
- 8.3.3 Market Forecast (2025-2033)
8.4 Dual In-Line Package
- 8.4.1 Overview
- 8.4.2 Historical and Current Market Trends (2019-2024)
- 8.4.3 Market Forecast (2025-2033)
8.5 Others
- 8.5.1 Historical and Current Market Trends (2019-2024)
- 8.5.2 Market Forecast (2025-2033)

9 Japan Semiconductor Packaging Market - Breakup by End User

9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2019-2024)
- 9.1.3 Market Forecast (2025-2033)
9.2 Automotive
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2019-2024)
- 9.2.3 Market Forecast (2025-2033)
9.3 Healthcare
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2019-2024)
- 9.3.3 Market Forecast (2025-2033)
9.4 IT and Telecommunication
- 9.4.1 Overview
- 9.4.2 Historical and Current Market Trends (2019-2024)
- 9.4.3 Market Forecast (2025-2033)
9.5 Aerospace and Defense
- 9.5.1 Overview
- 9.5.2 Historical and Current Market Trends (2019-2024)
- 9.5.3 Market Forecast (2025-2033)
9.6 Others
- 9.6.1 Historical and Current Market Trends (2019-2024)
- 9.6.2 Market Forecast (2025-2033)

10 Japan Semiconductor Packaging Market - Competitive Landscape

10.1 Overview
10.2 Market Structure
10.3 Market Player Positioning
10.4 Top Winning Strategies
10.5 Competitive Dashboard
10.6 Company Evaluation Quadrant

11 Profiles of Key Players

11.1 Company A
- 11.1.1 Business Overview
- 11.1.2 Products Offered
- 11.1.3 Business Strategies
- 11.1.4 SWOT Analysis
- 11.1.5 Major News and Events
11.2 Company B
- 11.2.1 Business Overview
- 11.2.2 Products Offered
- 11.2.3 Business Strategies
- 11.2.4 SWOT Analysis
- 11.2.5 Major News and Events
11.3 Company C
- 11.3.1 Business Overview
- 11.3.2 Products Offered
- 11.3.3 Business Strategies
- 11.3.4 SWOT Analysis
- 11.3.5 Major News and Events
11.4 Company D
- 11.4.1 Business Overview
- 11.4.2 Products Offered
- 11.4.3 Business Strategies
- 11.4.4 SWOT Analysis
- 11.4.5 Major News and Events
11.5 Company E
- 11.5.1 Business Overview
- 11.5.2 Products Offered
- 11.5.3 Business Strategies
- 11.5.4 SWOT Analysis
- 11.5.5 Major News and Events

12 Japan Semiconductor Packaging Market - Industry Analysis

12.1 Drivers, Restraints, and Opportunities
- 12.1.1 Overview
- 12.1.2 Drivers
- 12.1.3 Restraints
- 12.1.4 Opportunities
12.2 Porters Five Forces Analysis
- 12.2.1 Overview
- 12.2.2 Bargaining Power of Buyers
- 12.2.3 Bargaining Power of Suppliers
- 12.2.4 Degree of Competition
- 12.2.5 Threat of New Entrants
- 12.2.6 Threat of Substitutes
12.3 Value Chain Analysis