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市場調查報告書
商品編碼
1623228

半導體設備封裝和測試的全球市場規模:類別，各用途，各地區，範圍及預測

Global Semiconductor Equipment Packaging And Test Market Size By Type (Packaging Service, Test Service), By Application (Communication, Computing), By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

半導體元件封裝測試市場規模及預測

半導體設備封裝和測試市場規模預計到2023年將達到316.5億美元，到2030年將達到597.2億美元，在2024-2030年的預測期內複合年增長率為8.26%。為了提高電子系統的性能、可靠性和成本效益，先進的封裝技術被用於半導體封裝，這是市場的關鍵成長因素。全球半導體設備封裝和測試市場報告提供了對市場的整體評估。它對關鍵細分市場、趨勢、市場推動因素、阻礙因素、競爭格局以及在市場中發揮關鍵作用的因素進行了全面分析。

定義全球半導體元件封裝與測試市場

半導體是物理產品，通常由矽製成，其導電性能比玻璃等絕緣體更好，但不如銅或鋁等純導體。此外，引入雜質（稱為摻雜）可以改變半導體的電導率和其他特性，以滿足安裝半導體的電子元件的特定需求。封裝是半導體生產和設計的關鍵部分。因此，它在宏觀層面影響效能、成本和功耗，在微觀層面影響每個晶片的核心效能。此外，封裝是容納半導體晶片的容器。

此外，儘管代工供應商專注於封裝，但封裝有時是由其他供應商完成的。另外，封裝可以固定晶片、將晶片附接至基板或其他晶片以及散熱。半導體封裝將積體電路 (IC) 限制在適合特定設備的形狀元件中。半導體晶片和 IC 必須經過電氣封裝工藝，在該工藝中將它們塑造成適當的設計和結構，以便在電路板上加速或在電子設備中使用。相反，測試是在整個半導體裝置製造過程中進行的。這意味著測試晶圓上存在的每個積體電路。此外，還使用適當的測試標準對各個電路進行了活動錯誤測試。此外，測試是使用稱為處理機或晶圓探測器的設備進行的。

全球半導體元件封裝測試市場概況

半導體封裝是一種屏蔽殼，可在半導體製造過程的最後階段防止邏輯單元、矽晶圓和記憶體的材料損壞和腐蝕。此外，晶片還可以連接至電路板。此外，在消費性電子產品和工業產品中，現代封裝依賴機械工程原理，例如傳熱、流體動力學、力學、應力分析、保護元件免受機械損壞、冷卻、射頻噪音輻射和靜電放電。因此，先進的封裝技術被用於半導體封裝，以提高電子系統的性能、可靠性和成本效益，成為市場的關鍵成長因素。

相反，高昂的採購成本和維護成本成為市場阻礙因素，抑制了半導體設備封測市場的成長。此外，半導體封裝技術有望透過增加半導體產品的操作功能、提高和維持性能來增加半導體產品的價值，同時降低封裝的整體成本。此外，半導體封裝的採用也為多種消費性電子產品創造了對高性能晶片的需求。這推動了對智慧型手機和其他行動裝置中使用的封裝晶片的需求。

目錄

第1章 全球半導體設備封裝和測試市場簡介

  • 市場概要
  • 調查範圍
  • 前提條件

第2章 摘要整理

第3章 VERIFIED MARKET RESEARCH的調查手法

  • 資料探勘
  • 驗證
  • 第一手資料
  • 資料來源一覽

第4章 半導體設備封裝和測試的全球市場展望

  • 概要
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 機會
  • 波特的五力分析
  • 價值鏈分析

第5章 半導體設備封裝和測試的全球市場:各類型

  • 概要
  • 包裝服務
  • 試驗服務

第6章 半導體設備封裝和測試的全球市場:各用途

  • 概要
  • 通訊
  • 運算
  • 消費者電子產品
  • 其他

第7章 半導體設備封裝和測試的全球市場:各地區

  • 概要
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 其他歐洲
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 其他亞太地區
  • 全球其他地區
    • 南美
    • 中東·非洲

第8章 全球半導體設備封裝和測試市場競爭情形

  • 概要
  • 各公司的市場排行榜
  • 主要的發展策略

第9章 企業簡介

  • GREATEK
  • Samsung
  • KYEC
  • LINGSEN PRECISION INDUSTRIES
  • UTAC
  • CHIPMOS
  • POWERTECH TECHNOLOGY
  • SILICONWARE PRECISION INDUSTRIES(SPIL)
  • AMKOR TECHNOLOGY
  • ASE

第10章 附錄

  • 相關調查
簡介目錄
Product Code: 20758

Semiconductor Equipment Packaging And Test Market Size And Forecast

Semiconductor Equipment Packaging And Test Market size was valued at 31.65 USD Billion in 2023 and is projected to reach 59.72 USD Billion by 2030 , growing at a CAGR of 8.26% during the forecast period 2024-2030. To enhance the performance, reliability & cost-effectiveness of electronics systems, advanced packaging technology is being used for packaging semiconductors which act as the key growth element of the market. The Global Semiconductor Equipment Packaging And Test Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Semiconductor Equipment Packaging And Test Market Definition

The semiconductor is a physical product normally constituted of silicon, which conducts electricity more than an insulator, such as glass, but less than a pure conductor, such as copper or aluminum. Furthermore, their conductivity and other characteristics can be modified with the introduction of impurities, called doping, to meet the specific needs of the electronic component in which it lies. Packaging is a crucial part of semiconductor production and design. Therefore, it influences performance, cost, and power on a huge level and the primary performance of all chips on a micro-level. In addition, the package is the container that grips the semiconductor die.

Also, the packaging may be done by a separate vendor, despite foundries are amplifying their packaging endeavor. Furthermore, the package assures the die, attaches the chip to a board or other chips, and may vanish heat. Semiconductor packaging engages constraint integrated circuits (IC) in a form element that can fit into a particular device. Since a semiconductor chip or IC, is accelerated on a circuit board or used in an electronic device, it requires to go through an electrical packaging process to be molded into the proper design and structure. On the contrary, testing is electrocuted throughout semiconductor device manufacturing. Therefore, this associates the testing of all individual integrated circuits present on the wafer. Moreover, the individual circuits are tested for active bugs using appropriate test standards. In addition, the testing is implemented using an apparatus called a handler or wafer prober.

Global Semiconductor Equipment Packaging And Test Market Overview

Semiconductor packaging is a shielding case that stops material damage and corrosion to logic units, silicon wafers, and memory throughout the last stage of the semiconductor production process. Moreover, it permits the chip to be connected to a circuit board. In addition, in consumer electronics and industrial products, modern packaging depends on mechanical engineering principles, such as heat transfer and fluid mechanics, dynamics, stress analysis and safeguard elements from mechanical damage, cooling, RF noise emission, and electrostatic discharge. Consequently, to enhance the performance, reliability & cost-effectiveness of electronics systems, advanced packaging technology is being used for packaging semiconductors which act as the key growth element of the market.

On the contrary, high purchase and maintenance costs are acting as the restraint element and diminish the growth of the Semiconductor Equipment Packaging And Test Market. Furthermore, the technology of semiconductor packaging is expected to raise the value of a semiconductor product by adding functionality to its operation, growing and conserving the performance while lowering the overall cost of packaging. Moreover, the adoption of semiconductor packaging is also creating demand for high-performance chips for several consumer electronic products. This increases the demand for packaging chips used in smartphones and other mobile devices.

Global Semiconductor Equipment Packaging And Test Market Segmentation Analysis

The Global Semiconductor Equipment Packaging And Test Market is segmented on the basis of Type, Application, and Geography.

Semiconductor Equipment Packaging And Test Market, By Type

  • Packaging Service
  • Test Service

Based on Type, the market is segmented into Packaging Service and Test Service. The Packaging Service segment is dominating the market with the highest market share and is expected to grow substantially and dominate the global market during the forecast period. The section shows each type of production, revenue received price, market share, as well as growth rate.

Semiconductor Equipment Packaging And Test Market, By Application

  • Communication
  • Computing
  • Consumer Electronics
  • Others

Based on Application, the market is segmented into Communication, Computing, Consumer Electronics, and Others. The Communication segment is witnessing the highest market share with strong market growth during the forecast period in the global market. The Segment centers on the standing and opportunity for significant application value, market share, and growth valuation of each application.

Semiconductor Equipment Packaging And Test Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the world
  • On the basis of Regional Analysis, the Global Semiconductor Equipment Packaging And Test Market is classified into North America, Europe, Asia Pacific, and Rest of the world. The North America and Europe region is expected to witness the highest CAGR during the forecast period. This is primarily due to the rise in disposable income in these countries, and the growth in urbanization.

Key Players

  • The "Global Semiconductor Equipment Packaging And Test Market" study report will provide a valuable insight with an emphasis on the global market. The major players in the market are
  • Greatek, Samsung, KYEC, Lingsen Precision Industries, Amkor Technology, ASE, Powertech Technology, Siliconware Precision Industries (SPIL), UTAC, and ChipMos.

Our market analysis also entails a section solely dedicated for such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Key Developments

  • In June 2021, Samsung had announced to launch of new chipsets for its next-generation 5G solution and products, including the compact macro, massive Mimo radios, and based units which will be available in the commercial market.
  • In July 2020, ASE had announced its strategic agreement with Apple INC to steadily improve its energy efficiency and steadily shift into greener production.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY TYPE

  • 5.1 Overview
  • 5.2 Packaging Service
  • 5.3 Test Service

6 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY APPLICATION

  • 6.1 Overview
  • 6.2 Communication
  • 6.3 Computing
  • 6.4 Consumer Electronics
  • 6.5 Others

7 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET, BY GEOGRAPHY

  • 7.1 Overview
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 U.K.
    • 7.3.3 France
    • 7.3.4 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 Japan
    • 7.4.3 India
    • 7.4.4 Rest of Asia Pacific
  • 7.5 Rest of the World
    • 7.5.1 Latin America
    • 7.5.2 Middle East and Africa

8 GLOBAL SEMICONDUCTOR EQUIPMENT PACKAGING AND TEST MARKET COMPETITIVE LANDSCAPE

  • 8.1 Overview
  • 8.2 Company Market Ranking
  • 8.3 Key Development Strategies

9 COMPANY PROFILES

  • 9.1 GREATEK
    • 9.1.1 Overview
    • 9.1.2 Financial Performance
    • 9.1.3 Product Outlook
    • 9.1.4 Key Developments
  • 9.2 Samsung
    • 9.2.1 Overview
    • 9.2.2 Financial Performance
    • 9.2.3 Product Outlook
    • 9.2.4 Key Developments
  • 9.3 KYEC
    • 9.3.1 Overview
    • 9.3.2 Financial Performance
    • 9.3.3 Product Outlook
    • 9.3.4 Key Developments
  • 9.4 LINGSEN PRECISION INDUSTRIES
    • 9.4.1 Overview
    • 9.4.2 Financial Performance
    • 9.4.3 Product Outlook
    • 9.4.4 Key Developments
  • 9.5 UTAC
    • 9.5.1 Overview
    • 9.5.2 Financial Performance
    • 9.5.3 Product Outlook
    • 9.5.4 Key Developments
  • 9.6 CHIPMOS
    • 9.6.1 Overview
    • 9.6.2 Financial Performance
    • 9.6.3 Product Outlook
    • 9.6.4 Key Developments
  • 9.7 POWERTECH TECHNOLOGY
    • 9.7.1 Overview
    • 9.7.2 Financial Performance
    • 9.7.3 Product Outlook
    • 9.7.4 Key Developments
  • 9.8 SILICONWARE PRECISION INDUSTRIES (SPIL)
    • 9.8.1 Overview
    • 9.8.2 Financial Performance
    • 9.8.3 Product Outlook
    • 9.8.4 Key Developments
  • 9.9 AMKOR TECHNOLOGY
    • 9.9.1 Overview
    • 9.9.2 Financial Performance
    • 9.9.3 Product Outlook
    • 9.9.4 Key Developments
  • 9.10 ASE
    • 9.10.1 Overview
    • 9.10.2 Financial Performance
    • 9.10.3 Product Outlook
    • 9.10.4 Key Developments

10 Appendix

    • 10.1.1 Related Research