嵌入式板、模組和系統：現代產品開發和邊緣解決方案建構的基本平台。

Embedded Boards, Modules & Systems: Essential Platforms for Modern Product Development & Edge Solution Building

出版日期: 2026年04月30日 | 出版商:

VDC Strategy | 英文 41 Pages; 437 Exhibits | 商品交期: 最快1-2個工作天內

價格

簡介目錄

本報告內容

本報告對全球嵌入式板、模組和整合系統市場進行了全面分析，檢驗了不斷發展的邊緣運算、人工智慧和物聯網工作負載如何改變不同硬體外形尺寸和部署環境的需求。報告分析了市場總規模（TAM）、成長前景以及影響各種外形尺寸硬體採用的關鍵技術和應用趨勢，這些外形尺寸包括嵌入式模組電腦（COM）、系統模組（SOM）、主機板、單板電腦（SBC）、嵌入式/OEM 整合計算系統和伺服器。

此外，對競爭格局進行了詳細評估，揭示了主要供應商的概況、市場佔有率以及在產品類型和垂直市場中的策略差異化優勢。除了供應商側分析外，還納入了從廣泛的「Voice of the Engineer」調查中獲得的需求面洞察，展示了不同計畫的選擇標準、平台偏好和設計要求之間的差異。

本報告探討的主要問題

目前全球嵌入式電路板、模組和整合系統（主要外形尺寸）的市場規模為何？預計未來市場規模又是多少？
邊緣人工智慧、物聯網和加速工作負載等趨勢如何改變對平台的需求？
哪些廠商在嵌入式主機板、模組、單板電腦和整合系統市場中處於領先地位？它們的市場佔有率分佈如何？
不同硬體類別和垂直市場的競爭格局發生什麼樣的變化？
法規、安全和認證要求如何影響硬體設計和採購決策？
影響嵌入式/OEM硬體差異化的主要因素有哪些？
供應商策略（例如，垂直整合、人工智慧賦能、客製化、服務）如何演變以抓住未來的成長機會？

本報告涵蓋的技術供應商

AAEON Technologies
Abaco Systems
ADLINK Technology
Advantech
AMD
Arm
Avalue Technology
Axiomtek
BAE Systems
Beckhoff Automation
Cisco
congatec
Curtiss-Wright Defense Solutions
Dell Technologies OEM Solutions
DFI
Digi International
duagon
Eurotech
EVOC Intelligent Technology
Fujitsu Technology Solutions
General Dynamics Mission Systems
Hewlett Packard Enterprise
Huawei
IBASE Technology
IBM
IEI Integration
Inspur
Intel
Kontron
L3 Technologies
Lanner Electronics
Lenovo OEM
Leonardo DRS
MediaTek
Mercury Systems
MiTAC Computing
MPL
MSI
NEC Corporation
NVIDIA
OnLogic
Oracle
Penguin Solutions
PHYTEC
Portwell
Qualcomm
Radisys
Raspberry Pi
RTD Embedded
SECO
Semtech
Shenzhen NORCO Intelligent Technology
Silicon Labs
Supermicro Computer
Texas Instruments
Toradex
TQ Systems
Tria Technologies
VersaLogic
其他

主要發現
- 硬體需求在2025年復甦，長期利多。
- 邊緣人工智慧推動架構變革。
- 模組化和標準化有助於緩解重大問題。
- 記憶體瓶頸、短缺和安全問題是推動重新設計的主要原因。
- 網路安全從差異化因素轉變為法規要求。
- 邊緣應用的擴展推動垂直專業化。
- 從邊緣到雲端的整合也擴展到硬體平台。
- 近期併購

工程方面的考察

功能集的要求會顯著影響硬體組件的選擇。
系統級硬體標準也會隨著嵌入式功能的需求而發生類似的波動。
產品需求的成長帶來了更複雜的配置要求。
競爭格局
- 嵌入式主機板和單板電腦
- 嵌入式運算模組和卡
- 嵌入式整合式電腦系統和伺服器

供應商簡介

Abaco Systems
ADLINK
Advantech
BAE Systems
Beckhoff Automation
congatec
Dell Technologies
Eurotech
Hewlett Packard Enterprise
Kontron
Lenovo
Mercury Systems
NVIDIA
Penguin Solutions
Raspberry Pi
Supermicro
Toradex
Tria Technologies

關於作者

關於VDC戰略

簡介目錄

Inside this Report

This report provides a comprehensive analysis of the global market for embedded boards, modules, and integrated systems, examining how evolving edge computing, AI, and IoT workloads are reshaping demand across hardware form factors and deployment environments. It explores the total addressable market, growth outlook, and key technology and application trends influencing hardware adoption across form factors, including computer-on-modules (COMs), system-on-modules (SOMs), motherboards, single-board computers (SBCs), and embedded/OEM integrated computing systems and servers.

In addition, the report delivers a detailed assessment of the competitive landscape, profiling leading vendors, their market share positions, and their strategic differentiators across product categories and vertical markets. It incorporates both supplier-side analysis and demand-side insights drawn from extensive Voice of the Engineer research, illustrating how selection criteria, platform preferences, and design requirements vary across projects.

What Questions are Addressed?

What is the current and forecasted size of the global market for embedded boards, modules, and integrated systems across key form factors?
How are trends such as edge AI, IoT, and workload acceleration reshaping demand for platforms?
Which vendors lead the market across embedded motherboards, modules, SBCs, and integrated systems, and how is share distributed?
How is the competitive landscape evolving across different hardware categories and vertical markets?
What impact are regulatory, security, and certification requirements having on hardware design and procurement decisions?
What are key dynamics affecting embedded/OEM hardware differentiation?
How are supplier strategies (e.g., vertical integration, AI enablement, customization, and services) evolving to capture future growth opportunities?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing or participating in the ecosystem of IoT, embedded, and/or edge computing solutions, including:

CEO or other C-level executives
Corporate development and M&A teams
Marketing executives
Business development and sales leaders
Product development/strategy leaders
Channel management/strategy leaders

Technology Suppliers in this Research

AAEON Technologies
Abaco Systems
ADLINK Technology
Advantech
AMD
Arm
Avalue Technology
Axiomtek
BAE Systems
Beckhoff Automation
Cisco
congatec
Curtiss-Wright Defense Solutions
Dell Technologies OEM Solutions
DFI
Digi International
duagon
Eurotech
EVOC Intelligent Technology
Fujitsu Technology Solutions
General Dynamics Mission Systems
Hewlett Packard Enterprise
Huawei
IBASE Technology
IBM
IEI Integration
Inspur
Intel
Kontron
L3 Technologies
Lanner Electronics
Lenovo OEM
Leonardo DRS
MediaTek
Mercury Systems
MiTAC Computing
MPL
MSI
NEC Corporation
NVIDIA
OnLogic
Oracle
Penguin Solutions
PHYTEC
Portwell
Qualcomm
Radisys
Raspberry Pi
RTD Embedded
SECO
Semtech
Shenzhen NORCO Intelligent Technology
Silicon Labs
Supermicro Computer
Texas Instruments
Toradex
TQ Systems
Tria Technologies
VersaLogic
… and many others

Demand-side Research Overview

VDC launches numerous surveys of the IoT and embedded engineering ecosystem every year using an online survey platform. To support this research, VDC leverages its in-house panel of more than 30,000 individuals from various roles and industries across the world. Our global Voice of the Engineer survey recently captured insights from a total of 600 qualified respondents. This survey was used to inform our insights into key trends, preferences, and predictions within the engineering community. VDC does not use any AI-generated samples or panels for its surveys.

Inside this Report

Executive Summary

Key Findings
- Hardware Demand Rebounds in 2025 and Rides Long-term Tailwinds
- Edge AI Stimulates Architectural Change
- Modularity and Standardization Help Alleviate Major Pain Points
- Memory Bottlenecks, Shortages & Security Drive Redesigns
- Cybersecurity Moves from Differentiator to Regulatory Requirement
- Edge Use Cases Feed Verticalization
- Edge-to-Cloud Convergence Extends to Hardware Platforms
- Recent Acquisitions & Mergers

Engineering Insights

Feature Set Requirements Hold a Massive Influence Over Hardware Component Selection
Criteria for Systems-level Hardware Similarly Fluctuates by Embedded Capability Demand
Growing Product Demands are in Turn Driving Higher Configuration Requirements
Competitive Landscape
- Embedded Motherboards & Single-board Computers
- Embedded Computing Modules & Cards
- Embedded Integrated Computer Systems & Servers